查看购物车
  • Traditional Chinese
  • English
  • Japanese
  • Korean
封面
市场调查报告书
商品编码
1571984

高密度互连的全球市场

High Density Interconnect
出版日期: | 出版商: Global Industry Analysts, Inc. | 英文 92 Pages | 商品交期: 最快1-2个工作天内

价格

※ 本网页内容可能与最新版本有所差异。详细情况请与我们联繫。

简介目录

到 2030 年，全球高密度互连市场预计将达到 449 亿美元

全球高密度互连市场预计 2023 年为 209 亿美元，预计到 2030 年将达到 449 亿美元，2023-2030 年分析期间复合年增长率为 11.5%。 4-6 级是本报告分析的细分市场之一，预计复合年增长率为 9.6%，到分析期结束时将达到 104 亿美元。在分析期间，8-10 层细分市场的复合年增长率预计为 11.6%。

美国市场预计57亿美元，中国预计复合年增长率10.9%

预计 2023 年美国高密度互连市场规模将达 57 亿美元。中国作为世界第二大经济体，预计2030年市场规模将达到69亿美元，2023-2030年分析期间复合年增长率为10.9%。其他值得注意的区域市场包括日本和加拿大，在分析期间预计复合年增长率分别为 9.7% 和 9.8%。在欧洲，德国的复合年增长率预计约为 8.2%。

全球高密度互连市场－主要趋势与驱动因素总结

为什么高密度互连 (HDI) 技术对于电子产品至关重要？

高密度互连（HDI）技术已成为现代电子产品不可或缺的一部分，特别是在智慧型手机、笔记型电脑、穿戴式装置、汽车电子和医疗设备中使用的印刷电路基板（PCB）的设计和製造中。 HDI PCB 透过整合更精细的线路和空间、更小的过孔和更密集的元件来实现更复杂的电路设计。这使得製造商能够生产更小、更轻、更快的设备并提高效能。 HDI 技术对于开发需要大量运算能力和连接性的高效能电子产品至关重要，对于空间限制和可靠性至关重要的 IT/通讯、航太和汽车等产业也至关重要。

科技进步如何推动 HDI 市场？

电子设计的小型化和技术进步正在推动对 HDI 技术的需求。随着家用电子电器变得更小、更强大，对更小、更有效率的 PCB 的需求也不断增加。雷射钻孔和堆迭微孔等先进製造技术的发展增强了 HDI PCB 的功能，使其能够在不影响讯号完整性的情况下提高电路密度。此外，5G 网路和物联网 (IoT) 的兴起增加了对 HDI 技术的需求，因为装置需要更快的资料传输和更高的连接性。这些进步也使得 HDI PCB 的製造更具成本效益，从而将其应用范围扩大到更广泛。

市场区隔如何定义 HDI 市场成长？

HDI类型包括4-6层、8-10层和10层以上，其中4-6层由于其应用于智慧型手机和平板电脑等家用电子电器而占据主导地位。 HDI PCB 的最终用途产业包括通讯、汽车、航太、医疗保健和工业电子。在智慧型手机和 5G 基础设施激增的推动下，通讯仍然是最大的细分市场。汽车产业也看到了 HDI 技术的快速采用，特别是在 ADAS（高级驾驶辅助系统）和电动车 (EV) 的开发中。从地区来看，亚太地区领先市场，中国、日本和韩国等国家是电子製造的主要中心。

推动高密度互连市场成长的因素有哪些？

高密度互连市场的成长受到多种因素的推动，包括对小型化电子产品的需求不断增长、5G 网路的扩展以及 PCB 製造技术的进步。特别是智慧型手机和穿戴式装置等家用电子电器领域是采用 HDI 的主要推动力，因为製造商致力于打造更小、更快、更高效能的装置。在汽车产业，电气化和自动化的发展正在推动对 HDI 技术的需求，因为 ADAS 和车载资讯娱乐系统需要复杂的电子设备。此外，5G 网路的推出增加了通讯基础设施中对 HDI PCB 的需求，其中高速资料传输和低延迟至关重要。 HDI 製造中的技术创新，例如雷射钻孔和材料改进，透过提高 HDI PCB 的性能和降低成本，进一步推动市场成长。

