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市场调查报告书
商品编码
1765306

全球晶圆层次电子构装设备市场

Wafer-level Packaging Equipment
出版日期: | 出版商: Global Industry Analysts, Inc. | 英文 289 Pages | 商品交期: 最快1-2个工作天内

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简介目录

预计到 2030 年全球晶圆层次电子构装设备市场规模将达 208 亿美元

全球晶圆层次电子构装设备市场规模预计在 2024 年为 76 亿美元，预计到 2030 年将达到 208 亿美元，在 2024-2030 年分析期内的复合年增长率为 18.4%。

美国市场预计将达到 19 亿美元，中国市场复合年增长率将达到 23.4%

美国晶圆层次电子构装设备市场规模预计2024年达到19亿美元。预计到2030年，作为世界第二大经济体的中国市场规模将达到56亿美元，在2024-2030年的分析期间内，复合年增长率为23.4%。其他值得关注的区域市场包括日本和加拿大，预计在分析期间内，这两个市场的复合年增长率分别为12.9%和15.5%。在欧洲，预计德国市场的复合年增长率约为14.0%。

全球晶圆层次电子构装设备市场-主要趋势与驱动因素摘要

为什么晶圆层次电子构装设备对于现代半导体製造至关重要？

晶圆层次电子构装(WLP) 设备在现代半导体製造中变得越来越重要，因为它能够实现晶圆级积体电路 (IC) 的直接封装，从而提高装置性能并降低製造成本。扇出型晶圆级封装 (FOWLP) 和硅通孔 (TSV) 等 WLP 技术具有许多优势，包括小型化、更高的热性能和更佳的电气特性。消费性电子、汽车和通讯等领域对更小、更强大的电子设备的需求日益增长，这推动了晶圆级封装解决方案的采用。随着半导体装置尺寸不断缩小、功能不断增强，对先进封装设备的需求也日益增长，以支援创新的封装技术。

哪些技术创新推动了晶圆层次电子构装设备市场的发展？

晶圆层次电子构装设备市场受到封装技术、材料和设备设计的快速发展的影响。扇出型晶圆级封装 (FOWLP) 和 3D 堆迭技术的发展使半导体装置能够实现更高的整合度、更高性能和更小尺寸。微影术、蚀刻和沈积製程的创新正在提高晶圆层次电子构装的精度和效率。 WLP 设备中先进自动化、机器人技术和人工智慧主导的製程控制的整合正在提高产量比率、减少缺陷并优化生产流程。此外，铜柱和低 K 电介质等新材料的使用正在增强晶圆级封装的电气性能和可靠性。

晶圆层次电子构装设备市场面临哪些挑战与机会？

晶圆层次电子构装设备市场面临的挑战包括设备成本高、先进节点封装製程复杂，以及需要持续创新以满足不断变化的半导体需求。先进 WLP 设备（尤其是 3D 堆迭和 FOWLP）的开发和部署成本给半导体製造商带来了沉重的负担。此外，随着装置尺寸缩小和新材料的引入，封装流程变得更加复杂，需要不断创新和改进。然而，这些挑战也带来了成长机会。对先进半导体装置（例如用于 5G、AI 和汽车应用的装置）的需求不断增长，正在推动对下一代 WLP 技术的投资。小型化、晶片性能提升以及异质整合的采用等日益增长的趋势为专用 WLP 设备解决方案创造了机会。

晶圆层次电子构装设备市场的成长受到多种因素的推动…

晶圆层次电子构装设备市场的成长受到多种因素的推动，例如对高性能半导体元件的需求不断增长、封装技术的进步以及电子产品小型化的趋势。家用电子电器、汽车和通讯应用中半导体的使用日益增多是市场成长的主要驱动力。 FOWLP、3D堆迭和TSV等封装技术的创新正在提高半导体元件的性能和整合度，从而支持市场扩张。此外，向更小、更复杂的半导体节点的转变需要更精确、更有效的封装解决方案，这推动了对先进WLP设备的需求。专注于透过创新封装解决方案降低生产成本和提高装置性能也促进了市场成长。

部分

段（晶圆层次电子构装设备）

受访公司范例

  • Advanced Semiconductor Engineering, Inc.
  • Atomica Corp
  • Busch Machinery, Inc.
  • CRYSTAL GmbH
  • JCET Group Company Limited
  • Mactronix
  • Packaging Fulfillment Company Inc.
  • Suss MicroTec AG
  • Ulvac Technologies, Inc.

