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市场调查报告书
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1616683

电子热管理材料市场机会、成长动力、产业趋势分析及 2024 年至 2032 年预测

Electronic Thermal Management Materials Market Opportunity, Growth Drivers, Industry Trend Analysis, and Forecast 2024 to 2032

出版日期: | 出版商: Global Market Insights Inc. | 英文 200 Pages | 商品交期: 2-3个工作天内

价格
简介目录

全球电子热管理材料市场将于2023 年达到64 亿美元,预计2024 年至2032 年复合年增长率为7.5%。内的最佳温度。这些材料在消费性电子、汽车、航太、医疗保健和电信等各个领域都至关重要。它们有助于电子设备基板之间的有效散热。透过最大限度地减少接触电阻,ETMM 不仅可以提高电子设备的性能和使用寿命,还可以确保遵守操作规范。

各行业(尤其是汽车和医疗保健领域)电子设备使用量的激增推动了 ETMM 的需求。这种趋势在发展中地区尤其明显,将在预测期内大幅提高市场收入。随着汽车、航太、医疗保健和消费性电子等行业对先进电子设备的需求日益增长,电子热管理材料 (ETMM) 市场正在强劲成长。随着电子设备变得更加紧凑和强大,有效的热管理解决方案的紧迫性也越来越大。

这种需求刺激了各种 ETMM 产品的创建和采用,包括热界面材料 (TIM)、间隙填充物、导热膏和相变材料,所有这些产品都旨在优化散热并确保电子元件的最佳性能。整个产业分为产品、应用和区域。对市场导电浆料领域的预测显示这是一个重要的里程碑,预计 2024 年至 2032 年复合年增长率将达到 8.2%。性方面的关键作用。预测表明,到2032 年,电子热管理材料市场的消费品应用领域将增长至19 亿美元,2024 年至2032 年复合年增长率将继续保持8.2%。需求的推动,包括智慧型手机、平板电脑和穿戴式装置。

市场范围
开始年份 2023年
预测年份 2024-2032
起始值 64 亿美元
预测值 128 亿美元
复合年增长率 7.5%

这些设备需要高效的热管理才能达到最佳效能和使用寿命。随着消费者倾向于更强大、更紧凑和功能丰富的设备,有效散热的紧迫性日益增强,从而推动了该领域对热管理材料的需求。亚太地区电子热管理材料产业将显着成长,预计到2023 年市场价值将达到45 亿美元。需求。亚太地区以中国、日本和韩国等主要电子製造中心为主导,正在加大智慧型手机、平板电脑和电动车等设备的生产。

目录

第 1 章:方法与范围

第 2 章:执行摘要

第 3 章:产业洞察

  • 产业生态系统分析
    • 主要製造商
    • 经销商
    • 全行业利润率
  • 产业影响力
    • 成长动力
    • 市场挑战
    • 市场机会
      • 新机会
      • 成长潜力分析
  • 原料景观
    • 製造趋势
    • 技术演进
      • 永续製造
        • 绿色实践
        • 脱碳
    • 原材料的可持续性
    • 价格趋势(美元/吨),2021 - 2032
  • 法规和市场影响
  • 波特的分析
  • PESTEL分析

第 4 章:竞争格局

  • 公司市占率分析
  • 竞争定位矩阵
  • 战略展望矩阵

第 5 章:市场规模与预测:按产品划分,2021-2032 年

  • 主要趋势
  • 导电浆料
    • 环氧树脂
    • 丙烯酸纤维
  • 导电胶带
  • 相变材料
    • 石蜡
    • 盐水合物
    • 其他的
  • 间隙填充物
    • 硅酮
    • 非硅胶
  • 润滑脂
    • 硅酮
    • 非硅胶
  • 其他的

