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市场调查报告书
商品编码
1406120

晶片贴装设备：市场占有率分析、产业趋势/统计、成长预测，2024-2029

Die Attach Equipment - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts 2024 - 2029
出版日期: | 出版商: Mordor Intelligence | 英文 120 Pages | 商品交期: 2-3个工作天内

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简介目录

晶片贴装设备市场规模预计到 2024 年为 14.5 亿美元，预计到 2029 年将达到 19.5 亿美元，在预测期内（2024-2029 年）复合年增长率为 6.09%。

晶片贴装设备-市场-IMG1

物联网 (IoT) 设备中越来越多地使用堆迭晶粒技术推动了成长。最近的趋势表明，由于医疗、军事、光电和无线电子等新兴和现有应用，对混合电路的需求仍然强劲。

主要亮点

  • C2W混合键合是一种很有前景的新技术，可实现直接 Cu-Cu 键合，并可取代 3D 堆迭记忆体和高阶逻辑应用中的 TCB。然而，C2W混合键合仍处于早期阶段。 2.5D结构的逻辑元件预计将于2022年至2023年上市，将可大幅支撑设备市场的成长。
  • 对金锡共晶贴片技术的需求将推动市场的发展。传统上，晶片采用各种晶片黏合产品进行安装，包括金属填充导电环氧树脂、高铅焊料和金硅焊料，以确保设备在整个生命週期内具有可靠的功能。然而，由于发热增加、对更小型设备的需求、RoHS 和 REACH 的颁布以及向 GaAs 晶片的转变，传统材料的使用受到限制。对装置高可靠性的需求促使工程师评估各种用于晶粒连接的新材料。
  • 对分立功率元件的需求正在推动市场发展。铜夹作为传统引线接合法和带状键结的替代品越来越受欢迎。晶片连接功能是分立功率元件封装解决方案的标誌。宽能带隙半导体晶粒技术（SiC 和 GaN）的采用带来了新的创新封装解决方案，包括银烧结晶片连接（材料包括环氧模塑料和互连材料）。 EV/HEV 应用中从分立 SiC 逐渐过渡到 SiC 模组、嵌入式晶粒封装系统以及 GaN 装置在多晶片系统中的整合只是此类趋势的几个例子。因此，对分立功率元件晶片贴装设备的需求不断增加。
  • 然而，主要是加工过程中的尺寸变化、使用寿命以及透过设备加工过程中移动部件的机械不平衡对设备的功能提出了挑战，并可能抑制市场。
  • 此外，COVID-19 的影响不会对设备需求产生重大影响。例如，在大流行期间，Palomar Technologies 宣布已受委託生产关键的半导体元件，以应对 COVID-19。该公司的 3880 贴片机设备订单加速成长，该设备支援无线通讯和网路频宽、远端医疗、机器人物联网和视讯会议。这种加速对于其他市场参与者来说也是类似的。因此，疫情期间对设备的需求仍然较高。由于对物联网设备、自动化和智慧技术的需求，这种需求将在大流行后继续增长。

晶片贴装设备市场趋势

LED将实现显着成长

  • 晶片黏接材料对于中、高和超高高功率LED 的性能和可靠性至关重要。随着 LED普及的提高，对晶片贴装设备的需求也增加。为特定晶片结构和应用选择适当的晶片黏接材料取决于多种考虑因素，包括封装製程（吞吐量和产量比率）、性能（热和光输出）、可靠性（流明维持率）和成本。共晶金锡、银填充环氧树脂、焊料、硅胶和烧结材料均已用于 LED 晶片贴装。
  • 例如，SFE提供了一种采用环氧树脂黏剂的黏合方法，LED环氧树脂晶片黏合机的特点是索引时间为0.2秒/週期（90%运转率），晶片尺寸为250*250标准，并且透过两种方式提供引线框架辨识相机。其软体功能提供自动安装水平和拾取水平教学功能。
  • 此外，导电黏剂（主要是载银环氧树脂）构成了最广泛使用的 LED 热晶片黏合材料（单位）。它们与现有的后端封装设备相容，并提供有吸引力的成本/性能平衡（通常高达 50W/mK 热量，具有二次回流相容性）。由于它附着在裸硅上，因此它是无后端金属化晶粒（例如硅基氮化镓）的最优选材料。
  • 而且，在LED市场上，有许多对手和竞争者，但ASM是这个市场的突出参与者之一，其LED环氧树脂高速固晶机AD830在LED市场上占据主导地位。随着越来越多的国家寻求逐步淘汰传统灯泡，LED 继续占据市场主导地位。根据联合研究中心的数据，基于销售额的LED普及正在增加，预计到2025年将达到75.8%的普及。这增加了晶片贴装设备市场的需求。
  • 此外，2022年9月，Palomar Technologies宣布推出新型贴片机3880-II，该机荣获2022年军事+航空电子创新奖。这款新机器包括可最大限度提高生产率、将编程时间缩短高达 95% 并提高整体键合机生产率的选项。
晶片贴装设备-市场-IMG2

