查看购物车
  • Traditional Chinese
  • English
  • Japanese
封面
市场调查报告书
商品编码
1716300

2032 年 SOI（绝缘体上硅）市场预测：按产品、晶圆类型、厚度、晶圆尺寸、技术、最终用户和地区进行的全球分析

Silicon on Insulators Market Forecasts to 2032 - Global Analysis By Product, Wafer Type, Thickness, Wafer Size, Technology, End User and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3个工作天内

价格

根据 Stratistics MRC 的数据，全球绝缘体上硅 (SOI) 市场预计在 2025 年达到 17.8 亿美元，到 2032 年将达到 54.6 亿美元，预测期内的复合年增长率为 17.3%。

SOI（绝缘体上硅）製造製程涉及在绝缘基板（通常是二氧化硅）上沉积一层薄硅。透过降低寄生元件耦合元件的电容，该结构在性能和功率效率方面优于传统的体硅。 RF应用、高速或低功耗积体电路以及先进的微处理器都广泛使用SOI技术。它能够降低漏电流并提高开关速度，使其成为小型化和能源效率至关重要的现代电子设备的理想选择。

根据半导体产业协会（SIA）预测，2024年全球半导体产业销售额将达6,276亿美元，与前一年同期比较成长19.1%。

扩大汽车电子产品的使用

自动驾驶技术、联网汽车生态系统以及电动车（EV）的出现正在改变汽车产业。这些发展主要依赖即使在恶劣环境下也能可靠运作的半导体装置。 SOI 晶片具有出色的导热性、抗闩锁性和抗软错误能力，使其成为煞车、转向和导航等安全关键系统的理想选择。此外，SOI 装置的坚固性和长期可靠性越来越受到 AEC-Q100 等汽车标准的认可。

生产和材料成本过高

阻碍SOI技术广泛应用的主要障碍之一是其製造成本相对较高。与传统的体硅晶圆製造相比，製造SOI晶圆需要更多资源密集且复杂的工艺，例如SIMOX和Smart-Cut™。此外，SOI基板需要精确控制层厚度，并具有额外的绝缘氧化层，因此价格更昂贵。此外，中小型半导体公司也因研发预算有限而受到成本限制，阻碍了产业应用。

自动驾驶汽车和电动车的使用日益增多

SOI 设备最大的成长机会之一是向电动车 (EV) 和自动驾驶技术的快速转变。这些车辆需要高度可靠且能在恶劣条件和宽温度范围内运作的电子设备。 SOI 具有出色的高温性能以及抗闩锁和软错误的能力，是 ADAS（高级驾驶辅助系统）感知器、电源管理集成电路和汽车微控制器的理想选择。此外，随着电动车的普及以及对可靠、节能半导体的需求不断增长，SOI 技术很可能在长期内创造巨大的商机，特别是随着车载电子设备变得更加软体主导和连网。

其他半导体技术的竞争加剧

儘管 SOI 具有许多优势，但其他半导体技术，尤其是 FinFET 和先进的体硅 CMOS，却构成了严重威胁。在先进的製程节点上，FinFET 因其卓越的功率效率和可扩展性而广泛应用。台积电和英特尔等大型代工厂已针对大批量生产优化了其 FinFET 工艺，使其在成熟度、规模成本效益和生态系统支援方面具有竞争优势。此外，随着体硅技术不断控制洩漏并提供更好的性能，SOI 的独特价值提案正受到威胁，特别是在成本敏感的大量和消费性电子产品中。

COVID-19的影响：

COVID-19 疫情以多种方式影响了绝缘体上硅 (SOI) 市场。半导体生产和SOI晶圆交付的延迟最初是由于劳动力短缺、工厂关闭和全球供应链中断造成的，影响了消费性电子和汽车等终端产业。然而，疫情加速了数位转型，增加了对资料中心、5G基础设施和连网型设备的需求。此外，随着远距工作、线上服务和边缘运算的兴起，SOI 市场的长期前景也得到了改善。

预计预测期内射频（RF）设备部分将成为最大的部分。

预计预测期内射频 (RF) 设备部分将占据最大的市场占有率。这种主导地位主要归功于智慧型手机、平板电脑和 5G通讯系统中基于 SOI 的射频晶片的使用日益增多。 RF-SOI技术具有高频高效能、低功耗和优异的隔离性，使其成为无线通讯前端模组的理想选择。全球行动数据流量的增加以及 5G 基础设施和物联网连接的发展推动了对 RF-SOI 设备的需求。此外，RF应用在扩大整体SOI市场方面发挥关键作用。

