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关注的IC:AI，5G，CMOS影像感测器，记忆体晶片的市场分析
市场调查报告书
商品编码
1266874

关注的IC:AI，5G，CMOS影像感测器，记忆体晶片的市场分析

Hot ICs: A Market Analysis of Artificial Intelligence (AI), 5G, Automotive and Memory Chips
出版日期: | 出版商: Information Network | 英文 | 商品交期: 2-3个工作天内

价格

本报告提供AI，5G, CMOS影像感测器，记忆体晶片(DRAM，NAND，NVM)调查分析，详细的说明，及IC与其用途的市场预测，各部门的市场占有率等资讯。

目录

第1章 摘要整理

第2章 汽车

  • 汽车产业的指标
  • 汽车半导体产业
    • 汽车用记忆体半导体
    • 汽车半导体:各类型
  • 主要的技术和零组件的供应商
    • NXP
    • STMicroelectronics
    • Renesas Electronics
    • Nvidia
    • Intel (Mobileye and Moovit)
    • Skyworks
    • Qualcomm
    • onsemi
    • Texas Instruments
    • Analog Devices
  • 汽车/ADAS
    • 替代汽车AI晶片的竞争
      • Intel-Mobileye
      • Qualcomm
      • Nvidia
      • Huawei
      • Horizon Robotics
      • Black SesameTechnologies
      • Xin Chi Technology
      • Tesla
  • LiDAR感测器
    • LiDAR - 成本的考虑事项
    • 汽车用途
    • LiDAR供应商
      • Velodyne
      • Luminar
      • Aeva
      • Ouster
      • Innoviz
      • Hesai
      • Livox
      • Innovusion

第3章 5G

  • 5G晶片的技术和趋势
  • 用途
    • 行动电话
    • 跨学科的连接
  • 市场分析
    • 市场预测
    • 5G和4G的新的零组件
  • 5G晶片供应商的产品和简介
    • Analog Devices
    • Anokiware
    • Apple
    • Broadcom
    • Huawei
    • Infineon
    • Intel
    • Inphi
    • Microchip
    • MediaTek
    • Marvell
    • M/A-Com
    • NXP Semiconductor
    • Onsemi
    • Qualcomm
    • Qorvo
    • Samsung Electronics
    • Sivers IMA
    • Skyworks Solutions
    • STMicroelectronics
    • Teradyne
    • Texas Instruments
    • Win Semiconductors
    • Xilinx

第4章 AI

  • AI的技术和趋势
    • 云端AI运算
    • 边缘AI运算
    • AI的要素
  • 市场分析
    • AI晶片的收益预测
  • 用途
    • AI的产业用途
    • AI装载设备
    • 军事/防卫用途
    • AI晶片的收益预测
  • AI晶片技术
    • GPU
    • FPGA
    • ASIC
    • 神经形态晶片
    • DPU
  • AI晶片供应商的产品和简介
    • IC供应商
      • Achronix
      • AMD
      • Ampere
      • Biren Technology
      • Flex Logix
      • IBM
      • Intel
      • MediaTek
      • Nvidia
      • NXP
      • Qualcomm
      • Rockchip
      • Samsung Electronics
      • STMicroelectronics
      • Tentsorrent
      • Xilinx
    • 云端供应商 - 技术领导者
      • Alibaba
      • Alibaba Cloud
      • Amazon
      • Apple
      • Baidu
      • Meta
      • Fujitsu
      • Google
      • Huawei Cloud
      • Microsoft
      • Nokia
      • Tencent Cloud
      • Tesla
    • IP供应商
      • ARM
      • CEVA
      • Imagination
      • VeriSilicon
      • Videantis
    • 全球Start-Ups
      • Adapteva
      • aiCTX
      • AImotive
      • AlphaICs
      • Anari AI
      • Blaize
      • BrainChip
      • Cerebras Systems
      • Cornami
      • DeepScale
      • Anari AI
      • Esperanto Technologies
      • Graphcore
      • GreenWaves Technology
      • Groq
      • Hailo AI
      • KAIST
      • Kalray
      • Kneron
      • Knowm
      • Koniku
      • Mythic
      • SambaNova Systems
      • Tachyum
      • Via
      • videantis
      • Wave Computing
    • 中国的Start-Ups
      • AISpeech
      • Bitmain
      • Cambricon
      • Chipintelli
      • DeePhi Tech
      • Horizon Robotics
      • NextVPU
      • Rokid
      • Thinkforce
      • Unisound

