市场调查报告书
商品编码
1518691
2024-2032 年按材料类型(铝、铜)、应用(汽车领域、消费性电子产品)和地区分類的 IGBT 针翅式散热器市场报告Pin Fin Heat Sink for IGBT Market Report by Material Type (Aluminium, Copper), Application (Automotive Field, Consumer Electronics), and Region 2024-2032 |
2023年,全球IMARC Group针翅散热器市场规模达9.945亿美元。现代消费性电子产品对有效冷却解决方案的需求激增,汽车行业中电动汽车和混合动力汽车越来越多地使用IGBT 模组,以及用于多设备冷却的混合针翅式散热器的日益普及,这些都是推动这一趋势的一些关键因素。
针翅式散热器是指具有平坦底座和大量针状结构的紧凑型散热器,旨在将热量散发到周围空气中。它们通常使用铜或铝合金製造,并显示为嵌入多个翅片的实心块。可根据热负荷、气流和可用空间轻鬆客製化针翅片,以适应各种应用。这些水槽用作热交换器,其几何设计和结构可增加表面积和传热係数,在高气流(200+ LFM)下提供从底座到翅片的低热阻,并在气流方向不明确的环境中工作,使他们非常有效。圆形空气动力学销钉设计和间距减少了对进入销钉阵列的周围气流的阻力,同时增加了空气湍流。这反过来又打破了包裹在其表面的静止空气的边界层,从而产生了高对流热效率。因此,针翅式散热器被广泛用于冷却绝缘栅双极电晶体 (IGBT)。
针翅式散热器在解决空间有限和热负荷较大的应用中的复杂热问题方面越来越受欢迎。目前,为了透过适当的散热方法来满足现代电子产品的要求,对有效冷却解决方案的需求不断增加,这正在加速针翅式散热器的采用。再加上全球人口不断增长和数位化的快速发展对巨大电力供应的需求不断增加,这是推动市场成长的主要因素。此外,由于人们越来越认识到针翅式散热器的优点,例如更高的容积效率、紧凑的尺寸、重量轻、更好的冷却能力和低成本,因此从其他类型的散热器转向针翅式散热器。与此一致的是,汽车产业中混合动力电动车 (HEV) 和电动车 (EV) 越来越多地采用 IGBT 模组,从而促进了市场成长。此外,对元件密度的需求不断增加以及电子设备的日益小型化,增强了对紧凑且经济高效的冷却解决方案(例如针翅式散热器)的需求。此外,主要参与者的各种产品创新,例如混合针翅式散热器的开发,其热性能比标准铝和铜散热器更好,并且可用于多设备冷却,为市场成长提供了积极的推动力。
The global pin fin heat sink for IGBT market size reached US$ 994.5 Million in 2023. Looking forward, IMARC Group expects the market to reach US$ 1,401.8 Million by 2032, exhibiting a growth rate (CAGR) of 3.77% during 2024-2032. The surging need for effective cooling solutions for modern consumer electronics, the rising use of IGBT modules in the automotive industry for EVs and HEVs, and the growing popularity of hybrid pin fin heat sinks for multi-device cooling represent some of the key factors driving the market.
Pin fin heat sinks refer to compact sinks with a flat base and a large number of pin-like structures designed to dissipate heat out into the surrounding air. They are usually manufactured using copper or aluminum alloys and appear as a solid block embedded with multiple fins. The pin fins can be easily customized for various applications based on the heat load, airflow, and available space. These sinks serve as heat exchangers and are designed and structured geometrically to increase the surface area and coefficient for heat transfer, provide low thermal resistance from base to fins at high airflow (200-plus LFM), and work in environments with ambiguous airflow direction, making them highly effective. The round aerodynamic pin design and spacing reduce resistance to surrounding airstreams that enter the pin array while simultaneously increasing air turbulence. This, in turn, breaks the boundary layers of still air wrapped around its surface, creating high convective thermal efficiencies. As a result, pin fin heat sinks are widely used to cool insulated-gate bipolar transistors (IGBT).
Pin fin heat sinks are gaining immense popularity in solving complex thermal problems in applications with limited space and substantial heat loads. At present, the surging need for effective cooling solutions to meet the requirements of modern electronics via proper heat dissipation methods is accelerating the adoption of pin fin heat sinks. This, coupled with the escalating demand for huge power supply due to the expanding global population and rapid digitization, represents the primary factor driving the market growth. Moreover, there has been a significant shift from other types of heat sinks toward pin fin heat sinks owing to the growing awareness about their benefits, such as higher volumetric efficiency, compact size, lightweight, better cooling capacity, and low cost. In line with this, the rising adoption of IGBT modules in the automotive industry for hybrid electric vehicles (HEVs) and electric vehicles (EVs) has catalyzed market growth. In addition, the augmenting demand for component density and the increasing miniaturization of electronic devices has strengthened the need for compact and cost-effective cooling solutions, such as pin fin heat sinks. Furthermore, various product innovations by key players, such as the development of the hybrid pin fin heat sink that offers better thermal performance than standard aluminum and copper sinks and can be used for multi-device cooling, are providing a positive thrust to the market growth.
IMARC Group provides an analysis of the key trends in each segment of the global pin fin heat sink for IGBT market, along with forecasts at the global, regional, and country levels from 2024-2032. Our report has categorized the market based on material type and application.
Aluminium
Copper
The report has provided a detailed breakup and analysis of the pin fin heat sink for IGBT market based on the material type. This includes aluminium and copper. According to the report, aluminium represented the largest segment.
Automotive Field
Consumer Electronics
A detailed breakup and analysis of the pin fin heat sink for IGBT market based on the application has also been provided in the report. This includes automotive field and consumer electronics. According to the report, the automotive field accounted for the largest market share.
North America
United States
Canada
Asia-Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa
The report has also provided a comprehensive analysis of all the major regional markets, which include North America (the United States and Canada); Asia-Pacific (China, Japan, India, South Korea, Australia, Indonesia, and others); Europe (Germany, France, the United Kingdom, Italy, Spain, Russia and others); Latin America (Brazil, Mexico, and others); and the Middle East and Africa. According to the report, Asia-Pacific was the largest market for pin fin heat sink for IGBT. Some of the factors driving the Asia-Pacific Pin Fin Heat Sink for IGBT market included the rapid growth in the automotive sector, increasing demand for power supply devices, emerging trend of home remodeling, etc.
The report has also provided a comprehensive analysis of the competitive landscape in the global pin fin heat sink for IGBT market. Competitive analysis such as market structure, market share by key players, player positioning, top winning strategies, competitive dashboard, and company evaluation quadrant has been covered in the report. Also, detailed profiles of all major companies have been provided. Some of the companies covered include Advanced Thermal Solutions Inc., Wellste Aluminum, etc. Kindly note that this only represents a partial list of companies, and the complete list has been provided in the report.
Kindly note that this only represents a partial list of companies, and the complete list has been provided in the report.