市场调查报告书
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1541192
2024-2032 年热界面材料市场报告(按产品类型、应用和地区)Thermal Interface Materials Market Report by Product Type, Application, and Region 2024-2032 |
IMARC Group年全球热界面材料市场规模达35亿美元。该市场的主要驱动因素包括消费性电子产业的显着成长、再生能源投资的增加、汽车技术的不断进步、5G技术的不断采用、航空航天和国防领域的快速扩张以及对医疗设备创新的日益关注。
主要市场驱动因素:由于电子元件的小型化以及对强大运算设备的需求不断增加,对高效散热的需求不断增长,正在推动全球热界面材料(TIM)市场的发展。此外,电动车 (EV) 和再生能源系统的日益普及需要先进的热管理解决方案来提高电池性能和可靠性。
主要市场趋势:由于电信基础设施的扩展需要 TIM 等先进的热管理解决方案,因此 5G 技术的普及是市场的重要趋势。穿戴式科技和物联网 (IoT) 装置的长足发展需要紧凑且高效的热管理解决方案,这是另一个主要市场趋势。
地理趋势:在快速工业化、不断扩大的电子产业以及中国、日本和韩国等国家主要製造中心的推动下,亚太地区引领市场。该地区的主导地位得益于有利的政府政策和对技术进步的大量投资,这刺激了各种应用对 TIM 的需求。热界面材料市场概况凸显了亚太地区在塑造全球市场格局中的关键作用。
竞争格局:市场竞争格局包括3M、陶氏、汉高股份公司、霍尼韦尔国际公司、铟泰公司、北川工业美国公司、莱尔德科技公司、迈图高性能材料公司等领导公司.、Parker-Hannifin Corporation 和Zalman Tech Co. Ltd。他们的努力旨在占领更大的市场份额并满足对高效热管理解决方案不断增长的需求。这些活动为热界面材料市场创造了许多近期成长和进步的机会,展示了该行业的动态和竞争本质。
挑战与机会:市场面临多重挑战,例如根据新兴技术创新材料的需求不断增加,以及製造环保产品的压力越来越大。然而,这些挑战也带来了巨大的成长机会。再生能源和电动车 (EV) 等新兴应用的成长需要更复杂的热技术。随着 TIM 在寻求更高效和永续技术的行业中迅速采用,市场在多个领域呈现出巨大的成长和机会。这些动态凸显了市场近期的创新和成长机会,使该产业在不断发展的技术和环境景观中拥有光明的未来。
消费性电子领域显着成长
大众对高性能电子设备不断增长的需求正在推动市场的发展。随着电子设备变得更加紧凑和强大,有效的散热对于维持其性能和寿命至关重要。 TIM 是透过提高组件和散热器之间的导热性来管理热量的重要元素。这种需求在消费性电子、汽车和电信产业尤其明显,现代 TIM 可确保更高的可靠性和效率。除了高效能运算设备和游戏之外,所有这些趋势都增强了对先进热管理解决方案的需求。因此,热界面材料市场预测仍然乐观,不断进步推动其扩张。
再生能源投资不断增加
对再生能源开发的不断增长的投资正在支持市场的成长。向太阳能和风能等再生能源的过渡涉及部署需要高效热管理的复杂电子系统。太阳能逆变器、风力发电机控制器和其他相关设备等电力电子设备在运作过程中会产生大量热量,因此需要使用高性能TIM来满足性能要求。这是由于人们对永续能源的持续关注以及利用再生能源减少碳足迹的全球趋势,从而刺激了热界面材料在再生能源专案中的使用。随着再生能源产业的成长,对高科技热管理解决方案的需求不断增加,从而显着推动热界面材料的需求。
汽车技术的不断进步
新车开发的新兴创新是推动全球市场的重要因素。电动车和自动驾驶汽车的日益普及导致对有效热管理解决方案的需求不断增加。热管理对于电动车尤其重要,因为电池和 ECU 需要严格的温度控制。 TIM 的使用对于调节这些组件的热设计以及提高电动车的效率和安全性至关重要。此外,现代车辆还整合了 ADAS 和资讯娱乐等功能,在运行时需要良好的热管理。这一趋势进一步促进了热界面材料市场的成长。
IMARC Group提供了每个细分市场的主要趋势分析,以及 2024-2032 年全球、区域和国家层面的预测。我们的报告根据产品类型和应用对市场进行了分类。
胶带和薄膜
弹性垫
润滑脂和黏合剂
相变材料
金属基材料
其他的
润滑脂和黏合剂占据大部分市场份额
该报告根据产品类型对市场进行了详细的细分和分析。这包括胶带和薄膜、弹性垫、润滑脂和黏合剂、相变材料、金属基材料等。根据该报告,润滑脂和黏合剂代表了最大的部分。
润滑脂和黏合剂因其高导热性和易于涂抹的特性而在市场上占据主导地位。润滑脂具有较高的热性能,可以填充表面之间的小间隙,以确保有效的热传递。相较之下,黏合剂兼具导热性和机械黏合能力,使其适用于不同的应用。因此,这些产品因其性能和多功能性而在 TIM 市场中占有主要市场份额。由于各行业对高性能设备的需求不断增长,润滑脂和黏合剂预计将继续产生高热界面材料市场收入。
