查看购物车
  • Traditional Chinese
  • English
  • Japanese
  • Korean
IC市场重点领域：人工智慧（AI）、5G、汽车、记忆体晶片市场分析
市场调查报告书
商品编码
1473280

IC市场重点领域：人工智慧（AI）、5G、汽车、记忆体晶片市场分析

Hot ICs: A Market Analysis of Artificial Intelligence (AI), 5G, Automotive and Memory Chips
出版日期: | 出版商: Information Network | 英文 | 商品交期: 2-3个工作天内

价格

人工智慧（AI）、5G技术、汽车工业和储存晶片的趋势

人工智慧（AI）领域正在出现几个重要趋势，包括人工智慧架构和演算法的进步、边缘人工智慧的扩散以及人工智慧与各产业和应用的融合。人工智慧技术变得越来越复杂，可以实现自然语言处理、电脑视觉和自主决策等任务。

5G技术的广泛采用将彻底改变整个产业，实现更快、更可靠的连接，支援物联网（IoT）设备、扩增实境（AR）、虚拟实境（VR）、加速自我等领域的创新-驾驶汽车。

在汽车领域，人们越来越重视电气化、连网化和自动化，从而促进了电动车（EV）、连网汽车和自动驾驶技术的发展。

最后，储存晶片领域的重点是增加储存容量、提高效能和降低功耗，以满足云端运算、人工智慧和大数据分析等资料密集型应用不断增长的需求。

这些趋势代表了当前人工智慧、5G、汽车和储存晶片技术的演进和融合，正在推动创新和全球产业重组。

科技融合

人工智慧 (AI)、5G 技术、汽车产业以及储存晶片技术进步的融合代表着全球技术格局的重大转变，开启了创新和连接的新时代。本报告揭示了这四个关键领域复杂的交叉动态，它们共同构成了现代 DX（数位转型）的支柱，并为跨产业前所未有的成长机会奠定了基础。

人工智慧处于这场技术革命的前沿，透过驱动更智慧、更有效率的系统来改变我们的生活、工作和互动方式。从提高运算能力到实现更复杂的数据分析和决策过程，人工智慧在塑造技术未来方面的作用至关重要。本报告探讨了人工智慧跨产业的整合、其对智慧系统发展的影响，以及人工智慧如何彻底改变从消费性电子产品到复杂工业运作的一切。

同时，5G 技术的推出标誌着连接性、交付速度和可靠性方面的一个重要里程碑，远远超过了其前辈。5G 不仅仅是增强通讯能力；它将促进物联网 (IoT)、自动驾驶汽车、远距医疗服务等所需的即时资料传输。生态系统分析提供对 5G 生态系统的洞察，研究基础设施课题、监管环境以及 5G 和人工智慧之间将促进技术进步的协同作用。

汽车产业正在经历一场变革，电气化、自动驾驶和连网汽车重新定义了移动出行的本质。本报告评估了人工智慧和 5G 将如何加速汽车创新，重点关注 ADAS（高级驾驶辅助系统）、车载资讯娱乐系统和 V2X（车联网）通讯的整合。它还研究了对製造商、消费者和更广泛的交通基础设施的影响。

记忆体晶片是数位时代的无名英雄，在支援人工智慧、5G 和汽车技术的发展中发挥关键作用。随着这些行业的快速成长，对更快、更有效率和更高容量的储存解决方案的需求也在不断增长。本节评估了记忆体晶片技术的最新趋势，包括 DRAM、NAND 和新兴的 NVRAM（非挥发性记忆体）技术，以及新兴技术在支援资料密集需求方面所发挥的重要作用。

