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市场调查报告书
商品编码
1621668

金属芯 PCB (MCPCB) 市场机会、成长驱动因素、产业趋势分析和 2024 年至 2032 年预测

Metal Core PCB (MCPCB) Market Opportunity, Growth Drivers, Industry Trend Analysis, and Forecast 2024 to 2032

出版日期: | 出版商: Global Market Insights Inc. | 英文 125 Pages | 商品交期: 2-3个工作天内

价格
简介目录

2023 年全球金属芯 PCB (MCPCB) 市场估值为 137 亿美元,预计 2024 年至 2032 年复合年增长率为 4%。二极体(LED)技术的需求显着增加。金属芯 PCB 在 LED 应用中至关重要,因为它们可以有效管理散热。随着 LED 照明系统在住宅、商业和汽车等各种环境中不断取代萤光灯泡和传统白炽灯,对具有增强热管理功能的 MCPCB 的需求不断增加。智慧照明和汽车照明的持续扩张,特别是在电动车的背景下,进一步推动了这一市场的成长,巩固了 MCPCB 作为现代节能照明解决方案中重要组件的作用。

在汽车领域,由于产业技术的快速进步,对金属芯PCB的需求也不断增加。电动车 (EV)、自动驾驶系统和高级驾驶辅助系统 (ADAS) 等创新需要耐用且耐热的电子元件。金属芯 PCB 凭藉其卓越的散热性能在这方面表现出色。汽车中高功率电子装置的整合(包括电池管理和功率转换系统)是 MCPCB 市场成长的重要推动力。

市场可依层类型分为单层、双层和多层 MCPCB。预计单层 MCPCB 领域在预测期内的复合年增长率将超过 3%。单层 MCPCB 由安装在金属芯(通常是铝或铜)上的单一导电铜层组成,其间有绝缘介电层。这些板非常适合以最小的电路复杂性优先考虑散热的应用,使其成为 LED 照明、汽车照明和消费电子产品等行业的经济高效的选择。

市场范围
开始年份 2023年
预测年份 2024-2032
起始值 137 亿美元
预测值 200亿美元
复合年增长率 4%

此外,市场可按芯材细分为铝芯 PCB、铜芯 PCB 和其他金属芯 PCB。到2032 年,铝芯市场预计将达到90 亿美元。选择。 2023年,亚太地区引领全球MCPCB市场,占总份额超过30%。该地区的主导地位归功于其强大的电子和製造业,主要参与者依赖 MCPCB 进行有效的热管理。

在汽车和电信产业需求不断增长的推动下,美国市场也正在经历强劲成长,尤其是与 5G 基础设施和再生能源项目相关的需求。

目录

第 1 章:方法与范围

第 2 章:执行摘要

第 3 章:产业洞察

  • 产业生态系统分析
    • 影响价值链的因素
    • 利润率分析
    • 干扰
    • 未来展望
    • 製造商
    • 经销商
  • 供应商格局
  • 利润率分析
  • 重要新闻和倡议
  • 监管环境
  • 衝击力
    • 成长动力
      • LED照明需求不断增加
      • 汽车电子产品的采用率不断上升
      • 消费性电子市场的扩大
      • 电信和 5G 基础设施的进步
    • 产业陷阱与挑战
      • 製造成本高
      • 新兴技术的竞争
  • 成长潜力分析
  • 波特的分析
  • PESTEL分析

第 4 章:竞争格局

  • 介绍
  • 公司市占率分析
  • 竞争定位矩阵
  • 战略展望矩阵

第 5 章:市场估计与预测:按类型,2021-2032 年

  • 主要趋势
  • 铝芯PCB
  • 铜芯PCB
  • 其他金属芯PCB

第 6 章:市场估计与预测:按层类型,2021-2032

  • 主要趋势
  • 单层 MCPCB
  • 双层 MCPCB
  • 多层 MCPCB

第 7 章:市场估计与预测:按应用划分,2021-2032 年

  • 主要趋势
  • LED照明
  • 电源转换器
  • 电动车
  • 太阳能板
  • 电信设备
  • 汽车电子
  • 消费性电子产品
  • 航太和国防
  • 医疗器材
  • 其他的