预计在预测期内，智慧切割部分将以最高的复合年增长率成长。

预计智慧切割部分将在预测期内呈现最高的成长率。 SmartCut 技术实现的精确层转移可以在绝缘基板上创建薄而均匀的硅层，精度高，缺陷少。该技术经常用于生产具有更高可扩展性、更低功耗和更优异电气性能的复杂 SOI 晶圆，这对于 5G、人工智慧和高速运算等下一代半导体应用至关重要。此外，其在射频设备、电力电子和高性能逻辑电路的应用日益广泛，推动了全球 SOI 市场的快速成长。

比最大的地区

预计北美地区将在预测期内占据最大的市场占有率。这是由于整体广泛采用最尖端科技、知名半导体公司的存在以及先进的研究设施。该地区将受益于消费电子、自动驾驶汽车、国防系统和 5G 基础设施等行业对基于 SOI 的产品的强劲需求。美国在半导体製造和设计方面投入了大量资金，是主要的技术创新中心，尤其是在射频设备、MEMS 和功率半导体领域。此外，政府支持国内晶片製造和 5G 网路发展的倡议进一步加强了北美在 SOI 市场的主导地位。

复合年增长率最高的地区：

预计亚太地区在预测期内的复合年增长率最高。该地区不断增长的电子製造业基础、对半导体製造业不断增加的投资以及 SOI 技术在 5G、物联网和电动汽车等尖端应用中的日益广泛使用都是推动这一快速增长的因素。中国、韩国、台湾和日本等国家拥有大量研发预算、政府支持和优惠政策。此外，消费性电子和工业自动化领域对高性能、节能晶片​​的需求不断增长，进一步推动了亚太地区对 SOI 的采用。

免费客製化服务：

订阅此报告的客户可享有以下免费自订选项之一：

  • 公司简介
    • 对其他市场公司（最多 3 家公司）进行全面分析
    • 主要企业的SWOT分析（最多3家公司）
  • 地理细分
    • 根据客户兴趣对主要国家市场进行估计、预测和复合年增长率（註：基于可行性检查）
  • 竞争基准化分析
    • 根据产品系列、地理分布和策略联盟对主要企业基准化分析

目录

第一章执行摘要

第二章 前言

  • 概述
  • 相关利益者
  • 研究范围
  • 调查方法
    • 资料探勘
    • 数据分析
    • 数据检验
    • 研究途径
  • 研究材料
    • 初级研究资讯来源
    • 次级研究资讯来源
    • 先决条件

第三章市场走势分析

  • 驱动程式
  • 限制因素
  • 机会
  • 威胁
  • 产品分析
  • 技术分析
  • 最终用户分析
  • 新兴市场
  • COVID-19的影响

第四章 波特五力分析

  • 供应商的议价能力
  • 买家的议价能力
  • 替代品的威胁
  • 新进入者的威胁
  • 竞争对手之间的竞争

第五章全球SOI（绝缘体上硅）市场（依产品）

  • 射频（RF）设备
  • MEMS元件
  • 功率半导体装置
  • 光电子
  • 记忆
  • 感应器

第六章 全球SOI（绝缘体上硅）市场（以晶圆类型）

  • 射频SOI（绝缘体上硅）（RF-SOI）
  • 全耗尽SOI（绝缘体上硅）（FD-SOI）
  • 部分耗尽SOI（绝缘体上硅）（PD-SOI）
  • 功率SOI
  • 其他晶圆类型

第七章 全球SOI（绝缘体上硅）市场（依厚度）

  • 薄膜SOI晶圆
  • 厚SOI晶圆

第八章 全球SOI（绝缘体上硅）市场（以晶圆尺寸为单位）

  • 200mm
  • 300mm

第九章全球绝缘体上硅（SOI）市场（按技术）

  • 连接技术
  • 外延层转移（ELTRAN）
  • 蓝宝石上硅 (SOS)
  • 注入氧气分离（SIMOX）
  • 智慧切割

第 10 章全球 SOI（绝缘体上硅）市场（依最终用户）

  • 车
  • 航太与国防
  • 家电
  • 娱乐与游戏
  • 资料通讯和通讯
  • 工业应用
  • 光电

第 11 章全球 SOI（绝缘体上硅）市场（按区域）

  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 义大利
    • 法国
    • 西班牙
    • 其他欧洲国家
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 澳洲
    • 纽西兰
    • 韩国
    • 其他亚太地区
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 南美洲其他地区
  • 中东和非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 卡达
    • 南非
    • 其他中东和非洲地区

