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市场调查报告书
商品编码
1459024

全球云端 EDA 市场

Cloud EDA
出版日期: | 出版商: Global Industry Analysts, Inc. | 英文 218 Pages | 商品交期: 最快1-2个工作天内

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简介目录

预计2030年全球云端EDA市场将达到116亿美元

全球云端 EDA 市场预计 2023 年为 78 亿美元，预计到 2030 年将达到 116 亿美元，2023 年至 2030 年复合年增长率为 5.1%。半导体智慧财产权 (SIP) 是本报告分析的细分市场之一，预计复合年增长率为 5.5%，到分析期结束时将达到 44 亿美元。预计未来八年电脑辅助工程 (CAE) 领域的复合年增长率为 6%。

美国市场预计成长23亿美元，中国复合年增长率为6.1%

预计到 2023 年，美国云端 EDA 市场价值将达到 23 亿美元。中国作为世界第二大经济体，预计2030年市场规模将达19亿美元，2023年至2030年分析期间复合年增长率为6.1%。其他值得注意的区域市场包括日本和加拿大，预计 2023 年至 2030 年将分别成长 4.2% 和 4.7%。在欧洲，德国的复合年增长率预计约为 4.5%。

推出 2024 年令人兴奋的新报告功能

完全访问影响者参与统计数据

免费存取数位檔案和「MarketGlass」研究平台。我们独特的 MarketGlass 平台使我们能够集体协作地释放世界各地专家的创造力和市场知识。我们的尖端工具提供世界一流的市场可视性，同时保护市场参与企业的隐私和身分。报告中的数字、统计数据和市场描述是基于该领域专家和影响者共用的全面见解。

使用即时资料模拟器工具和自订报告产生参与互动式调查。

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1 年免费报告更新

竞争覆盖范围，包括主要参与者的全球市场占有率

多个地区参与者的市场影响分析（强/活跃/利基/次要）

访问专家/影响者访谈、播客、新闻公告和活动主题演讲的 YouTube 视频

2024 年世界经济有何预期

货币紧缩和相关利率上升导致的地缘政治和经济不稳定将在 2024 年造成动盪的局面。一些因素将继续给復苏之路带来压力，包括中东的敌对行动和日益频繁的气候灾害。儘管存在风险，但一些积极因素正在显现，包括通货紧缩征兆更加明显、对顽固通膨的担忧有所缓解、供应链正常化以及儘管能源成本波动但价格仍有所回落。这一切已经开始发生。印度和美国等二十一国集团国家的选举可能会影响资本流动和投资策略。儘管印度作为全球投资目的地的地位日益突出，但在充满活力的人才和资本生态系统的推动下，美国科技公司将继续占据主导地位。对于寻求高成长潜力的投资者来说，硅谷和其他高科技公司的投资机会仍然具有吸引力，因为国内经济儘管放缓但仍具有韧性，且法规环境有利。欧洲持续应对紧缩的货币政策和景气衰退风险，但英国的前景最严峻，2024 年景气衰退的风险最高。中国仍然是通用凭证，其成长预计将受到政府支出和消费者支出改善的支持。动盪的环境可能为投资者和公司带来机会和挑战。投资决策的灵活性和策略远见对于生存仍然至关重要，同时将波动性视为成长的催化剂。

受访企业范例

  • Autodesk, Inc.
  • Cadence Design Systems, Inc.
  • ANSYS, Inc.
  • Arm Ltd.
  • Aspen Technology, Inc.
  • Aldec, Inc.
  • Altair Engineering, Inc.
  • Bentley Systems, Inc.
  • CAST, Inc.
  • Achronix Semiconductor Corporation
  • Altium Limited
  • Agnisys Inc.
  • ALTEM Technologies
  • 4.ST Belgium
  • Ceetron AS

目录

第一章调查方法

第 2 章执行摘要

  • 市场概况
  • 主要企业
  • 市场趋势和驱动因素
  • 全球市场展望

第三章市场分析

  • 美国
  • 加拿大
  • 日本
  • 中国
  • 欧洲
  • 法国
  • 德国
  • 义大利
  • 英国
  • 其他欧洲国家
  • 亚太地区
  • 世界其他地区

第四章 比赛

简介目录
Product Code: MCP11069

Global Cloud EDA Market to Reach $11.6 Billion by 2030

The global market for Cloud EDA estimated at US$7.8 Billion in the year 2023, is expected to reach US$11.6 Billion by 2030, growing at a CAGR of 5.1% over the period 2023-2030. Semiconductor Intellectual Property (SIP), one of the segments analyzed in the report, is expected to record 5.5% CAGR and reach US$4.4 Billion by the end of the analysis period. Growth in the Computer Aided Engineering (CAE) segment is estimated at 6% CAGR for the next 8-year period.