亚太地区市场成长显着

  • 亚太地区是晶片贴装设备产业显着成长的地区。全球超过 60% 的 OSAT（外包半导体组装和测试）公司总部位于亚太地区。这些 OSAT 公司在其半导体製造製程中使用晶片贴装设备。此外，该地区 IDM（集成设备製造商）的数量正在增加，预计这将很快推动市场成长。
  • 在中国和台湾，光电、MEMS和MOEMS等多种装置被用于智慧型手机、穿戴式装置和白色家电等电子产品的大规模生产。所有这些设备在零件组装过程中都需要晶片连接设备。
  • 此外，预计韩国、中国（主要是日本）的老年人口在预测期内将加快医疗服务的需求，人工呼吸器、透析和包含 MEMS 压力感测器的血压监测设备等设备。亚太经社会预测，该地区60岁及以上老年人口将从目前的9.55人增加到2025年的10.64人，2050年将增加到18.44人，占世界人口的60%。对 MEMS 压力感测器晶片贴装设备的需求推动了该市场的成长。
  • 此外，由于政府的倡议，印度许多智慧城市正在发展，预计将采用电子解决方案用于监视、维护和监控等目的。根据smartcities.gov.in报道，中央政府已拨款9.77亿美元用于60个此类智慧城市的发展。这导致了对更多 CMOS 影像感测器的需求，进一步推动了市场成长。
  • 高功率雷射在工业领域有广泛的需求，其应用范围广泛，包括切割、焊接和机械加工。该公司正在转向雷射技术，以利用其高性能和可靠性。雷射二极体的进步显着增加了对环氧树脂加工设备和共晶接合技术的需求。
  • 随着物联网、人工智慧和ADAS的发展，记忆体的需求预计将进一步增加。因此，比以往任何时候都更需要提高记忆体晶片製造的生产率并提高后处理中的装置可靠性。为了解决这个问题，2022 年 8 月，史丹佛大学的工程师创建了一种更有效率、更灵活的 AI 晶片。这有可能将人工智慧的力量带入小型边缘设备，有助于提高记忆体製造的吞吐量和可靠性。

晶片贴装设备产业概况

由于本地和全球参与者的存在渗透到激烈的市场中，晶片贴装设备市场呈现碎片化。此外，随着公司专注于透过开发和联盟来提高设备效能，例如吞吐量和产量比率，市场竞争正在加剧。

  • 2022 年 10 月，Hermetic Solutions Group (HSG) 从 RHP Technologies 收购了 DiaCool 智慧财产权。这扩大了 HSG 的产品范围，并在未来为客户提供更多选择。 HSG 用于散热器、晶片片和散热器的 DiaCool 钻石复合材料为客户提供了优于传统层压板和 MMC 材料的显着优势。
  • 2022 年 10 月，Kulicke 和 Soffa 收到了多个热压解决方案的新订单，并成功将其第一台助焊剂热压接合机 (TCB)出货给主要客户，巩固了其在先进LED 组件领域的地位。

