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半导体生产设备硅晶圆

市场调查报告书

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1620598

绝缘体上硅 (SOI) 市场机会、成长动力、产业趋势分析与预测 2024 - 2032 年

Silicon-on-Insulator (SOI) Market Opportunity, Growth Drivers, Industry Trend Analysis, and Forecast 2024 - 2032

出版日期: 2024年10月08日 | 出版商:

Global Market Insights Inc. | 英文 190 Pages | 商品交期: 2-3个工作天内

价格

简介目录

2023 年全球绝缘体上硅 (SOI) 市场价值为 13 亿美元，预计 2024 年至 2032 年复合年增长率为 15.3%。以及各个行业（尤其是汽车行业）越来越多地采用SOI 技术。对智慧型手机、穿戴式装置和平板电脑等更快、更节能设备的需求导致人们更加关注 SOI 技术。全耗尽型 SOI (FD-SOI) 因其在保持最佳性能的同时降低功耗的能力而广受欢迎，使其成为消费性电子产品中的关键技术。同时，在向电动车 (EV) 和自动驾驶系统转变的推动下，汽车产业正在迅速采用 SOI 技术。

SOI 的可靠性、耐热性和能源效率使其非常适合用于先进驾驶辅助系统(ADAS) 和电动车电源管理。基于 SOI 的晶片的一个关键优势是，与传统硅晶片相比，它们能够将功耗降低高达 30%。这种功效对于需要高性能和最少能耗的应用至关重要，例如 ADAS 和车辆资讯娱乐系统。 SOI 市场按技术分为智慧切割、键结 SOI 和层转移 SOI。

智慧切割领域预计将以超过16% 的复合年增长率成长，到2032 年价值将超过30 亿美元。其非常受欢迎-适合低功耗设备中的FD-SOI应用。依晶圆尺寸，SOI市场分为200mm和300mm两类。 2023年300毫米晶圆细分市场占据主导地位，市占率超过64%。 300mm 等较大晶圆具有支援大量生产的优势，使其能够高效地用于先进半导体应用。

市场范围
开始年份	2023年
预测年份	2024-2032
起始值	13亿美元
预测值	48.5 亿美元
复合年增长率	15.3%

向 300mm 晶圆的转变是由于其能够提供更高的良率和更低的生产成本，使其成为消费性电子、电信和汽车等行业经济高效的解决方案。 2023年，北美占全球SOI市场份额超过28%，其中美国成长迅速。这一成长是由电子、电信和汽车产业对先进半导体的需求所推动的。由于研发方面的大量投资以及 5G 和物联网等技术的快速采用，美国也已成为 SOI 采用的领导者。

对电动和自动驾驶汽车的日益关注进一步支持了 SOI 在电源管理系统中的发展。

产业生态系统分析
- 影响价值链的因素
- 利润率分析
- 干扰
- 未来展望
- 製造商
- 经销商
供应商格局
利润率分析
重要新闻和倡议
监管环境
衝击力
- 成长动力
  - 对低功耗、高效能设备的需求不断增长
  - 汽车产业越来越多的采用
  - 扩展 5G 和电信基础设施
  - 资料中心和云端运算的进步
- 产业陷阱与挑战
  - 生产成本高
  - 材料供应有限
成长潜力分析
波特的分析
PESTEL分析

第 4 章：竞争格局

介绍
公司市占率分析
竞争定位矩阵
战略展望矩阵

第 5 章：市场估计与预测：按晶圆类型，2021-2032 年

主要趋势
射频SOI
FD SOI（完全耗尽型 SOI）
PD SOI（部分耗尽型 SOI）
功率SOI
其他的

第 6 章：市场估计与预测：依晶圆尺寸，2021-2032 年

主要趋势
200毫米
300毫米

第 7 章：市场估计与预测：按技术划分，2021-2032 年

主要趋势
智慧切割
接合SOI
层转移SOI

第 8 章：市场估计与预测：依应用分类，2021-2032

主要趋势
射频有限元素产品
微机电系统元件
电源产品
光通讯
图像感测
其他的

第 9 章：市场估计与预测：依最终用途产业，2021-2032 年

主要趋势
消费性电子产品
汽车
数据通讯和电信
工业的
航太与国防
其他的

第 10 章：市场估计与预测：按地区划分，2021-2032 年

主要趋势
北美洲
- 我们
- 加拿大
欧洲
- 英国
- 德国
- 法国
- 义大利
- 西班牙
- 俄罗斯
亚太地区
- 中国
- 印度
- 日本
- 韩国
- 澳洲
拉丁美洲
- 巴西
- 墨西哥
MEA
- 南非
- 沙乌地阿拉伯
- 阿联酋

第 11 章：公司简介

GlobalWafers
Honeywell International Inc.
NXP Semiconductors
Okmetic
Qorvo
Seiren KST
Shanghai Simgui Technology
Shin-Etsu Chemical
Silicon Valley Microelectronics
Skyworks Solutions
Soitec
STMicroelectronics
Sumco
Taiwan Semiconductor Manufacturing
Tower Semiconductor
Ultrasil
Vanguard International Semiconductor
WaferPro

简介目录

Product Code: 11817

The Global Silicon-On-Insulator (SOI) Market was valued at USD 1.3 billion in 2023 and is projected to grow at a CAGR of 15.3% from 2024 to 2032. This growth is fueled by increasing demand for low-power, high-performance electronics and the rising adoption of SOI technology across various industries, particularly automotive. The need for faster, more power-efficient devices such as smartphones, wearables, and tablets has led to a greater focus on SOI technology. Fully Depleted SOI (FD-SOI) has gained popularity for its ability to reduce power consumption while maintaining optimal performance, making it a key technology in consumer electronics. Meanwhile, the automotive sector is rapidly adopting SOI technology, driven by the shift towards electric vehicles (EVs) and autonomous driving systems.

