市场调查报告书
商品编码
1557674
全球半导体产业链发展及策略定位Development and Strategic Position of the Global Semiconductor Industry Chain |
由于地缘政治风险加大、衝突持续、西方货币政策紧缩、全国选举和自然灾害带来的不确定性等因素变化,全球经济表现与2023年相比可能继续保持持平或疲软。儘管面临更广泛的经济挑战,半导体市场仍接近完成去库存。在汽车、高效能运算 (HPC) 和物联网 (AIoT) 领域长期需求的支撑下,随着终端产品需求逐渐復苏,半导体市场重回成长轨道,达到两位数。本报告概述了全球半导体市场,分析了三大 DRAM 供应商 (Samsung、SK Hynix、Micron) 的竞争格局,并考察了 3D NAND 和主要晶圆代工厂的未来发展 (截至2025年) 。
With escalating geopolitical risks, ongoing conflicts, tighter monetary policies in Europe and the U.S., and variables such as uncertainties from national elections and natural disasters, global economic performance is expected to remain flat or subdued compared to 2023. Despite the broader economic challenges, the semiconductor market is seeing a nearing completion of inventory adjustments. As demand for terminal products gradually recovers and long-term needs in automotive, high-performance computing (HPC), and Artificial Intelligence of Things (AIoT) sectors provide support, the semiconductor market is anticipated to return to a growth trajectory, with potential for double-digit growth. This report offers an overview of the global semiconductor market performance, analyzes the competitive landscape of three dynamic random access memory (DRAM) suppliers—Samsung, SK Hynix, and Micron—and explores the future development of 3D NAND and major wafer foundries through 2025.