第十二章 重大进展

  • 协议、伙伴关係、合作和合资企业
  • 收购与合併
  • 新产品发布
  • 业务扩展
  • 其他关键策略

第十三章 公司概况

  • Murata Manufacturing Co., Ltd.
  • IBM
  • Sumco Corporation
  • Qorvo, Inc.
  • Shin-Etsu Chemical Co., Ltd.
  • NXP Semiconductors NV
  • Magnachip Semiconductor Inc
  • Qualcomm Inc.
  • Wafer World Inc.
  • Silicon Valley Microelectronics, Inc.
  • United Microelectronics Corporation
  • STMicroelectronics NV
  • Intel Corporation
  • Skyworks Solutions, Inc.
  • Ultrasil Corporation
Product Code: SMRC29111

According to Stratistics MRC, the Global Silicon on Insulators Market is accounted for $1.78 billion in 2025 and is expected to reach $5.46 billion by 2032 growing at a CAGR of 17.3% during the forecast period. In the silicon on insulator (SOI) fabrication process, a thin layer of silicon is deposited on top of an insulating substrate, usually silicon dioxide. By lowering parasitic device capacitance, this structure outperforms traditional bulk silicon in terms of performance and power efficiency. RF applications, high-speed or low-power integrated circuits, and sophisticated microprocessors all make extensive use of SOI technology. It is perfect for contemporary electronic devices where compactness and energy efficiency are crucial because of its capacity to reduce leakage current and increase switching speed.

According to the Semiconductor Industry Association (SIA), global semiconductor industry sales totaled $627.6 billion in 2024, reflecting a 19.1% increase compared to the previous year.

Market Dynamics:

Driver:

Growing use of automotive electronics

The emergence of autonomous driving technologies, connected car ecosystems, and electric vehicles (EVs) is transforming the automotive industry. These developments mainly depend on semiconductor devices that are dependable and high-performing even in harsh environments. SOI chips are ideal for safety-critical systems like braking, steering, and navigation because of their exceptional thermal conductivity, resistance to latch-up, and immunity to soft errors. Furthermore, the durability and long-term dependability that SOI devices offer are becoming more and more valued by automotive standards like AEC-Q100.

Restraint:

Exorbitant production and material expenses

One of the main obstacles preventing SOI technology from being widely used is the comparatively high cost of fabrication. Compared to traditional bulk silicon wafer manufacturing, the production of SOI wafers requires more resource-intensive, complex processes like SIMOX and the Smart Cut(TM) method. Furthermore, because SOI substrates require precise control over layer thickness and have an extra insulating oxide layer, their cost is much higher. Moreover, the limited R&D budgets of small and medium-sized semiconductor companies are also impacted by cost constraints, which prevent wider industry penetration.

Opportunity:

Growing use of autonomous and electric vehicles

One of the biggest growth opportunities for SOI devices is the rapidly accelerating shift to electric vehicles (EVs) and autonomous driving technologies. These cars need electronics that are highly reliable and able to function in harsh conditions and a wide range of temperatures. SOI is the perfect choice for advanced driver-assistance systems (ADAS) sensors, power management integrated circuits, and automotive microcontrollers due to its exceptional high-temperature performance and resistance to latch-up and soft errors. Additionally, a strong long-term opportunity for SOI technology will arise as EV adoption increases and the demand for reliable and power-efficient semiconductors rises, particularly as vehicle electronics become more software-driven and networked.

Threat:

Increasing rivalry with other semiconductor technologies

Despite SOI's benefits, other semiconductor technologies-most notably FinFET and advanced bulk CMOS-are a serious threat. At advanced process nodes, FinFET in particular is widely used due to its exceptional power efficiency and scalability. Large foundries like TSMC and Intel have a competitive edge in terms of maturity, cost-effectiveness at scale, and ecosystem support because they have optimized their FinFET processes for mass production. Furthermore, bulk silicon technologies keep getting better at controlling leaks and performing better, which puts SOI's distinctive value proposition in jeopardy, particularly in high-volume manufacturing and consumer electronics that are cost-sensitive.