The U.S. Market is Estimated at $2.3 Billion, While China is Forecast to Grow at 6.1% CAGR

The Cloud EDA market in the U.S. is estimated at US$2.3 Billion in the year 2023. China, the world`s second largest economy, is forecast to reach a projected market size of US$1.9 Billion by the year 2030 trailing a CAGR of 6.1% over the analysis period 2023 to 2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 4.2% and 4.7% respectively over the 2023-2030 period. Within Europe, Germany is forecast to grow at approximately 4.5% CAGR.

Introducing Our Exciting New Report Features for 2024

Full access to influencer engagement stats

Free access to our digital archives & "MarketGlass" research platform. Our proprietary MarketGlass platform is fully enabled to unlock creativity and market knowledge of domain experts worldwide in a cohesive and collaborative manner. Our state-of-art tools bring world class market perspectives while protecting participants` privacy and identity. Numbers, statistics and market narrative in the report are based on fully curated insights shared by domain experts and influencers in this space.

Opportunity to engage with interactive questionnaires that come with real-time data simulator tools & bespoke report generation capabilities

Full client access to peer collaborative and interactive platform for cross-enterprise smart exchange of ideas

Complimentary report updates for one year

Competitor coverage with global market shares of major players

Player market presence analysis (Strong/Active/Niche/Trivial) across multiple geographies

Access to curated YouTube video transcripts of domain experts/influencer interviews, podcasts, press statements and event keynotes

What to Expect from the Global Economy in 2024

Edgy geopolitics, and economic instability caused by monetary policy tightening and ensuing higher interest rates will create a tumultuous landscape for 2024. Several factors will continue to exert pressure on the path to recovery including hostilities in the Middle East and increasingly common climate disasters. Among the risks, several positives are also taking shape such as growing signs of disinflation and easing of anxiety over stubborn inflation, supply chain normalization and price moderation despite volatility in energy costs. Elections across several G21 jurisdictions, notably in India and the United States, will have potential ramifications for capital flows and investment strategies. While India emerges as a compelling destination in the global investment landscape, U.S, based tech firms will continue to dominate, fueled by a dynamic ecosystem of talent and capital. Tech opportunities in Silicon Valley and beyond remain attractive for investors seeking high-growth prospects supported largely by a resilient albeit slowing domestic economy and conducive regulatory environment. Europe will continue to battle tight monetary policy and recession risks with U.K. having the most challenging outlook and running the greatest risk of recession in 2024. China remains a wild card with hope for growth in the country underpinned by government spending and improvements in consumer spending. The volatile environment will offer both opportunities and challenges for investors and businesses alike. Embracing volatility as a catalyst for growth together with agility and strategic foresight in navigating investment decisions will remain important for survival.

Select Competitors (Total 36 Featured) -

  • Autodesk, Inc.
  • Cadence Design Systems, Inc.
  • ANSYS, Inc.
  • Arm Ltd.
  • Aspen Technology, Inc.
  • Aldec, Inc.
  • Altair Engineering, Inc.
  • Bentley Systems, Inc.
  • CAST, Inc.
  • Achronix Semiconductor Corporation
  • Altium Limited
  • Agnisys Inc.
  • ALTEM Technologies
  • 4.ST Belgium
  • Ceetron AS