受访企业范例（36家知名企业）

  • Austria Technologie & Systemtechnik
  • CMK
  • Compeq Co.,
  • Daeduck GDS Co.,
  • EPEC
  • Fujitsu Interconnect Technologies
  • Kingboard Holdings
  • Meiko Electronics Co.,
  • Multek
  • Ncab Group
  • Shenzhen Kinwong Electronic Co.,
  • Sierra Circuits
  • TTM Technologies
  • Unimicron
  • Zhen Ding Tech

目录

第一章调查方法

第 2 章执行摘要

  • 市场概况
  • 主要企业
  • 市场趋势和驱动因素
  • 全球市场展望

第三章市场分析

  • 美国
  • 加拿大
  • 日本
  • 中国
  • 欧洲
  • 法国
  • 德国
  • 义大利
  • 英国
  • 其他欧洲国家
  • 亚太地区
  • 其他领域

第四章 比赛

简介目录
Product Code: MCP21955

Global High Density Interconnect Market to Reach US$44.9 Billion by 2030

The global market for High Density Interconnect estimated at US$20.9 Billion in the year 2023, is expected to reach US$44.9 Billion by 2030, growing at a CAGR of 11.5% over the analysis period 2023-2030. 4-6 Layers, one of the segments analyzed in the report, is expected to record a 9.6% CAGR and reach US$10.4 Billion by the end of the analysis period. Growth in the 8-10 Layers segment is estimated at 11.6% CAGR over the analysis period.

The U.S. Market is Estimated at US$5.7 Billion While China is Forecast to Grow at 10.9% CAGR

The High Density Interconnect market in the U.S. is estimated at US$5.7 Billion in the year 2023. China, the world's second largest economy, is forecast to reach a projected market size of US$6.9 Billion by the year 2030 trailing a CAGR of 10.9% over the analysis period 2023-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 9.7% and 9.8% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 8.2% CAGR.

Global High Density Interconnect Market - Key Trends and Drivers Summarized

Why Is High Density Interconnect (HDI) Technology Crucial for Electronics?

High Density Interconnect (HDI) technology has become an essential component of modern electronics, particularly in the design and manufacturing of printed circuit boards (PCBs) used in smartphones, laptops, wearables, automotive electronics, and medical devices. HDI PCBs allow for more complex circuit designs by incorporating finer lines and spaces, smaller vias, and more densely packed components. This enables manufacturers to produce smaller, lighter, and faster devices with enhanced performance. HDI technology is critical in the development of high-performance electronics that require significant computing power and connectivity, making it indispensable for industries like telecommunications, aerospace, and automotive, where space constraints and reliability are paramount.

How Are Technological Advancements Driving the HDI Market?

Technological advancements in miniaturization and electronic design are driving the demand for HDI technology. As consumer electronics become more compact and feature-rich, the need for smaller, more efficient PCBs has increased. The development of advanced fabrication techniques, such as laser drilling and stacked microvias, has enhanced the capabilities of HDI PCBs, allowing for higher circuit density without compromising signal integrity. Additionally, the rise of 5G networks and the Internet of Things (IoT) has increased the demand for HDI technology, as devices require faster data transmission and greater connectivity. These advancements are also making HDI PCBs more cost-effective to produce, expanding their adoption across a wider range of applications.

How Are Market Segments Defining the Growth of the HDI Market?

