磁簧接近感测器市场机会、成长驱动因素、产业趋势分析与预测 2024 - 2032 年

2023年全球磁簧接近感测器市场价值为465亿美元，预计2024年至2032年复合年增长率为5%。这些创新正在重塑感测器技术、提高效能并拓宽应用范围。微型化、高度整合的感测器正在满足消费性电子产品的需求，其中紧凑性和功能性至关重要。随着消费性设备变得更加复杂和空间受限，对具有整合和小型化优势的先进磁簧接近感测器的需求将会激增。

整个磁簧接近感测器行业根据类型、感测范围、安装类型、技术、最终用途、电源电压和地区进行分类。市场根据感测范围分为短距离（最多 10 毫米）、中距离（10 毫米至 50 毫米）和长距离（50 毫米以上）。短距离（最大10 毫米）细分市场预计将在2023 年占据市场主导地位，预计到2032 年将超过400 亿美元。越受欢迎。这些感测器正在整合到智慧型手机、穿戴式装置和智慧家庭小工具等装置中，以实现萤幕锁定、装置启动和用户互动等功能。

基于安装类型的市场细分包括表面安装、面板安装、螺纹安装、螺丝安装、法兰安装等。面板安装细分市场正在成为成长最快的细分市场，2024 年至2032 年的复合年增长率将超过10%。 。在感测器需要安全连接到面板或外壳的情况下，面板安装是首选，可提供对机械应力和环境挑战的增强保护。亚太地区的磁簧接近感测器市场正在激增，预计到 2032 年将达到 350 亿美元以上。

亚太地区因其对创新和技术进步的承诺而脱颖而出。在快速工业化和蓬勃发展的电子产业的推动下，中国的磁簧接近感测器市场正处于上升轨道。作为全球製造强国，中国对磁簧感测器的需求涵盖从汽车和工业自动化到消费性电子产品等多种应用。

目录

第 1 章：方法与范围

第 2 章：执行摘要

第 3 章：产业洞察

• 产业生态系统分析
• 供应商矩阵
• 技术与创新格局
• 专利分析
• 重要新闻和倡议
• 监管环境
• 衝击力
  • 成长动力
    • 工业自动化的扩展
    • 汽车安全系统的进步
    • 消费性电子产品和智慧型设备的成长
    • 感测器整合和小型化的技术进步
    • 航太和国防应用需求不断成长
  • 产业陷阱与挑战
    • 检测范围和灵敏度有限
    • 易受环境干扰
• 成长潜力分析
• 波特的分析
• PESTEL分析

第 4 章：竞争格局

• 公司市占率分析
• 竞争定位矩阵
• 战略展望矩阵

第 5 章：市场估计与预测：按类型，2021 - 2032

• 主要趋势
• A 型（常开）
• B 型（常闭）
• C 型（转换）
• 其他的

第 6 章：市场估计与预测：依感测范围，2021 - 2032 年

• 主要趋势
• 短距离（最多 10 毫米）
• 中等范围（10 毫米至 50 毫米）
• 长距离（50毫米以上）

第 7 章：市场估计与预测：按安装类型，2021 - 2032 年

• 主要趋势
• 表面贴装
• 面板安装
• 螺纹安装
• 螺丝安装
• 法兰安装
• 其他的

第 8 章：市场估计与预测：依技术分类，2021 - 2032

• 主要趋势
• 单簧片感测器
• 双干簧管感测器
• 多干簧管感测器
• 客製化干簧感测器

第 9 章：市场估计与预测：依最终用途产业，2021 - 2032 年

• 主要趋势
• 汽车
• 工业的
• 消费性电子产品
• 卫生保健
• 航太与国防
• 海洋
• 能源与公用事业
• 其他的

第 10 章：市场估计与预测：按电源电压，2021 - 2032 年

• 主要趋势
• 低电压（5V以下）
• 中压（5V 至 12V）
• 高电压（12V以上）

第 11 章：市场估计与预测：按地区，2021 - 2032

• 主要趋势
• 北美洲
  • 我们
  • 加拿大
• 欧洲
  • 英国
  • 德国
  • 法国
  • 义大利
  • 西班牙
  • 欧洲其他地区
• 亚太地区
  • 中国
  • 印度
  • 日本
  • 韩国
  • 澳新银行
  • 亚太地区其他地区
• 拉丁美洲
  • 巴西
  • 墨西哥
  • 拉丁美洲其他地区
• MEA
  • 阿联酋
  • 沙乌地阿拉伯
  • 南非
  • MEA 的其余部分