人工智慧集成

利用检验的专家内容和 AI 工具转变您的市场和竞争情报。

Global Industry Analysts 并未遵循典型的 LLM 或特定产业的 SLM查询，而是建立了一个从全球专家收集的内容库，其中包括影片录影、部落格、搜寻引擎研究以及大量的公司、产品/服务和市场数据。

关税影响係数

全球产业分析师根据公司总部所在国家、製造地、进出口状况（成品和原始OEM）预测其竞争态势的变化。这种复杂且多面向的市场动态预计将以多种方式影响竞争对手，包括销货成本成本 (COGS) 上升、盈利下降、供应链重组以及其他微观和宏观市场动态。

目录

第一章调查方法

第二章执行摘要

  • 市场概览
  • 主要企业
  • 市场趋势和驱动因素
  • 全球市场展望

第三章市场分析

  • 美国
  • 加拿大
  • 日本
  • 中国
  • 欧洲
  • 法国
  • 德国
  • 义大利
  • 英国
  • 西班牙
  • 俄罗斯
  • 其他欧洲国家
  • 亚太地区
  • 澳洲
  • 印度
  • 韩国
  • 其他亚太地区
  • 拉丁美洲
  • 阿根廷
  • 巴西
  • 墨西哥
  • 其他拉丁美洲
  • 中东
  • 伊朗
  • 以色列
  • 沙乌地阿拉伯
  • 阿拉伯聯合大公国
  • 其他中东地区
  • 非洲

第四章 竞赛

简介目录
Product Code: MCP15549

Global Wafer-level Packaging Equipment Market to Reach US$20.8 Billion by 2030

The global market for Wafer-level Packaging Equipment estimated at US$7.6 Billion in the year 2024, is expected to reach US$20.8 Billion by 2030, growing at a CAGR of 18.4% over the analysis period 2024-2030.

The U.S. Market is Estimated at US$1.9 Billion While China is Forecast to Grow at 23.4% CAGR

The Wafer-level Packaging Equipment market in the U.S. is estimated at US$1.9 Billion in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$5.6 Billion by the year 2030 trailing a CAGR of 23.4% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 12.9% and 15.5% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 14.0% CAGR.

Global Wafer-level Packaging Equipment Market - Key Trends & Drivers Summarized

Why Is Wafer-level Packaging Equipment Essential in Modern Semiconductor Manufacturing?

Wafer-level Packaging (WLP) Equipment is becoming increasingly vital in modern semiconductor manufacturing as it enables the packaging of integrated circuits (ICs) directly at the wafer level, enhancing device performance and reducing production costs. WLP technologies, such as Fan-Out Wafer-level Packaging (FOWLP) and Through-Silicon Via (TSV), offer numerous advantages, including smaller form factors, improved thermal performance, and better electrical characteristics. The growing demand for compact, high-performance electronic devices in consumer electronics, automotive, and telecommunications is driving the adoption of wafer-level packaging solutions. As semiconductor devices continue to scale down in size with increased functionality, the need for advanced WLP equipment that supports innovative packaging techniques is becoming more critical.

What Technological Innovations Are Driving the Wafer-level Packaging Equipment Market?

The Wafer-level Packaging Equipment market is being shaped by rapid advancements in packaging technologies, materials, and equipment design. The development of Fan-Out Wafer-level Packaging (FOWLP) and 3D stacking technologies is enabling higher levels of integration, better performance, and reduced form factors in semiconductor devices. Innovations in lithography, etching, and deposition processes are enhancing the precision and efficiency of wafer-level packaging. The integration of advanced automation, robotics, and AI-driven process control in WLP equipment is improving yield rates, reducing defects, and optimizing production processes. Additionally, the use of new materials, such as copper pillars and low-K dielectrics, is enhancing the electrical performance and reliability of wafer-level packages.

