查看购物车
  • Traditional Chinese
  • English
  • Japanese
  • Korean
封面
市场调查报告书
商品编码
1196936

全球接口 IC 市场 - COVID-19 的增长、趋势、影响和预测 (2023-2028)

Global Interface Ic Market - Growth, Trends, and Forecasts (2023 - 2028)
出版日期: | 出版商: Mordor Intelligence | 英文 100 Pages | 商品交期: 2-3个工作天内

价格

※ 本网页内容可能与最新版本有所差异。详细情况请与我们联繫。

简介目录

全球接口 IC 市场预计在 2022 年至 2027 年的预测期内復合年增长率为 15.5%。

COVID-19 的全球爆发严重扰乱了 2020 年初所研究市场的供应炼和生产。 劳动力短缺迫使全球半导体供应链中的许多参与者缩减规模或停止运营，从而影响市场增长。

*接口 IC 由于其紧凑和节能的设计，适用于一次性医疗设备、贴片和运动/健身设备。 例如，代工复杂混合信号 ASIC 的无晶圆厂公司 Ensilica 宣布推出 ENS62020，这是一款超低功耗医疗传感器接口 IC，专为监测可穿戴医疗设备和医疗设备中的生命体征而设计。我来了。

* 接口集成电路 (IC) 可以识别外部电源并根据其类型选择两个电池充电电流级别之一。 不同电子系统之间的信号通信由接口 IC 控制和管理。 通信协议决定了数据的传输方式。

*半导体设备製造商正在增加集成到单个 IC 中的晶体管数量，从而导致电路设计复杂性和物理访问限制增加。 因此，需要使用无错误掩模进行有效图案化，以将无错误和无缺陷的图案转移到晶圆上。 因此，OEM 需要在设备性能方面具有竞争优势，这推动了市场增长。

*此外，我们多样化的接口 IC 可实现可靠、高效且具有成本效益的连接，同时保持信号隔离和保护的最高标准。

*但是，封装和组装厂在标准引线框 (FCSOL)、四方扁平封装无引线 (QFN) 和标准双马来□亚胺三秦 (BT) 树脂基板上提供倒装芯片安装选项，以实现成本效益。我们已采取措施提供高质量的解决方案。 儘管晶圆製造的初始成本很高，但 Assembly House 使用成熟的技术和创新工艺为客户提供更好的解决方案。

接口IC市场趋势

预计汽车领域的市场份额将显着增长

*汽车是这个市场的主要终端用户之一。 汽车及其製造的进步增加了对小型、高能效设备的需求。

*高级驾驶辅助系统 (ADAS) 的日益普及以及全球范围内越来越多的强制执行 ADAS 的政府法规也扩大了该细分市场的覆盖面。 车载信息娱乐的日益普及也有望成为一个增长机会。 汽车数字应用日益复杂，需要接口 IC 和技术不断发展。

*车载信息娱乐系统正变得越来越复杂，随着显示器数量的增加，面板选项正在扩展到广泛使用的 LVDS（低压差分信号）显示器之外。 例如，2020 年 6 月，东芝电子元件及存储装置公司在其用于汽车车载信息娱乐 (IVI) 系统的显示接口桥接 IC 中增加了两款产品。 预计市场供应商的投资将提振需求。

*市场越来越关注产品线创新。 例如，在 2021 年 2 月，运动控制和节能係统传感和电源解决方案的全球先驱 Allegro MicroSystems, Inc. 宣布推出汽车级接口 IC，用于具有信号调节算法的电阻桥式压力传感器，即 A17700。

*由于 5G 网络的快速部署和 GaN 器件物联网 (IoT) 应用的增加，例如用于驾驶员辅助和智能交通的 V2X 通信，预计对接口 IC 的需求将会增加。

预计亚太地区将占据较大的市场份额

*亚太地区半导体製造基地众多，在全球市场占有很大份额。 该地区的半导体製造商正在提高产能，以满足无晶圆厂供应商日益增长的需求。 中国也在努力巩固基板製造市场，这正在推动市场的增长。

*该地区的供应商更加积极地专注于向非手机芯片领域的多元化发展。 例如，2022 年 4 月，由于智能手机需求不断增长，台湾 IC 测试接口专家 Chunghwa Precision Test Tech (CHPT) 正在努力扩大其非手机部署。

*对 5G 基础设施的投资增加、数据中心服务器和物联网连接数量的增加以及网络设备的进步是推动该地区 IT 和电信行业增长的关键因素。

*随着 IT 和电信以及汽车行业等行业的需求，供应商正在扩大其在中国的生产能力，以在 2020 年抢占市场份额。 例如，2021年5月，奥地利电子供应商奥特斯宣布将投资4.5亿欧元扩建其重庆工厂的产能。