电信
电脑
医疗器材
工业机械
耐久性消费品
汽车电子
其他的
电脑业占有率第一
报告还提供了基于应用程式的详细市场细分和分析。这包括电信、电脑、医疗设备、工业机械、耐用消费品、汽车电子等。报告称,计算机占据了最大的市场份额。
电脑领域占有最大的市场占有率。对高效能运算 (HPC) 和电子模组小型化不断增长的需求推动了散热创新。随着电脑处理器的不断进步,包括更快的处理器和更强大的显示卡的开发,对有效热管理解决方案的需求不断增加。此外,游戏 PC、工作站和资料中心的使用不断增长,进一步加速了对高效能 TIM 的需求。由于这些技术进步和电脑系统日益复杂,热界面材料的市场前景仍然看好。
北美洲
美国
加拿大
亚太地区
中国
日本
印度
韩国
澳洲
印尼
其他的
欧洲
德国
法国
英国
义大利
西班牙
俄罗斯
其他的
拉丁美洲
巴西
墨西哥
其他的
中东和非洲
亚太地区引领市场,占据最大的热界面材料市场份额
该报告还对所有主要区域市场进行了全面分析,其中包括北美(美国和加拿大);亚太地区(中国、日本、印度、韩国、澳洲、印尼等);欧洲(德国、法国、英国、义大利、西班牙、俄罗斯等);拉丁美洲(巴西、墨西哥等);以及中东和非洲。报告称,亚太地区是热界面材料最大的区域市场。
由于亚太地区工业化的快速发展、电子产业的显着成长以及中国、日本和韩国等主要製造中心的扩张,亚太地区占据了最大的市场份额。该地区消费性电子产品、汽车电子产品和其他先进技术产量的不断增加也推动了对该产品的需求。此外,主要参与者对电动车生产和技术创新的持续投资在增强热界面材料市场方面进一步发挥重要作用。
市场研究报告也对市场竞争格局进行了全面分析。也提供了所有主要公司的详细资料。热界面材料产业的一些主要市场参与者包括3M 公司、陶氏公司、汉高股份公司、霍尼韦尔国际公司、Indium 公司、北川工业美国公司、莱尔德科技公司、迈图高性能材料公司。
(请注意,这只是关键参与者的部分列表,报告中提供了完整列表。)
领先的热界面材料公司正在分配大量资源用于研发,寻求开发更新、更好的热界面材料,其特点是具有更好的导热性、可靠性和安装性。这包括製备具有改进特性的基材、黏合剂和保护涂层,例如降低热阻和提高耐热性,以满足不同行业不断增长的市场需求。此外,一些公司正在促进业务、併购,以扩大其全球影响力,因为这些合作有助于企业了解各自业务合作伙伴的实力,甚至帮助他们将尖端技术精确地引入热管理解决方案中。参考热界面材料市场的最新发展,一些市场参与者正在推出环保且永续的热界面材料。他们也特别关註生产线的数位化和工业进步,以实现最大的投资回报。此外,奈米技术等先进材料和技术的不断结合也被认为正在增加,这正在扩大市场。
2023 年2 月21 日,Indium Corporation 宣布将于3 月5 日至8 日在美国亚利桑那州梅萨举行的TestConX 上展示其高性能金属热界面材料(TIM),进行老化和测试。卓越的热性能纯金属铟的电导率超过非金属,达到 86W/mK。其含铟TIM有纯铟、铟银合金和铟锡三种形式。
2024年3月29日,Resonac公司宣布决定将其高性能半导体晶片材料的生产能力提高到目前水准的3.5至5倍,这些晶片主要用作人工智慧(AI)的CPU。该公司的目标是扩大非导电薄膜(NCF)和热界面材料(TIM)的生产。它计划投资 150 亿日元用于生产这些材料的设施,并将于 2024 年及之后开始运营扩建后的设施。
The global thermal interface materials market size reached US$ 3.5 Billion in 2023. Looking forward, IMARC Group expects the market to reach US$ 7.3 Billion by 2032, exhibiting a growth rate (CAGR) of 8.3% during 2024-2032. The market is majorly driven by significant growth in the consumer electronics sector, rising investments in renewable energy, continual advancements in automotive technology, increasing adoption of 5G technology, rapid expansion in aerospace and defense sectors, and an enhanced focus on medical device innovations.
