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市场调查报告书
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1398976

保持领先地位-半导体产业分析超值套件(2023):报告(7 卷)-台湾,中国和全球IC设计製造(代工,记忆体)和IC OSAT产业洞察,供应链

Stay Ahead - 2023 Semiconductor Industry Research Value Pack: 7 Reports Bundle Encompasses IC Design, IC Manufacturing (Foundry, Memory) and IC OSAT Industry Insights and Supply Chains in Taiwan, China, and the World
出版日期: | 出版商: MIC - Market Intelligence & Consulting Institute | 英文 80 Pages | 订单完成后即时交付

价格

执行摘要

本报告包全面分析全球、中国及台湾IC设计、IC製造（晶圆代工、记忆体）、IC OSAT（半导体封装及测试外包）产业，以及各供应链结构及最新动态（2022-2023）。

儘管面临高通膨、俄乌战争等不利因素，2022年全球半导体产业仍将维持两位数成长。这一趋势受到上半年销售成长以及网路和资料中心晶片销售强劲的支持。受整体宏观经济环境影响，预计2023年全球半导体市场规模将下降10.1%至5,161亿美元。内存IC产业今年受到的影响尤其严重。幸运的是，自2023年第一季以来，全球主要储存IC製造商都实施了减产控制并稳定了出货价格。预计年增率为46.3%的储存IC产业，2024年市场规模将达到1,343亿美元，2025年和2026年将持续高成长，年成长率分别为38.7%和13.1%。预计预计该行业将成为未来三年全球半导体市场成长的主要推动力。

目录

全球IC设计产业：概况（2022年）与发展（2023年）

第一章 全球IC设计产业发展（2022年）

  • 全球10强IC设计公司排名（2022年）
  • IC设计产业整体表现（2022年）

第二章 主要IC设计公司业务发展状况（2022年）

  • Qualcomm、MediaTek
  • Nvidia、AMD
  • Broadcom、Marvell

第三章 全球IC设计产业发展（2023年）

  • 由于智慧型手机和PC市场復苏延迟，2023年下半年前景不确定
  • 人工智慧应用的兴起为云端伺服器和边缘运算晶片带来机遇

附录

  • 公司名单
  • 全球半导体代工产业：概况（2022年）与发展（2023年）

第一章 全球铸造产业概况（2022年）

  • 全球半导体代工市场规模（2022年）
  • 全球10大半导体代工厂排名（2022年）
  • 半导体代工产业整体表现（2022年）

第二章 主要半导体代工厂发展趋势（2022年）

  • TSMC
  • Samsung
  • UMC、PSMC、Vanguard
  • SMIC
  • GlobalFoundries

第三章 全球半导体代工产业发展（2023年）

  • 晶圆代工营运预计2023年上半年触底，但2023年下半年復苏步伐仍不确定性
  • Intel全新IFS商业模式改变全球半导体代工格局

附录

  • 公司名单
  • 全球IC封装测验产业：概况（2022年）与发展（2023年）

第一章 全球封测产业概况（2022年）

  • 全球IC封测产业市场规模及前10家OSAT排名（2022年）
  • 全球IC封装测试产业整体表现（2022年）

第二章 主要封测企业经营绩效（2022年）

  • ASE Holdings、PTI、KYEC
  • Amkor、JCET

第三章 全球封测产业展望

  • 随着消费性电子产品需求下滑，OSAT 将重点转向汽车晶片
  • 领导企业加速开发先进封装技术，因应 HPC 和 AI 应用的新兴趋势

附录

  • 公司名单
  • 中国IC设计产业发展及主要企业

第一章 中国IC设计产业概况

  • IC设计产业市场规模趋势
  • IC设计产业企业分布
    • IC设计公司数量趋势
    • IC设计公司分布：依规模
    • IC设计产品分布：依类别

