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市场调查报告书
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1662593

2030 年记忆体积体电路市场预测：按产品类型、最终用户和地区进行的全球分析

Memory Integrated Circuits Market Forecasts to 2030 - Global Analysis By Product Type, End User and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3个工作天内

价格

根据 Stratistics MRC 的数据，全球记忆体积体电路市场规模预计在 2024 年将达到 956 亿美元，到 2030 年将达到 1,451 亿美元，预测期内的复合年增长率为 7.2%。

称为记忆体积体电路（IC）的半导体元件用于储存数位资料。储存单元阵列通常由电晶体和电容器组成，用于表示二进位资料（0 和 1）。重要的类型是用于短期记忆的随机存取记忆体 (RAM) 和用于长期记忆的唯读记忆体 (ROM)。为了处理和储存资料，记忆体积体电路（IC）是电脑、智慧型手机和其他电子设备中不可或缺的元件。

根据半导体产业协会（SIA）的数据，2022年全球半导体产业销售额将达5,741亿美元。

家用电子电器需求不断成长

现代家用电子电器产品需要大容量、高速的记忆体解决方案来支援扩增实境、高解析度摄影机和无缝多工处理等高级功能。此外，物联网设备和智慧家居技术的普及进一步推动了对高效能记忆体IC的需求。这一趋势是由可支配收入的增加和技术进步所推动的，使得家用电子电器成为市场成长的主要动力。

製造成本高

製造记忆体IC需要复杂的製程、先进的材料和尖端的製造技术，因此高成本。 3D NAND 和 DRAM 扩展等技术创新需要在研发、专用设备和技术纯熟劳工进行大量投资。这些因素增加了整体製造成本并限制了某些应用的可负担性。此外，製造商之间的价格竞争也给利润率带来压力，对先进记忆体IC的广泛应用构成挑战。

资料中心的成长

对云端运算、巨量资料分析和人工智慧驱动应用的日益依赖需要具有大储存容量和快​​速处理速度的高效能记忆体解决方案。 DRAM 和NAND快闪记忆体等记忆体 IC 对于处理超大规模资料中心的海量资料负载至关重要。随着企业不断将业务转移到云端，这一趋势预计将继续推动对先进记忆体技术的需求。

环境问题

由于高能耗、温室气体排放和有害物质的使用，製造记忆体积体电路对环境有很大影响。製造过程使用大量的水并产生有毒废弃物，引发了人们永续性的担忧。此外，电子废弃物的不当处理也会造成污染。此类环境问题可能需要更严格的法规和永续的做法，从而增加生产成本并使製造商的合规性变得更加复杂。

COVID-19 的影响

由于供应链中断和製造能力下降，COVID-19 疫情扰乱了记忆体 IC 市场。封锁延误了生产计划并影响了原材料的供应。然而，疫情期间远距办公的增加和对数位基础设施的依赖提振了对家用电子电器和资料中心的需求，部分抵消了损失。疫情后的復苏努力加速了对半导体製造业的投资，确保了市场的长期成长。

预计非挥发性记忆体部分在预测期内将成为最大的部分。

非挥发性记忆体预计将在预测期内占据最大的市场占有率，因为它能够在没有电源的情况下保存资料，并且它在智慧型手机、固态硬碟和物联网设备等应用中发挥着重要作用。 NAND快闪记忆体等技术因其耐用性和可扩展性而被广泛应用于家用电子电器和企业储存解决方案。该领域的成长得益于 3D NAND 技术的进步，该技术在降低成本的同时提高了储存密度。它在各个行业的多功能性使其能够继续保持市场领先地位。

预计预测期内，IT 和通讯产业将实现最高的复合年增长率。

由于 5G 网路和云端运算技术的日益普及，预计 IT 和通讯领域将在预测期内实现最高成长率。记忆体IC对于支援基地台和路由器等通讯基础架构中的高速资料传输和储存至关重要。此外，电讯人工智慧驱动应用的激增正在加速对先进记忆体解决方案的需求。

