碳化硅市场机会、成长动力、产业趋势分析及2025-2034年预测

2024 年全球碳化硅市场价值为 42 亿美元，预计 2025 年至 2034 年期间的复合年增长率将达到 34.5%，这得益于电动汽车 (EV) 的普及、可再生能源应用的扩大以及对高效电力电子产品的需求不断增长。随着各行各业转向先进的能源解决方案，碳化硅凭藉其卓越的效率、耐用性和热性能，已成为各种应用中的关键材料。

这一成长的主要驱动力之一是全球对电动车的需求激增。汽车製造商越来越多地将碳化硅元件整合到电力电子设备中，以提高车辆性能、提高充电效率并延长电池续航里程。碳化硅基功率半导体可实现更高的能量转换效率，减少电力传动系统中的功率损耗和热产生。随着各国政府推出严格的排放法规并鼓励电动车的普及，碳化硅的需求持续加速成长。除了电动车之外，碳化硅在再生能源应用中也发挥着至关重要的作用，尤其是在太阳能和风能係统中。其高导热性和耐极端条件性提高了能源效率和系统寿命，使其成为下一代电源解决方案的重要组成部分。

市场按设备类型细分，其中 SiC 模组在 2024 年创造 17 亿美元的收入。这些模组由二极体和 MOSFET 等元件组成，广泛应用于电动车、工业电源和再生能源基础设施。它们能够承受高电压和高温，因此非常适合电源转换应用，尤其是电动车逆变器和充电站。随着汽车产业继续向电动车转型，对 SiC 模组的需求预计将大幅上升，从而推动整体市场成长。

碳化硅也按产品类型分类，其中黑碳化硅在 2024 年占据 42.3% 的主导市场。黑碳化硅因其出色的硬度和强度而广泛应用于汽车、航太和金属製造等行业的磨料应用。它在研磨、切割、抛光和耐磨涂层中的应用使其成为高性能製造中不可或缺的一部分。对耐用、高效磨料的需求不断增长是该行业扩张的关键因素。

受电动车技术、工业自动化和再生能源专案进步的推动，北美在 2024 年将占据全球碳化硅市场份额的 28.8%。该地区对能源效率的关注和高性能电子产品的广泛采用推动了市场扩张。随着各行各业继续投资下一代技术，碳化硅将在塑造电力电子和永续能源解决方案的未来方面发挥至关重要的作用。

目录

第一章：方法论与范围

第二章：执行摘要

第三章：行业洞察

• 产业生态系统分析
• 产业衝击力
  • 成长动力
    • 对节能电力电子产品的需求不断增加
    • 电动车（EV）的普及率不断提高
    • 再生能源系统的成长
    • 5G和电信基础设施的扩展
    • 扩大航太和国防领域的应用
  • 产业陷阱与挑战
    • 製造成本高
    • 技术复杂性和整合问题
• 成长潜力分析
• 监管格局
• 技术格局
• 未来市场趋势
• 差距分析
• 波特的分析
• PESTEL 分析

第四章：竞争格局

• 介绍
• 公司市占率分析
• 主要市场参与者的竞争分析
• 竞争定位矩阵
• 策略仪表板

第五章：市场估计与预测：依产品类型，2021 年至 2034 年

• 主要趋势
• 黑碳化硅
• 绿碳化硅
• 其他碳化硅类型

第六章：市场估计与预测：按设备类型，2021 年至 2034 年

• 主要趋势
• SiC分立元件
  • 二极体
  • 场效电晶体
  • BJT（双极接面电晶体）
  • JFET（结型场效电晶体）
• SiC 模组
• 其他SiC装置

第七章：市场预估与预测：依晶圆尺寸，2021 – 2034

• 主要趋势
• 2英吋
• 4吋
• 6吋以上

第 8 章：市场估计与预测：按应用，2021 年至 2034 年

• 主要趋势
• 电力电子
  • 电源和逆变器
  • 无线充电
  • 电网设备
  • 工业马达驱动器
  • 电动车充电基础设施
  • 再生能源系统
• 光学设备
  • LED照明
  • 光子学
  • 雷射应用
  • 紫外线探测器
• 感测
  • 压力感测器
  • 温度感测器
  • 气体感测器
  • 辐射探测器
  • 其他应用

第九章：市场估计与预测：依生产方式，2021 年至 2034 年

• 主要趋势
• 艾奇逊过程
• 物理气相传输（PVT）
• 化学气相沉积 (CVD)
• 其他生产方法

第 10 章：市场估计与预测：按最终用途产业，2021 年至 2034 年

• 主要趋势
• 汽车
• 航太与国防
• 电信
• 能源与电力
• 卫生保健
• 电子和半导体
• 工业製造
• 石油和天然气
• 矿业
• 化学加工
• 消费性电子产品
• 研究与开发