其他福利：

  • Excel 格式的市场预测 (ME) 表
  • 3 个月的分析师支持

目录

第一章简介

  • 研究假设和市场定义
  • 调查范围

第二章调查方法

第三章执行摘要

第四章市场动态

  • 市场概况
  • 市场驱动因素
    • 对 AuSn 共晶晶片贴装技术的需求不断增长
    • 对分立功率元件的需求
    • LED 细分市场显着成长
  • 市场抑制因素
    • 加工和使用寿命期间的尺寸变化和机械不平衡
  • 价值链分析
  • 产业吸引力—五力分析
    • 新进入者的威胁
    • 买家/消费者的议价能力
    • 供应商的议价能力
    • 替代品的威胁
    • 竞争公司之间敌对关係的强度
  • COVID-19 市场影响评估

第五章市场区隔

  • 类型
    • 固晶机
    • 覆晶键合机
  • 接合技术
    • 环氧树脂
    • 共晶
    • 软焊料
    • 混合键合
    • 其他的
  • 应用
    • 记忆
    • 射频・MEMS
    • LED
    • CMOS影像感测器
    • 逻辑
    • 光电子/光电
    • 其他的
  • 地区
    • 北美洲
    • 欧洲
    • 亚太地区
    • 拉丁美洲
    • 中东/非洲

第六章 竞争形势

  • 公司简介
    • Palomar Technologies, Inc.
    • Shinkawa Ltd.
    • MicroAssembly Technologies, Ltd.
    • ASM Pacific Technology Limited
    • Be Semiconductor Industries NV
    • Kulicke and Soffa Industries, Inc.
    • Dr. Tresky AG
    • Fasford Technology Co Ltd.
    • Inseto UK Limited
    • Anza Technology Inc.

第七章 投资分析

第八章 市场机会及未来趋势

简介目录
Product Code: 69683
Die Attach Equipment - Market - IMG1

The Die Attach Equipment Market size is estimated at USD 1.45 billion in 2024, and is expected to reach USD 1.95 billion by 2029, growing at a CAGR of 6.09% during the forecast period (2024-2029).

Growth is fueled by the increased use of stacked die technology in the Internet of Things (IoT) devices. In recent trends, the demand for hybrid circuits has remained strong due to emerging and existing applications in medical, military, photonics, wireless electronics, etc.

Key Highlights

  • C2W hybrid bonding is a promising emerging technology that can enable direct Cu- Cu bonding and replace TCB for 3D stacked memory and high-end logic applications. However, C2W hybrid bonding is still in its early stages level. It is expected to hit the market in 2022/23 for logic devices with 2.5D structures, significantly assisting the equipment market's growth.
  • The demand for the AuSn Eutectic Die-Attach technique drives the market. Traditionally, various die-attach products, which include metal-filled conductive epoxies, high lead-containing solders, and gold-silicon solders, were sufficient to mount the chip and have it perform reliably for the life of the device. However, the trend towards increasing heat generation, demand for compact devices, enactment of RoHS and REACH legislation, and the transition to GaAs chips limited the use of conventional materials. The demand for high device reliability has led engineers to evaluate various new materials for their die attachment.
  • The suggested solder preforms are eutectic gold-tin and can be implemented for high volume or lab quantity adoption using a Palomar Technologies' die bonder. This equipment can handle the complete die-attach process, including high-accuracy pick-and-place of substrates, eutectic gold-tin preforms, and components; eutectic die-attach; and pulsed-heat reflow using a computer-controlled Pulse Heat Stage (PHS).
  • The demand for discrete power devices drives the market. Copper clips are becoming increasingly popular as an alternative to traditional wire and ribbon bonding. Die-attach functionality is a feature of packaging solutions for discrete power components. The adoption of wide-bandgap semiconductor die technologies (SiC and GaN) brings new innovative packaging solutions, including silver sintering die-attach (materials include epoxy molding compounds and interconnection materials). The progressive transition from discrete SiC towards SiC modules in EV/HEV applications, the embedded-die packaged systems, and the integration of GaN devices in multichip systems are just a few examples of such a trend. This factor enhances the demand for the die attaches equipment for the discrete power devices.
  • However, primarily dimensional changes during processing and service life and mechanical unbalance of moving parts during processing through equipment challenges the equipment's functionality which could restrain the market.
  • Further, the impact of COVID-19 does not highly affect the demand for equipment. For instance, during the pandemic, Palomar Technologies announced that they got a request for manufacturing critical semiconductor components to address COVID-19. They saw an acceleration of orders of their 3880 Die Bonder equipment to assist in wireless communications and networking bandwidth, remote medicine, IoT in robotics, and video conferencing. This acceleration is similar for other market players. Hence, the demand for equipment has remained relatively high during the pandemic. This demand will continue to grow post-pandemic owing to the need for IoT devices, automation, and smart technologies.