第 6 章:市场规模与预测:按应用划分,2021-2032 年

  • 主要趋势
  • 消费品
  • 航太
  • 汽车
  • 卫生保健
  • 电信
  • 其他的

第 7 章:市场规模与预测:按地区划分,2021-2032 年

  • 主要趋势
  • 北美洲
    • 我们
    • 加拿大
  • 欧洲
    • 德国
    • 英国
    • 法国
    • 义大利
    • 西班牙
    • 欧洲其他地区
  • 亚太地区
    • 中国
    • 印度
    • 日本
    • 韩国
    • 澳洲
    • 亚太地区其他地区
  • 拉丁美洲
    • 巴西
    • 墨西哥
    • 阿根廷
    • 拉丁美洲其他地区
  • MEA
    • 沙乌地阿拉伯
    • 阿联酋
    • 南非
    • MEA 的其余部分

第 8 章:公司简介

  • 3M
  • Parker Chomerics
  • Boyd
  • European Thermodynamics
  • Dr Dietrich Muller Gmbh,
  • Wacker AG
  • Darcoid company
  • Laird PLC
  • Lord Corporation
  • Amerasia International (AI) Technology Inc
  • Henkel AG & Company
  • Marian Inc
  • Honeywell International Inc
  • Dupont
简介目录
Product Code: 3780

The Global Electronic Thermal Management Materials Market reached USD 6.4 billion in 2023 and is projected to grow at a CAGR of 7.5% from 2024 to 2032. Electronic thermal management materials (ETMM) are pivotal in today's electronics to ensure optimal temperatures within electronic assemblies. These materials are vital across diverse sectors, including consumer electronics, automotive, aerospace, healthcare, and telecommunications. They facilitate efficient heat dissipation between electronic device substrates. By minimizing contact resistance, ETMM not only boosts the performance and lifespan of electronic devices but also guarantees adherence to operational specifications.

Driving the demand for ETMM is the surging use of electronic devices across industries, notably in automotive and healthcare. This trend, especially pronounced in developing regions, is set to substantially elevate the market revenue during the forecast period. As industries like automotive, aerospace, healthcare, and consumer electronics increasingly demand advanced electronic devices, the electronic thermal management materials (ETMM) market is witnessing robust growth. With electronic devices becoming more compact and powerful, the urgency for effective thermal management solutions intensifies.

This demand has spurred the creation and adoption of diverse ETMM products, including thermal interface materials (TIMs), gap fillers, thermal pastes, and phase change materials, all aimed at optimizing heat dissipation and ensuring peak performance of electronic components. The overall industry is segmented into product, application, and region. Projections for the conductive paste segment of the market indicate a significant milestone, with expectations to record a CAGR of 8.2% from 2024 to 2032. This surge is fueled by the rising demand for high-performance electronic components in sectors like automotive, consumer electronics, and telecommunications, underscoring the pivotal role of conductive pastes in thermal management and electrical conductivity. Forecasts suggest that the consumer goods application segment in the electronic thermal management materials market will grow to USD 1.9 billion by 2032, continuing at a CAGR of 8.2% from 2024 to 2032. This growth is spurred by the rising demand for sophisticated consumer electronics, including smartphones, tablets, and wearables.

Market Scope
Start Year2023
Forecast Year2024-2032
Start Value$6.4 Billion
Forecast Value$12.8 Billion
CAGR7.5%

These devices necessitate efficient thermal management for optimal performance and longevity. As consumers gravitate towards more powerful, compact, and feature-rich devices, the urgency for effective heat dissipation intensifies, driving the demand for thermal management materials in this segment. Asia Pacific is set to witness remarkable growth in the electronic thermal management materials sector, with projections valuing the market at USD 4.5 billion in 2023. This surge is largely attributed to the region's booming demand for consumer electronics, automotive innovations, and strides in industrial automation. Dominated by major electronics manufacturing hubs like China, Japan, and South Korea, the Asia Pacific is ramping up production of devices, such as smartphones, tablets, and electric vehicles.