HDI types include 4-6 layers, 8-10 layers, and 10+ layers, with the 4-6 layer segment dominating due to its application in consumer electronics such as smartphones and tablets. The end-use industries for HDI PCBs include telecommunications, automotive, aerospace, healthcare, and industrial electronics. Telecommunications remains the largest segment, driven by the proliferation of smartphones and 5G infrastructure. The automotive industry is also witnessing rapid growth in the adoption of HDI technology, particularly in the development of advanced driver assistance systems (ADAS) and electric vehicles (EVs). Regionally, Asia-Pacific leads the market, with countries like China, Japan, and South Korea being major hubs for electronics manufacturing.

What Factors Are Driving the Growth in the High Density Interconnect Market?

The growth in the high density interconnect market is driven by several factors, including the increasing demand for miniaturized electronic devices, the expansion of 5G networks, and advancements in PCB fabrication technologies. The consumer electronics sector, particularly smartphones and wearables, is a major driver of HDI adoption as manufacturers seek to create smaller, faster, and more powerful devices. The automotive industry's push toward electrification and automation is also boosting demand for HDI technology, as more sophisticated electronics are required for ADAS and in-car infotainment systems. Additionally, the rollout of 5G networks is driving the need for HDI PCBs in telecommunications infrastructure, where high-speed data transmission and reduced latency are critical. Technological innovations in HDI fabrication, such as laser drilling and improved materials, are further propelling market growth by enhancing the performance and reducing the costs of HDI PCBs.

Select Competitors (Total 36 Featured) -

  • Austria Technologie & Systemtechnik
  • CMK
  • Compeq Co.,
  • Daeduck GDS Co.,
  • EPEC
  • Fujitsu Interconnect Technologies
  • Kingboard Holdings
  • Meiko Electronics Co.,
  • Multek
  • Ncab Group
  • Shenzhen Kinwong Electronic Co.,
  • Sierra Circuits
  • TTM Technologies
  • Unimicron
  • Zhen Ding Tech