Covid-19 Impact:

The COVID-19 pandemic affected the silicon on insulators (SOI) market in a variety of ways. Delays in semiconductor production and SOI wafer deliveries were initially caused by workforce shortages, factory closures, and global supply chain disruptions, which had an impact on end-use industries like consumer electronics and the automotive sector. The pandemic did, however, also hasten digital transformation by raising demand for data centers, 5G infrastructure, and connected devices-all of which depend on high-performance, energy-efficient semiconductors, of which SOI technology is essential. Moreover, the long-term outlook for the SOI market improved as remote work, online services, and edge computing gained popularity.

The radio frequency (RF) devices segment is expected to be the largest during the forecast period

The radio frequency (RF) devices segment is expected to account for the largest market share during the forecast period. The growing use of SOI-based RF chips in smart phones, tablets, and 5G communication systems is primarily responsible for this dominance. RF-SOI technology is perfect for front-end modules used in wireless communication because it provides high performance at high frequencies, low power consumption, and excellent isolation. Demand for RF-SOI devices is still being driven by the increase in global mobile data traffic, as well as the development of 5G infrastructure and IoT connectivity. Furthermore, RF applications play a significant role in the expansion of the SOI market as a whole.

The smart cut segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the smart cut segment is predicted to witness the highest growth rate. The precise layer transfer made possible by Smart Cut technology makes it possible to fabricate thin, homogeneous silicon layers on insulating substrates with great accuracy and few flaws. This technique is frequently used to create sophisticated SOI wafers with improved scalability, lower power consumption, and superior electrical performance-all of which are critical for next-generation semiconductor applications like 5G, artificial intelligence, and high-speed computing. Moreover, its quick rise in the global SOI market is being fueled by its expanding use in RF devices, power electronics, and high-performance logic circuits.

Region with largest share:

During the forecast period, the North America region is expected to hold the largest market share, driven by the widespread adoption of cutting-edge technologies across industries, the presence of prominent semiconductor companies, and sophisticated research facilities. Strong demand for SOI-based products in industries like consumer electronics, autonomous vehicles, defense systems, and 5G infrastructure benefits the region. With large investments in semiconductor fabrication and design, the U.S. in particular is a major center for innovation in RF devices, MEMS, and power semiconductors. Additionally, North America's dominance in the SOI market is being further cemented by government initiatives that support domestic chip manufacturing and the growth of 5G networks.

Region with highest CAGR:

Over the forecast period, the Asia Pacific region is anticipated to exhibit the highest CAGR. The region's growing electronics manufacturing base, increased investments in semiconductor fabrication and growing use of SOI technology in cutting-edge applications like 5G, IoT, and electric vehicles are all contributing factors to this quick growth. Leading the way are nations like China, South Korea, Taiwan, and Japan, who have substantial R&D expenditures, supportive governments, and advantageous policies. Furthermore, Asia-Pacific's adoption of SOI is further accelerated by the rise in demand for high-performance, energy-efficient chips in consumer electronics and industrial automation.

Key players in the market

Some of the key players in Silicon on Insulators Market include Murata Manufacturing Co., Ltd., IBM, Sumco Corporation, Qorvo, Inc., Shin-Etsu Chemical Co., Ltd., NXP Semiconductors N.V., Magnachip Semiconductor Inc, Qualcomm Inc., Wafer World Inc., Silicon Valley Microelectronics, Inc., United Microelectronics Corporation, STMicroelectronics N.V., Intel Corporation, Skyworks Solutions, Inc. and Ultrasil Corporation.

Key Developments:

In February 2025, Murata Electronics (India) Private Limited, a subsidiary of Murata Manufacturing Co. Ltd., has signed an agreement to lease a factory at the OneHub Chennai Industrial Park, Tamil Nadu. The Japanese firm will commence full-scale operation in financial year 2026.

In February 2025, NXP Semiconductors N.V. announced it has entered into a definitive agreement to acquire Kinara, Inc., an industry leader in high performance, energy-efficient and programmable discrete neural processing units (NPUs). These devices enable a wide range of edge AI applications, including multi-modal generative AI models.

In September 2024, IBM and L&T Semiconductor Technologies (SiLT) have signed an agreement to co-develop advanced processors for edge devices, hybrid cloud systems and areas like mobility, industrial, energy, and servers. In a social media post, Union Minister for Information and Broadcasting and Electronics and IT Ashwini Vaishnaw said that this partnership will boost India's semiconductor capabilities by creating competitive products for global markets.