Major Market Drivers: The rising need for efficient heat dissipation due to the miniaturization of electronic components and the augmenting demand for powerful computing devices is driving the global market for thermal interface materials (TIMs). Additionally, the increasing adoption of electric vehicles (EVs) and renewable energy systems requires advanced thermal management solutions to enhance battery performance and reliability.
Key Market Trends: The proliferation of 5G technology due to the expansion of telecommunications infrastructure that demand advanced thermal management solutions such as TIMs is a significant trend in the market. Considerable developments in wearable technologies and the Internet of Things (IoT) devices, which require compact and efficient thermal management solutions, is another major market trend.
Geographical Trends: The Asia Pacific region leads the market, driven by rapid industrialization, expanding electronics sector, and the presence of major manufacturing hubs in countries, such as China, Japan, and South Korea. The region's dominance is bolstered by favorable government policies and significant investments in technological advancements, which fuel the demand for TIMs in various applications. The thermal interface materials market overview highlights the critical role of Asia Pacific in shaping the global market landscape.
Competitive Landscape: The competitive landscape of the market includes leading companies such as 3M Company, Dow Inc., Henkel AG & Co. KGaA, Honeywell International Inc., Indium Corporation, Kitagawa Industries America Inc., Laird Technologies Inc. Momentive Performance Materials Inc., Parker-Hannifin Corporation, and Zalman Tech Co. Ltd. These key players are heavily investing in research and development to innovate and expand their product portfolios. Their efforts aim to capture a larger market share and address the growing demand for efficient thermal management solutions. These activities result in the creation of numerous thermal interface materials market recent opportunities for growth and advancement, showcasing the industry's dynamic and competitive nature.
Challenges and Opportunities: The market faces multiple challenges, such as the augmenting need to innovate materials in line with emerging technologies and the increasing pressure to manufacture environmentally friendly products. However, these challenges also present significant growth opportunities. The growth in emerging applications, such as renewable energy and electric vehicles (EVs), requires more sophisticated thermal technologies. With TIMs being rapidly adopted across industries seeking more efficient and sustainable technologies, the market presents numerous growth and opportunities in multiple sectors. These dynamics highlight the market recent opportunities for innovation and growth, positioning the industry for a promising future amid evolving technological and environmental landscapes.
Significant growth in the consumer electronics sector
The rising demand for high-performance electronic devices among the masses is driving the market. As electronic devices become more compact and powerful, effective heat dissipation is crucial to maintain their performance and longevity. TIMs are essential elements in managing heat by improving thermal conductivity between the components and heatsinks. This need is especially noticeable in the consumer electronics, automotive, and telecom industries where modern-day TIMs ensure greater reliability and efficiency. All of these trends are empowering the demand for advanced thermal management solutions, in addition to high-performance computing devices and gaming. As a result, the thermal interface materials market forecast remains positive, with continuous advancements driving its expansion.
Rising Investments in Renewable Energy
The growing investments made for the development of renewable energy sources are supporting the market growth. The transition towards renewable energy, such as solar and wind power, involves the deployment of sophisticated electronic systems that require efficient thermal management. The power electronics equipment such as solar inverters, wind turbine controllers and other associated devices produce considerable amount of heat in course of operation and hence, require the usage of high-performance TIMs to meet the performance requirement. This is due to the continuing interest for sustainable energy and the global trend towards utilizing renewable energy to reduce carbon footprint, thus stimulating the usage of thermal interface materials for renewable energy projects. With the growth of renewable energy sectors, demand for high-tech thermal management solutions is continuously increasing and consequently propelling the thermal interface materials demand significantly.
Continual advancements in automotive technology
Emerging innovations in the development of new vehicles are a significant factor impelling the global market. The rising popularity of electric vehicles and self-driving vehicles has led to the augmenting demand for effective thermal management solutions. Thermal management is particularly crucial for electric vehicles as batteries and ECUs need stringent control of temperature. The use of TIMs is vital in regulating the thermal design of these components and increasing the efficiency and safety of EVs. Also, modern vehicles incorporate features such as ADAS and infotainment that require good thermal management in their operation. This trend is further contributing to the thermal interface materials market growth.
IMARC Group provides an analysis of the key trends in each segment of the market, along with forecasts at the global, regional, and country levels for 2024-2032. Our report has categorized the market based on product type and application.
