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市场调查报告书
商品编码
1468335

2024-2032 年按类型、技术、应用和地区分類的晶片贴装机市场报告

Die Attach Machine Market Report by Type, Technique, Application, and Region 2024-2032
出版日期: | 出版商: IMARC | 英文 136 Pages | 商品交期: 2-3个工作天内

价格

IMARC Group年全球晶片贴装机市场规模达11.211亿美元。半导体产量的增加、对再生能源的需求不断增长以及自动驾驶、电动和豪华汽车销售的成长是推动市场发展的一些关键因素。

晶片附着是将半导体晶片附着在基板或封装上的过程。它被认为是不同类型封装的基础，并使用各种材料，例如环氧树脂、聚酰亚胺和镀银玻璃。它使用晶片贴装机进行操作，该机器旨在以高精度处理晶片并将其放置到基板或封装上。晶片贴装机也称为晶片安装或晶片键合机，配备视觉系统和其他感测器，以确保晶片充分定位并使用加热黏合剂或热压键合製程进行键合。目前，消费性电子设备销售的成长正在刺激全球对晶片贴装机的需求。

晶片贴装机市场趋势：

晶片贴装机在半导体装置（例如微处理器、记忆体晶片和其他积体电路（IC））生产中的利用率不断提高，是推动全球市场成长的主要因素之一。此外，晶片贴装机在半导体元件封装中的使用不断增加，有利于市场成长。此外，在印刷电路板 (PCB) 製造中越来越多地使用晶片贴装机来连接不同电子设备中的电子元件，这对市场产生了积极影响。除此之外，晶片贴装机在汽车产业中也用于製造车辆的各种零件，包括感测器、引擎和变速箱控制模组、安全、导航和音讯系统、先进驾驶辅助系统(ADAS) 和电动马达控制器。再加上由于收入水平上涨而导致电动车和豪华汽车销量的增加，正在推动市场的成长。此外，晶片贴装机在心律调节器、胰岛素帮浦、植入式设备、血糖仪和血压监测仪等医疗设备中的应用增加。再加上严重疾病的盛行率激增，正在推动市场的成长。此外，对智慧手錶和健身追踪器等穿戴式装置的需求不断增长，为市场创造了积极的前景。除此之外，对风力涡轮机和太阳能电池板等再生能源的需求不断增长，也推动了对晶片贴装机的需求。

本报告回答的关键问题：

  • 迄今为止，全球晶片贴装机市场表现如何，未来几年将如何表现？
  • 全球晶片贴装机市场的驱动因素、限制因素和机会是什么？
  • 每个驱动因素、限制因素和机会对全球晶片贴装机市场有何影响？
  • 主要区域市场有哪些？
  • 哪些国家代表了最具吸引力的晶片贴装机市场？
  • 依类型划分市场是怎么样的？
  • 晶片贴装机市场中哪种类型最具吸引力？
  • 基于技术的市场区隔是什么？
  • 晶片贴装机市场中哪种技术最具吸引力？
  • 基于应用程式的市场区隔是什么？
  • 晶片贴装机市场中哪一项应用最具吸引力？
  • 全球晶片贴装机市场的竞争结构如何？
  • 全球晶片贴装机市场的主要参与者/公司有哪些？

目录

第一章：前言

第 2 章：范围与方法

  • 研究目的
  • 利害关係人
  • 资料来源
    • 主要资源
    • 二手资料
  • 市场预测
    • 自下而上的方法
    • 自上而下的方法
  • 预测方法

第 3 章：执行摘要

第 4 章：简介

  • 概述
  • 主要行业趋势

第 5 章：全球晶片贴装机市场

  • 市场概况
  • 市场业绩
  • COVID-19 的影响
  • 市场预测

第 6 章：市场区隔：按类型

  • 倒装晶片接合机
    • 市场走向
    • 市场预测
  • 晶片接合机
    • 市场走向
    • 市场预测

第 7 章：市场区隔：依技术

  • 环氧树脂
    • 市场走向
    • 市场预测
  • 软焊料
    • 市场走向
    • 市场预测
  • 烧结
    • 市场走向
    • 市场预测
  • 共晶
    • 市场走向
    • 市场预测
  • 其他的
    • 市场走向
    • 市场预测