第 11 章：市场估计与预测：按地区，2021 年至 2034 年

• 主要趋势
• 北美洲
  • 我们
  • 加拿大
• 欧洲
  • 德国
  • 英国
  • 法国
  • 西班牙
  • 义大利
  • 荷兰
• 亚太地区
  • 中国
  • 印度
  • 日本
  • 澳洲
  • 韩国
• 拉丁美洲
  • 巴西
  • 墨西哥
  • 阿根廷
• 中东和非洲
  • 沙乌地阿拉伯
  • 南非
  • 阿联酋

第十二章：公司简介

• ROHM Co., Ltd.
• Central Semiconductor Corp.
• Cree, Inc.
• Danfoss A/S
• Fuji Electric Co., Ltd.
• General Electric Company (GE Aviation)
• GeneSiC Semiconductor Inc.
• Global Power Technologies Group
• Hitachi Power Semiconductor Device, Ltd.
• II-VI Incorporated
• Infineon Technologies AG
• Littelfuse, Inc.
• Microsemi Corporation
• Mitsubishi Electric Corporation
• NXP Semiconductors NV
• ON Semiconductor Corporation
• Power Integrations, Inc.
• Renesas Electronics Corporation
• STMicroelectronics NV
• Taiyo Yuden Co., Ltd.
• Toshiba Corporation
• United Silicon Carbide, Inc. (USCi)

The Global Silicon Carbide Market was valued at USD 4.2 billion in 2024 and is projected to expand at a CAGR of 34.5% from 2025 to 2034, driven by the rising adoption of electric vehicles (EVs), expanding renewable energy applications, and increasing demand for high-efficiency power electronics. As industries shift toward advanced energy solutions, silicon carbide has emerged as a crucial material in various applications due to its superior efficiency, durability, and thermal performance.

One of the primary drivers of this growth is the surging demand for EVs worldwide. Automakers are increasingly integrating silicon carbide components into power electronics to enhance vehicle performance, improve charging efficiency, and extend battery range. SiC-based power semiconductors enable higher energy conversion efficiency, reducing power losses and heat generation in electric drivetrains. As governments introduce stringent emissions regulations and incentivize EV adoption, the demand for silicon carbide continues to accelerate. In addition to EVs, silicon carbide plays a critical role in renewable energy applications, particularly in solar and wind power systems. Its high thermal conductivity and resistance to extreme conditions enhance energy efficiency and system longevity, making it an essential component in next-generation power solutions.

The market is segmented by device type, with SiC modules generating USD 1.7 billion in revenue in 2024. These modules, which consist of components such as diodes and MOSFETs, are extensively used in electric vehicles, industrial power supplies, and renewable energy infrastructure. Their ability to handle high voltages and temperatures makes them ideal for power conversion applications, particularly in EV inverters and charging stations. As the automotive industry continues transitioning toward electric mobility, the demand for SiC modules is expected to rise significantly, fueling overall market growth.

Silicon carbide is also categorized by product type, with black silicon carbide holding a dominant market share of 42.3% in 2024. Recognized for its exceptional hardness and strength, black SiC is widely utilized in abrasive applications across industries such as automotive, aerospace, and metal fabrication. Its use in grinding, cutting, polishing, and wear-resistant coatings makes it indispensable in high-performance manufacturing. The increasing demand for durable and efficient abrasive materials has been a key factor in the segment's expansion.

North America accounted for 28.8% of the global silicon carbide market share in 2024, driven by advancements in electric vehicle technology, industrial automation, and renewable energy projects. The region's focus on energy efficiency and the widespread adoption of high-performance electronics have propelled market expansion. As industries continue investing in next-generation technologies, silicon carbide is set to play a vital role in shaping the future of power electronics and sustainable energy solutions.

Table of Contents

Chapter 1 Methodology and Scope

• 1.1 Market scope and definitions
• 1.2 Research design
  • 1.2.1 Research approach
  • 1.2.2 Data collection methods
• 1.3 Base estimates and calculations
  • 1.3.1 Base year calculation
  • 1.3.2 Key trends for market estimation
• 1.4 Forecast model
• 1.5 Primary research and validation
  • 1.5.1 Primary sources
  • 1.5.2 Data mining sources

Chapter 2 Executive Summary

• 2.1 Industry 360⁰ synopsis

Chapter 3 Industry Insights

• 3.1 Industry ecosystem analysis
• 3.2 Industry impact forces
  • 3.2.1 Growth drivers
    • 3.2.1.1 Increasing demand for energy efficient power electronics
    • 3.2.1.2 Growing adoption of electric vehicles (EVs)
    • 3.2.1.3 Growth in renewable energy systems
    • 3.2.1.4 Expansion of 5G and telecommunications infrastructure
    • 3.2.1.5 Expanding applications in aerospace and defense
  • 3.2.2 Industry pitfalls and challenges
    • 3.2.2.1 High manufacturing costs
    • 3.2.2.2 Technical complexity and integration issues
• 3.3 Growth potential analysis
• 3.4 Regulatory landscape
• 3.5 Technology landscape
• 3.6 Future market trends
• 3.7 Gap analysis
• 3.8 Porter's analysis
• 3.9 PESTEL analysis

