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市场调查报告书
商品编码
1759484
无晶圆厂IC的全球市场:终端用户产业·类型·各地区 (~2032年)Global Fabless IC Market Research Report by End Use Industry, by Type, by Region Market Analysis till 2032 |
预计到 2032 年,全球无晶圆厂积体电路市场规模将达到 4394.698 亿美元,在预测期内(2024-2032 年),复合年增长率将达到 17.9%,而 2023 年的市场规模为 1050.186 亿美元。
这种显着成长归因于消费性电子、汽车、医疗和工业自动化等各行各业对创新电子解决方案的需求日益增长。此外,半导体製造技术的不断进步,例如生产更小、更快、更节能的晶片,也推动了全球无晶圆厂积体电路市场的发展。
主要的成长机会来自于人工智慧和机器学习在晶片设计中的应用。这将推动开发针对新技术最佳化的高性能智慧积体电路,从而进一步增强市场竞争力。然而,无晶圆厂积体电路市场也存在一些阻碍因素。尤其是在涉及国家安全敏感元素的设计中,存在着与法规合规性和智慧财产权相关的课题。
区域展望
受半导体和积体电路技术先进进步的推动,北美是全球无晶圆厂积体电路市场的第二大地区。尤其是美国,它引领着该行业的技术创新,并发挥着举足轻重的作用。此外,美国汽车产销的成长,尤其是在使用数位讯号处理器 (DSP) 的领域,也支撑着无晶圆厂积体电路产业的进一步成长。
受混合动力车和电动车日益普及的推动,欧洲市场前景强劲。尤其是德国,它被视为插电式电动车的最大市场。此外,工业4.0的推进使得工业自动化日益受到重视,工业机器人、协作机器人(COBOT)、滚筒和自动导引车(AGV)等技术的日益普及也显着推动了对无晶圆厂IC的需求。
亚太地区已成为全球无晶圆厂IC创新的中心。这个充满活力且快速发展的市场得益于专业的无晶圆厂公司,它们拥有技术领先优势、建立了策略联盟并持续创新。
中东和非洲的无晶圆厂IC市场也稳定成长。这得益于物联网应用的普及、日益增长的自动化需求以及各国政府大力发展智慧城市基础设施和推动数位转型,这些都大大促进了市场的成长。
本报告提供全球无晶圆厂IC的市场调查,彙整市场定义和概要,市场成长的各种影响因素分析,市场规模的转变·预测,各种区分·地区/各主要国家的明细,竞争环境,主要企业简介等资讯。
Global Fabless IC Market Research Report by End Use Industry (Consumer Electronics, Automotive, Industrial, Telecommunication, Healthcare, Aerospace & Defense, and Others), by Type [Microcontrollers (MCUs), Digital Signal Processors (DSP), Graphic Processing Units (GPUs), Application Specific Integrated Circuits (ASIC), Power Management ICs (PMICs), Display Driver ICs, Memory ICs, and Others], by Region (North America, Europe, Asia-Pacific, Middle East & Africa, and South America) Market Analysis till 2032
Industry Overview
The global fabless IC market was valued at USD 105,018.6 million in 2023 and is expected to grow significantly, reaching USD 439,469.8 million by 2032, registering a strong compound annual growth rate (CAGR) of 17.9% during the forecast period of 2024 - 2032.
The impressive growth is largely fueled by the rising demand for innovative electronic solutions across various industries, including consumer electronics, automotive, healthcare, and industrial automation. Moreover, ongoing advancements in semiconductor manufacturing, such as the creation of more compact, faster, and energy-efficient chips, are further driving the global fabless IC market's momentum.
A key growth opportunity lies in the incorporation of artificial intelligence (AI) and machine learning (ML) into chip design, enabling the development of intelligent and efficient ICs tailored for emerging technologies. However, the global fabless IC market does face certain restraints, notably challenges related to regulatory compliance and concerns over intellectual property, particularly in designs involving sensitive national security elements.
Industry Segmentation
In terms of types, the global fabless IC market includes microcontrollers (MCUS), application specific integrated circuits (ASIC), power management ICs (PMICs), digital signal processors (DSP), graphic processing units (GPUS), display driver ICs, memory ICs, and others.
Global fabless IC market has been segmented into end user industry, including automotive, industrial, telecommunication, consumer electronics, healthcare, aerospace & defense, and others.
Based on the region, the global fabless IC market includes Asia-Pacific, Middle East & Africa, North America, Europe, and South America.
Regional Perspectives
North America ranks as the second-largest region in the global fabless integrated circuit (IC) market, primarily due to advanced developments in semiconductor and IC technologies. The United States plays a pivotal role, leading innovation in this industry. Additionally, the country's growth in automotive production and sales, especially in sectors utilizing digital signal processors, is further bolstering the fabless IC industry.
In Europe, the market outlook remains strong, largely fueled by the increasing adoption of hybrid and electric vehicles, with Germany emerging as the top market for plug-in electric car sales. Furthermore, the growing emphasis on industrial automation, supported by Industry 4.0 integration and technologies such as industrial robots, collaborative robots (COBOTs), rollers, and automated guided vehicles, is significantly enhancing the demand for fabless ICs.
The Asia-Pacific (APAC) region has become a global hub for fabless IC innovation. This vibrant and rapidly evolving global fabless IC market is being driven by specialized fabless firms that bring technological leadership, strategic collaboration, and continuous innovation to the semiconductor landscape.
Meanwhile, the Middle East and Africa (MEA) region is also witnessing notable growth. The progress is fuelled by the rising adoption of IoT-based applications, increasing automation needs, and various government initiatives aimed at promoting digital transformation and the development of smart city infrastructures, all contributing to the expansion of the fabless IC market.
Major Competitors
Silicon Labs, MediaTek Inc., Qualcomm Inc, Broadcom Inc., Infineon Technologies AG, NVIDIA Corporation, Xilinx Inc., Himax Technologies Inc., Ambarella Inc., Renesas Electronics Corporation are the leading companies in the Global Fabless IC Market.