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热管理技术市场:2023-2028 年全球产业趋势、份额、规模、成长、机会与预测Thermal Management Technologies Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2023-2028 |
2022年全球热管理技术市场规模达127亿美元。展望未来, IMARC Group预计到2028年市场规模将达到200亿美元,2022-2028年复合年增长率(CAGR)为7.9%。
热管理技术是用于监控和管理电子设备和电路产生的过多热量的系统。它涉及在电子设备内使用各种基板来有效散热。一些常用的热管理材料包括黏性和非黏性材料,例如热垫、间隙填充物、相变材料 (PCM) 和油。它们在安装和校准过程中用于消费性电子产品、伺服器和资料中心的各种传导、对流、进阶和混合冷却系统。它们有助于防止故障并延长设备的使用寿命,并在汽车、国防、航空航太和电信等各个行业中广泛使用。
全球电子电气产业的显着成长是创造积极市场前景的关键因素之一。随着消费性电子产品製造技术的进步,对具有更高功率密度的小型化设备的需求不断增加。这反过来又积极影响了对热管理技术的需求,以最大限度地减少这些设备产生的高热通量。与此一致,热管理技术在各种汽车以及电动和混合动力汽车中的广泛采用也促进了市场的成长。此外,技术进步,例如喷射衝击机制、冷板、热蒸汽室和冷却晶片的发展,也是其他成长诱导因素。这些创新解决方案用作主动冷却剂,并嵌入微流体和多相传热技术,以提高电脑和其他耗电设备的热阻和性能。其他因素,包括不断增长的支出能力以及广泛的研发(R&D)活动预计将推动市场成长。
The global thermal management technologies market size reached US$ 12.7 Billion in 2022. Looking forward, IMARC Group expects the market to reach US$ 20.0 Billion by 2028, exhibiting a growth rate (CAGR) of 7.9% during 2022-2028.
Thermal management technologies are the systems used for monitoring and managing the excessive heat generated from electronic devices and circuitry. It involves the use of various substrate within the electronic devices for efficient dissipation of heat. Some of the commonly used thermal management materials include adhesive and non-adhesive materials, such as thermal cushions, gap fillers, phase change materials (PCMs) and oil. They are utilized in various conduction, convection, advanced and hybrid cooling systems of consumer electronics, servers and data centers during installation and calibration. They aid in preventing failures and enhancing the operational life of the equipment and find extensive applications across various industries, such as automotive, defense, aerospace and telecommunication.
Significant growth in the electronic and electrical industries across the globe is one of the key factors creating a positive outlook for the market. With improvements in the manufacturing technologies of consumer electronics, there is an increasing demand for miniaturized devices with enhanced power densities. This, in turn, has positively impacted the demand for thermal management technologies for minimizing the high heat flux generated by these devices. In line with this, the widespread adoption of thermal management technologies in various automobiles and electric and hybrid vehicles is also contributing to the growth of the market. Additionally, technological advancements, such as the development of jet impingement mechanisms, cold plates, heat vapor chambers and cool chips, are acting as other growth-inducing factors. These innovative solutions are used as active cooling agents and are embedded with micro fluids and multi-phase heat transfer technologies to improve thermal resistance and performance of computers and other power-intensive devices. Other factors, including rising expenditure capacities, along with extensive research and development (R&D) activities are anticipated to drive the market toward growth.
IMARC Group provides an analysis of the key trends in each sub-segment of the global thermal management technologies market report, along with forecasts at the global, regional and country level from 2023-2028. Our report has categorized the market based on product and application.
Hardware
Software
Interface
Substrates
Computers
Consumer Electronics
Telecommunication
Automotive
Renewable Energy
Others
North America
United States
Canada
Asia-Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa
The competitive landscape of the industry has also been examined along with the profiles of the key players being Advanced Cooling Technologies Inc., Autoneum Holding AG, Gentherm Inc., Heatex Inc. (Madison Industries), Henkel AG & Co. KGaA, Honeywell International Inc., Laird Thermal Systems Inc., Momentive Performance Materials Inc., Parker-Hannifin Corp. and Thermal Management Technologies.