第二章 我国主要IC设计公司发展状况

  • Huawei HiSilicon
  • Unisoc
  • GigaDevice
  • Will Semiconductor

第三章我国IC设计业的发展

  • 中国积体电路自给率
  • EDA 出口禁令的后续影响

第 4 章 MIC 视角

附录

  • 公司名单
  • 中国IC封测产业发展及主要企业

第一章 中国积体电路封测产业发展

  • 中国IC封测产业市场规模及近期变化
  • 中国IC封测产业企业区域分布

第二章 本国主要IC封测企业发展状况

  • 中国IC封测企业：10强企业排名
  • 中国封测企业：近期业绩前三名
    • JCET
    • Tongfu Microelectronics
    • Huatian Technology

第三章 产业展望

  • 国家积体电路产业投资基金效应
  • 中美衝突与与中国脱钩的影响
  • 先进製程技术失败后中国将重点转向汽车半导体

附录

  • 公司名单
  • 台湾半导体产业格局：2023年及以后
  • 台湾在全球半导体产业的地位与发展
  • 台湾半导体产业重点领域发展
  • 台湾半导体产业主要动态（2023年第三季起）

第一章 半导体产业发展

  • 积体电路设计
    • 旺季表现未达预期（2023年下半年）
    • 随着人工智慧热潮持续，IC设计公司向多种应用领域多元化发展
  • 积体电路製造
    • 晶圆代工前景谨慎：订单能见度低
    • 预计2023年第四季至2024年上半年内存需求和供应将保持稳定。
  • IC封装/检验
    • 消费市场动能恢復，旺季影响
    • HPC和AI应用新趋势对先进封装和测试的需求持续成长

附录

  • 公司名单
Product Code: SCRPT23112401

Executive Summary

This pack offers comprehensive insights into the IC design, IC manufacturing (foundry, memory), and IC OSAT (Outsourced Semiconductor Assembly and Testing) sectors, covering global, Taiwan, and China, along with their respective supply chains for the period 2022-2023 and beyond.

Despite adverse factors such as high inflation rates and the Russia-Ukraine war, the global semiconductor industry sustained double-digit growth throughout 2022, supported by higher revenue in the first half and robust sales of networking and data center chips. In 2023, the global semiconductor market is expected to have declined by 10.1% to US$516.1 billion under the influence of the overall macroeconomic environment. Among them, the memory IC sector has been the most affected this year. Fortunately, since the first quarter of 2023, major global memory IC manufacturers have implemented production reduction controls, stabilizing shipment prices. With an expected year-on-year growth of 46.3%, the memory IC sector is anticipated to reach US$134.3 billion in 2024 and continue high growth in 2025 and 2026, with year-on-year growth rates of 38.7% and 13.1%, respectively. This sector is expected to be a major driving force for the global semiconductor market growth in the next three years.

Table of Contents

  • 2022 Recap and 2023 Development of the Global IC Design Industry

1.Development of the Global IC Design Industry in 2022

  • 1.1 Ranking of Global Top Ten IC Design Companies in 2022
  • 1.2 IC Design Industry's Overall Performance in 2022

2. Major IC Design Companies' Business Operations in 2022

  • 2.1 Qualcomm & MediaTek
  • 2.2 Nvidia & AMD
  • 2.3 Broadcom & Marvell

3.Development of the Global IC Design Industry in 2023

  • 3.1 Uncertain Outlook for 2H23 Due to Slow Recovery in the Smartphone and PC Markets
  • 3.2 Rise of AI Applications Driving Opportunities for Cloud Server and Edge Computing Chips

Appendix

  • List of Companies
  • 2022 Recap and 2023 Development of the Worldwide Semiconductor Foundry Industry

1.Global Foundry Industry Recap 2022

  • 1.1 Global Semiconductor Foundry Market Size in 2022
  • 1.2 Top Ten Global Semiconductor Foundry Rankings in 2022
  • 1.3 Overall Performance of the Semiconductor Foundry Industry in 2022

2. Development Trends of Major Semiconductor Foundries in 2022

  • 2.1 TSMC
  • 2.2 Samsung
  • 2.3 UMC, PSMC, Vanguard
  • 2.4 SMIC
  • 2.5 GlobalFoundries