本报告分析了全球IC市场主要领域—人工智慧（AI）、5G、汽车和储存晶片—的最新发展，并探讨了各领域的基本市场结构和驱动因素，以及最新的技术发展和发展趋势。

目录

第一章执行摘要

第二章 汽车

  • 汽车产业指标
  • 汽车半导体产业
    • 汽车记忆体半导体
    • 汽车半导体：依类型
  • 关键技术及零件供应商
    • NXP
    • STMicroelectronics
    • Renesas Electronics
    • Nvidia
    • Intel (Mobileye and Moovit)
    • Skyworks
    • Qualcomm
    • onsemi
    • Texas Instruments
    • Analog Devices
  • 汽车/高级驾驶辅助系统 (ADAS)
    • 与其他汽车AI晶片的竞争
      • Intel-Mobileye
      • Qualcomm
      • Nvidia
      • Huawei
      • Horizon Robotics
      • Black SesameTechnologies
      • Xin Chi Technology
      • Tesla
  • 光达感测器
    • 光达成本考虑
    • 汽车应用
    • 光达供应商
      • Velodyne
      • Luminar
      • Aeva
      • Ouster
      • Innoviz
      • Hesai
      • Livox
      • Innovusion

第三章 5G

  • 5G晶片技术及趋势
  • 应用领域
    • 手机
    • 跨学科联繫
  • 市场分析
    • 市场预测
    • 适用于 5G 和 4G 的新组件
  • 5G晶片供应商产品及简介
    • Analog Devices
    • Anokiware
    • Apple
    • Broadcom
    • Huawei
    • Infineon
    • Intel
    • Inphi
    • Microchip
    • MediaTek
    • Marvell
    • M/A-Com
    • NXP Semiconductor
    • Onsemi
    • Qualcomm
    • Qorvo
    • Samsung Electronics
    • Sivers IMA
    • Skyworks Solutions
    • STMicroelectronics
    • Teradyne
    • Texas Instruments
    • Win Semiconductors
    • Xilinx

第四章 人工智慧（AI）

  • AI科技及趋势
    • 云端人工智慧运算
    • 边缘人工智慧运算
    • 人工智慧的要素
  • 市场分析
    • AI晶片营收预测
  • 应用领域
    • 人工智慧的工业应用
    • 人工智慧驱动的设备
    • 军事/国防应用
    • AI晶片营收预测
  • 人工智慧晶片技术
    • GPU（影像处理单元）
    • FPGA（现场可程式化闸阵列）
    • ASIC（专用积体电路）
    • 神经形态晶片
    • DPU（资料处理单元）
  • AI晶片供应商产品及简介
    • 积体电路供应商
      • Achronix
      • AMD
      • Ampere
      • Biren Technology
      • Flex Logix
      • IBM
      • Intel
      • MediaTek
      • Nvidia
      • NXP
      • Qualcomm
      • Rockchip
      • Samsung Electronics
      • STMicroelectronics
      • Tentsorrent
      • Xilinx
    • 云端提供者：技术领导者
      • Alibaba
      • Alibaba Cloud
      • Amazon
      • Apple
      • Baidu
      • Meta
      • Fujitsu
      • Google
      • Huawei Cloud
      • Microsoft
      • Nokia
      • Tencent Cloud
      • Tesla
    • 智慧财产权供应商
      • ARM
      • CEVA
      • Imagination
      • VeriSilicon
      • Videantis
    • 世界各地的新创公司
      • Adapteva
      • aiCTX
      • AImotive
      • AlphaICs
      • Anari AI
      • Blaize
      • BrainChip
      • Cerebras Systems
      • Cornami
      • DeepScale
      • Anari AI
      • Esperanto Technologies
      • Graphcore
      • GreenWaves Technology
      • Groq
      • Hailo AI
      • KAIST
      • Kalray
      • Kneron
      • Knowm
      • Koniku
      • Mythic
      • SambaNova Systems
      • Tachyum
      • Via
      • deantis
      • Wave Computing
    • 中国新创公司
      • AISpeech
      • Bitmain
      • Cambricon
      • Chipintelli
      • DeePhi Tech
      • Horizon Robotics
      • NextVPU
      • Rokid
      • Thinkforce
      • Unisound

第五章 记忆体晶片

  • 记忆体技术及趋势
    • 记忆
    • NAND
    • NVRAM：MRAM、RRAM、FERAM
  • 应用领域
    • 记忆
    • NAND
  • 市场分析
  • 记忆体晶片供应商产品和简介
    • CXMT
    • Fujian
    • GigaDevice Semiconductor
    • Intel
    • Micron Technology
    • Nanya
    • Powerchip Technology
    • Samsung Electronics
    • SK Hynix
    • Toshiba (Kloxia)
    • Tsinghua Chongqing
    • Western Digital
    • Winbond
    • YMTC

Trends in Artificial Intelligence (AI), 5G technology, the automotive industry, and memory chips

In the realm of Artificial Intelligence (AI), several key trends are emerging, including advancements in AI architectures and algorithms, the proliferation of edge AI, and the integration of AI into various industries and applications. AI technologies are becoming more sophisticated, enabling tasks such as natural language processing, computer vision, and autonomous decision-making.