What Challenges and Opportunities Are Present in the Wafer-level Packaging Equipment Market?

The Wafer-level Packaging Equipment market faces challenges such as high equipment costs, the complexity of packaging processes for advanced nodes, and the need for continuous innovation to meet evolving semiconductor demands. The cost of developing and deploying advanced WLP equipment, particularly for technologies like 3D stacking and FOWLP, can be significant for semiconductor manufacturers. Moreover, the packaging process becomes more complex as device geometries shrink and new materials are introduced, requiring continuous innovation and adaptation. However, these challenges also present opportunities for growth. The increasing demand for advanced semiconductor devices, such as those used in 5G, AI, and automotive applications, is driving investments in next-generation WLP technologies. The growing trend towards miniaturization, increased chip performance, and the adoption of heterogeneous integration are creating opportunities for specialized WLP equipment solutions.

The Growth in the Wafer-level Packaging Equipment Market Is Driven by Several Factors…

The growth in the Wafer-level Packaging Equipment market is driven by several factors, including the rising demand for high-performance semiconductor devices, advancements in packaging technologies, and the trend towards miniaturization in electronics. The increasing use of semiconductors in consumer electronics, automotive, and telecommunications applications is a major driver of market growth. Innovations in packaging technologies, such as FOWLP, 3D stacking, and TSV, are enhancing the performance and integration levels of semiconductor devices, supporting market expansion. Additionally, the shift towards smaller and more complex semiconductor nodes, which require more precise and effective packaging solutions, is propelling the demand for advanced WLP equipment. The focus on reducing production costs and improving device performance through innovative packaging solutions is also contributing to the market's growth.

SCOPE OF STUDY:

The report analyzes the Wafer-level Packaging Equipment market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Segment (Wafer-level Packaging Equipment)

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; Spain; Russia; and Rest of Europe); Asia-Pacific (Australia; India; South Korea; and Rest of Asia-Pacific); Latin America (Argentina; Brazil; Mexico; and Rest of Latin America); Middle East (Iran; Israel; Saudi Arabia; United Arab Emirates; and Rest of Middle East); and Africa.

Select Competitors (Total 31 Featured) -

  • Advanced Semiconductor Engineering, Inc.
  • Atomica Corp
  • Busch Machinery, Inc.
  • CRYSTAL GmbH
  • JCET Group Company Limited
  • Mactronix
  • Packaging Fulfillment Company Inc.
  • Suss MicroTec AG
  • Ulvac Technologies, Inc.

AI INTEGRATIONS

We're transforming market and competitive intelligence with validated expert content and AI tools.

Instead of following the general norm of querying LLMs and Industry-specific SLMs, we built repositories of content curated from domain experts worldwide including video transcripts, blogs, search engines research, and massive amounts of enterprise, product/service, and market data.