SOI's reliability, heat resistance, and energy efficiency make it ideal for use in advanced driver assistance systems (ADAS) and EV power management. A key advantage of SOI-based chips is their ability to reduce power consumption by up to 30% compared to conventional silicon chips. This power efficiency is critical for applications requiring high performance with minimal energy use, such as ADAS and vehicle infotainment systems. The SOI market is segmented by technology into smart cut, bonding SOI, and layer transfer SOI.

The smart cut segment is expected to grow at a CAGR of over 16%, reaching a value of over USD 3 billion by 2032. Smart cut technology enables the production of ultra-thin SOI wafers, offering scalability and consistent quality, which makes it well-suited for FD-SOI applications in low-power devices. By wafer size, the SOI market is divided into 200mm and 300mm categories. The 300mm wafer segment dominated the market in 2023, with a market share exceeding 64%. Larger wafers like 300mm offer the advantage of supporting high-volume production, making them highly efficient for advanced semiconductor applications.

Market Scope
Start Year	2023
Forecast Year	2024-2032
Start Value	$1.3 Billion
Forecast Value	$4.85 Billion
CAGR	15.3%

This shift to 300mm wafers is driven by their ability to deliver better yield rates and lower production costs, making them a cost-effective solution for industries such as consumer electronics, telecommunications, and automotive. North America accounted for over 28% of the global SOI market share in 2023, with the U.S. experiencing rapid growth. This growth is driven by the demand for advanced semiconductors in the electronics, telecommunications, and automotive sectors. The U.S. has also emerged as a leader in SOI adoption due to substantial investments in R&D and the fast-paced adoption of technologies like 5G and IoT.

The increasing focus on electric and autonomous vehicles further supports the growth of SOI in power management systems.

Chapter 1 Methodology & Scope

1.1 Market scope & definitions
1.2 Base estimates & calculations
1.3 Forecast calculations
1.4 Data sources
- 1.4.1 Primary
- 1.4.2 Secondary
  - 1.4.2.1 Paid sources
  - 1.4.2.2 Public sources

Chapter 2 Executive Summary

2.1 Industry synopsis, 2021-2032

Chapter 3 Industry Insights

3.1 Industry ecosystem analysis
- 3.1.1 Factor affecting the value chain
- 3.1.2 Profit margin analysis
- 3.1.3 Disruptions
- 3.1.4 Future outlook
- 3.1.5 Manufacturers
- 3.1.6 Distributors
3.2 Supplier landscape
3.3 Profit margin analysis
3.4 Key news & initiatives
3.5 Regulatory landscape
3.6 Impact forces
- 3.6.1 Growth drivers
  - 3.6.1.1 Increasing demand for low-power, high-performance devices
  - 3.6.1.2 Growing adoption in automotive industry
  - 3.6.1.3 Expansion of 5G and telecommunications infrastructure
  - 3.6.1.4 Advances in data centers and cloud computing
- 3.6.2 Industry pitfalls & challenges
  - 3.6.2.1 High production costs
  - 3.6.2.2 Limited material availability
3.7 Growth potential analysis
3.8 Porter's analysis
3.9 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

4.1 Introduction
4.2 Company market share analysis
4.3 Competitive positioning matrix
4.4 Strategic outlook matrix

Chapter 5 Market Estimates & Forecast, By Wafer Type, 2021-2032 (USD Billion)

5.1 Key trends
5.2 RF SOI
5.3 FD SOI (fully depleted SOI)
5.4 PD SOI (partially depleted SOI)
5.5 Power SOI
5.6 Others

Chapter 6 Market Estimates & Forecast, By Wafer Size, 2021-2032 (USD Billion)

6.1 Key trends
6.2 200mm
6.3 300mm

Chapter 7 Market Estimates & Forecast, By Technology, 2021-2032 (USD Billion)

7.1 Key trends
7.2 Smart cut
7.3 Bonding SOI
7.4 Layer transfer SOI

Chapter 8 Market Estimates & Forecast, By Application, 2021-2032 (USD Billion)

8.1 Key trends
8.2 RF FEM products
8.3 MEMS devices
8.4 Power products
8.5 Optical communication
8.6 Image sensing
8.7 Others

Chapter 9 Market Estimates & Forecast, By End Use Industry, 2021-2032 (USD Billion)

9.1 Key trends
9.2 Consumer electronics
9.3 Automotive
9.4 Datacom & telecom
9.5 Industrial
9.6 Aerospace & defence
9.7 Others

Chapter 10 Market Estimates & Forecast, By Region, 2021-2032 (USD Billion)

10.1 Key trends
10.2 North America
- 10.2.1 U.S.
- 10.2.2 Canada
10.3 Europe
- 10.3.1 UK
- 10.3.2 Germany
- 10.3.3 France
- 10.3.4 Italy
- 10.3.5 Spain
- 10.3.6 Russia
10.4 Asia Pacific
- 10.4.1 China
- 10.4.2 India
- 10.4.3 Japan
- 10.4.4 South Korea
- 10.4.5 Australia
10.5 Latin America
- 10.5.1 Brazil
- 10.5.2 Mexico
10.6 MEA
- 10.6.1 South Africa
- 10.6.2 Saudi Arabia
- 10.6.3 UAE