The adoption of 5G technology is driving significant transformations across industries, enabling faster and more reliable connectivity, supporting the proliferation of Internet of Things (IoT) devices, and facilitating innovations in areas like augmented reality (AR), virtual reality (VR), and autonomous vehicles.

In the automotive sector, there is a growing emphasis on electrification, connectivity, and autonomy, leading to the development of electric vehicles (EVs), connected cars, and selfdriving technologies.

Finally, in the realm of memory chips, there is a focus on increasing storage capacity, improving performance, and reducing power consumption to meet the growing demands of dataintensive applications such as cloud computing, artificial intelligence, and big data analytics.

These trends collectively represent the ongoing evolution and convergence of AI, 5G, automotive, and memory chip technologies, driving innovation and reshaping industries across the globe.

Convergence of Technology

The convergence of Artificial Intelligence (AI), 5G technology, the automotive industry, and advancements in memory chip technology represents a pivotal shift in the global technological landscape, heralding a new era of innovation and connectivity. This comprehensive report delves into the intricate dynamics at the intersection of these four critical sectors, unveiling how they collectively form the backbone of modern digital transformation and setting the stage for unprecedented growth opportunities across various industries.

Artificial Intelligence stands at the forefront of this technological revolution, driving smarter, more efficient systems that are transforming how we live, work, and interact. From enhancing computational power to enabling more sophisticated data analysis and decision-making processes, AI's role in shaping the future of technology cannot be overstated. This report explores AI's integration across industries, its impact on developing intelligent systems, and how it's revolutionizing everything from consumer electronics to complex industrial operations.

Parallelly, the rollout of 5G technology marks a significant milestone in connectivity, offering speeds and reliability that far surpass its predecessors. The implications of 5G extend beyond mere communication enhancements, facilitating the real-time data transmission necessary for the Internet of Things (IoT), autonomous vehicles, and remote healthcare services, among others. Our analysis provides insights into the 5G ecosystem, examining infrastructure challenges, regulatory landscapes, and the synergy between 5G and AI in catalyzing technological advancement.

The automotive sector is undergoing a transformative phase, with electrification, autonomous driving, and connected vehicles redefining the very essence of mobility. This report assesses how AI and 5G collectively accelerate automotive innovations, focusing on the integration of advanced driver-assistance systems (ADAS), in-vehicle infotainment, and vehicle-to-everything (V2X) communications. It also considers the implications for manufacturers, consumers, and the broader transportation infrastructure.

Memory chips, the unsung heroes of the digital age, play a crucial role in sustaining the growth of AI, 5G, and automotive technologies. As these sectors burgeon, so does the demand for faster, more efficient, and higher-capacity storage solutions. This section of the report evaluates the latest developments in memory chip technology, including DRAM, NAND, and emerging non-volatile memory technologies, highlighting their critical role in supporting the data-intensive needs of modern technologies.

In compiling this report, we aim to provide a holistic overview of how AI, 5G, the automotive sector, and advancements in memory chip technology are intricately linked, driving forward a new wave of innovation and industry growth. Through detailed market analysis, technological insights, and forward-looking projections, this report offers valuable intelligence for stakeholders across these sectors, enabling informed decision-making and strategic planning in an increasingly interconnected technological ecosystem.