Products Covered:

  • Radio Frequency (RF) Devices
  • MEMS Devices
  • Power Semiconductor Devices
  • Optoelectronics
  • Memory
  • Sensors

Wafer Types Covered:

  • Radio Frequency Silicon on Insulator (RF-SOI)
  • Fully Depleted Silicon on Insulator (FD-SOI)
  • Partially Depleted Silicon on Insulator (PD-SOI)
  • Power SOI
  • Other Wafer Types

Thicknesses Covered:

  • Thin-film SOI Wafers
  • Thick-film SOI Wafers

Wafer Sizes Covered:

  • 200mm
  • 300mm

Technologies Covered:

  • Bonding Technology
  • Epitaxial Layer Transfer (ELTRAN)
  • Silicon On Sapphire (SOS)
  • Separation By Implantation of Oxygen (SIMOX)
  • Smart Cut

End Users Covered:

  • Automotive
  • Aerospace and Defense
  • Consumer Electronics
  • Entertainment and Gaming
  • Datacom and Telecom
  • Industrial Applications
  • Photonics

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Product Analysis
  • 3.7 Technology Analysis
  • 3.8 End User Analysis
  • 3.9 Emerging Markets
  • 3.10 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Silicon on Insulators Market, By Product

  • 5.1 Introduction
  • 5.2 Radio Frequency (RF) Devices
  • 5.3 MEMS Devices
  • 5.4 Power Semiconductor Devices
  • 5.5 Optoelectronics
  • 5.6 Memory
  • 5.7 Sensors

6 Global Silicon on Insulators Market, By Wafer Type

  • 6.1 Introduction
  • 6.2 Radio Frequency Silicon on Insulator (RF-SOI)
  • 6.3 Fully Depleted Silicon on Insulator (FD-SOI)
  • 6.4 Partially Depleted Silicon on Insulator (PD-SOI)
  • 6.5 Power SOI
  • 6.6 Other Wafer Types

7 Global Silicon on Insulators Market, By Thickness

  • 7.1 Introduction
  • 7.2 Thin-film SOI Wafers
  • 7.3 Thick-film SOI Wafers

8 Global Silicon on Insulators Market, By Wafer Size

  • 8.1 Introduction
  • 8.2 200mm
  • 8.3 300mm

9 Global Silicon on Insulators Market, By Technology

  • 9.1 Introduction
  • 9.2 Bonding Technology
  • 9.3 Epitaxial Layer Transfer (ELTRAN)
  • 9.4 Silicon On Sapphire (SOS)
  • 9.5 Separation By Implantation of Oxygen (SIMOX)
  • 9.6 Smart Cut

10 Global Silicon on Insulators Market, By End User

  • 10.1 Introduction
  • 10.2 Automotive
  • 10.3 Aerospace and Defense
  • 10.4 Consumer Electronics
  • 10.5 Entertainment and Gaming
  • 10.6 Datacom and Telecom
  • 10.7 Industrial Applications
  • 10.8 Photonics

11 Global Silicon on Insulators Market, By Geography

  • 11.1 Introduction
  • 11.2 North America
    • 11.2.1 US
    • 11.2.2 Canada
    • 11.2.3 Mexico
  • 11.3 Europe
    • 11.3.1 Germany
    • 11.3.2 UK
    • 11.3.3 Italy
    • 11.3.4 France
    • 11.3.5 Spain
    • 11.3.6 Rest of Europe
  • 11.4 Asia Pacific
    • 11.4.1 Japan
    • 11.4.2 China
    • 11.4.3 India
    • 11.4.4 Australia
    • 11.4.5 New Zealand
    • 11.4.6 South Korea
    • 11.4.7 Rest of Asia Pacific
  • 11.5 South America
    • 11.5.1 Argentina
    • 11.5.2 Brazil
    • 11.5.3 Chile
    • 11.5.4 Rest of South America
  • 11.6 Middle East & Africa
    • 11.6.1 Saudi Arabia
    • 11.6.2 UAE
    • 11.6.3 Qatar
    • 11.6.4 South Africa
    • 11.6.5 Rest of Middle East & Africa

12 Key Developments

  • 12.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 12.2 Acquisitions & Mergers
  • 12.3 New Product Launch
  • 12.4 Expansions
  • 12.5 Other Key Strategies

13 Company Profiling

  • 13.1 Murata Manufacturing Co., Ltd.
  • 13.2 IBM
  • 13.3 Sumco Corporation
  • 13.4 Qorvo, Inc.
  • 13.5 Shin-Etsu Chemical Co., Ltd.
  • 13.6 NXP Semiconductors N.V.
  • 13.7 Magnachip Semiconductor Inc
  • 13.8 Qualcomm Inc.
  • 13.9 Wafer World Inc.
  • 13.10 Silicon Valley Microelectronics, Inc.
  • 13.11 United Microelectronics Corporation
  • 13.12 STMicroelectronics N.V.
  • 13.13 Intel Corporation
  • 13.14 Skyworks Solutions, Inc.
  • 13.15 Ultrasil Corporation