Chapter 4 Competitive Landscape, 2024

• 4.1 Introduction
• 4.2 Company market share analysis
• 4.3 Competitive analysis of major market players
• 4.4 Competitive positioning matrix
• 4.5 Strategy dashboard

Chapter 5 Market Estimates and Forecast, By Product Type, 2021 – 2034 (USD Bn)

• 5.1 Key trends
• 5.2 Black silicon carbide
• 5.3 Green silicon carbide
• 5.4 Other silicon carbide types

Chapter 6 Market Estimates and Forecast, By Device Type, 2021 – 2034 (USD Bn)

• 6.1 Key trends
• 6.2 SiC discrete devices
  • 6.2.1 Diodes
  • 6.2.2 MOSFETs
  • 6.2.3 BJTs (Bipolar Junction Transistors)
  • 6.2.4 JFETs (Junction Field Effect Transistors)
• 6.3 SiC modules
• 6.4 Other SiC devices

Chapter 7 Market Estimates and Forecast, By Wafer Size, 2021 – 2034 (USD Bn)

• 7.1 Key trends
• 7.2 2-inch
• 7.3 4-inch
• 7.4 6-inch and above

Chapter 8 Market Estimates and Forecast, By Application, 2021 – 2034 (USD Bn)

• 8.1 Key trends
• 8.2 Power electronics
  • 8.2.1 Power supply and inverter
  • 8.2.2 Wireless charging
  • 8.2.3 Power grid devices
  • 8.2.4 Industrial motor drives
  • 8.2.5 Electric vehicle charging infrastructure
  • 8.2.6 Renewable energy systems
• 8.3 Optical Devices
  • 8.3.1 LED lighting
  • 8.3.2 Photonics
  • 8.3.3 Laser applications
  • 8.3.4 UV detectors
• 8.4 Sensing
  • 8.4.1 Pressure sensors
  • 8.4.2 Temperature sensors
  • 8.4.3 Gas sensors
  • 8.4.4 Radiation detectors
  • 8.4.5 Other applications

Chapter 9 Market Estimates and Forecast, By Production Method, 2021 – 2034 (USD Bn)

• 9.1 Key trends
• 9.2 Acheson process
• 9.3 Physical Vapor Transport (PVT)
• 9.4 Chemical Vapor Deposition (CVD)
• 9.5 Other production methods

Chapter 10 Market Estimates and Forecast, By End Use industry, 2021 – 2034 (USD Bn)

• 10.1 Key trends
• 10.2 Automotive
• 10.3 Aerospace & defense
• 10.4 Telecommunications
• 10.5 Energy & power
• 10.6 Healthcare
• 10.7 Electronics & semiconductors
• 10.8 Industrial manufacturing
• 10.9 Oil & gas
• 10.10 Mining
• 10.11 Chemical processing
• 10.12 Consumer electronics
• 10.13 Research & development

Chapter 11 Market Estimates and Forecast, By Region, 2021 – 2034 (USD Bn & Kilo Tons)

• 11.1 Key trends
• 11.2 North America
  • 11.2.1 U.S.
  • 11.2.2 Canada
• 11.3 Europe
  • 11.3.1 Germany
  • 11.3.2 UK
  • 11.3.3 France
  • 11.3.4 Spain
  • 11.3.5 Italy
  • 11.3.6 Netherlands
• 11.4 Asia Pacific
  • 11.4.1 China
  • 11.4.2 India
  • 11.4.3 Japan
  • 11.4.4 Australia
  • 11.4.5 South Korea
• 11.5 Latin America
  • 11.5.1 Brazil
  • 11.5.2 Mexico
  • 11.5.3 Argentina
• 11.6 Middle East and Africa
  • 11.6.1 Saudi Arabia
  • 11.6.2 South Africa
  • 11.6.3 UAE

Chapter 12 Company Profiles

• 12.1 ROHM Co., Ltd.
• 12.2 Central Semiconductor Corp.
• 12.3 Cree, Inc.
• 12.4 Danfoss A/S
• 12.5 Fuji Electric Co., Ltd.
• 12.6 General Electric Company (GE Aviation)
• 12.7 GeneSiC Semiconductor Inc.
• 12.8 Global Power Technologies Group
• 12.9 Hitachi Power Semiconductor Device, Ltd.
• 12.10 II-VI Incorporated
• 12.11 Infineon Technologies AG
• 12.12 Littelfuse, Inc.
• 12.13 Microsemi Corporation
• 12.14 Mitsubishi Electric Corporation
• 12.15 NXP Semiconductors N.V.
• 12.16 ON Semiconductor Corporation
• 12.17 Power Integrations, Inc.
• 12.18 Renesas Electronics Corporation
• 12.19 STMicroelectronics N.V.
• 12.20 Taiyo Yuden Co., Ltd.
• 12.21 Toshiba Corporation
• 12.22 United Silicon Carbide, Inc. (USCi)