比最大的地区

由于亚太地区是全球半导体製造和家用电子电器生产的中心，预计将在预测期内占据最大的市场占有率。受国内智慧型手机、物联网设备和汽车电子产品强劲需求的推动，中国、韩国和日本等国家在先进记忆体积体电路的生产方面处于领先地位。此外，政府支持技术创新的措施也进一步支持了该地区的发展。

复合年增长率最高的地区

在预测期内，由于人工智慧技术的进步和云端基础设施投资的增加，预计北美将呈现最高的复合年增长率。该地区对研发的高度重视正在推动高效能记忆体解决方案的创新。此外，自动驾驶汽车和智慧型装置的日益普及也促进了该市场的强劲成长。

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    • 根据产品系列、地理分布和策略联盟对主要企业基准化分析

目录

第一章执行摘要

第 2 章 前言

  • 概述
  • 相关利益者
  • 研究范围
  • 调查方法
    • 资料探勘
    • 资料分析
    • 资料检验
    • 研究途径
  • 研究资讯来源
    • 主要研究资讯来源
    • 二手研究资料资讯来源
    • 先决条件

第三章 市场走势分析

  • 介绍
  • 驱动程式
  • 限制因素
  • 机会
  • 威胁
  • 产品分析
  • 最终用户分析
  • 新兴市场
  • COVID-19 的影响

第 4 章 波特五力分析

  • 供应商的议价能力
  • 买家的议价能力
  • 替代品的威胁
  • 新进入者的威胁
  • 竞争对手之间的竞争

5. 全球记忆体积体电路市场（依产品类型）

  • 介绍
  • 挥发性记忆体
    • 动态随机存取记忆体 (DRAM)
    • 静态随机存取记忆体（SRAM）
  • 非挥发性记忆体
    • 快闪记忆体
      • NAND快闪记忆体
      • 单层单元 (SLC)
      • 多层单元 (MLC)
      • 三层单元 (TLC)
      • 四层电池 (QLC)
      • NOR快闪记忆体
    • 唯读记忆体（ROM）
      • 遮罩唯读记忆体
      • 可程式 ROM (PROM)
      • 可擦除可编程 ROM (EPROM)
      • 电可擦除可程式设计体 (EEPROM)
    • 下一代记忆体
      • 磁阻电阻式记忆体(MRAM)
      • 铁电RAM (FRAM)
      • 电阻式 RAM (ReRAM)
      • 相变记忆体（PCRAM）

6. 全球记忆体积体电路市场（依最终用户划分）

  • 介绍
  • 家用电子电器
    • 智慧型手机和平板电脑
    • 电脑和笔记型电脑
    • 游戏机
    • 穿戴式装置
  • 资讯科技和通讯
    • 资料中心
    • 伺服器
    • 网路基础设施
    • 储存系统
  • 车
    • 高级驾驶辅助系统 (ADAS)
    • 资讯娱乐系统
    • 车辆控制单元
  • 产业
    • 工业自动化
    • 智慧製造
    • 过程控制系统
  • 航太和国防
    • 航空电子设备
    • 国防电子
    • 卫星系统
  • 医疗
    • 医学影像设备
    • 诊断设备
    • 病患监测系统

7. 世界记忆体积体电路市场区域分布

  • 介绍
  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 义大利
    • 法国
    • 西班牙
    • 欧洲其他地区
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 澳洲
    • 纽西兰
    • 韩国
    • 其他亚太地区
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 南美洲其他地区
  • 中东和非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 卡达
    • 南非
    • 其他中东和非洲地区