3. Global Semiconductor Foundry Industry Development in 2023

  • 3.1 Foundry Operations Expected to Bottom Out in 1H23, Recovery Pace Remains Uncertain in 2H23
  • 3.2 Intel’s New IFS Business Model to Change the Global Semiconductor Foundry Landscape

Appendix

  • List of Companies
  • 2022 Recap and 2023 Development of the Global IC Packaging and Testing Industry

1. Recap of the Global IC Packaging and Testing Industry in 2022

  • 1.1 Market Size and Top Ten OSAT Rankings in the Global IC Packaging and Testing Industry in 2022
  • 1.2 Overall Performance of the Global IC Packaging and Testing Industry in 2022

2.Operational Performance of Major OSAT Companies in 2022

  • 2.1 ASE Holdings, PTI, KYEC
  • 2.2 Amkor, JCET

3. Outlook for the Global IC Packaging and Testing Industry

  • 3.1 OSATs Shifting Focus to Automotive Chips While Consumer Electronics Demand Weakening
  • 3.2 Leading Players Accelerate Advanced Packaging Technology Development to Meet Emerging HPC and AI Application Trends

Appendix

  • List of Companies
  • Development of the IC Design Industry and Major Players in China

1.Overview of the IC Design Industry in China

  • 1.1 Changes in the Market Size of the IC Design Industry
  • 1.2 Distribution of IC Design Industry Players
    • 1.2.1 Changes in the Number of IC Design Companies
    • 1.2.2 Distribution of IC Design Industry Players by Scale
    • 1.2.3 Distribution of IC Design Products by Category

2. Development of Major IC Design Companies in China

  • 2.1 Huawei HiSilicon
  • 2.2 Unisoc
  • 2.3 GigaDevice
  • 2.4 Will Semiconductor

3. Development of the IC Design Industry in China

  • 3.1 Independent IC Supply Rate in China
  • 3.2 The Subsequent Impact of the EDA Ban

4.MIC Perspective

Appendix

  • List of Companies
  • Development of the China IC Packaging and Testing Industry and Key Players

1.Development of China IC Packaging and Testing Industry

  • 1.1 Market Size and Recent Changes in China's IC Packaging and Testing Industry
  • 1.2 Regional Distribution of IC Packaging and Testing Industry Players in China

2.Development of major IC Packaging and Testing Players in China

  • 2.1 Ranking of the Top-10 Chinese IC Packaging and Testing Companies
  • 2.2 Recent Performance of the Top-3 Chinese IC Packaging and Testing Companies
    • 2.2.1 JCET
    • 2.2.2 Tongfu Microelectronics
    • 2.2.3 Huatian Technology

3.Outlook for the Industry

  • 3.1 Effects of National Integrated Circuit Industry Investment Fund
  • 3.2 Impact of US-China Conflict and Decoupling from China
  • 3.3 China Shifting Focus to Automotive Semiconductors Following Obstacles in Advanced Process Technology

Appendix

  • List of Companies
  • Taiwanese Semiconductor Industry Landscape, 2023 and Beyond
  • Taiwan's Global Position and Development in the Semiconductor Industry
  • Development of Taiwan's Major Semiconductor Industry Sectors
  • Key Developments in the Taiwan Semiconductor Industry, 3Q 2023 and Beyond

1.Development of the Semiconductor Industry

  • 1.1 IC Design
    • 1.1.1 Peak Season Performance Fails to Meet Expectations in 2H23
    • 1.1.2 IC Design Firms Diversify into Multiple Applications amid Continued AI Boom
  • 1.2 IC Manufacturing
    • 1.2.1 Wafer Foundry Outlook Cautious due to Low Order Visibility
    • 1.2.2 Memory Supply and Demand Expected to Stabilize during 4Q23 to 1H24
  • 1.3 IC Packaging and Testing
    • 1.3.1 Peak Season Effect Depending on Consumer Market Momentum Pickups
    • 1.3.2 Emerging Trends in HPC and AI Applications Continue to Drive Demand for Advanced Packaging and Testing