第 8 章:市场估计与预测:按地区,2021-2032 年

  • 主要趋势
  • 北美洲
    • 我们
    • 加拿大
  • 欧洲
    • 英国
    • 德国
    • 法国
    • 义大利
    • 西班牙
    • 俄罗斯
  • 亚太地区
    • 中国
    • 印度
    • 日本
    • 韩国
    • 澳洲
  • 拉丁美洲
    • 巴西
    • 墨西哥
  • MEA
    • 南非
    • 沙乌地阿拉伯
    • 阿联酋

第 9 章:公司简介

  • ABP Electronics Limited
  • Advanced Circuits, Inc.
  • Aoshikang Technology Co., Ltd.
  • AT&S Austria Technologie & Systemtechnik AG
  • Best Technology
  • Cirexx International
  • Epec, LLC.
  • ExPlus Co.
  • Focus Technology Co., Ltd.
  • Fujikura Ltd.
  • HuanYu Future Technologies Co., Ltd.
  • Infineon
  • Insulectro
  • Isola Group
  • Meyer Burger Technology AG
  • Mitsubishi Materials Corporation
  • RIGIFLEX TECHNOLOGY INC.
  • Sierra Circuits, Inc.
  • Technotronix
  • Viasion Technology Co., Ltd.
简介目录
Product Code: 11859

The Global Metal Core PCB (MCPCB) Market was valued at USD 13.7 billion in 2023 and is projected to grow at a CAGR of 4% from 2024 to 2032. This growth is primarily driven by the global shift towards energy-efficient lighting solutions, which has significantly increased the demand for Light Emitting Diode (LED) technology. Metal core PCBs are crucial in LED applications as they efficiently manage heat dissipation. As LED lighting systems continue to replace fluorescent bulbs and traditional incandescent in various settings, including residential, commercial, and automotive, the demand for MCPCBs with enhanced thermal management features is on the rise. The ongoing expansion of smart lighting and automotive lighting, especially in the context of electric vehicles, is further fueling this market growth, solidifying the role of MCPCBs as vital components in modern energy-efficient lighting solutions.

In the automotive sector, the demand for metal core PCBs is also increasing due to the industry's rapid technological advancements. Innovations such as electric vehicles (EVs), autonomous driving systems, and advanced driver-assistance systems (ADAS) require durable and heat-resistant electronic components. Metal core PCBs excel in this regard, thanks to their exceptional heat dissipation properties. The integration of high-power electronics in vehicles, including systems for battery management and power conversion, is a significant driver of growth within the MCPCB market.

The market can be categorized based on layer type into single-layer, double-layer, and multi-layer MCPCBs. The single-layer MCPCB segment is anticipated to grow at a CAGR of over 3% during the forecast period. Single-layer MCPCBs consist of a single conductive copper layer mounted on a metal core, typically aluminum or copper, with an insulating dielectric layer in between. These boards are ideal for applications that prioritize heat dissipation with minimal circuit complexity, making them a cost-effective choice for industries such as LED lighting, automotive lighting, and consumer electronics.

Market Scope
Start Year2023
Forecast Year2024-2032
Start Value$13.7 Billion
Forecast Value$ 20 Billion
CAGR4%

Additionally, the market can be segmented by core material into aluminum core PCBs, copper core PCBs, and other metal core PCBs. The aluminum core segment is expected to reach USD 9 billion by 2032. Aluminum core PCBs are favored for their excellent thermal conductivity, lightweight nature, and cost-effectiveness, making them ideal for applications that require efficient heat dissipation without adding significant weight. The Asia-Pacific region led the global MCPCB market in 2023, accounting for over 30% of the total share. This region's dominance is attributed to its robust electronics and manufacturing sectors, with major players relying on MCPCBs for effective heat management.

The U.S. market is also experiencing strong growth, driven by increasing demand from the automotive and telecommunications industries, particularly related to 5G infrastructure and renewable energy projects.