第八章 主要进展

  • 协议、伙伴关係、合作和合资企业
  • 收购与合併
  • 新产品发布
  • 业务扩展
  • 其他关键策略

第九章 公司概况

  • Advanced Micro Devices（AMD）
  • Analog Devices, Inc.
  • Broadcom Inc.
  • Cypress Semiconductor Corporation
  • Fujitsu Limited
  • Infineon Technologies AG
  • Intel Corporation
  • Integrated Silicon Solution Inc.
  • Macronix International Co., Ltd.
  • Maxim Integrated Products, Inc.
  • Micron Technology, Inc.
  • NVIDIA Corporation
  • NXP Semiconductors NV
  • Renesas Electronics Corporation
  • Samsung Electronics Co., Ltd.
  • SK Hynix Inc.
  • STMicroelectronics NV
  • Taiwan Semiconductor Manufacturing Company（TSMC）
Product Code: SMRC28454

According to Stratistics MRC, the Global Memory Integrated Circuits Market is accounted for $95.6 billion in 2024 and is expected to reach $145.1 billion by 2030 growing at a CAGR of 7.2% during the forecast period. Semiconductor devices called memory integrated circuits (ICs) are made to store digital data. They represent binary data (0s and 1s) using arrays of memory cells, usually transistors or capacitors. Random Access Memory (RAM) for short-term storage and Read-Only Memory (ROM) for long-term storage are important types. In order to process and store data, memory integrated circuits (ICs) are crucial parts of computers, smartphones, and other electronic devices.

According to the Semiconductor Industry Association (SIA), global semiconductor industry sales reached $574.1 billion in 2022.

Market Dynamics:

Driver:

Increasing demand for consumer electronics

Modern consumer electronics require high-capacity and high-speed memory solutions to support advanced features like augmented reality, high-resolution cameras, and seamless multitasking. Additionally, the proliferation of IoT devices and smart home technologies further boosts demand for efficient memory ICs. This trend is fueled by rising disposable incomes and technological advancements, making consumer electronics a key driver of market growth.

Restraint:

High manufacturing costs

The production of memory ICs involves complex processes, advanced materials, and cutting-edge manufacturing technologies, leading to high costs. Innovations like 3D NAND and DRAM scaling require significant investments in research and development, specialized equipment, and skilled labor. These factors increase the overall cost of production, limiting affordability for certain applications. Moreover, price competition among manufacturers pressures profit margins, posing a challenge to the widespread adoption of advanced memory ICs.

Opportunity:

Growth in data centers

Increasing reliance on cloud computing, big data analytics, and AI-driven applications necessitates high-performance memory solutions with large storage capacities and fast processing speeds. Memory ICs like DRAM and NAND flash are critical for handling the massive data loads in hyper scale data centers. As businesses continue to migrate operations to the cloud, this trend is expected to drive sustained demand for advanced memory technologies.

Threat:

Environmental concerns

The manufacturing of memory ICs has a substantial environmental impact due to high energy consumption, greenhouse gas emissions, and the use of hazardous materials. The production process involves significant water usage and generates toxic waste, raising concerns about sustainability. Additionally, improper disposal of electronic waste contributes to pollution. These environmental challenges necessitate stricter regulations and sustainable practices, which may increase production costs and complicate compliance for manufacturers.

Covid-19 Impact:

The COVID-19 pandemic disrupted the memory IC market due to supply chain interruptions and reduced manufacturing capacity. Lockdowns delayed production schedules and impacted raw material availability. However, increased reliance on remote work and digital infrastructure during the pandemic drove demand for consumer electronics and data centers, partially offsetting losses. Post-pandemic recovery efforts have accelerated investments in semiconductor manufacturing, ensuring long-term market growth.

The non-volatile memory segment is expected to be the largest during the forecast period

The non-volatile memory segment is expected to account for the largest market share during the forecast period due to its ability to retain data without power, making it essential for applications like smartphones, SSDs, and IoT devices. Technologies such as NAND flash are widely used in consumer electronics and enterprise storage solutions due to their durability and scalability. The segment's growth is driven by advancements in 3D NAND technology that enhance storage density while reducing costs. Its versatility across various industries ensures its continued leadership in the market.