About This Report

This report encompasses a broad spectrum of analyses, insights, and projections that illuminate the current state and future trajectory of these interlinked sectors. This report not only delves into individual technologies and their applications but also explores the synergies and intersections that are propelling innovation and market growth. Here's an expanded view of what such a report covers:

Artificial Intelligence (AI)

  • Market Overview: Analysis of the global AI market, including size, growth trends, and forecasts. It examines key segments such as machine learning, natural language processing, and AI in robotics.
  • Technology Trends: Exploration of cutting-edge AI technologies and methodologies, including deep learning, computer vision, and AI chips. The report assesses how these technologies are transforming industries.
  • Application Areas: Detailed review of AI applications across various sectors, including healthcare, finance, retail, and more, highlighting case studies of successful AI integration.
  • Challenges and Opportunities: Discussion on ethical considerations, data privacy issues, and the talent gap in AI. It also explores funding trends and governmental policies affecting AI development and adoption.

5G Technology

  • Infrastructure and Deployment: Examination of the global rollout of 5G, including infrastructure requirements, spectrum allocation, and deployment strategies. It evaluates the progress in major regions and the challenges faced.
  • Use Cases and Applications: Insight into the transformative potential of 5G across industries such as entertainment, manufacturing, and agriculture, emphasizing enhanced connectivity and IoT.
  • Market Dynamics: Analysis of the competitive landscape, key players, and partnerships shaping the 5G ecosystem. It includes investment trends and regulatory impacts on market evolution.
  • Future Prospects: Projection of the future of 5G, including the integration with satellite communications, development of 6G, and its role in enabling smart cities and autonomous systems.

Automotive Industry

  • Electrification and Autonomous Driving: Overview of trends in electric vehicles (EVs) and autonomous driving technologies. This section covers advancements in battery technology, ADAS, and regulatory frameworks impacting vehicle automation and connectivity.
  • Connectivity Solutions: Examination of the role of 5G in transforming automotive connectivity, including vehicle-to-everything (V2X) communication, in-car infotainment systems, and telematics.
  • Market Players and Innovations: Analysis of leading automotive manufacturers, technology companies, and startups driving innovation in connected and autonomous vehicles.
  • Sustainability and Challenges: Discussion on the automotive industry's move towards sustainability, including challenges in adoption, infrastructure development, and the impact on urban mobility.

Memory Chips

  • Technology Evolution: Deep dive into the developments in memory chip technology, including DRAM, NAND flash, and emerging technologies like 3D XPoint and MRAM. It assesses the impact of these advancements on storage capacity, speed, and power efficiency.
  • Industry Applications: Exploration of how memory chips support the data needs of AI, 5G, and automotive technologies, facilitating advancements in edge computing, data centers, and consumer electronics.
  • Market Analysis: Review of the global memory chip market, including supply and demand dynamics, key manufacturers, and pricing trends. It also considers the impact of geopolitical factors on the semiconductor supply chain.
  • Future Directions: Projections for the memory chip market, focusing on innovations in semiconductor materials, manufacturing processes, and the integration of memory technologies in next-generation computing architectures.

Table of Contents

Chapter 1. Executive Summary

Chapter 2. Automotive

  • 2.1. Automotive Industry Metrics
  • 2.2. Automotive Semiconductor Industry
    • 2.2.1. Automotive Memory Semiconductors
    • 2.2.2. Automotive Semiconductors By Type
      • 2.2.2.1. Microcontrollers
      • 2.2.2.2. ASSP/ASICs
      • 2.2.2.3. Analog
      • 2.2.2.4. Discrete
  • 2.3. Key Technology And Component Suppliers
    • NXP
    • STMicroelectronics
    • Renesas Electronics
    • Nvidia
    • Intel (Mobileye and Moovit)
    • Skyworks
    • Qualcomm
    • onsemi
    • Texas Instruments
    • Analog Devices
  • 2.4. Automotive/ Advanced Driver Assistance Systems (ADAS)
    • 2.4.1. Competition from Alternative Automotive AI Chips
      • Intel-Mobileye
      • Qualcomm
      • Nvidia
      • Huawei
      • Horizon Robotics
      • Black SesameTechnologies
      • Xin Chi Technology
      • Tesla
  • 2.5. LiDAR Sensors
    • 2.5.1. LiDAR - Cost Considerations
    • 2.5.2. Automotive Applications
    • 2.5.3. LiDAR Suppliers
      • Velodyne
      • Luminar
      • Aeva
      • Ouster
      • Innoviz
      • Hesai
      • Livox
      • Innovusion