*此外，2021 年 5 月，日本政府决定要求大型半导体公司台积电在日本开发芯片製造技术。 这些因素也有助于接口 IC 的市场增长。

接口IC市场竞争者分析

接口 IC 市场与许多区域和全球参与者竞争适中。 玩家已将协作、伙伴关係和协议等策略作为其主要发展策略。

*2022 年 2 月 - Onsemi 是一家智能电源和传感器解决方案供应商，它采用了更精细的製造方法，通过提高毛利率来实现长期的财务成功。

*2021 年 8 月 - Analog Devices 宣布完成对 Maxim Integrated Products 的收购。 12个月后销售额超过90亿美元，进一步巩固了ADI作为高性能模拟半导体製造商的地位。

其他好处

  • Excel 格式的市场预测 (ME) 表
  • 3 个月的分析师支持

内容

第一章介绍

  • 调查假设和市场定义
  • 调查范围

第二章研究方法论

第 3 章执行摘要

第 4 章市场洞察

  • 市场概览
  • 波特的五力分析
    • 供应商的议价能力
    • 买家的议价能力
    • 新进入者的威胁
    • 替代品的威胁
    • 竞争对手之间的竞争强度
  • 评估 COVID-19 的市场影响

第 5 章市场动态

  • 市场驱动力
    • MOSFET 功率晶体管在消费电子产品中的使用增加
    • 智能手机和平板电脑的普及以及对 MOSFET 功率晶体管的需求不断增长
  • 市场挑战
    • 製造过程的复杂性

第 6 章市场细分

  • 按产品类型
    • CAN接口IC
    • USB接口IC
    • 置换界面
    • 其他
  • 按行业
    • 消费类电子产品
    • 通讯设备
    • 工业设备
    • 汽车
    • 其他最终用户
  • 区域信息
    • 北美
    • 欧洲
    • 亚太地区
    • 拉丁美洲
    • 中东

第七章竞争格局

  • 公司简介
    • Infineon Technologies AG
    • Renesas Electronics Corporation
    • Texas Instruments Incorporated
    • Analog Devices, Inc.
    • Microchip Technology Inc
    • NXP Semiconductors.
    • Broadcom Inc.
    • Mitsubishi Electric Corporation
    • Toshiba Corporation
    • Vishay Intertechnology, Inc.

第8章 投资分析

第9章 市场未来性

简介目录
Product Code: 90954

The Global Interface IC Market is expected to register a CAGR of 15.5% over the forecast period from 2022 to 2027. The outbreak of COVID-19 across the globe significantly disrupted the supply chain and production of the studied market during the initial phase of 2020. Due to labor shortages, many of the players in the semiconductor supply chain worldwide had to reduce or even suspend their operations, which affected the market growth.

* The interface ICs are suitable for disposable medical devices and patches and sports and fitness equipment due to their small size and power-saving design. For instance, EnSilica, a fabless supplier of complex mixed-signal ASIC to OEMs, launched The ENS62020, an ultra-low-power healthcare sensor interface IC designed for monitoring vital signs in wearable healthcare and medical devices.

* The interface integrated circuit (IC) can recognize the external power source and select one of two battery charge current levels based on the type. Signal communications between different electronic systems are controlled and managed by interface ICs. Depending on the communication protocol, these ICs determine how data is transmitted.

* Semiconductor device manufacturers are integrating an increasing number of transistors per IC, leading to increased circuit design complexity and physical access limitations. It requires effective patterning that uses error-free masks to transfer the pattern onto wafers without any errors or defects. Therefore, the need for OEMs to have an edge in terms of device performance drives the market growth

* Also, a diverse range of interface ICs enables dependable, efficient, and cost-effective connections while maintaining the highest signal isolation and protection standards.

* However, the packaging and assembly houses have taken steps towards providing cost-effective solutions by offering flip-chip packaging options on a standard lead frame (FCSOL), quad flat pack no leads (QFN), and standard bis-maleimide triazine (BT) resin substrates. Whereas there may still be costs upfront in the wafer fabrication process, assembly houses are using proven technologies and innovative processes to provide customers with better solutions.

Interface IC Market Trends

Automotive Segment Expected to Witness Significant Market Share

* Automotive is one of the significant end users of the market. The advancement in automotive and its manufacturing is also driving the need for compact power-efficient devices.

* The growing adoption of advanced driver-assistance systems (ADAS) and increasing government regulations globally mandating ADAS are also expanding the scope of this segment. Also, the growing adoption of vehicle infotainment is expected to provide growth opportunities. The growing complexity of automotive digital applications requires the constant evolution of Interface IC and technologies.

* Automotive in-vehicle infotainment (IVI) systems are growing more advanced, and panel options are expanding beyond the widely used Low-voltage differential signaling (LVDS) display as the number of displays they contain increases. For instance, in June 2020, Toshiba Electronic Devices & Storage Corporation added two additional interface bridge ICs to its display interface bridge ICs for automobile In-Vehicle Infotainment (IVI) systems investments by market vendors are expected to drive the demand.

