市场调查报告书
商品编码
1451367
2024-2032 年按组件(射频滤波器、射频开关、射频功率放大器等)、应用(消费电子、汽车、无线通讯等)及地区分類的射频前端模组市场报告RF Front End Module Market Report by Component (RF Filters, RF Switches, RF Power Amplifiers, and Others), Application (Consumer Electronics, Automotive, Wireless Communication, and Others), and Region 2024-2032 |
2023年全球射频前端模组市场规模达229亿美元。展望未来, IMARC Group预计到2032年市场规模将达到623亿美元,2024-2032年复合年增长率(CAGR)为11.4%。
射频(RF)前端模组是指结合了天线和接收器之间所有电路的设备面板。它由射频滤波器、放大器、本振、混频器和多个开关组成。它通常用于最小化影像响应并防止强带外讯号使输入级饱和。此模组也用于无线系统和调频 (FM) 无线电中的无线电讯号和基频频率之间的切换,以在传输过程中对讯号进行编码/解码。因此,它广泛应用于消费性电子、汽车、军事设备和无线通讯工具的製造,例如家用设备、智慧恆温器、穿戴式装置、物联网(IoT)设备、智慧照明、感测器和范围扩展器。
快速的数位化以及不断增长的工业自动化(尤其是在发展中经济体)是创造积极市场前景的关键因素之一。此外,随着社交网路平台和物联网设备的使用越来越多,银行、金融服务和保险(BFSI)等资料密集产业产生的流量大幅增加。这增强了消费者对配备创新射频前端模组的智慧设备的偏好,从而促进了市场成长。此外,各种技术进步,例如绝缘体上硅(SOI)基板的开发,也是其他成长诱导因素。 RF-SOI 基板支援 3G、4G/LTE 的功能和未来网路要求,以实现更快、更可靠的资料传输。其他因素,包括 5G 技术的商业化以及资讯技术 (IT) 基础设施的显着改善,预计将进一步推动市场发展。
The global RF front end module market size reached US$ 22.9 Billion in 2023. Looking forward, IMARC Group expects the market to reach US$ 62.3 Billion by 2032, exhibiting a growth rate (CAGR) of 11.4% during 2024-2032.
A radio frequency (RF) front end module refers to a device panel that combines all circuits between the antenna and the receiver. It consists of an RF filter, amplifier, local oscillator, mixer and multiple switches. It is commonly used to minimize the image response and prevent strong out-of-band signals from saturating the input stages. The module is also used for switching between the radio signal and baseband frequency in wireless systems and frequency modulation (FM) radios to encode/decode the signals during transmission. Thus, it is widely used in the manufacturing of consumer electronics, automobiles, military equipment and wireless communication tools, such as in-home devices, smart thermostats, wearables, internet of things (IoT) devices, smart lighting, sensors and range extenders.
Rapid digitalization, along with growing industrial automation, especially in developing economies, represents one of the key factors creating a positive outlook for the market. Furthermore, with the increasing use of social networking platforms and IoT devices, there is a substantial rise in the traffic generated from data-intensive industries, such as banking, financial services and insurance (BFSI). This has enhanced the consumer preference for smart devices equipped with innovative RF front end modules, which, in turn, is contributing to the market growth. Additionally, various technological advancements, such as the development of silicon-on-insulator (SOI) substrates, are acting as other growth-inducing factors. RF-SOI substrates support the functioning of 3G, 4G/LTE and future network requirements to enable faster and reliable data transmission. Other factors, including the commercialization of 5G technology, along with significant improvements in the information technology (IT) infrastructure, are anticipated to drive the market further.
IMARC Group provides an analysis of the key trends in each sub-segment of the global RF front end module market report, along with forecasts at the global, regional and country level from 2024-2032. Our report has categorized the market based on component and application.
RF Filters
RF Switches
RF Power Amplifiers
Others
Consumer Electronics
Automotive
Wireless Communication
Others
North America
United States
Canada
Asia Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa
The report has also analysed the competitive landscape of the market with some of the key players being Broadcom Inc., Infineon Technologies AG, Murata Manufacturing Co. Ltd., NXP Semiconductors N.V., Qorvo Inc., Skyworks Solutions Inc., STMicroelectronics N.V., Taiyo Yuden Co. Ltd., TDK Corporation, Teradyne Inc. and Texas Instruments Incorporated.