Die Attach Equipment Market Trends

LED to Witness Significant Growth

  • Die attach material is key in the performance and reliability of mid, high, and super-high power LEDs. The demand for die-attach equipment is increasing with an increasing LED penetration rate. The selection of suitable die-attach material for a particular chip structure and application depends on various considerations, which include the packaging process (throughput and yield), performance (thermal dissipation output and light output), reliability (lumen maintenance), and cost. Eutectic gold-tin, silver-filled epoxies, solder, silicones, and sintered materials have all been used for LED die attach.
  • For instance, SFE provides an Epoxy Adhesive bonding method where its LED Epoxy Die Bonder machine features an index time of 0.2 Sec /Cycle (90 Percent Rate of Operation) with a chip size of 250 * 250 standards, providing lead frame recognition through 2 Cameras. Its software function provides auto mount level & pick-up level teaching functions.
  • Further, conductive adhesives (mostly silver-filled epoxies) constitute LEDs' most extensive thermal die-attach materials (by unit number). They are compatible with existing back-end packaging equipment and provide an attractive cost/performance balance (typically up to 50 W/mK thermals with secondary reflow compatibility). As they stick to bare silicon, they are the most preferred material for dies without back-end metallization like GaN on silicon.
  • Further, in the LED market, there are a lot of rivals or competitors, and ASM is one of the prominent players in this market, and its LED Epoxy High speed die bonder AD830 dominates in the LED market. As more and more countries are getting close to phasing out conventional bulbs, LEDs are continuing their march to the top of the market. According to Joint Research Center, The penetration rate of LEDs based on sales is raising and is expected to reach a penetration rate of 75.8 % by 2025. This factor enhances the demand for the die attaches equipment market.
  • Furthermore, in September 2022, Palomar Technologies launched a new 3880-II die-bonder, which won the 2022 military+Aerospace electronics Innovation Award. This new machine includes options to maximize productivity, reduce programming time by up to 95% and improve overall bonder productivity.
Die Attach Equipment - Market - IMG2

Asia-Pacific Accounts for Significant Market Growth

  • Asia-Pacific accounted for the significant growth of the die-attach equipment industry. More than 60% of OSAT (Outsourced Semiconductor Assembly And Test) players present across the world have their headquarters in the APAC region. These OSAT companies use die-attach equipment in the semiconductor fabrication process. Additionally, an increasing number of IDMs (Integrated Device Manufacturers) in the region is expected to boost the market growth shortly.
  • In China and Taiwan, the mass production of electronic products, including smartphones, wearables, and white goods, uses several devices, such as optoelectronics, MEMS, and MOEMS. All these devices require die-attach equipment in the assembly process of these components.
  • Further, South Korea, China, and mostly Japan's old age population are anticipated to accelerate the need for healthcare services during the forecast period, thus providing scope for devices, such as ventilators, dialysis, and blood pressure monitoring devices constituting MEMS pressure sensors. ESCAP estimates that the geriatric population in the region, aged 60 years and older, could penetrate at the rate of 10.64 by 2025 with 9.55 in the current year and raise to 18.44 by 2050, which represent 60 percent of the worlds population. The instance caters to the growth of the market due to the demand for die-attach equipment for MEMS pressure sensor.
  • Furthermore, India is also witnessing growth in a number of smart cities, due to government initiatives and are expected to incorporate electronic solutions for purposes, such as surveillance, maintenance, monitoring, etc. According to smartcities.gov.in, the central government has allotted USD 977 million into the development of 60 such smart cities. This leads to the demand for a higher number of CMOS image sensors, which further supports the market growth.
  • High Power lasers are finding extensive demand in industrial sectors for a wide range of applications, including cutting, welding, and fabrication. Companies are moving towards Laser technologies to take advantage of high performance and reliability. The advancement in laser diode significantly increases the demand for equipment, which processes the technique of Epoxy and Eutectic bonding.
  • Further memory demand is expected to increase with the development of IoT, AI, and ADAS. As a result, productivity improvement in memory chip manufacturing and improvement of post-processing device reliability will be required more than in the past. To address this, in August 2022, Stanford engineers created a more efficient and flexible AI chip, which could bring the power of AI into tiny edge devices that contributes to improved throughput and reliability in memory production.

