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市场调查报告书
商品编码
1959643
无线充电IC市场机会、成长要素、产业趋势分析及2026年至2035年预测Wireless Charging IC Market Opportunity, Growth Drivers, Industry Trend Analysis, and Forecast 2026 - 2035 |
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2025 年全球无线充电积体电路 (IC) 市场价值为 34 亿美元,预计到 2035 年将达到 434 亿美元,年复合成长率为 31%。

无线充电积体电路 (IC) 是专门用于管理无线充电系统中感应式功率传输的半导体元件。它们将发射线圈提供的交流电转换为适合电池充电的直流电。这些 IC 还监控通讯协定、调节电压和电流、实现异物检测,并提高多个电子平台的整体能源效率。电源管理架构的快速创新和无线充电解决方案的日益普及正在加速市场对这类 IC 的需求。随着产业和消费者越来越重视便利性、耐用性和精简的设备设计,製造商正在大力投资先进的无线电力控制技术。无线充电功能与紧凑型高性能电子设备的整合度不断提高,也持续提升高效 IC 解决方案在全球的重要性。
| 市场范围 | |
|---|---|
| 开始年份 | 2025 |
| 预测年份 | 2026-2035 |
| 起始值 | 34亿美元 |
| 预测金额 | 434亿美元 |
| 复合年增长率 | 31% |
预计对自动化技术的投资增加将进一步推动对无线充电积体电路的需求。工业用户正在寻求高效、低维护的供电系统,以减少物理磨损并提高运行连续性。采用无线充电积体电路的非接触式电力传输最大限度地减少了对机械连接器的依赖,并提高了系统可靠性。无线充电积体电路在汽车、工业、通讯和消费性电子领域的应用日益广泛,增强了其长期成长前景。随着标准化和安全要求的不断发展,製造商正在开发能够支援跨各种应用的安全互通无线电力传输的积体电路平台。
预计到2025年,发送器IC市占率将达到54.01%,并有望持续保持强劲成长。这一成长主要得益于共用充电基础设施的日益普及以及对符合先进充电标准的高功率产品需求的不断增长。增强型发送器设计对于支援超过50W的输出功率至关重要,同时还要实现精确的功率控制、温度控管和异物侦测。为了抓住不断扩展的基础设施机会,製造商正优先开发整合先进热保护、高效氮化镓元件、紧凑型多线圈配置以及符合汽车级AEC-Q100认证的高功率发送器IC。
预计到2025年,15W低功率充电器市场规模将达22亿美元。由于市场对满足日常充电需求的紧凑型、高能源效率积体电路(IC)有着广泛的需求,该细分市场占据了最大的市场份额。 5-10W功率范围内的充电器则着重低矮设计、降低发热量和通用相容性标准。成本效益和电池优化进一步巩固了此功率类别在大众消费市场的领先地位。
预计到2025年,北美无线充电IC市占率将达到19.4%。该地区的成长主要得益于先进电子技术的早期应用以及无线充电功能在互联设备中的广泛整合。汽车领域的整合是关键的成长路径,这主要得益于电动出行和车载数位系统的创新。完善的法规结构和积极的行业合作促进了市场的有序发展。该地区的特点是技术持续进步、整车厂商与零件供应商之间的策略合作以及下一代无线充电解决方案的快速普及。
The Global Wireless Charging IC Market was valued at USD 3.4 billion in 2025 and is estimated to grow at a CAGR of 31% to reach USD 43.4 billion by 2035.