第 8 章：市场区隔：按应用

  • 射频和微机电系统
    • 市场走向
    • 市场预测
  • 光电
    • 市场走向
    • 市场预测
  • 逻辑
    • 市场走向
    • 市场预测
  • 记忆
    • 市场走向
    • 市场预测
  • CMOS影像感测器
    • 市场走向
    • 市场预测
  • 引领
    • 市场走向
    • 市场预测
  • 其他的
    • 市场走向
    • 市场预测

第 9 章：市场区隔：按地区

  • 北美洲
    • 美国
    • 加拿大
  • 亚太
    • 中国
    • 日本
    • 印度
    • 韩国
    • 澳洲
    • 印尼
    • 其他的
  • 欧洲
    • 德国
    • 法国
    • 英国
    • 义大利
    • 西班牙
    • 俄罗斯
    • 其他的
  • 拉丁美洲
    • 巴西
    • 墨西哥
    • 其他的
  • 中东和非洲
    • 市场走向
    • 市场细分：按国家/地区
    • 市场预测

第 10 章：驱动因素、限制与机会

  • 概述
  • 司机
  • 限制
  • 机会

第 11 章：价值链分析

第 12 章：波特五力分析

  • 概述
  • 买家的议价能力
  • 供应商的议价能力
  • 竞争程度
  • 新进入者的威胁
  • 替代品的威胁

第 13 章：价格分析

第14章：竞争格局

  • 市场结构
  • 关键参与者
  • 关键参与者简介
    • Anza Technology Inc.
    • ASM Pacific Technology Limited
    • Be Semiconductor Industries NV
    • Dr. Tresky AG
    • Fasford Technology Co Ltd. (Fuji Machinery Co., Ltd)
    • Hybond Inc.
    • Inseto UK Limited
    • Kulicke and Soffa Industries Inc.
    • MicroAssembly Technologies Ltd.
    • MRSI Systems (Mycronic AB (Publ))
    • Palomar Technologies Inc.
    • Shinkawa Ltd. (Yamaha Motor Co. Ltd.)
Product Code: SR112024A7423

The global die attach machine market size reached US$ 1,121.1 Million in 2023. Looking forward, IMARC Group expects the market to reach US$ 1,678.9 Million by 2032, exhibiting a growth rate (CAGR) of 4.4% during 2024-2032. The increasing production of semiconductors, rising demand for renewable energy sources and the growing sales of autonomous, electric, and luxury vehicles represent some of the key factors driving the market.

Die attach is the process wherein a semiconductor chip is attached to a substrate or package. It is considered fundamental to different types of packaging and uses various materials, such as epoxy, polyimide, and silver-filled glass. It is operated using a die attach machine that is designed to handle and place the die onto the substrate or package with high accuracy and precision. A die attach machine, also known as a die mount or die bond machine, is equipped with vision systems and other sensors to ensure that the die is adequately positioned and bonded using a heated adhesive or a thermocompression bonding process. At present, rising sales of consumer electronic devices are catalyzing the demand for die attach machine across the globe.

Die Attach Machine Market Trends:

The increasing utilization of die attach machines in the production of semiconductor devices, such as microprocessors, memory chips, and other integrated circuits (ICs), represents one of the major factors strengthening the market growth around the world. Moreover, the rising use of die attach machines in the packaging of semiconductor devices is favoring the market growth. In addition, the growing usage of die attach machines in the manufacturing of printed circuit boards (PCBs) to connect electronic components in different electronic devices is influencing the market positively. Apart from this, die attach machines are employed in the automotive industry to manufacture various parts of vehicles, including sensors, engine and transmission control modules, safety, navigation, and audio systems, advanced driver assistance systems (ADAS), and electric motor controllers. This, coupled with the increasing sales of electric and luxury vehicles on account of inflating income levels, is contributing to the market growth. Furthermore, there is a rise in the adoption of die attach machines in medical devices like pacemakers, insulin pumps, implantable devices, glucose meters, and blood pressure monitors. This, along with the surging prevalence of severe medical conditions, is fueling the market growth. Additionally, the increasing demand for wearable devices, such as smartwatches and fitness trackers, is creating a positive outlook for the market. Besides this, the growing demand for renewable energy sources, such as wind turbines and solar panels, is driving the need for die attach machines.