Tapes and Films
Elastomeric Pads
Greases and Adhesives
Phase Change Materials
Metal Based Materials
Others
Greases and adhesives accounts for the majority of the market share
The report has provided a detailed breakup and analysis of the market based on the product type. This includes tapes and films, elastomeric pads, greases and adhesives, phase change materials, metal-based materials, and others. According to the report, greases and adhesives represented the largest segment.
Greases and adhesives dominate the market due to their high thermal conductivity and easy-to-apply properties. Greases offer high thermal performance and can fill small gaps between surfaces to ensure efficient heat transfer. Adhesives, in contrast, have a combination of thermal conductivity and mechanical bonding capacity, making them suitable for different applications. As a result, these products have a major market share in the TIMs market due to their performance and versatility. On account of the increasing demand for high-performance devices in various industries, greases and adhesives are expected to continue generating high thermal interface materials market revenue.
Telecom
Computer
Medical Devices
Industrial Machinery
Consumer Durables
Automotive Electronics
Others
Computer holds the largest share of the industry
A detailed breakup and analysis of the market based on the application have also been provided in the report. This includes telecom, computer, medical devices, industrial machinery, consumer durables, automotive electronics, and others. According to the report, computer accounted for the largest market share.
The computer segment holds the largest share of the market. Growing demand for high-performance computing (HPC) and the miniaturization of electronic modules drive heat removal innovations. With ongoing advancements in computer processors, including the development of faster processors and more powerful graphics cards, the demand for effective thermal management solutions is rising. Furthermore, the growing usage of gaming PCs, workstations, and data centers further accelerates the demand for high-performance TIMs. The thermal interface materials market outlook remains favorable due to these technological advancements and the increasing complexity of computer systems.
North America
United States
Canada
Asia Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa
Asia Pacific leads the market, accounting for the largest thermal interface materials market share
The report has also provided a comprehensive analysis of all the major regional markets, which include North America (the United States and Canada); Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia, and others); Europe (Germany, France, the United Kingdom, Italy, Spain, Russia, and others); Latin America (Brazil, Mexico, and others); and the Middle East and Africa. According to the report, Asia Pacific represents the largest regional market for thermal interface materials.
Asia Pacific holds the largest segment in the market due to the region's rapid industrialization, significant growth of the electronics industries, and the expansion of major manufacturing hubs such as China, Japan, and South Korea. The increasing production of consumer electronics, automotive electronics, and other advanced technologies in this region also drives the demand for the product. Furthermore, continual investments by key players in the production of EVs and technological innovations are further playing a significant role in enhancing the thermal interface materials market.
The market research report has also provided a comprehensive analysis of the competitive landscape in the market. Detailed profiles of all major companies have also been provided. Some of the major market players in the thermal interface materials industry include 3M Company, Dow Inc., Henkel AG & Co. KGaA, Honeywell International Inc., Indium Corporation, Kitagawa Industries America Inc., Laird Technologies Inc. Momentive Performance Materials Inc., Parker-Hannifin Corporation, and Zalman Tech Co. Ltd.
(Please note that this is only a partial list of the key players, and the complete list is provided in the report.)
Leading thermal interface materials companies are allocating significant amounts of resources towards research and development as they seek to develop newer and better TIMs characterized by better thermal conductivity, reliability, and installation. This comprises of preparing substrates, adhesives, and protective coatings with improved characteristics like reduced thermal resistance and increased thermal endurance to accommodate the increasing market requirements of different industries. Moreover, several companies are promoting businesses, mergers, and acquisitions to promote their global reach as these collaborations assist businesses in understanding the strength of the respective business partners, thus even helping them in bringing cutting-edge technology to thermal management solutions precisely. With reference to thermal interface materials market recent developments, some of the market players are launching environmentally friendly and sustainable TIMs. They are also paying special attention to digital and industrial advancement in production lines to achieve maximum returns on their investments. Additionally, the constant incorporation of advanced materials and technologies such as nanotechnology is also perceived to be on the rise, which is augmenting the market.
On 21st February 2023, Indium Corporation announced that it will feature its high-performance metal thermal interface materials (TIMs) for burn-in and test at TestConX during March 5th to 8th in Mesa, Arizona, U.S. The indium-containing TIMs offer superior thermal conductivity over non-metals with pure indium metal delivering 86W/mK. Its indium-containing TIMs are available as pure indium, indium-silver alloys, and indium-tin.
On 29th March 2024, Resonac Corporation announced the decision to increase its capacity to produce materials for high-performance semiconductor chips, which are to be used mainly as CPUs for artificial intelligence (AI), to 3.5 to 5 times of the current level. The company aims to escalate the production of non-conductive film (NCF) and thermal interface material (TIM). It plans to invest 15 billion yen in facilities to produce these materials and will commence operation of the expanded facilities in and after 2024.