第5章 记忆体晶片

  • 记忆体的技术和趋势
    • DRAM
    • NAND
    • NVRAM - MRAM，RRAM，FERAM
  • 用途
    • DRAM
    • NAND
  • 市场分析
  • 记忆体晶片供应商的产品和简介
    • CXMT
    • Fujian
    • GigaDevice Semiconductor
    • Intel
    • Micron Technology
    • Nanya
    • Powerchip Technology
    • Samsung Electronics
    • SK Hynix
    • Toshiba (Kloxia)
    • Tsinghua Chongqing
    • Western Digital
    • Winbond
    • YMTC

Not only are these ICs the "hottest" part of the highest growing technology sectors, they are, in fact, interrelated.

Advanced driver-assistance systems (ADAS) are ubiquitous in autonomous vehicles. ADAS uses CMOS Integrated Sensors, memory, processing, and networking to detect road conditions and provide feedback to drivers-and in some cases to drive the vehicle off the road if there are unsafe conditions.

Besides powering ADAS and autonomous vehicles, AI is also a key enabler of voice recognition technologies, smart cities, and the Internet of Things (IoT). AI alongside the development of greater universal connectivity will enable new services that can benefit consumers in many ways.

Real-world fleets of autonomous vehicles are now ready for commercial deployment and many auto companies already provide some level of autonomous vehicle technology in their latest models. It is likely that on the show floor and in conference presentations we will see new uses for these AI-driven vehicles. We'll also see how possible problems are being tackled before the technology moves more into the consumer space.

The growth in mobile and personal devices, and their need for energy-efficient electronics, will lead to new ways to store information for immediate processing as well as long-term storage. The report details storage and memory products including those using traditional (NAND and DRAM) memories and emerging memories, such as phase change memory (PCM), magnetic random access memory (MRAM) or resistive random access memory. With the end of Moore's-law computer-lithography scaling, there is also a move to more specialized processing capability, tied to particular applications.

This report examines in detail Artificial Intelligence (AI), 5G, CMOS Image Sensor, and Memory Chips (DRAM, NAND, NVM). Markets for the ICs and their applications are forecast to 2025, and market shares given in each sector.

Table of Contents

1.0. Executive Summary

2.0. Automotive

  • 2.1. Automotive Industry Metrics
  • 2.2. Automotive Semiconductor Industry
    • 2.2.1. Automotive Memory Semiconductors
    • 2.2.2. Automotive Semiconductors By Type
      • 2.2.2.1 Microcontrollers
      • 2.2.2.2 ASSP/ASICs
      • 2.2.2.3 Analog
      • 2.2.2.4 Discrete
  • 2.3. Key Technology And Component Suppliers
    • NXP
    • STMicroelectronics
    • Renesas Electronics
    • Nvidia
    • Intel (Mobileye and Moovit)
    • Skyworks
    • Qualcomm
    • onsemi
    • Texas Instruments
    • Analog Devices
  • 2.4. Automotive/ Advanced Driver Assistance Systems (ADAS)
    • 2.4.1. Competition from Alternative Automotive AI Chips
      • Intel-Mobileye
      • Qualcomm
      • Nvidia
      • Huawei
      • Horizon Robotics
      • Black SesameTechnologies
      • Xin Chi Technology
      • Tesla
  • 2.5. LiDAR Sensors
    • 2.5.1. LiDAR - Cost Considerations
    • 2.5.2. Automotive Applications
    • 2.5.3. LiDAR Suppliers
      • Velodyne
      • Luminar
      • Aeva
      • Ouster
      • Innoviz
      • Hesai
      • Livox
      • Innovusion