List of Tables

  • Table 1 Global Silicon on Insulators Market Outlook, By Region (2024-2032) ($MN)
  • Table 2 Global Silicon on Insulators Market Outlook, By Product (2024-2032) ($MN)
  • Table 3 Global Silicon on Insulators Market Outlook, By Radio Frequency (RF) Devices (2024-2032) ($MN)
  • Table 4 Global Silicon on Insulators Market Outlook, By MEMS Devices (2024-2032) ($MN)
  • Table 5 Global Silicon on Insulators Market Outlook, By Power Semiconductor Devices (2024-2032) ($MN)
  • Table 6 Global Silicon on Insulators Market Outlook, By Optoelectronics (2024-2032) ($MN)
  • Table 7 Global Silicon on Insulators Market Outlook, By Memory (2024-2032) ($MN)
  • Table 8 Global Silicon on Insulators Market Outlook, By Sensors (2024-2032) ($MN)
  • Table 9 Global Silicon on Insulators Market Outlook, By Wafer Type (2024-2032) ($MN)
  • Table 10 Global Silicon on Insulators Market Outlook, By Radio Frequency Silicon on Insulator (RF-SOI) (2024-2032) ($MN)
  • Table 11 Global Silicon on Insulators Market Outlook, By Fully Depleted Silicon on Insulator (FD-SOI) (2024-2032) ($MN)
  • Table 12 Global Silicon on Insulators Market Outlook, By Partially Depleted Silicon on Insulator (PD-SOI) (2024-2032) ($MN)
  • Table 13 Global Silicon on Insulators Market Outlook, By Power SOI (2024-2032) ($MN)
  • Table 14 Global Silicon on Insulators Market Outlook, By Other Wafer Types (2024-2032) ($MN)
  • Table 15 Global Silicon on Insulators Market Outlook, By Thickness (2024-2032) ($MN)
  • Table 16 Global Silicon on Insulators Market Outlook, By Thin-film SOI Wafers (2024-2032) ($MN)
  • Table 17 Global Silicon on Insulators Market Outlook, By Thick-film SOI Wafers (2024-2032) ($MN)
  • Table 18 Global Silicon on Insulators Market Outlook, By Wafer Size (2024-2032) ($MN)
  • Table 19 Global Silicon on Insulators Market Outlook, By 200mm (2024-2032) ($MN)
  • Table 20 Global Silicon on Insulators Market Outlook, By 300mm (2024-2032) ($MN)
  • Table 21 Global Silicon on Insulators Market Outlook, By Technology (2024-2032) ($MN)
  • Table 22 Global Silicon on Insulators Market Outlook, By Bonding Technology (2024-2032) ($MN)
  • Table 23 Global Silicon on Insulators Market Outlook, By Epitaxial Layer Transfer (ELTRAN) (2024-2032) ($MN)
  • Table 24 Global Silicon on Insulators Market Outlook, By Silicon On Sapphire (SOS) (2024-2032) ($MN)
  • Table 25 Global Silicon on Insulators Market Outlook, By Separation By Implantation of Oxygen (SIMOX) (2024-2032) ($MN)
  • Table 26 Global Silicon on Insulators Market Outlook, By Smart Cut (2024-2032) ($MN)
  • Table 27 Global Silicon on Insulators Market Outlook, By End User (2024-2032) ($MN)
  • Table 28 Global Silicon on Insulators Market Outlook, By Automotive (2024-2032) ($MN)
  • Table 29 Global Silicon on Insulators Market Outlook, By Aerospace and Defense (2024-2032) ($MN)
  • Table 30 Global Silicon on Insulators Market Outlook, By Consumer Electronics (2024-2032) ($MN)
  • Table 31 Global Silicon on Insulators Market Outlook, By Entertainment and Gaming (2024-2032) ($MN)
  • Table 32 Global Silicon on Insulators Market Outlook, By Datacom and Telecom (2024-2032) ($MN)
  • Table 33 Global Silicon on Insulators Market Outlook, By Industrial Applications (2024-2032) ($MN)
  • Table 34 Global Silicon on Insulators Market Outlook, By Photonics (2024-2032) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.