Die Attach Equipment Industry Overview

The die-attach equipment market is fragmented as the presence of local and global players penetrates the intense rivalry in the market. Further, players are focusing on improving their equipment performance in terms of throughput and yield through development and partnership, making the market more competitive. Key players are Be Semiconductor Industries N.V., ASM Pacific Technology Limited, Palomar Technologies Inc, etc. Recent developments in the market are -

  • In October 2022, Hermetic Solutions Group (HSG) acquired the Intellectual property of DiaCool, from RHP Technologies. This expands HSG's product lineup and offers customers significantly more options for many years. HSG's DiaCool diamond composite material for heat sinks, die tabs, and heat spreaders provide customers with significant advantages over conventional laminate or MMC materials.
  • In October 2022, Kulicke and Soffa received multiple new purchase orders for its thermo-compression solution and successfully shipped its first Fluxless Thermo-Compression Bonder (TCB) to a key customer and continues its position in the advanced LED Assembly.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET DYNAMICS

  • 4.1 Market Overview
  • 4.2 Market Drivers
    • 4.2.1 Growing Demand of AuSn Eutectic Die-Attach Technology
    • 4.2.2 Demand of Discrete Power Devices
    • 4.2.3 LED Segment to Witness Significant Growth
  • 4.3 Market Restraints
    • 4.3.1 Dimensional Changes During Processing and Service Life and Mechanical Unbalance
  • 4.4 Industry Value Chain Analysis
  • 4.5 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.5.1 Threat of New Entrants
    • 4.5.2 Bargaining Power of Buyers/Consumers
    • 4.5.3 Bargaining Power of Suppliers
    • 4.5.4 Threat of Substitute Products
    • 4.5.5 Intensity of Competitive Rivalry
  • 4.6 Assessment of Impact of COVID-19 on the Market

5 MARKET SEGMENTATION

  • 5.1 Type
    • 5.1.1 Die Bonder
    • 5.1.2 Flip Chip Bonder
  • 5.2 Bonding Technique
    • 5.2.1 Epoxy
    • 5.2.2 Eutectic
    • 5.2.3 Soft Solder
    • 5.2.4 Hybrid Bonding
    • 5.2.5 Other Bonding Techniques
  • 5.3 Application
    • 5.3.1 Memory
    • 5.3.2 RF & MEMS
    • 5.3.3 LED
    • 5.3.4 CMOS Image Sensor
    • 5.3.5 Logic
    • 5.3.6 Optoelectronics / Photonics
    • 5.3.7 Other Applications
  • 5.4 Geography
    • 5.4.1 North America
    • 5.4.2 Europe
    • 5.4.3 Asia Pacific
    • 5.4.4 Latin America
    • 5.4.5 Middle East and Africa

6 COMPETITIVE LANDSCAPE

  • 6.1 Company Profiles
    • 6.1.1 Palomar Technologies, Inc.
    • 6.1.2 Shinkawa Ltd.
    • 6.1.3 MicroAssembly Technologies, Ltd.
    • 6.1.4 ASM Pacific Technology Limited
    • 6.1.5 Be Semiconductor Industries N.V.
    • 6.1.6 Kulicke and Soffa Industries, Inc.
    • 6.1.7 Dr. Tresky AG
    • 6.1.8 Fasford Technology Co Ltd.
    • 6.1.9 Inseto UK Limited
    • 6.1.10 Anza Technology Inc.

7 INVESTMENT ANALYSIS

8 MARKET OPPORTUNITIES AND FUTURE TRENDS