3.0. 5G

  • 3.1. 5G Chip Technology and Trends
  • 3.2. Applications
    • 3.2.1. Mobile Handsets
    • 3.2.2. Interdisciplinary Connections
  • 3.3. Market Analysis
    • 3.3.1. Market Forecasts
    • 3.3.2. New Components For 5G vs 4G
      • 3.3.2.1 5G Modem Chip Overview
      • 3.3.2.2 5G Chips
      • 3.3.2.3 mmWave Modules
      • 3.3.2.4 Traditional MIMO Antennas
  • 3.4. 5G Chip Supplier Products and Profiles
    • Analog Devices
    • Anokiware
    • Apple
    • Broadcom
    • Huawei
    • Infineon
    • Intel
    • Inphi
    • Microchip
    • MediaTek
    • Marvell
    • M/A-Com
    • NXP Semiconductor
    • Onsemi
    • Qualcomm
    • Qorvo
    • Samsung Electronics
    • Sivers IMA
    • Skyworks Solutions
    • STMicroelectronics
    • Teradyne
    • Texas Instruments
    • Win Semiconductors
    • Xilinx

4.0. Artificial Intelligence (AI)

  • 4.1. AI Technology and Trends
    • 4.1.1. Cloud AI Computing
    • 4.1.2. Edge AI Computing
    • 4.1.3 The Elements Of Artificial Intelligence
      • 4.1.3.1 Importance Of Training And Inference
      • 4.1.3.2 The Growing Importance Of Accelerators In Dc Spending
      • 4.1.3.3 Training Costs
      • 4.1.3.4 Generative AI
  • 4.2. Market Analysis
    • 4.2.1. AI Chip Revenue Forecast
  • 4.3. Applications
    • 4.3.1. Industry Applications of AI
      • 4.3.1.1 Smart Healthcare
      • 4.3.1.2 Smart Security
      • 4.3.1.3 Smart Finance
      • 4.3.1.4 Smart Grid
      • 4.3.1.5 Smart Hone
    • 4.3.2. AI-Powered Devices
      • 4.3.2.1 Smart Speakers
      • 4.3.2.2 Drones
      • 4.3.2.3 Intelligent Robots
    • 4.3.3 Military/Defense Applications
      • 4.3.3.1 China's AI Plan
      • 4.3.2.1 Driverless Vehicles
      • 4.3.2.2 Computer Chips
      • 4.3.2.3 Financial
      • 4.3.2.4 Facial Recognition
      • 4.3.2.5 Retail
      • 4.3.2.6 Robots
    • 4.3.3. AI Chip Revenue Forecast
  • 4.4. AI Chip Technology
    • 4.4.1. Graphics Processing Unit (GPU)
    • 4.4.2. Field Programmable Gate Array (FPGA)
    • 4.4.3. Application Specific Integrated Circuits (ASIC)
    • 4.4.4. Neuromorphic Chips
    • 4.4.5. Data Processing Units (DPUs)
  • 4.5. AI Chip Supplier Products and Profiles
    • 4.5.1. IC Vendors
      • Achronix
      • AMD
      • Ampere
      • Biren Technology
      • Flex Logix
      • IBM
      • Intel
      • MediaTek
      • Nvidia
      • NXP
      • Qualcomm
      • Rockchip
      • Samsung Electronics
      • STMicroelectronics
      • Tentsorrent
      • Xilinx
    • 4.5.2. Cloud Providers - Tech Leaders
      • Alibaba
      • Alibaba Cloud
      • Amazon
      • Apple
      • Baidu
      • Meta
      • Fujitsu
      • Google
      • Huawei Cloud
      • Microsoft
      • Nokia
      • Tencent Cloud
      • Tesla
    • 4.5.3. IP Vendors
      • ARM
      • CEVA
      • Imagination
      • VeriSilicon
      • Videantis
    • 4.5.4. Startups Worldwide
      • Adapteva
      • aiCTX
      • AImotive
      • AlphaICs
      • Anari AI
      • Blaize
      • BrainChip
      • Cerebras Systems
      • Cornami
      • DeepScale
      • Anari AI
      • Esperanto Technologies
      • Graphcore
      • GreenWaves Technology
      • Groq
      • Hailo AI
      • KAIST
      • Kalray
      • Kneron
      • Knowm
      • Koniku
      • Mythic
      • SambaNova Systems
      • Tachyum
      • Via
      • videantis
      • Wave Computing
    • 4.5.5. Startups in China
      • AISpeech
      • Bitmain
      • Cambricon
      • Chipintelli
      • DeePhi Tech
      • Horizon Robotics
      • NextVPU
      • Rokid
      • Thinkforce
      • Unisound