第 12 章：公司简介

• Analog Devices, Inc.
• Broadcom Inc.
• Eaton Corporation plc
• General Electric Company (GE)
• Honeywell International Inc.
• HUIMU Ltd.
• Infineon Technologies AG
• Keysight Technologies, Inc.
• Microchip Technology Inc.
• Mitsubishi Electric Corporation
• NVIDIA Corporation
• NXP Semiconductors NV
• ON Semiconductor Corporation
• Qualcomm Incorporated
• Renesas Electronics Corporation
• Rohm Semiconductor
• Schneider Electric SE
• Siemens AG
• SMSC (a Microchip Technology company)
• STMicroelectronics NV
• Texas Instruments Inc.

The Global Magnetic Reed Proximity Sensors Market was valued at USD 46.5 billion in 2023 and is projected to grow at a CAGR of 5% from 2024 to 2032. Key growth drivers for the magnetic reed proximity sensors market include technological advancements in sensor integration and miniaturization. These innovations are reshaping sensor technology, boosting performance, and broadening application horizons. Miniaturized, highly integrated sensors are meeting the demands of consumer electronics, where compactness and functionality are paramount. As consumer devices evolve to be more sophisticated and space-constrained, the appetite for advanced magnetic reed proximity sensors, which offer integration and miniaturization benefits, is set to surge.

The overall magnetic reed proximity sensors industry is classified based on type, sensing range, mounting type, technology, end-use, supply voltage, and region. The market is segmented based on sensing range into short range (up to 10 mm), medium range (10 mm to 50 mm), and long range (Above 50 mm). Dominating the market in 2023, the short range (up to 10 mm) segment is projected to exceed USD 40 billion by 2032. Short-range magnetic reed proximity sensors are gaining traction in consumer electronics, thanks to their compactness and reliability. These sensors are being integrated into devices like smartphones, wearables, and smart home gadgets for functions such as screen locking, device activation, and user interaction.

Market segmentation based on mounting type includes surface mount, panel mount, threaded mount, screw mount, flange mount, and others. The panel mount segment is emerging as the fastest growing segment, boasting a CAGR of over 10% from 2024 to 2032. The panel mount segment's growth is fueled by a rising demand for durable magnetic reed proximity sensors. Panel mounts are preferred in scenarios where sensors need secure attachment to panels or enclosures, offering enhanced protection against mechanical stress and environmental challenges. Asia Pacific is witnessing a surge in the magnetic reed proximity sensors market, with projections indicating a reach of over USD 35 billion by 2032. The region's growth is propelled by booming automotive, industrial, and consumer electronics sectors, with nations like China, Japan, and Korea leading the charge.

Asia Pacific stands out for its commitment to innovation and technological progress. China's magnetic reed proximity sensor market is on an upward trajectory, driven by swift industrialization and a burgeoning electronics sector. As a global manufacturing powerhouse, China's demand for magnetic reed sensors spans diverse applications, from automotive and industrial automation to consumer electronics.

Table of Contents

Chapter 1 Methodology & Scope

• 1.1 Market scope & definition
• 1.2 Base estimates & calculations
• 1.3 Forecast parameters
• 1.4 Data sources
  • 1.4.1 Primary
  • 1.4.2 Secondary
    • 1.4.2.1 Paid sources
    • 1.4.2.2 Public sources

Chapter 2 Executive Summary

• 2.1 Industry 360° synopsis, 2024 - 2032
• 2.2 Business trends
  • 2.2.1 Total addressable market (TAM), 2024-2032

Chapter 3 Industry Insights

• 3.1 Industry ecosystem analysis
• 3.2 Vendor matrix
• 3.3 Technology & innovation landscape
• 3.4 Patent analysis
• 3.5 Key news and initiatives
• 3.6 Regulatory landscape
• 3.7 Impact forces
  • 3.7.1 Growth drivers
    • 3.7.1.1 Expansion of industrial automation
    • 3.7.1.2 Advancements in automotive safety systems
    • 3.7.1.3 Growth in consumer electronics and smart devices
    • 3.7.1.4 Technological advancements in sensor integration and miniaturization
    • 3.7.1.5 Rising demand in aerospace and defense applications
  • 3.7.2 Industry pitfalls & challenges
    • 3.7.2.1 Limited detection range and sensitivity
    • 3.7.2.2 Susceptibility to environmental interference
• 3.8 Growth potential analysis
• 3.9 Porter's analysis
  • 3.9.1 Supplier power
  • 3.9.2 Buyer power
  • 3.9.3 Threat of new entrants
  • 3.9.4 Threat of substitutes
  • 3.9.5 Industry rivalry
• 3.10 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