Table of Contents

Chapter 1 Methodology & Scope

  • 1.1 Market scope & definition
  • 1.2 Base estimates & calculations
  • 1.3 Forecast calculation
  • 1.4 Data sources
    • 1.4.1 Primary
    • 1.4.2 Secondary
      • 1.4.2.1 Paid sources
      • 1.4.2.2 Public sources

Chapter 2 Executive Summary

  • 2.1 Industry 360° synopsis

Chapter 3 Industry Insights

  • 3.1 Industry ecosystem analysis
    • 3.1.1 Key manufacturers
    • 3.1.2 Distributors
    • 3.1.3 Profit margins across the industry
  • 3.2 Industry impact forces
    • 3.2.1 Growth drivers
    • 3.2.2 Market challenges
    • 3.2.3 Market opportunity
      • 3.2.3.1 New opportunities
      • 3.2.3.2 Growth potential analysis
  • 3.3 Raw material landscape
    • 3.3.1 Manufacturing trends
    • 3.3.2 Technology evolution
      • 3.3.2.1 Sustainable manufacturing
        • 3.3.2.1.1 Green practices
        • 3.3.2.1.2 Decarbonization
    • 3.3.3 Sustainability in raw materials
    • 3.3.4 Pricing trends (USD/Ton), 2021 - 2032
      • 3.3.4.1 North America
      • 3.3.4.2 Europe
      • 3.3.4.3 Asia Pacific
      • 3.3.4.4 Latin America
      • 3.3.4.5 Middle East & Africa
  • 3.4 Regulations & market impact
  • 3.5 Porter's analysis
  • 3.6 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

  • 4.1 Company market share analysis
  • 4.2 Competitive positioning matrix
  • 4.3 Strategic outlook matrix

Chapter 5 Market Size and Forecast, By Product, 2021-2032 (USD Billion, Kilo Tons)

  • 5.1 Key trends
  • 5.2 Conductive paste
    • 5.2.1 Silicon
    • 5.2.2 Epoxy
    • 5.2.3 Acrylic
  • 5.3 Conductive tape
  • 5.4 Phase change materials
    • 5.4.1 Paraffin
    • 5.4.2 Salt hydrate
    • 5.4.3 Others
  • 5.5 Gap fillers
    • 5.5.1 Silicone
    • 5.5.2 Non-silicone
  • 5.6 Greases
    • 5.6.1 Silicone
    • 5.6.2 Non-silicone
  • 5.7 Others

Chapter 6 Market Size and Forecast, By Application, 2021-2032 (USD Billion, Kilo Tons)

  • 6.1 Key trends
  • 6.2 Consumer goods
  • 6.3 Aerospace
  • 6.4 Automotive
  • 6.5 Healthcare
  • 6.6 Telecom
  • 6.7 Others

Chapter 7 Market Size and Forecast, By Region, 2021-2032 (USD Billion, Kilo Tons)

  • 7.1 Key trends
  • 7.2 North America
    • 7.2.1 U.S.
    • 7.2.2 Canada
  • 7.3 Europe
    • 7.3.1 Germany
    • 7.3.2 UK
    • 7.3.3 France
    • 7.3.4 Italy
    • 7.3.5 Spain
    • 7.3.6 Rest of Europe
  • 7.4 Asia Pacific
    • 7.4.1 China
    • 7.4.2 India
    • 7.4.3 Japan
    • 7.4.4 South Korea
    • 7.4.5 Australia
    • 7.4.6 Rest of Asia Pacific
  • 7.5 Latin America
    • 7.5.1 Brazil
    • 7.5.2 Mexico
    • 7.5.3 Argentina
    • 7.5.4 Rest of Latin America
  • 7.6 MEA
    • 7.6.1 Saudi Arabia
    • 7.6.2 UAE
    • 7.6.3 South Africa
    • 7.6.4 Rest of MEA

Chapter 8 Company Profiles

  • 8.1 3M
  • 8.2 Parker Chomerics
  • 8.3 Boyd
  • 8.4 European Thermodynamics
  • 8.5 Dr Dietrich Muller Gmbh,
  • 8.6 Wacker AG
  • 8.7 Darcoid company
  • 8.8 Laird PLC
  • 8.9 Lord Corporation
  • 8.10 Amerasia International (AI) Technology Inc
  • 8.11 Henkel AG & Company
  • 8.12 Marian Inc
  • 8.13 Honeywell International Inc
  • 8.14 Dupont