A wireless charging integrated circuit is a dedicated semiconductor component engineered to manage inductive power transfer within wireless charging systems. It converts alternating current supplied by the transmitting coil into direct current suitable for battery charging. These ICs also supervise communication protocols, regulate voltage and current flow, enable foreign object detection, and enhance overall energy efficiency across multiple electronic platforms. Rapid innovation in power management architecture and rising adoption of cable-free charging solutions is accelerating demand. As industries and consumers increasingly prioritize convenience, durability, and streamlined device design, manufacturers are investing heavily in advanced wireless power control technologies. Expanding integration of wireless charging capabilities into compact and high-performance electronics continues to elevate the importance of high-efficiency IC solutions worldwide.
| Market Scope | |
|---|---|
| Start Year | 2025 |
| Forecast Year | 2026-2035 |
| Start Value | $3.4 Billion |
| Forecast Value | $43.4 Billion |
| CAGR | 31% |
Growing investments in automation technologies are expected to stimulate demand for wireless charging ICs further. Industrial operators are seeking efficient, low-maintenance power delivery systems that reduce physical wear and improve operational continuity. Contactless power transfer supported by wireless charging ICs minimizes reliance on mechanical connectors and enhances system reliability. Adoption is broadening across automotive, industrial, telecommunications, and consumer electronics sectors, strengthening long-term growth prospects. As standardization and safety requirements evolve, manufacturers are developing IC platforms capable of supporting secure and interoperable wireless power transfer across diverse applications.
The transmitter IC segment accounted for 54.01% share in 2025 and is anticipated to witness strong growth momentum. Expansion is supported by increasing deployment of shared charging infrastructure and higher power requirements aligned with advanced charging standards. Enhanced transmitter designs are necessary to enable accurate power regulation, thermal management, and foreign object detection while supporting output levels exceeding 50W. Manufacturers are prioritizing high-power transmitter IC development, integrating advanced thermal protection, efficient gallium nitride components, compact multi-coil configurations, and compliance with automotive-grade AEC-Q100 certification to capture expanding infrastructure opportunities.
The low-range 15W segment generated USD 2.2 billion in 2025. This segment maintains the largest share due to widespread demand for compact and energy-efficient ICs optimized for everyday charging needs. Devices operating within the 5-10W range emphasize slim form factors, reduced heat generation, and universal compatibility standards. Cost efficiency and battery optimization further reinforce the dominance of this power category within the mass-market consumer segment.
North America Wireless Charging IC Market held a 19.4% share in 2025. Regional growth is supported by early adoption of advanced electronic technologies and strong integration of wireless charging capabilities across connected devices. Automotive integration represents a significant growth avenue, driven by innovation in electrified mobility and in-cabin digital systems. Established regulatory frameworks and active industry collaboration contribute to structured market development. The region is characterized by ongoing technological advancements, strategic partnerships between OEMs and component suppliers, and rapid implementation of next-generation wireless charging solutions.
Key participants operating in the Global Wireless Charging IC Market include Texas Instruments Incorporated, Qualcomm Incorporated, STMicroelectronics, Infineon Technologies AG, NXP Semiconductors, Renesas Electronics Corporation, Analog Devices, MediaTek Inc., Nordic Semiconductor, Richtek Technology Corporation, Silergy Corp., Samsung, Toshiba Electronic Devices & Storage Corporation, Energous Corporation, ConvenientPower HK Limited, Kinetic Technologies, Maxic Technology Incorporated, ABLIC, Southchip Semiconductor Technology (Shanghai) Co., Ltd., Weltrend Semiconductor, Inc., LAPIS Technology Co., Ltd., BOEONE, FU DA TONG TECHNOLOGY CO., LTD., and Xiamen Newyea Science and Technology Co., Ltd.. Companies competing in the Global Wireless Charging IC Market are reinforcing their competitive standing through sustained innovation and technology differentiation. Many firms are increasing investment in research and development to design high-efficiency, compact, and thermally optimized IC architectures that align with evolving global standards. Strategic collaborations with device manufacturers and automotive OEMs are strengthening supply chain integration and long-term contracts. Businesses are also focusing on certification compliance, automotive-grade reliability, and advanced power management features to address emerging infrastructure requirements. Geographic expansion into high-growth regions, combined with portfolio diversification across transmitter and receiver solutions, supports broader market penetration.