5.0. Memory Chips

  • 5.1. Memory Technology and Trends
    • 5.1.1. DRAM
    • 5.1.2. NAND
    • 5.1.3. NVRAM - MRAM, RRAM, and FERAM
  • 5.2. Applications
    • 5.2.1. DRAM
      • 5.2.1.1 Server
      • 5.2.1.2 PC
      • 5.2.1.3 Graphics
      • 5.2.1.4 Mobile
      • 5.2.1.5 Consumer
    • 5.2.2. NAND
      • 5.2.2.1 SSD
      • 5.2.2.2 PC
      • 5.2.2.3 TV
      • 5.2.2.4 Mobile
      • 5.2.2.5 USB
  • 5.3. Market Analysis
  • 5.4. Memory Chip Supplier Products and Profiles
    • CXMT
    • Fujian
    • GigaDevice Semiconductor
    • Intel
    • Micron Technology
    • Nanya
    • Powerchip Technology
    • Samsung Electronics
    • SK Hynix
    • Toshiba (Kloxia)
    • Tsinghua Chongqing
    • Western Digital
    • Winbond
    • YMTC

LIST OF FIGURES

  • 1.1. IC Market By Revenue By Type By Quarter 2019-
  • 1.2. IC Market By Units By Type By Quarter 2019-
  • 1.3. IC Market By Asps By Type By Quarter 2019-
  • 1.4. Smartphone And PC Unit Shipments By Quarter 2022-2023
  • 1.5. Smartphone And PC Unit Shipments By Year 2021-2024
  • 1-6. PC Semiconductor Market Forecast 2015-2026
  • 1.7. Logic Revenues By Quarter 2019-2023
  • 1.8. Memory Revenues By Quarter 2019-2023
  • 1.9. Memory Units By Quarter 2019-2023
  • 1.10. Memory ASPs By Quarter 2019-2023
  • 2.1. Semiconductor Content Per Vehicle Forecast
  • 2.2. Key Applications Of Semiconductors In An Automobile
  • 2.3. Diagram Of Automotive Memory Needs
  • 2.4. Automotive Memory Market Share
  • 2.5. Automotive Semiconductor Market Share
  • 2.6. Average Semiconductor Content Per Car By Level Of Automation
  • 2.7. Automotive Imaging Segments
  • 2.8. Five Levels Of Autonomous Driving
  • 3.1. RF Chip Market Forecast By Network Generation
  • 4.1. Performance Comparison Of TPU, GPU, And CPU
  • 4.2. Artificial Intelligence Market Share by Chip Type 2022 and 2023
  • 4.3. AI Training And Inference
  • 4.4. AI Training And Inference Chip Forecast
  • 4.5. AI Training And Inference Chip Forecast By Type
  • 4.6. Total Top Global Defense Company M&A 2013-2020
  • 5.1. DRAM Scaling
  • 5.2. DRAM Memory Shrink Roadmap
  • 5.3. 3D-NAND Memory Shrink Roadmap
  • 5.4. Transition From SLC To QLC
  • 5.5. Comparison Of Non-Volatile Ram Write Times
  • 5.6. Competition In Dissipation Speed And Memory Capacity
  • 5.7. DRAM Content Of Chinese Smartphones
  • 5.8. NAND Content Of Chinese Smartphones
  • 5.9. Total Available Market For SST MRAM
  • 5.10. Total Available Market For Toggle MRAM