Chapter 3 5G

  • 3.1 5G Chip Technology and Trends
  • 3.2. Applications
    • 3.2.1. Mobile Handsets
    • 3.2.2. Interdisciplinary Connections
  • 3.3. Market Analysis
    • 3.3.1. Market Forecasts
    • 3.3.2. New Components For 5G vs 4G
      • 3.3.2.1. 5G Modem Chip Overview
      • 3.3.2.2. 5G Chips
      • 3.3.2.3. mmWave Modules
      • 3.3.2.4. Traditional MIMO Antennas
  • 3.4. 5G Chip Supplier Products and Profiles
    • Analog Devices
    • Anokiware
    • Apple
    • Broadcom
    • Huawei
    • Infineon
    • Intel
    • Inphi
    • Microchip
    • MediaTek
    • Marvell
    • M/A-Com
    • NXP Semiconductor
    • Onsemi
    • Qualcomm
    • Qorvo
    • Samsung Electronics
    • Sivers IMA
    • Skyworks Solutions
    • STMicroelectronics
    • Teradyne
    • Texas Instruments
    • Win Semiconductors
    • Xilinx

Chapter 4. Artificial Intelligence (AI)

  • 4.1. AI Technology and Trends
    • 4.1.1. Cloud AI Computing
    • 4.1.2. Edge AI Computing
    • 4.1.3. The Elements Of Artificial Intelligence
      • 4.1.3.1. Importance Of Training And Inference
      • 4.1.3.2. The Growing Importance Of Accelerators In Dc Spending
      • 4.1.3.3. Training Costs
      • 4.1.3.4. Generative AI
  • 4.2. Market Analysis
    • 4.2.1. AI Chip Revenue Forecast
  • 4.3. Applications
    • 4.3.1. Industry Applications of AI
      • 4.3.1.1. Smart Healthcare
      • 4.3.1.2. Smart Security
      • 4.3.1.3. Smart Finance
      • 4.3.1.4. Smart Grid
      • 4.3.1.5. Smart Hone
    • 4.3.2. AI-Powered Devices
      • 4.3.2.1. Smart Speakers
      • 4.3.2.2. Drones
      • 4.3.2.3. Intelligent Robots
    • 4.3.3. Military/Defense Applications
      • 4.3.3.1. China's AI Plan
      • 4.3.2.1. Driverless Vehicles
      • 4.3.2.2. Computer Chips
      • 4.3.2.3. Financial
      • 4.3.2.4. Facial Recognition
      • 4.3.2.5. Retail
      • 4.3.2.6. Robots
    • 4.3.3. AI Chip Revenue Forecast
  • 4.4. AI Chip Technology
    • 4.4.1. Graphics Processing Unit (GPU)
    • 4.4.2. Field Programmable Gate Array (FPGA)
    • 4.4.3. Application Specific Integrated Circuits (ASIC)
    • 4.4.4. Neuromorphic Chips
    • 4.4.5. Data Processing Units (DPUs)
  • 4.5. AI Chip Supplier Products and Profiles
    • 4.5.1. IC Vendors
      • Achronix
      • AMD
      • Ampere
      • Biren Technology
      • Flex Logix
      • IBM
      • Intel
      • MediaTek
      • Nvidia
      • NXP
      • Qualcomm
      • Rockchip
      • Samsung Electronics
      • STMicroelectronics
      • Tentsorrent
      • Xilinx
    • 4.5.2. Cloud Providers - Tech Leaders
      • Alibaba
      • Alibaba Cloud
      • Amazon
      • Apple
      • Baidu
      • Meta
      • Fujitsu
      • Google
      • Huawei Cloud
      • Microsoft
      • Nokia
      • Tencent Cloud
      • Tesla
    • 4.5.3. IP Vendors
      • ARM
      • CEVA
      • Imagination
      • VeriSilicon
      • Videantis
    • 4.5.4. Startups Worldwide
      • Adapteva
      • aiCTX
      • AImotive
      • AlphaICs
      • Anari AI
      • Blaize
      • BrainChip
      • Cerebras Systems
      • Cornami
      • DeepScale
      • Anari AI
      • Esperanto Technologies
      • Graphcore
      • GreenWaves Technology
      • Groq
      • Hailo AI
      • KAIST
      • Kalray
      • Kneron
      • Knowm
      • Koniku
      • Mythic
      • SambaNova Systems
      • Tachyum
      • Via
      • deantis
      • Wave Computing
    • 4.5.5. Startups in China
      • AISpeech
      • Bitmain
      • Cambricon
      • Chipintelli
      • DeePhi Tech
      • Horizon Robotics
      • NextVPU
      • Rokid
      • Thinkforce
      • Unisound