Key Market Segmentation:

IMARC Group provides an analysis of the key trends in each segment of the global die attach machine market, along with forecasts at the global, regional, and country level from 2024-2032. Our report has categorized the market based on type, technique, and application.

Type Insights:

Flip Chip Bonder

Die Bonder

The report has provided a detailed breakup and analysis of the die attach machine market based on the type. This includes flip chip bonder and die bonder. According to the report, die bonder represented the largest segment.

Technique Insights:

Epoxy

Soft Solder

Sintering

Eutectic

Others

A detailed breakup and analysis of the die attach machine market based on the technique has also been provided in the report. This includes epoxy, soft solder, sintering, eutectic, and others. According to the report, epoxy represented the largest segment.

Application Insights:

RF and MEMS

Optoelectronics

Logic

Memory

CMOS Image Sensors

LED

Others

The report has provided a detailed breakup and analysis of the die attach machine market based on the application. This includes RF and MEMS, optoelectronics, logic, memory, CMOS image sensors, LED, and others. According to the report, LED represented the largest segment.

Regional Insights:

North America

United States

Canada

Asia-Pacific

China

Japan

India

South Korea

Australia

Indonesia

Others

Europe

Germany

France

United Kingdom

Italy

Spain

Russia

Others

Latin America

Brazil

Mexico

Others

Middle East and Africa

The report has also provided a comprehensive analysis of all the major regional markets, which include North America (the United States and Canada); Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia, and others); Europe (Germany, France, the United Kingdom, Italy, Spain, Russia, and others); Latin America (Brazil, Mexico, and others); and the Middle East and Africa. According to the report, Asia Pacific was the largest market for die attach machines. Some of the factors driving the Asia Pacific die attach machine market included the increasing demand for semiconductor devices, advancements in packaging technology, and rising adoption of automation in the semiconductor industry.

Competitive Landscape:

The report has also provided a comprehensive analysis of the competitive landscape in the global die attach machine market. Competitive analysis such as market structure, market share by key players, player positioning, top winning strategies, competitive dashboard, and company evaluation quadrant has been covered in the report. Also, detailed profiles of all major companies have been provided. Some of the companies covered Anza Technology Inc., ASM Pacific Technology Limited, Be Semiconductor Industries N.V., Dr. Tresky AG, Fasford Technology Co Ltd. (Fuji Machinery Co., Ltd), Hybond Inc., Inseto UK Limited, Kulicke and Soffa Industries Inc., MicroAssembly Technologies Ltd., MRSI Systems (Mycronic AB (Publ)), Palomar Technologies Inc., Shinkawa Ltd. (Yamaha Motor Co. Ltd.), etc. Kindly note that this only represents a partial list of companies, and the complete list has been provided in the report.

Key Questions Answered in This Report:

  • How has the global die attach machine market performed so far, and how will it perform in the coming years?
  • What are the drivers, restraints, and opportunities in the global die attach machine market?
  • What is the impact of each driver, restraint, and opportunity on the global die attach machine market?
  • What are the key regional markets?
  • Which countries represent the most attractive die attach machine markets?
  • What is the breakup of the market based on the type?
  • Which is the most attractive type in the die attach machine market?
  • What is the breakup of the market based on the technique?
  • Which is the most attractive technique in the die attach machine market?
  • What is the breakup of the market based on the application?
  • Which is the most attractive application in the die attach machine market?
  • What is the competitive structure of the global die attach machine market?
  • Who are the key players/companies in the global die attach machine market?