TARIFF IMPACT FACTOR

Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by increasing the Cost of Goods Sold (COGS), reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • Tariff Impact on Global Supply Chain Patterns
    • Wafer-level Packaging Equipment - Global Key Competitors Percentage Market Share in 2025 (E)
    • Global Economic Update
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2025 (E)
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Rising Demand for Miniaturization and High-Performance Semiconductor Devices
    • Growth in Advanced Packaging Techniques for Enhanced Device Functionality
    • Increasing Use of Wafer-Level Packaging in MEMS, Sensors, and Photonics
    • Impact of 5G and IoT on the Adoption of Wafer-Level Packaging Equipment
    • Technological Advancements in Fan-Out Wafer-Level Packaging and 3D Integration
    • Opportunities in Developing Markets for Semiconductor Manufacturing Expansion
    • Influence of Industry 4.0 and Automation on Wafer-Level Packaging Processes
    • Impact of Environmental Regulations on Equipment Design and Material Selection
    • Growing Need for High-Yield and Low-Cost Packaging Solutions
    • Expansion of Foundries and OSAT (Outsourced Semiconductor Assembly and Test) Service Providers
    • Emerging Trends in Heterogeneous Integration and System-in-Package (SiP) Solutio
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 2: World 6-Year Perspective for Wafer-level Packaging Equipment by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets for Years 2025 & 2030
    • TABLE 3: World Wafer-level Packaging Equipment Market Analysis of Annual Sales in US$ Million for Years 2015 through 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • Wafer-level Packaging Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)
    • TABLE 4: USA Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • CANADA
    • TABLE 5: Canada Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • JAPAN
    • Wafer-level Packaging Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)
    • TABLE 6: Japan Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • CHINA
    • Wafer-level Packaging Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)
    • TABLE 7: China Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • EUROPE
    • Wafer-level Packaging Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)
    • TABLE 8: Europe Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 9: Europe 6-Year Perspective for Wafer-level Packaging Equipment by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets for Years 2025 & 2030
  • FRANCE
    • Wafer-level Packaging Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2025 (E)
    • TABLE 10: France Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • GERMANY
    • Wafer-level Packaging Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2025 (E)
    • TABLE 11: Germany Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • ITALY
    • TABLE 12: Italy Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • UNITED KINGDOM
    • Wafer-level Packaging Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2025 (E)
    • TABLE 13: UK Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • SPAIN
    • TABLE 14: Spain Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • RUSSIA
    • TABLE 15: Russia Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • REST OF EUROPE
    • TABLE 16: Rest of Europe Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • ASIA-PACIFIC
    • Wafer-level Packaging Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)
    • TABLE 17: Asia-Pacific Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Geographic Region - Australia, India, South Korea and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 18: Asia-Pacific 6-Year Perspective for Wafer-level Packaging Equipment by Geographic Region - Percentage Breakdown of Value Sales for Australia, India, South Korea and Rest of Asia-Pacific Markets for Years 2025 & 2030
  • AUSTRALIA
    • Wafer-level Packaging Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Australia for 2025 (E)
    • TABLE 19: Australia Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • INDIA
    • Wafer-level Packaging Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in India for 2025 (E)
    • TABLE 20: India Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • SOUTH KOREA
    • TABLE 21: South Korea Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • REST OF ASIA-PACIFIC
    • TABLE 22: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • LATIN AMERICA
    • Wafer-level Packaging Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Latin America for 2025 (E)
    • TABLE 23: Latin America Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Geographic Region - Argentina, Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 24: Latin America 6-Year Perspective for Wafer-level Packaging Equipment by Geographic Region - Percentage Breakdown of Value Sales for Argentina, Brazil, Mexico and Rest of Latin America Markets for Years 2025 & 2030
  • ARGENTINA
    • TABLE 25: Argentina Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • BRAZIL
    • TABLE 26: Brazil Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • MEXICO
    • TABLE 27: Mexico Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • REST OF LATIN AMERICA
    • TABLE 28: Rest of Latin America Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • MIDDLE EAST
    • Wafer-level Packaging Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Middle East for 2025 (E)
    • TABLE 29: Middle East Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Geographic Region - Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 30: Middle East 6-Year Perspective for Wafer-level Packaging Equipment by Geographic Region - Percentage Breakdown of Value Sales for Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets for Years 2025 & 2030
  • IRAN
    • TABLE 31: Iran Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • ISRAEL
    • TABLE 32: Israel Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • SAUDI ARABIA
    • TABLE 33: Saudi Arabia Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • UNITED ARAB EMIRATES
    • TABLE 34: UAE Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • REST OF MIDDLE EAST
    • TABLE 35: Rest of Middle East Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • AFRICA
    • Wafer-level Packaging Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Africa for 2025 (E)
    • TABLE 36: Africa Recent Past, Current & Future Analysis for Wafer-level Packaging Equipment by Segment - Wafer-level Packaging Equipment - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR

IV. COMPETITION