Table of Contents

Chapter 1 Methodology & Scope

  • 1.1 Market scope & definitions
  • 1.2 Base estimates & calculations
  • 1.3 Forecast calculations
  • 1.4 Data sources
    • 1.4.1 Primary
    • 1.4.2 Secondary
      • 1.4.2.1 Paid sources
      • 1.4.2.2 Public sources

Chapter 2 Executive Summary

  • 2.1 Industry synopsis, 2021-2032

Chapter 3 Industry Insights

  • 3.1 Industry ecosystem analysis
    • 3.1.1 Factor affecting the value chain
    • 3.1.2 Profit margin analysis
    • 3.1.3 Disruptions
    • 3.1.4 Future outlook
    • 3.1.5 Manufacturers
    • 3.1.6 Distributors
  • 3.2 Supplier landscape
  • 3.3 Profit margin analysis
  • 3.4 Key news & initiatives
  • 3.5 Regulatory landscape
  • 3.6 Impact forces
    • 3.6.1 Growth drivers
      • 3.6.1.1 Increasing demand for LED lighting
      • 3.6.1.2 Rising adoption in automotive electronics
      • 3.6.1.3 Expansion of consumer electronics market
      • 3.6.1.4 Advancements in telecommunications and 5G infrastructure
    • 3.6.2 Industry pitfalls & challenges
      • 3.6.2.1 High manufacturing costs
      • 3.6.2.2 Competition of emerging technologies
  • 3.7 Growth potential analysis
  • 3.8 Porter's analysis
  • 3.9 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

  • 4.1 Introduction
  • 4.2 Company market share analysis
  • 4.3 Competitive positioning matrix
  • 4.4 Strategic outlook matrix

Chapter 5 Market Estimates & Forecast, By Type, 2021-2032 (USD Million)

  • 5.1 Key trends
  • 5.2 Aluminum core PCBs
  • 5.3 Copper core PCBs
  • 5.4 Other metal core PCBs

Chapter 6 Market Estimates & Forecast, By Layer Type, 2021-2032 (USD Million)

  • 6.1 Key trends
  • 6.2 Single-Layer MCPCBs
  • 6.3 Double-Layer MCPCBs
  • 6.4 Multi-layer MCPCBs

Chapter 7 Market Estimates & Forecast, By Application, 2021-2032 (USD Million)

  • 7.1 Key trends
  • 7.2 LED lighting
  • 7.3 Power converters
  • 7.4 Electric vehicles
  • 7.5 Solar panels
  • 7.6 Telecommunications equipment
  • 7.7 Automotive electronics
  • 7.8 Consumer electronics
  • 7.9 Aerospace and defense
  • 7.10 Medical devices
  • 7.11 Others

Chapter 8 Market Estimates & Forecast, By Region, 2021-2032 (USD Million)

  • 8.1 Key trends
  • 8.2 North America
    • 8.2.1 U.S.
    • 8.2.2 Canada
  • 8.3 Europe
    • 8.3.1 UK
    • 8.3.2 Germany
    • 8.3.3 France
    • 8.3.4 Italy
    • 8.3.5 Spain
    • 8.3.6 Russia
  • 8.4 Asia Pacific
    • 8.4.1 China
    • 8.4.2 India
    • 8.4.3 Japan
    • 8.4.4 South Korea
    • 8.4.5 Australia
  • 8.5 Latin America
    • 8.5.1 Brazil
    • 8.5.2 Mexico
  • 8.6 MEA
    • 8.6.1 South Africa
    • 8.6.2 Saudi Arabia
    • 8.6.3 UAE

Chapter 9 Company Profiles

  • 9.1 ABP Electronics Limited
  • 9.2 Advanced Circuits, Inc.
  • 9.3 Aoshikang Technology Co., Ltd.
  • 9.4 AT&S Austria Technologie & Systemtechnik AG
  • 9.5 Best Technology
  • 9.6 Cirexx International
  • 9.7 Epec, LLC.
  • 9.8 ExPlus Co.
  • 9.9 Focus Technology Co., Ltd.
  • 9.10 Fujikura Ltd.
  • 9.11 HuanYu Future Technologies Co., Ltd.
  • 9.12 Infineon
  • 9.13 Insulectro
  • 9.14 Isola Group
  • 9.15 Meyer Burger Technology AG
  • 9.16 Mitsubishi Materials Corporation
  • 9.17 RIGIFLEX TECHNOLOGY INC.
  • 9.18 Sierra Circuits, Inc.
  • 9.19 Technotronix
  • 9.20 Viasion Technology Co., Ltd.