Table of Contents

1 Preface

2 Scope and Methodology

  • 2.1 Objectives of the Study
  • 2.2 Stakeholders
  • 2.3 Data Sources
    • 2.3.1 Primary Sources
    • 2.3.2 Secondary Sources
  • 2.4 Market Estimation
    • 2.4.1 Bottom-Up Approach
    • 2.4.2 Top-Down Approach
  • 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

  • 4.1 Overview
  • 4.2 Key Industry Trends

5 Global Die Attach Machine Market

  • 5.1 Market Overview
  • 5.2 Market Performance
  • 5.3 Impact of COVID-19
  • 5.4 Market Forecast

6 Market Breakup by Type

  • 6.1 Flip Chip Bonder
    • 6.1.1 Market Trends
    • 6.1.2 Market Forecast
  • 6.2 Die Bonder
    • 6.2.1 Market Trends
    • 6.2.2 Market Forecast

7 Market Breakup by Technique

  • 7.1 Epoxy
    • 7.1.1 Market Trends
    • 7.1.2 Market Forecast
  • 7.2 Soft Solder
    • 7.2.1 Market Trends
    • 7.2.2 Market Forecast
  • 7.3 Sintering
    • 7.3.1 Market Trends
    • 7.3.2 Market Forecast
  • 7.4 Eutectic
    • 7.4.1 Market Trends
    • 7.4.2 Market Forecast
  • 7.5 Others
    • 7.5.1 Market Trends
    • 7.5.2 Market Forecast

8 Market Breakup by Application

  • 8.1 RF and MEMS
    • 8.1.1 Market Trends
    • 8.1.2 Market Forecast
  • 8.2 Optoelectronics
    • 8.2.1 Market Trends
    • 8.2.2 Market Forecast
  • 8.3 Logic
    • 8.3.1 Market Trends
    • 8.3.2 Market Forecast
  • 8.4 Memory
    • 8.4.1 Market Trends
    • 8.4.2 Market Forecast
  • 8.5 CMOS Image Sensors
    • 8.5.1 Market Trends
    • 8.5.2 Market Forecast
  • 8.6 LED
    • 8.6.1 Market Trends
    • 8.6.2 Market Forecast
  • 8.7 Others
    • 8.7.1 Market Trends
    • 8.7.2 Market Forecast

9 Market Breakup by Region

  • 9.1 North America
    • 9.1.1 United States
      • 9.1.1.1 Market Trends
      • 9.1.1.2 Market Forecast
    • 9.1.2 Canada
      • 9.1.2.1 Market Trends
      • 9.1.2.2 Market Forecast
  • 9.2 Asia-Pacific
    • 9.2.1 China
      • 9.2.1.1 Market Trends
      • 9.2.1.2 Market Forecast
    • 9.2.2 Japan
      • 9.2.2.1 Market Trends
      • 9.2.2.2 Market Forecast
    • 9.2.3 India
      • 9.2.3.1 Market Trends
      • 9.2.3.2 Market Forecast
    • 9.2.4 South Korea
      • 9.2.4.1 Market Trends
      • 9.2.4.2 Market Forecast
    • 9.2.5 Australia
      • 9.2.5.1 Market Trends
      • 9.2.5.2 Market Forecast
    • 9.2.6 Indonesia
      • 9.2.6.1 Market Trends
      • 9.2.6.2 Market Forecast
    • 9.2.7 Others
      • 9.2.7.1 Market Trends
      • 9.2.7.2 Market Forecast
  • 9.3 Europe
    • 9.3.1 Germany
      • 9.3.1.1 Market Trends
      • 9.3.1.2 Market Forecast
    • 9.3.2 France
      • 9.3.2.1 Market Trends
      • 9.3.2.2 Market Forecast
    • 9.3.3 United Kingdom
      • 9.3.3.1 Market Trends
      • 9.3.3.2 Market Forecast
    • 9.3.4 Italy
      • 9.3.4.1 Market Trends
      • 9.3.4.2 Market Forecast
    • 9.3.5 Spain
      • 9.3.5.1 Market Trends
      • 9.3.5.2 Market Forecast
    • 9.3.6 Russia
      • 9.3.6.1 Market Trends
      • 9.3.6.2 Market Forecast
    • 9.3.7 Others
      • 9.3.7.1 Market Trends
      • 9.3.7.2 Market Forecast
  • 9.4 Latin America
    • 9.4.1 Brazil
      • 9.4.1.1 Market Trends
      • 9.4.1.2 Market Forecast
    • 9.4.2 Mexico
      • 9.4.2.1 Market Trends
      • 9.4.2.2 Market Forecast
    • 9.4.3 Others
      • 9.4.3.1 Market Trends
      • 9.4.3.2 Market Forecast
  • 9.5 Middle East and Africa
    • 9.5.1 Market Trends
    • 9.5.2 Market Breakup by Country
    • 9.5.3 Market Forecast