Appendix

  • List of Companies

List of Tables

  • 2022 Recap and 2023 Development of the Global IC Design Industry
  • Table 1 Ranking of Global Top Ten IC Design Companies in 2022
  • 2022 Recap and 2023 Development of the Worldwide Semiconductor Foundry Industry
  • Table 1: Top Ten Global Semiconductor Foundry Rankings in 2022
  • 2022 Recap and 2023 Development of the Global IC Packaging and Testing Industry
  • Table 1 Global Top Ten OSAT Rankings in 2022
  • Development of the China IC Packaging and Testing Industry and Key Players
  • Table 1 Ranking of the Top-10 Chinese IC Packaging and Testing Companies in 2022

List of Figures

  • 2022 Recap and 2023 Development of the Global IC Design Industry
  • Figure 1 Leading IC Design Companies' Changes in Inventory Turnover Days, 1Q21 - 1Q23
  • Figure 2 Leading IC Design Companies' Revenue Changes, 1Q22 - 1Q23
  • Figure 3 Qualcomm's 2022 Revenue by Product Line
  • Figure 4 MediaTek's 2022 Revenue by Product Line
  • Figure 5 Nvidia's 2022 Revenue by Product Line
  • Figure 6 AMD's 2022 Revenue by Product Line
  • Figure 7 Broadcom's 2022 Revenue by Semiconductor Solutions Product Line
  • Figure 8 Marvell's 2022 Revenue by Product Line
  • 2022 Recap and 2023 Development of the Worldwide Semiconductor Foundry Industry
  • Figure 1 Comparison of Major Foundries’ Gross Margin Changes, 2021 - 2022
  • Figure 2 TSMC’s Revenue Changes by Product Applications, 2021-2022
  • Figure 3 Samsung’s Revenue Changes by Business Segments, 2021-2022
  • Figure 4 UMC’s Revenue Changes by Product Applications, 2021-2022
  • Figure 5 PSMC’s Revenue Changes by Product Applications, 2021-2022
  • Figure 6 Vanguard’s Revenue Changes by Product Applications, 2020-2021
  • Figure 7 SMIC’s Revenue Changes by Product Applications, 2021-2022
  • Figure 8 GlobalFoundries’ Revenue Changes by Product Applications, 2021-2022
  • Figure 9 Intel's IDM 2.0 Business Model
  • 2022 Recap and 2023 Development of the Global IC Packaging and Testing Industry
  • Figure 1: Revenue Changes of Major OSAT Companies, 1Q22 - 2Q23
  • Figure 2: Gross Margin Changes of Major OSAT Companies, 1Q22 - 2Q23
  • Figure 3: ASE ATM’s Revenue Changes by Product Application, 2020 - 2022
  • Figure 4: ASE ATM’s Revenue Changes by Packaging & Testing Product Portfolio, 2020 - 2022
  • Figure 5: PTI's Revenue Changes by Services, 2020 - 2022
  • Figure 6: PTI's Revenue Changes by Products, 2020 - 2022
  • Figure 7: KYEC's Revenue Changes by Process Nodes, 2020 - 2022
  • Figure 8: KYEC's Revenue Changes by Product Applications, 2020 - 2022
  • Figure 9: Amkor's Revenue Changes by Packaging & Testing Types, 2020 - 2022
  • Figure 10: Amkor's Revenue Changes by End Product Applications, 2020 - 2022
  • Figure 11: JCET's Revenue Changes by End-Product Applications, 2021 - 2022
  • Figure 12: Revenue Changes in Major OSAT Companies' Computing Business in 2022
  • Development of the IC Design Industry and Major Players in China
  • Figure 1. Shipment Value of the Semiconductor Industry in China, 2017-2021
  • Figure 2. IC Design Market Size and Changes in China, 2017-2022
  • Figure 3. Changes in the number of IC Design Companies in China from 2016 to 2022
  • Figure 4. Scale Distribution of IC Design Industry in China in 2022
  • Figure 5. Distribution of IC Design Product Revenue and Number of IC Design Companies in China
  • Figure 6. GigaDevice’s Financial Report Performance from the First Quarter of 2021 to the Third Quarter of 2022
  • Figure 7. GigaDevice's Revenue Proportion of Each Product Line, 1H 2020 - 1H 2022
  • Figure 8. Will Semiconductor's Financial Report Performance, 1Q 2021 - 3Q2022
  • Figure 9. Revenue Proportion of Will Semiconductor’s Product Lines in 2019-2021
  • Figure 10. Changes in IC Self-Sufficiency Rate in China, 2010-2026
  • Development of the China IC Packaging and Testing Industry and Key Players
  • Figure 1 Chinese IC Packaging and Testing Shipment Value, 2018-2022
  • Figure 2 Regional Distribution of IC Packaging and Testing Brands in China
  • Figure 3 Financial Information of JCET, 2018-2022
  • Figure 4 Revenue of JCET by Product Application, 2021-2022
  • Figure 5 Financial Information of Tongfu Microelectronics, 2018-2022
  • Figure 6 Financial Information of Huatian Technology, 2018-2022