• 4.1 Company market share analysis
• 4.2 Competitive positioning matrix
• 4.3 Strategic outlook matrix

Chapter 5 Market Estimates & Forecast, By Type, 2021 - 2032 (USD Million & Units)

• 5.1 Key trends
• 5.2 Form A (normally open)
• 5.3 Form B (normally closed)
• 5.4 Form C (changeover)
• 5.5 Others

Chapter 6 Market Estimates & Forecast, By Sensing Range, 2021 - 2032 (USD Million & Units)

• 6.1 Key trends
• 6.2 Short range (Up to 10 mm)
• 6.3 Medium range (10 mm to 50 mm)
• 6.4 Long range (above 50 mm)

Chapter 7 Market Estimates & Forecast, By Mounting Type, 2021 - 2032 (USD Million & Units)

• 7.1 Key trends
• 7.2 Surface mount
• 7.3 Panel mount
• 7.4 Threaded mount
• 7.5 Screw mount
• 7.6 Flange mount
• 7.7 Others

Chapter 8 Market Estimates & Forecast, By Technology, 2021 - 2032 (USD Million & Units)

• 8.1 Key trends
• 8.2 Single reed sensors
• 8.3 Double reed sensors
• 8.4 Multi reed sensors
• 8.5 Custom reed sensors

Chapter 9 Market Estimates & Forecast, By End Use Industry, 2021 - 2032 (USD Million & Units)

• 9.1 Key trends
• 9.2 Automotive
• 9.3 Industrial
• 9.4 Consumer electronics
• 9.5 Healthcare
• 9.6 Aerospace & defense
• 9.7 Marine
• 9.8 Energy & utilities
• 9.9 Others

Chapter 10 Market Estimates & Forecast, By Supply Voltage, 2021 - 2032 (USD Million & Units)

• 10.1 Key trends
• 10.2 Low voltage (below 5V)
• 10.3 Medium voltage (5V to 12V)
• 10.4 High voltage (above 12V)

Chapter 11 Market Estimates & Forecast, By Region, 2021 - 2032 (USD Million & Units)

• 11.1 Key trends
• 11.2 North America
  • 11.2.1 U.S.
  • 11.2.2 Canada
• 11.3 Europe
  • 11.3.1 UK
  • 11.3.2 Germany
  • 11.3.3 France
  • 11.3.4 Italy
  • 11.3.5 Spain
  • 11.3.6 Rest of Europe
• 11.4 Asia Pacific
  • 11.4.1 China
  • 11.4.2 India
  • 11.4.3 Japan
  • 11.4.4 South Korea
  • 11.4.5 ANZ
  • 11.4.6 Rest of Asia Pacific
• 11.5 Latin America
  • 11.5.1 Brazil
  • 11.5.2 Mexico
  • 11.5.3 Rest of Latin America
• 11.6 MEA
  • 11.6.1 UAE
  • 11.6.2 Saudi Arabia
  • 11.6.3 South Africa
  • 11.6.4 Rest of MEA

Chapter 12 Company Profiles

• 12.1 Analog Devices, Inc.
• 12.2 Broadcom Inc.
• 12.3 Eaton Corporation plc
• 12.4 General Electric Company (GE)
• 12.5 Honeywell International Inc.
• 12.6 HUIMU Ltd.
• 12.7 Infineon Technologies AG
• 12.8 Keysight Technologies, Inc.
• 12.9 Microchip Technology Inc.
• 12.10 Mitsubishi Electric Corporation
• 12.11 NVIDIA Corporation
• 12.12 NXP Semiconductors N.V.
• 12.13 ON Semiconductor Corporation
• 12.14 Qualcomm Incorporated
• 12.15 Renesas Electronics Corporation
• 12.16 Rohm Semiconductor
• 12.17 Schneider Electric SE
• 12.18 Siemens AG
• 12.19 SMSC (a Microchip Technology company)
• 12.20 STMicroelectronics N.V.
• 12.21 Texas Instruments Inc.