10 Drivers, Restraints, and Opportunities

  • 10.1 Overview
  • 10.2 Drivers
  • 10.3 Restraints
  • 10.4 Opportunities

11 Value Chain Analysis

12 Porters Five Forces Analysis

  • 12.1 Overview
  • 12.2 Bargaining Power of Buyers
  • 12.3 Bargaining Power of Suppliers
  • 12.4 Degree of Competition
  • 12.5 Threat of New Entrants
  • 12.6 Threat of Substitutes

13 Price Analysis

14 Competitive Landscape

  • 14.1 Market Structure
  • 14.2 Key Players
  • 14.3 Profiles of Key Players
    • 14.3.1 Anza Technology Inc.
      • 14.3.1.1 Company Overview
      • 14.3.1.2 Product Portfolio
    • 14.3.2 ASM Pacific Technology Limited
      • 14.3.2.1 Company Overview
      • 14.3.2.2 Product Portfolio
    • 14.3.3 Be Semiconductor Industries N.V.
      • 14.3.3.1 Company Overview
      • 14.3.3.2 Product Portfolio
      • 14.3.3.3 Financials
      • 14.3.3.4 SWOT Analysis
    • 14.3.4 Dr. Tresky AG
      • 14.3.4.1 Company Overview
      • 14.3.4.2 Product Portfolio
    • 14.3.5 Fasford Technology Co Ltd. (Fuji Machinery Co., Ltd)
      • 14.3.5.1 Company Overview
      • 14.3.5.2 Product Portfolio
    • 14.3.6 Hybond Inc.
      • 14.3.6.1 Company Overview
      • 14.3.6.2 Product Portfolio
    • 14.3.7 Inseto UK Limited
      • 14.3.7.1 Company Overview
      • 14.3.7.2 Product Portfolio
    • 14.3.8 Kulicke and Soffa Industries Inc.
      • 14.3.8.1 Company Overview
      • 14.3.8.2 Product Portfolio
      • 14.3.8.3 Financials
    • 14.3.9 MicroAssembly Technologies Ltd.
      • 14.3.9.1 Company Overview
      • 14.3.9.2 Product Portfolio
    • 14.3.10 MRSI Systems (Mycronic AB (Publ))
      • 14.3.10.1 Company Overview
      • 14.3.10.2 Product Portfolio
    • 14.3.11 Palomar Technologies Inc.
      • 14.3.11.1 Company Overview
      • 14.3.11.2 Product Portfolio
    • 14.3.12 Shinkawa Ltd. (Yamaha Motor Co. Ltd.)
      • 14.3.12.1 Company Overview
      • 14.3.12.2 Product Portfolio

Kindly note that this only represents a partial list of companies, and the complete list has been provided in the report.