The IT & telecommunication segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the IT & telecommunication segment is predicted to witness the highest growth rate due to increasing adoption of 5G networks and cloud computing technologies. Memory ICs are critical for supporting high-speed data transmission and storage in telecommunications infrastructure like base stations and routers. Additionally, the proliferation of AI-driven applications in telecom accelerates demand for advanced memory solutions.

Region with largest share:

During the forecast period, the Asia Pacific region is expected to hold the largest market share due to its position as a global hub for semiconductor manufacturing and consumer electronics production. Countries like China, South Korea, and Japan lead in producing advanced memory ICs driven by strong domestic demand for smartphones, IoT devices, and automotive electronics. Additionally, government initiatives supporting technological innovation further bolster regional growth.

Region with highest CAGR:

Over the forecast period, the North America region is anticipated to exhibit the highest CAGR owing to advancements in AI technologies and increased investments in cloud infrastructure. The region's strong focus on research and development drives innovation in high-performance memory solutions. Additionally, rising adoption of autonomous vehicles and smart devices contributes to robust growth in this market.

Key players in the market

Some of the key players in Memory Integrated Circuits Market include Advanced Micro Devices (AMD), Analog Devices, Inc., Broadcom Inc., Cypress Semiconductor Corporation, Fujitsu Limited, Infineon Technologies AG, Intel Corporation, Integrated Silicon Solution Inc., Macronix International Co., Ltd., Maxim Integrated Products, Inc., Micron Technology, Inc., NVIDIA Corporation, NXP Semiconductors N.V., Renesas Electronics Corporation, Samsung Electronics Co., Ltd., SK Hynix Inc., STMicroelectronics N.V. and Taiwan Semiconductor Manufacturing Company (TSMC).

Key Developments:

In January 2025, Micron Technology, Inc. announced expansions across its crucial consumer memory and storage portfolio, including unveiling the high-speed Crucial P510 SSD, and expanding density and form factor options across its existing DRAM portfolio to enable broader choice and flexibility for consumers. The P510 features read and write speeds of up to 11,000/9,550 megabytes per second (MB/s), bringing blazing fast Gen5 performance to the masses.

In December 2024, Broadcom Inc. announced the availability of its 3.5D eXtreme Dimension System in Package (XDSiP(TM)) platform technology, enabling consumer AI customers to develop next-generation custom accelerators (XPUs). The 3.5D XDSiP integrates more than 6000 mm2 of silicon and up to 12 high bandwidth memory (HBM) stacks in one packaged device to enable high-efficiency, low-power computing for AI at scale. Broadcom has achieved a significant milestone by developing and launching the industry's first Face-to-Face (F2F) 3.5D XPU.

In October 2024, AMD announced its third generation commercial AI mobile processors, designed specifically to transform business productivity with Copilot+ features including live captioning and language translation in conference calls and advanced AI image generators. The new Ryzen AI PRO 300 Series processors deliver industry-leading AI compute, with up to three times the AI performance than the previous generation, and offer uncompromising performance for everyday workloads.

Product Types Covered:

  • Volatile Memory
  • Non-Volatile Memory

End Users Covered:

  • Consumer Electronics
  • IT & Telecommunication
  • Automotive
  • Industrial
  • Aerospace & Defense
  • Healthcare

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2022, 2023, 2024, 2026, and 2030
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Product Analysis
  • 3.7 End User Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Memory Integrated Circuits Market, By Product Type

  • 5.1 Introduction
  • 5.2 Volatile Memory
    • 5.2.1 Dynamic Random-Access Memory (DRAM)
    • 5.2.2 Static Random-Access Memory (SRAM)
  • 5.3 Non-Volatile Memory
    • 5.3.1 Flash Memory
      • 5.3.1.1 NAND Flash
      • 5.3.1.1.1 Single-Level Cell (SLC)
      • 5.3.1.1.2 Multi-Level Cell (MLC)
      • 5.3.1.1.3 Triple-Level Cell (TLC)
      • 5.3.1.1.4 Quad-Level Cell (QLC)
      • 5.3.1.2 NOR Flash
    • 5.3.2 Read-Only Memory (ROM)
      • 5.3.2.1 Mask ROM
      • 5.3.2.2 Programmable ROM (PROM)
      • 5.3.2.3 Erasable Programmable ROM (EPROM)
      • 5.3.2.4 Electrically Erasable Programmable ROM (EEPROM)
    • 5.3.3 Next-Generation Memory
      • 5.3.3.1 Magnetoresistive RAM (MRAM)
      • 5.3.3.2 Ferroelectric RAM (FRAM)
      • 5.3.3.3 Resistive RAM (ReRAM)
      • 5.3.3.4 Phase-Change Memory (PCRAM)