List of Topics

Development of the global, China, and Taiwan IC design industry in 2022-2023, covering respective company rankings, their performance overview in 2022, and development strategies of major players such as Qualcomm, MediaTek, Nvidia, AMD, Broadcom, Marvell, Huawei Hisilicon, Unisoc, GigaDevice, Will Semiconductor, etc.

Development of the global and Taiwan semiconductor foundry industry in 2022-2023, addressing respective foundry rankings, their performance overview in 2022, and development strategies of key players such as TSMC, Samsung, UMC, PSMC, VSI (Vanguard), SMIC, GlobalFoundries, etc.

Development of the global, China, and Taiwan IC OSAT (Outsourced Semiconductor Assembly and Testing) industry in 2022-2023, including respective foundry rankings, their performance overview, and development strategies of key players such as ASE, PTI, KYEC, Amkor, JCET, Tongfu Microelectronics, Huatian Technology, etc.

Companies covered

Alchip
Amazon
AMD
Amkor
Apple
Ardentec
ASE Group
ASEN Semiconductors
Baidu
Biren
Bitmain
Cadence
Geely
Bosch
Broadcom
China Wafer Level
Chipmore Technology
ChipMOS
Chrysler
DB HiTek
Dell
Denso
Episil
Faraday
FlipChip International
FocalTech
Ford
Forehope Electronic
Formosa Advanced
General Motors
GigaDevice
Global Unichip
GlobalFoundries
Google
Hana Microelectronics
Himax
HiSilicon
Hongxin Semiconductor
HP
HSMC
Huawei
Jinan Quanxin
Macronix
Hua Hong Semiconductor
Huahong Group
Huatian Technology
Infineon
Intel
Inventec
JCET
Kore Semiconductor
KYEC
Lingsen Precision
Macronix
Marvell
MediaTek
MediaTek
Micron
OmniVision
Qualcomm
RDA Microelectronics
Siemens
Silead
Micron
Mosel
Nanya Technology
Nepes
Nexchip
Novatek
Nuvoton
Nvidia
NXP
Onsemi
Open AI
Orient Semiconductor
Payton Technology
Powertech Technology
PSMC
Qorvo
Qualcomm
Quanta
Realtek
Samsung
SFA
Sigurd Microelectronics
Siliconware
SJ Semiconductor
SK Hynix
Skyworks
SMIC
Sony
Spreadtrum
Synopsys
STATS ChipPAC
STMicroelectronics
Sunplus
Supermicro
Texas Instruments
Tongfu Electronics
Tower
Tsinghua Unigroup
TSMC
UMC
Unimos Microelectronics
Unisem
Unisoc
Unitech Holdings
UTAC
Vanguard
VIS
Walton Advanced Engineering
Will Semiconductor
Winbond
Wise Road Capital
Wistron
Xilinx
YTEC