LIST OF TABLES

  • 1.1. Semiconductor Market Forecast By End Application 2019-
  • 1.2. Smartphone Unit Shipment Forecast 2019-
  • 1.3. Smartphone Semiconductor Content Forecast 2019-
  • 1.4. Smartphone Semiconductor Market By Revenue 2019-2026
  • 1.5. Smartphone Semiconductor Revenue Content 2019-2026
  • 1.6. Smartphone Dram ASPs Forecast 2019-2026
  • 1.7. Smartphone Nand ASPs Forecast 2019-2026
  • 1.8. PC Market Forecast By Type 2019-2026
  • 1.9. PC Semiconductor Market Forecast 2019-2026
  • 1-10. PC Memory Revenue Market Forecast 2019-2026
  • 1-11. PC Memory Gb Market Forecast By Type 2019-2026
  • 1-12. Server Market Forecast 2019-2026
  • 1-13. Server Semiconductor Market Forecast 2019-2026
  • 1-14. Server Memory Revenue Market Forecast 2019-2026
  • 1-15. Server GPU Revenue Market Forecast 2019-2026
  • 2.1. EV Shipment Forecast By Region 2018-
  • 2.2. ICE Auto Shipment Forecast By Region 2018-
  • 2.3. Automotive Semiconductor Sales Forecast 2019-
  • 2.4. Automotive Semiconductor Sales By Company 2022-2024
  • 2.5. Top Automotive Semiconductor Sales By Customer 2021-2022
  • 2.6. SOC Autopilot Chip Versions
  • 2.7. Functionality Comparison Of Sensor Modalities
  • 2.8. Differences Among Lidar Devices
  • 2.9. Major Lidar Companies
  • 3.1. Feature Comparison Of Smartphone PAs By Generation
  • 3.2. 5G Subscriptions
  • 3.3. Smartphone Forecast By Geographic Region
  • 3.4. Smartphone Subscription Forecast By Technology
  • 3.5. 5G Smartphone Forecast By Geographic Region
  • 3.6. 5G Smartphone Mobile Semiconductor Forecast
  • 3.7. 5G Semiconductor Total Available Market Forecast
  • 3.8. 5G Smartphone Shipment By Major OEMs
  • 3.9. 5G Smartphone Penetration By Country
  • 3.10. Mobile Subscriptions By Region
  • 3.11. Smartphone Subscriptions By Region
  • 3.12. LTE Subscriptions By Region
  • 3.13. 5G Subscriptions By Region
  • 3.14. Data Traffic Per Smartphone By Region
  • 3.15. Mobile Data Traffic By Region
  • 4.1. Artificial Intelligence Market Forecast By Chip Type 2019-2026
  • 4.2. AI Training And Inference Chip Forecast
  • 4.3. AI Chip Forecast By Chip Type
  • 4.4. Characteristics Of CPU, FPGA, CCPU, and ASIC
  • 4.5. Characteristics Of CPU, FPGA, CCPU, and ASIC
  • 4.6. Smart Speaker Products
  • 5.1. Comparison Of Non-Volatile RAM Technology
  • 5.2. Total DRAM Industry Revenue Forecast 2019-2026
  • 5.3. Total DRAM Bit Shipment Revenue Forecast 2019-2026
  • 5.4. Total DRAM Blended ASP ($/GB) Revenue Forecast 2015-2026
  • 5.5. Total DRAM Bit Supply Forecast 2019-2026
  • 5.6. DRAM Revenue By End Market Forecast 2019-2026
  • 5.7. DRAM Capacity By Company Forecast 2018-2024
  • 5.8. DRAM Revenue By Company Forecast 2018-2024
  • 5.9. Total NAND Industry Revenue Forecast 2019-2026
  • 5.10. Total NAND Bit Shipment Revenue Forecast 2019-2026
  • 5-11. Total NAND Blended ASP ($/Gb) Revenue Forecast 2019-2026
  • 5-12. Total NAND Bit Supply Forecast 2019-2026
  • 5-13. NAND Revenue By End Market Forecast 2019-2026
  • 5-14. NAND Capacity By Company Forecast 2018-2024
  • 5-15. NAND Revenue By Company Forecast 2018-2024