* The market is more focused on innovating the product lines. For instance, in February 2021, Allegro MicroSystems, Inc., a global pioneer in motion control and energy-efficient systems sensing and power solutions, announced the A17700, an automotive-grade interface IC for resistive bridge pressure sensors with signal conditioning algorithms.

* The rapid deployment of 5G networks, coupled with the increasing Internet of Things (IoT) applications for GaNdevices, such as assisted driving and vehicle-to-everything (V2X) communication for smart transport, is expected to increase the demand for Interface ICs.

Asia-Pacific Region Expected to Witness Significant Market Share

* Asia-Pacific holds a prominent share in the global market due to a significant number of regional semiconductor manufacturing operations. The pure-play manufacturers operating in the region are increasing their production capacity to cater to the growing demand from fabless vendors. China is also trying to consolidate its substrate manufacturing market, driving market growth.

* The region vendors are actively more focused on diversifying into non-handset chip segments. For instance, in April 2022, Chunghwa Precision Test Tech (CHPT), a Taiwanese IC test interface expert, is working on expanding deployments beyond handsets as demand for smartphones is growing.

* The growing investment in 5G infrastructure, the increasing number of data center servers and IoT connections, and the advancements in networking devices are some of the major factors driving the growth of the IT and telecom segment in the region.

* The vendors are expanding their production capacities in China to gain a share in the market with demand from sectors such as IT & telecom and the automotive industry during 2020. For instance, in May 2021, AT&S, an Austrian Electronics Component supplier, announced that it is investing EUR 450 million in expanding capacity in its Chongqing factory.

* Further, In May 2021, the Japanese government finalized a plan to enlist one of the major semiconductor companies, Taiwan Semiconductor Manufacturing Co., to develop chip-making technologies in Japan. Such factors also contribute to the growth of the market for interface IC.

Interface IC Market Competitor Analysis

The Interface IC Market is moderately competitive, with many regional and global players. The players are adopting strategies like collaboration, partnership, and agreement as their key developmental strategies.

* February 2022 - Onsemi, a provider of intelligent power and sensor solutions, adopted a fab-liter manufacturing approach to achieve long-term financial success by increasing gross margins.

* August 2021 - Analog Devices, Inc. announced completing the acquisition of Maxim Integrated Products, Inc. With a trailing twelve-month revenue of more than USD 9 billion, ADI's position as a high-performance analog semiconductor manufacturer is further strengthened.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumption and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

  • 4.1 Market Overview
  • 4.2 Porter's Five Forces Analysis
    • 4.2.1 Bargaining Power Of Suppliers
    • 4.2.2 Bargaining Power of Buyers
    • 4.2.3 Threat Of New Entrants
    • 4.2.4 Threat Of Substitutes
    • 4.2.5 Intensity of Competitive Rivalry
  • 4.3 Assessment of COVID-19 Impact on the Market

5 MARKET DYNAMICS

  • 5.1 Market Drivers
    • 5.1.1 Rising Usage of MOSFET Power Transistor in Consumer Electronics Applications
    • 5.1.2 High Adoption of Smartphones and Tablets and Growing Requirement for MOSFET Power Transistor
  • 5.2 Market Challenges
    • 5.2.1 Complexity in the Manufacturing Process

6 MARKET SEGMENTATION

  • 6.1 By Product Type
    • 6.1.1 CAN Interface IC
    • 6.1.2 USB InterfaceIC
    • 6.1.3 Displace Interface
    • 6.1.4 Others
  • 6.2 By End-User Industry
    • 6.2.1 Consumer Electronics
    • 6.2.2 Telecom
    • 6.2.3 Industrial
    • 6.2.4 Automotive
    • 6.2.5 Other End-user Industries
  • 6.3 By Geography
    • 6.3.1 North America
    • 6.3.2 Europe
    • 6.3.3 Asia-Pacific
    • 6.3.4 Latin America
    • 6.3.5 Middle-East

7 COMPETITIVE LANDSCAPE

  • 7.1 Company Profiles
    • 7.1.1 Infineon Technologies AG
    • 7.1.2 Renesas Electronics Corporation
    • 7.1.3 Texas Instruments Incorporated
    • 7.1.4 Analog Devices, Inc.
    • 7.1.5 Microchip Technology Inc
    • 7.1.6 NXP Semiconductors.
    • 7.1.7 Broadcom Inc.
    • 7.1.8 Mitsubishi Electric Corporation
    • 7.1.9 Toshiba Corporation
    • 7.1.10 Vishay Intertechnology, Inc.

8 INVESTMENT ANALYSIS

9 FUTURE OF THE MARKET