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • World Market Trajectories
    • Global Economic Update
    • High Density Interconnect - Global Key Competitors Percentage Market Share in 2024 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2024 (E)
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Rising Demand for Miniaturized Electronic Devices Drives Growth in HDI Technology
    • Technological Advancements in PCB Manufacturing Propel Adoption of HDI Solutions
    • Increasing Focus on Lightweight and Compact Consumer Electronics Expands Addressable Market for HDI
    • Growing Adoption of HDI in Automotive Electronics Spurs Market Innovation
    • Surge in Demand for High-Speed and High-Performance PCBs Strengthens Business Case for HDI
    • Rising Use of HDI in Medical Devices and Wearable Electronics Propels Market Growth
    • Technological Integration of HDI with IoT and 5G Networks Expands Market Opportunities
    • Growing Focus on Reducing PCB Weight and Thickness Spurs Innovation in HDI Designs
    • Expansion of Advanced Driver Assistance Systems (ADAS) Drives Demand for HDI in Automotive Sector
    • Increasing Use of HDI in Aerospace and Defense Applications Sustains Market Growth
    • Rising Popularity of Flexible and Rigid-Flex HDI PCBs Expands Market Opportunities
    • Surge in Demand for Multilayer PCBs in Telecommunications Propels Growth in HDI Market
    • Regulatory Approvals for HDI PCBs in Medical and Automotive Sectors Drive Adoption
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Recent Past, Current & Future Analysis for High Density Interconnect by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 2: World Historic Review for High Density Interconnect by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 3: World 16-Year Perspective for High Density Interconnect by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2014, 2024 & 2030
    • TABLE 4: World Recent Past, Current & Future Analysis for 4-6 Layers by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 5: World Historic Review for 4-6 Layers by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 6: World 16-Year Perspective for 4-6 Layers by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 7: World Recent Past, Current & Future Analysis for 8-10 Layers by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 8: World Historic Review for 8-10 Layers by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 9: World 16-Year Perspective for 8-10 Layers by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 10: World Recent Past, Current & Future Analysis for 10+ Layers by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 11: World Historic Review for 10+ Layers by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 12: World 16-Year Perspective for 10+ Layers by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 13: World Recent Past, Current & Future Analysis for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 14: World Historic Review for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 15: World 16-Year Perspective for Other Applications by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 16: World Recent Past, Current & Future Analysis for Computer & Display by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 17: World Historic Review for Computer & Display by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 18: World 16-Year Perspective for Computer & Display by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 19: World Recent Past, Current & Future Analysis for Communication Devices & Equipment by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 20: World Historic Review for Communication Devices & Equipment by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 21: World 16-Year Perspective for Communication Devices & Equipment by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 22: World Recent Past, Current & Future Analysis for Automotive Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 23: World Historic Review for Automotive Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 24: World 16-Year Perspective for Automotive Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 25: World Recent Past, Current & Future Analysis for Connected Devices by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 26: World Historic Review for Connected Devices by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 27: World 16-Year Perspective for Connected Devices by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 28: World Recent Past, Current & Future Analysis for Wearable Devices by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 29: World Historic Review for Wearable Devices by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 30: World 16-Year Perspective for Wearable Devices by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 31: World High Density Interconnect Market Analysis of Annual Sales in US$ Million for Years 2014 through 2030
    • TABLE 32: World Recent Past, Current & Future Analysis for Audio / Audiovisual (AV) Devices by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 33: World Historic Review for Audio / Audiovisual (AV) Devices by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 34: World 16-Year Perspective for Audio / Audiovisual (AV) Devices by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • High Density Interconnect Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2024 (E)
    • TABLE 35: USA Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 36: USA Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 37: USA 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 38: USA Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 39: USA Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 40: USA 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030
  • CANADA
    • TABLE 41: Canada Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 42: Canada Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 43: Canada 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 44: Canada Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 45: Canada Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 46: Canada 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030
  • JAPAN
    • High Density Interconnect Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2024 (E)
    • TABLE 47: Japan Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 48: Japan Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 49: Japan 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 50: Japan Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 51: Japan Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 52: Japan 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030
  • CHINA
    • High Density Interconnect Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2024 (E)
    • TABLE 53: China Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 54: China Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 55: China 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 56: China Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 57: China Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 58: China 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030
  • EUROPE
    • High Density Interconnect Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2024 (E)
    • TABLE 59: Europe Recent Past, Current & Future Analysis for High Density Interconnect by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 60: Europe Historic Review for High Density Interconnect by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 61: Europe 16-Year Perspective for High Density Interconnect by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2014, 2024 & 2030
    • TABLE 62: Europe Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 63: Europe Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 64: Europe 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 65: Europe Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 66: Europe Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 67: Europe 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030
  • FRANCE
    • High Density Interconnect Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2024 (E)
    • TABLE 68: France Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 69: France Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 70: France 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 71: France Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 72: France Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 73: France 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030
  • GERMANY
    • High Density Interconnect Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2024 (E)
    • TABLE 74: Germany Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 75: Germany Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 76: Germany 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 77: Germany Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 78: Germany Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 79: Germany 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030
  • ITALY
    • TABLE 80: Italy Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 81: Italy Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 82: Italy 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 83: Italy Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 84: Italy Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 85: Italy 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030
  • UNITED KINGDOM
    • High Density Interconnect Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2024 (E)
    • TABLE 86: UK Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 87: UK Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 88: UK 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 89: UK Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 90: UK Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 91: UK 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030
  • REST OF EUROPE
    • TABLE 92: Rest of Europe Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 93: Rest of Europe Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 94: Rest of Europe 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 95: Rest of Europe Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 96: Rest of Europe Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 97: Rest of Europe 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030
  • ASIA-PACIFIC
    • High Density Interconnect Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2024 (E)
    • TABLE 98: Asia-Pacific Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 99: Asia-Pacific Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 100: Asia-Pacific 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 101: Asia-Pacific Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 102: Asia-Pacific Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 103: Asia-Pacific 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030
  • REST OF WORLD
    • TABLE 104: Rest of World Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 105: Rest of World Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 106: Rest of World 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 107: Rest of World Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 108: Rest of World Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 109: Rest of World 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030

IV. COMPETITION