6 Global Memory Integrated Circuits Market, By End User

  • 6.1 Introduction
  • 6.2 Consumer Electronics
    • 6.2.1 Smartphones & Tablets
    • 6.2.2 Computers & Laptops
    • 6.2.3 Gaming Consoles
    • 6.2.4 Wearable Devices
  • 6.3 IT & Telecommunication
    • 6.3.1 Data Centers
    • 6.3.2 Servers
    • 6.3.3 Network Infrastructure
    • 6.3.4 Storage Systems
  • 6.4 Automotive
    • 6.4.1 Advanced Driver Assistance Systems (ADAS)
    • 6.4.2 Infotainment Systems
    • 6.4.3 Vehicle Control Units
  • 6.5 Industrial
    • 6.5.1 Industrial Automation
    • 6.5.2 Smart Manufacturing
    • 6.5.3 Process Control Systems
  • 6.6 Aerospace & Defense
    • 6.6.1 Avionics
    • 6.6.2 Defense Electronics
    • 6.6.3 Satellite Systems
  • 6.7 Healthcare
    • 6.7.1 Medical Imaging Equipment
    • 6.7.2 Diagnostic Devices
    • 6.7.3 Patient Monitoring Systems

7 Global Memory Integrated Circuits Market, By Geography

  • 7.1 Introduction
  • 7.2 North America
    • 7.2.1 US
    • 7.2.2 Canada
    • 7.2.3 Mexico
  • 7.3 Europe
    • 7.3.1 Germany
    • 7.3.2 UK
    • 7.3.3 Italy
    • 7.3.4 France
    • 7.3.5 Spain
    • 7.3.6 Rest of Europe
  • 7.4 Asia Pacific
    • 7.4.1 Japan
    • 7.4.2 China
    • 7.4.3 India
    • 7.4.4 Australia
    • 7.4.5 New Zealand
    • 7.4.6 South Korea
    • 7.4.7 Rest of Asia Pacific
  • 7.5 South America
    • 7.5.1 Argentina
    • 7.5.2 Brazil
    • 7.5.3 Chile
    • 7.5.4 Rest of South America
  • 7.6 Middle East & Africa
    • 7.6.1 Saudi Arabia
    • 7.6.2 UAE
    • 7.6.3 Qatar
    • 7.6.4 South Africa
    • 7.6.5 Rest of Middle East & Africa

8 Key Developments

  • 8.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 8.2 Acquisitions & Mergers
  • 8.3 New Product Launch
  • 8.4 Expansions
  • 8.5 Other Key Strategies

9 Company Profiling

  • 9.1 Advanced Micro Devices (AMD)
  • 9.2 Analog Devices, Inc.
  • 9.3 Broadcom Inc.
  • 9.4 Cypress Semiconductor Corporation
  • 9.5 Fujitsu Limited
  • 9.6 Infineon Technologies AG
  • 9.7 Intel Corporation
  • 9.8 Integrated Silicon Solution Inc.
  • 9.9 Macronix International Co., Ltd.
  • 9.10 Maxim Integrated Products, Inc.
  • 9.11 Micron Technology, Inc.
  • 9.12 NVIDIA Corporation
  • 9.13 NXP Semiconductors N.V.
  • 9.14 Renesas Electronics Corporation
  • 9.15 Samsung Electronics Co., Ltd.
  • 9.16 SK Hynix Inc.
  • 9.17 STMicroelectronics N.V.
  • 9.18 Taiwan Semiconductor Manufacturing Company (TSMC)