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Cloud EDA - Global Key Competitors Percentage Market Share in 2023 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2023 (E)
    • Moving to the Cloud is a Matter of Survival for Companies in the 21st Century
    • Cloud is a Matter of Survival, A Urgent Business Need for Businesses to Stay Afloat & Excel in Competitive Markets: Global Market for Cloud Computing Services (In US$ Billion) for Years 2021, 2023, 2025 and 2027
    • Global Economic Outlook
    • Electronic Design Automation (EDA) & Cloud EDA: Definition, Importance & Benefits
    • Companies Move EDA Into the Cloud. Here's Why
    • Recent Market Activity
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • The Storm Wrought by the Pandemic Changes Competitive Dynamics, Forcing Semiconductor Leaders to Weave New Strategies to Survive Post Pandemic Times
    • EDA & IP Are Two Sides of the Same Coin. Competitive Pressure to Secure IPs Push Up Willingness to Invest in Cloud EDA
    • IP Cores per SoC
    • The Race to Secure IP Increases Reliance on Innovative EDA Tools to Rapidly Design Chips, Especially Cloud EDA: Global Semiconductor (Silicon) Intellectual Property (SIP) (In US$ Million) for Years 2021, 2023, 2025 and 2027
    • Semiconductor Industry Comes Under Extreme Pressure to Outperform as Time-to-Market Challenges Worsens
    • Pushed to Innovate Semiconductor Companies Adopt Cloud Based EDA Tools
    • Cloud EPA to Tackle Challenges Arising from Growing Complexities in Chip Design
    • EDA in the Cloud Holds Key in Rapidly Innovating SoC Design
    • Accelerating Advanced Networking SoC Design with Cloud-Based Emulation
    • Robust Outlook for CAD, CAM and CAE to Bring Cheer to the Cloud EDA Market
    • With Adoption of Engineering Software Reaching Mainstream, Focus Now Shifts to Migration to the Cloud: Global Market for Engineering Software (CAD, CAM, CAE, AEC, & EDA) (In US$ Billion) for Years 2021, 2023, 2025 and 2027
    • Advent of Autonomous Vehicles and Rising Demand for Connected Cars to Boost Need for Innovative Chip Design
    • Autonomous Cars & Vehicle Electronification Push Up the Need for Rapid Designing of Innovative Chips: Global Market for Autonomous Vehicles (In Units) for Years 2021, 2023, 2025 and 2027
    • Healthy Demand for PCBs Bodes Well for Market Growth
    • Faster Time-to-Market Need Pushes EDA for PCB Design into the Cloud: Global Opportunity for Printed Circuit Boards (PCBs) (In US$ Billion) for Years 2021, 2023, 2025 and 2027
    • Challenges to Cloud EDA & How They Can be Overcome
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Recent Past, Current & Future Analysis for Cloud EDA by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 2: World 7-Year Perspective for Cloud EDA by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2024 & 2030
    • TABLE 3: World Recent Past, Current & Future Analysis for Semiconductor Intellectual Property (SIP) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 4: World 7-Year Perspective for Semiconductor Intellectual Property (SIP) by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
    • TABLE 5: World Recent Past, Current & Future Analysis for Computer Aided Engineering (CAE) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 6: World 7-Year Perspective for Computer Aided Engineering (CAE) by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
    • TABLE 7: World Recent Past, Current & Future Analysis for IC Physical Design & Verification by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 8: World 7-Year Perspective for IC Physical Design & Verification by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
    • TABLE 9: World Recent Past, Current & Future Analysis for Printed Circuit Board (PCB) & Multi-Chip Module (MCM) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 10: World 7-Year Perspective for Printed Circuit Board (PCB) & Multi-Chip Module (MCM) by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
    • TABLE 11: World Recent Past, Current & Future Analysis for Military / Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 12: World 7-Year Perspective for Military / Defense by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
    • TABLE 13: World Recent Past, Current & Future Analysis for Aerospace by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 14: World 7-Year Perspective for Aerospace by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
    • TABLE 15: World Recent Past, Current & Future Analysis for Telecom by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 16: World 7-Year Perspective for Telecom by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
    • TABLE 17: World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 18: World 7-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
    • TABLE 19: World Recent Past, Current & Future Analysis for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 20: World 7-Year Perspective for Other Applications by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
    • TABLE 21: World Cloud EDA Market Analysis of Annual Sales in US$ Million for Years 2020 through 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2024 (E)
    • TABLE 22: USA Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 23: USA 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 24: USA Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 25: USA 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
  • CANADA
    • TABLE 26: Canada Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 27: Canada 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 28: Canada Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 29: Canada 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
  • JAPAN
    • Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2024 (E)
    • TABLE 30: Japan Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 31: Japan 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 32: Japan Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 33: Japan 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
  • CHINA
    • Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2024 (E)
    • TABLE 34: China Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 35: China 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 36: China Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 37: China 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
  • EUROPE
    • Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2024 (E)
    • TABLE 38: Europe Recent Past, Current & Future Analysis for Cloud EDA by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 39: Europe 7-Year Perspective for Cloud EDA by Geographic Region - Percentage Breakdown of Value Revenues for France, Germany, Italy, UK and Rest of Europe Markets for Years 2024 & 2030
    • TABLE 40: Europe Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 41: Europe 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 42: Europe Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 43: Europe 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
  • FRANCE
    • Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2024 (E)
    • TABLE 44: France Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 45: France 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 46: France Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 47: France 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
  • GERMANY
    • Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2024 (E)
    • TABLE 48: Germany Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 49: Germany 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 50: Germany Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 51: Germany 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
  • ITALY
    • TABLE 52: Italy Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 53: Italy 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 54: Italy Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 55: Italy 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
  • UNITED KINGDOM
    • Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2024 (E)
    • TABLE 56: UK Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 57: UK 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 58: UK Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 59: UK 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
  • REST OF EUROPE
    • TABLE 60: Rest of Europe Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 61: Rest of Europe 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 62: Rest of Europe Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 63: Rest of Europe 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
  • ASIA-PACIFIC
    • Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2024 (E)
    • TABLE 64: Asia-Pacific Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 65: Asia-Pacific 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 66: Asia-Pacific Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 67: Asia-Pacific 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030
  • REST OF WORLD
    • TABLE 68: Rest of World Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 69: Rest of World 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2024 & 2030
    • TABLE 70: Rest of World Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 71: Rest of World 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2024 & 2030

IV. COMPETITION