Chapter 5. Memory Chips

  • 5.1. Memory Technology and Trends
    • 5.1.1. DRAM
    • 5.1.2. NAND
    • 5.1.3. NVRAM - MRAM, RRAM, and FERAM
  • 5.2. Applications
    • 5.2.1. DRAM
      • 5.2.1.1. Server
      • 5.2.1.2. PC
      • 5.2.1.3. Graphics
      • 5.2.1.4. Mobile
      • 5.2.1.5. Consumer
    • 5.2.2. NAND
      • 5.2.2.1. SSD
      • 5.2.2.2. PC
      • 5.2.2.3. TV
      • 5.2.2.4. Mobile
      • 5.2.2.5. USB
  • 5.3. Market Analysis
  • 5.4. Memory Chip Supplier Products and Profiles
    • CXMT
    • Fujian
    • GigaDevice Semiconductor
    • Intel
    • Micron Technology
    • Nanya
    • Powerchip Technology
    • Samsung Electronics
    • SK Hynix
    • Toshiba (Kloxia)
    • Tsinghua Chongqing
    • Western Digital
    • Winbond
    • YMTC

List of Figures

  • 1.1. IC Market By Revenue By Type By Quarter 2019-2023
  • 1.2. IC Market By Units By Type By Quarter 2019-2023
  • 1.3. IC Market By Asps By Type By Quarter 2019-2023
  • 1.4. Smartphone And PC Unit Shipments By Quarter 2022-2023
  • 1.5. Smartphone And PC Unit Shipments By Year 2021-2024
  • 1.6. PC Semiconductor Market Forecast 2015-2026
  • 1.7. Logic Revenues By Quarter 2019-2023
  • 1.8. Memory Revenues By Quarter 2019-2023
  • 1.9. Memory Units By Quarter 2019-2023
  • 1.10. Memory ASPs By Quarter 2019-2023
  • 2.1. Semiconductor Content Per Vehicle Forecast
  • 2.2. Key Applications Of Semiconductors In An Automobile
  • 2.3. Diagram Of Automotive Memory Needs
  • 2.4. Automotive Memory Market Share
  • 2.5. Automotive Semiconductor Market Share
  • 2.6. Average Semiconductor Content Per Car By Level Of Automation
  • 2.7. Automotive Imaging Segments
  • 2.8. Five Levels Of Autonomous Driving
  • 3.1. RF Chip Market Forecast By Network Generation
  • 4.1. Performance Comparison Of TPU, GPU, And CPU
  • 4.2. Artificial Intelligence Market Share by Chip Type 2022 and 2023
  • 4.3. AI Training And Inference
  • 4.4. AI Training And Inference Chip Forecast
  • 4.5. AI Training And Inference Chip Forecast By Type
  • 4.6. Total Top Global Defense Company M&A 2013-2020
  • 5.1. DRAM Scaling
  • 5.2. DRAM Memory Shrink Roadmap
  • 5.3. 3D-NAND Memory Shrink Roadmap
  • 5.4. Transition From SLC To QLC
  • 5.5. Comparison Of Non-Volatile Ram Write Times
  • 5.6. Competition In Dissipation Speed And Memory Capacity
  • 5.7. DRAM Content Of Chinese Smartphones
  • 5.8. NAND Content Of Chinese Smartphones
  • 5.9. Total Available Market For SST MRAM
  • 5.10. Total Available Market For Toggle MRAM