List of Tables

  • Table 1 Global Memory Integrated Circuits Market Outlook, By Region (2022-2030) ($MN)
  • Table 2 Global Memory Integrated Circuits Market Outlook, By Product Type (2022-2030) ($MN)
  • Table 3 Global Memory Integrated Circuits Market Outlook, By Volatile Memory (2022-2030) ($MN)
  • Table 4 Global Memory Integrated Circuits Market Outlook, By Dynamic Random-Access Memory (DRAM) (2022-2030) ($MN)
  • Table 5 Global Memory Integrated Circuits Market Outlook, By Static Random-Access Memory (SRAM) (2022-2030) ($MN)
  • Table 6 Global Memory Integrated Circuits Market Outlook, By Non-Volatile Memory (2022-2030) ($MN)
  • Table 7 Global Memory Integrated Circuits Market Outlook, By Flash Memory (2022-2030) ($MN)
  • Table 8 Global Memory Integrated Circuits Market Outlook, By Read-Only Memory (ROM) (2022-2030) ($MN)
  • Table 9 Global Memory Integrated Circuits Market Outlook, By Next-Generation Memory (2022-2030) ($MN)
  • Table 10 Global Memory Integrated Circuits Market Outlook, By End User (2022-2030) ($MN)
  • Table 11 Global Memory Integrated Circuits Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 12 Global Memory Integrated Circuits Market Outlook, By Smartphones & Tablets (2022-2030) ($MN)
  • Table 13 Global Memory Integrated Circuits Market Outlook, By Data Centers (2022-2030) ($MN)
  • Table 14 Global Memory Integrated Circuits Market Outlook, By Servers (2022-2030) ($MN)
  • Table 15 Global Memory Integrated Circuits Market Outlook, By Network Infrastructure (2022-2030) ($MN)
  • Table 16 Global Memory Integrated Circuits Market Outlook, By Storage Systems (2022-2030) ($MN)
  • Table 17 Global Memory Integrated Circuits Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 18 Global Memory Integrated Circuits Market Outlook, By Advanced Driver Assistance Systems (ADAS) (2022-2030) ($MN)
  • Table 19 Global Memory Integrated Circuits Market Outlook, By Infotainment Systems (2022-2030) ($MN)
  • Table 20 Global Memory Integrated Circuits Market Outlook, By Vehicle Control Units (2022-2030) ($MN)
  • Table 21 Global Memory Integrated Circuits Market Outlook, By Industrial (2022-2030) ($MN)
  • Table 22 Global Memory Integrated Circuits Market Outlook, By Industrial Automation (2022-2030) ($MN)
  • Table 23 Global Memory Integrated Circuits Market Outlook, By Smart Manufacturing (2022-2030) ($MN)
  • Table 24 Global Memory Integrated Circuits Market Outlook, By Process Control Systems (2022-2030) ($MN)
  • Table 25 Global Memory Integrated Circuits Market Outlook, By Aerospace & Defense (2022-2030) ($MN)
  • Table 26 Global Memory Integrated Circuits Market Outlook, By Avionics (2022-2030) ($MN)
  • Table 27 Global Memory Integrated Circuits Market Outlook, By Defense Electronics (2022-2030) ($MN)
  • Table 28 Global Memory Integrated Circuits Market Outlook, By Satellite Systems (2022-2030) ($MN)
  • Table 29 Global Memory Integrated Circuits Market Outlook, By Healthcare (2022-2030) ($MN)
  • Table 30 Global Memory Integrated Circuits Market Outlook, By Medical Imaging Equipment (2022-2030) ($MN)
  • Table 31 Global Memory Integrated Circuits Market Outlook, By Diagnostic Devices (2022-2030) ($MN)
  • Table 32 Global Memory Integrated Circuits Market Outlook, By Patient Monitoring Systems (2022-2030) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.