List of Figures

  • Figure 1: Global: Die Attach Machine Market: Major Drivers and Challenges
  • Figure 2: Global: Die Attach Machine Market: Sales Value (in Million US$), 2018-2023
  • Figure 3: Global: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 4: Global: Die Attach Machine Market: Breakup by Type (in %), 2023
  • Figure 5: Global: Die Attach Machine Market: Breakup by Technique (in %), 2023
  • Figure 6: Global: Die Attach Machine Market: Breakup by Application (in %), 2023
  • Figure 7: Global: Die Attach Machine Market: Breakup by Region (in %), 2023
  • Figure 8: Global: Die Attach Machine (Flip Chip Bonder) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 9: Global: Die Attach Machine (Flip Chip Bonder) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 10: Global: Die Attach Machine (Die Bonder) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 11: Global: Die Attach Machine (Die Bonder) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 12: Global: Die Attach Machine (Epoxy) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 13: Global: Die Attach Machine (Epoxy) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 14: Global: Die Attach Machine (Soft Solder) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 15: Global: Die Attach Machine (Soft Solder) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 16: Global: Die Attach Machine (Sintering) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 17: Global: Die Attach Machine (Sintering) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 18: Global: Die Attach Machine (Eutectic) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 19: Global: Die Attach Machine (Eutectic) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 20: Global: Die Attach Machine (Other Techniques) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 21: Global: Die Attach Machine (Other Techniques) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 22: Global: Die Attach Machine (RF and MEMS) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 23: Global: Die Attach Machine (RF and MEMS) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 24: Global: Die Attach Machine (Optoelectronics) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 25: Global: Die Attach Machine (Optoelectronics) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 26: Global: Die Attach Machine (Logic) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 27: Global: Die Attach Machine (Logic) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 28: Global: Die Attach Machine (Memory) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 29: Global: Die Attach Machine (Memory) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 30: Global: Die Attach Machine (CMOS Image Sensors) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 31: Global: Die Attach Machine (CMOS Image Sensors) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 32: Global: Die Attach Machine (LED) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 33: Global: Die Attach Machine (LED) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 34: Global: Die Attach Machine (Other Applications) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 35: Global: Die Attach Machine (Other Applications) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 36: North America: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 37: North America: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 38: United States: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 39: United States: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 40: Canada: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 41: Canada: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 42: Asia-Pacific: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 43: Asia-Pacific: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 44: China: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 45: China: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 46: Japan: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 47: Japan: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 48: India: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 49: India: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 50: South Korea: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 51: South Korea: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 52: Australia: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 53: Australia: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 54: Indonesia: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 55: Indonesia: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 56: Others: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 57: Others: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 58: Europe: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 59: Europe: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 60: Germany: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 61: Germany: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 62: France: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 63: France: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 64: United Kingdom: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 65: United Kingdom: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 66: Italy: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 67: Italy: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 68: Spain: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 69: Spain: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 70: Russia: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 71: Russia: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 72: Others: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 73: Others: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 74: Latin America: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 75: Latin America: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 76: Brazil: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 77: Brazil: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 78: Mexico: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 79: Mexico: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 80: Others: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 81: Others: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 82: Middle East and Africa: Die Attach Machine Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 83: Middle East and Africa: Die Attach Machine Market: Breakup by Country (in %), 2023
  • Figure 84: Middle East and Africa: Die Attach Machine Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 85: Global: Die Attach Machine Industry: Drivers, Restraints, and Opportunities
  • Figure 86: Global: Die Attach Machine Industry: Value Chain Analysis
  • Figure 87: Global: Die Attach Machine Industry: Porter's Five Forces Analysis

List of Tables

  • Table 1: Global: Die Attach Machine Market: Key Industry Highlights, 2023 & 2032
  • Table 2: Global: Die Attach Machine Market Forecast: Breakup by Type (in Million US$), 2024-2032
  • Table 3: Global: Die Attach Machine Market Forecast: Breakup by Technique (in Million US$), 2024-2032
  • Table 4: Global: Die Attach Machine Market Forecast: Breakup by Application (in Million US$), 2024-2032
  • Table 5: Global: Die Attach Machine Market Forecast: Breakup by Region (in Million US$), 2024-2032
  • Table 6: Global: Die Attach Machine Market: Competitive Structure
  • Table 7: Global: Die Attach Machine Market: Key Players