List of Tables

  • 1.2. Smartphone Unit Shipment Forecast 2019-2026
  • 1.3. Smartphone Semiconductor Content Forecast 2019-2026
  • 1.4. Smartphone Semiconductor Market By Revenue 2019-2026
  • 1.5. Smartphone Semiconductor Revenue Content 2019-2026
  • 1.6. Smartphone Dram ASPs Forecast 2019-2026
  • 1.7. Smartphone Nand ASPs Forecast 2019-2026
  • 1.8. PC Market Forecast By Type 2019-2026
  • 1.9. PC Semiconductor Market Forecast 2019-2026
  • 1.10. PC Memory Revenue Market Forecast 2019-2026
  • 1.11. PC Memory Gb Market Forecast By Type 2019-2026
  • 1.12. Server Market Forecast 2019-2026
  • 1.13. Server Semiconductor Market Forecast 2019-2026
  • 1.14. Server Memory Revenue Market Forecast 2019-2026
  • 1.15. Server GPU Revenue Market Forecast 2019-2026
  • 2.1. EV Shipment Forecast By Region 2018-2025
  • 2.2. ICE Auto Shipment Forecast By Region 2018-2025
  • 2.3. Automotive Semiconductor Sales Forecast 2019-2025
  • 2.4. Automotive Semiconductor Sales By Company 2022-2024
  • 2.5. Top Automotive Semiconductor Sales By Customer 2021-2022
  • 2.6. SOC Autopilot Chip Versions
  • 2.7. Functionality Comparison Of Sensor Modalities
  • 2.8. Differences Among Lidar Devices
  • 2.9. Major Lidar Companies
  • 3.1. Feature Comparison Of Smartphone PAs By Generation
  • 3.2. 5G Subscriptions
  • 3.3. Smartphone Forecast By Geographic Region
  • 3.4. Smartphone Subscription Forecast By Technology
  • 3.5. 5G Smartphone Forecast By Geographic Region
  • 3.6. 5G Smartphone Mobile Semiconductor Forecast
  • 3.7. 5G Semiconductor Total Available Market Forecast
  • 3.8. 5G Smartphone Shipment By Major OEMs
  • 3.9. 5G Smartphone Penetration By Country
  • 3.10. Mobile Subscriptions By Region
  • 3.11. Smartphone Subscriptions By Region
  • 3.12. LTE Subscriptions By Region
  • 3.13. 5G Subscriptions By Region
  • 3.14. Data Traffic Per Smartphone By Region
  • 3.15. Mobile Data Traffic By Region
  • 4.1. Artificial Intelligence Market Forecast By Chip Type 2019-2026
  • 4.2. AI Training And Inference Chip Forecast
  • 4.3. AI Chip Forecast By Chip Type
  • 4.4. Characteristics Of CPU, FPGA, CCPU, and ASIC
  • 4.5. Characteristics Of CPU, FPGA, CCPU, and ASIC
  • 4.6. Smart Speaker Products
  • 5.1. Comparison Of Non-Volatile RAM Technology
  • 5.2. Total DRAM Industry Revenue Forecast 2019-2026
  • 5.3. Total DRAM Bit Shipment Revenue Forecast 2019-2026
  • 5.4. Total DRAM Blended ASP ($/GB) Revenue Forecast 2015-2026
  • 5.5. Total DRAM Bit Supply Forecast 2019-2026
  • 5.6. DRAM Revenue By End Market Forecast 2019-2026
  • 5.7. DRAM Capacity By Company Forecast 2018-2024
  • 5.8. DRAM Revenue By Company Forecast 2018-2024
  • 5.9. Total NAND Industry Revenue Forecast 2019-2026
  • 5.10. Total NAND Bit Shipment Revenue Forecast 2019-2026
  • 5.11. Total NAND Blended ASP ($/Gb) Revenue Forecast 2019-2026
  • 5.12. Total NAND Bit Supply Forecast 2019-2026
  • 5.13. NAND Revenue By End Market Forecast 2019-2026
  • 5.14. NAND Capacity By Company Forecast 2018-2024
  • 5.15. NAND Revenue By Company Forecast 2018-2024