2026-2030年全球记忆体IC市场
市场调查报告书
商品编码
1937589

2026-2030年全球记忆体IC市场

Global Memory Ics Market 2026-2030

出版日期: | 出版商: TechNavio | 英文 319 Pages | 订单完成后即时交付

价格
简介目录

预计从 2025 年到 2030 年,全球记忆体 IC 市场规模将成长 1,179.214 亿美元,预测期内复合年增长率为 10.6%。

本报告对全球记忆体 IC 市场进行了全面分析,包括市场规模和预测、趋势、成长要素和挑战,以及对约 25 家公司的供应商分析。

该报告对当前市场格局、最新趋势和驱动因素以及整体市场环境进行了最新分析,而整体市场环境的驱动因素包括高效能运算和人工智慧的广泛应用、5G 连接和边缘运算的加速应用以及全球汽车产业的数位转型。

本研究采用客观的方法,结合一手和二手讯息,包括来自主要行业相关人员的意见。报告包含全面的市场规模数据、区域細項分析、供应商格局以及对主要企业的分析。报告提供历史数据和预测数据。

市场覆盖范围
基准年 2026
年末 2030
预测期 2026-2030
成长势头 加速度
2026 年与前一年相比 9.6%
复合年增长率 10.6%
增量 1179.214亿美元

研究指出,全球运算生态系统向DDR5和LP-DDR5X架构的策略转型是未来几年推动全球记忆体IC市场成长的关键因素之一。此外,分散式记忆体架构的Compute Express Link技术的进步、3D NAND技术的规模化应用以及垂直整合预计也将显着提升市场需求。

目录

第一章执行摘要

第二章 Technavio 分析

  • 价格、生命週期、顾客购买篮、采用率和购买标准分析
  • 投入与差异化因素的重要性
  • 混淆来源
  • 驱动因素和挑战的影响

第三章 市场情势

  • 市场生态系统
  • 市场特征
  • 价值链分析

第四章 市场规模

  • 市场定义
  • 市场区隔分析
  • 2025年市场规模
  • 2025-2030年市场展望

第五章 市场规模表现

  • 2020-2024年全球记忆体IC市场
  • 类型细分市场分析 2020-2024
  • 2020-2024年最终用户细分市场分析
  • 应用细分市场分析 2020-2024
  • 2020-2024年区域市场分析
  • 2020-2024年国家细分市场分析

第六章 定性分析

  • 人工智慧的影响:全球记忆体积体电路市场

第七章五力分析

  • 五力分析概述
  • 买方的议价能力
  • 供应商的议价能力
  • 新进入者的威胁
  • 替代品的威胁
  • 竞争威胁
  • 市场状况

第八章 按类型分類的市场区隔

  • 比较:按类型
  • 挥发性记忆体
  • 非挥发性记忆体
  • 其他的
  • 按类型分類的市场机会

9. 按最终用户进行市场区隔

  • 比较:按最终用户
  • 家用电子电器
  • 资讯科技和电信
  • 卫生保健
  • 其他的
  • 按最终用户分類的市场机会

第十章 按应用程式进行市场细分

  • 比较:按应用
  • 智慧型手机和平板电脑
  • 资料中心和伺服器
  • 汽车电子
  • 工业电子
  • 其他的
  • 按应用分類的市场机会

第十一章 客户情况

第十二章 区域情势

  • 区域细分
  • 区域比较
  • 亚太地区
    • 中国
    • 日本
    • 韩国
    • 印度
    • 澳洲
    • 印尼
  • 北美洲
    • 我们
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 法国
    • 英国
    • 义大利
    • 荷兰
    • 西班牙
  • 中东和非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 南非
    • 以色列
    • 土耳其
  • 南美洲
    • 巴西
    • 阿根廷
    • 哥伦比亚
  • 各区域的市场机会

第十三章:驱动因素、挑战与机会

  • 市场驱动因素
  • 市场挑战
  • 驱动因素和挑战的影响
  • 市场机会

第十四章 竞争格局

  • 概述
  • 竞争格局
  • 令人困惑的局面
  • 产业风险

第十五章 竞争分析

  • 公司简介
  • 企业排名指数
  • 公司市场定位
  • Analog Devices Inc.
  • Changxin Technology Group Co. Ltd
  • GigaDevice Semiconductor Inc
  • Infineon Technologies AG
  • Kioxia Corp.
  • Macronix International Co Ltd
  • Microchip Technology Inc.
  • Micron Technology Inc.
  • Renesas Electronics Corp.
  • ROHM Co. Ltd.
  • Samsung Electronics Co. Ltd.
  • SK hynix Co. Ltd.
  • STMicroelectronics NV
  • Winbond Electronics Corp.
  • Yangtze RST Co., Ltd

第十六章附录

简介目录
Product Code: IRTNTR81294

The global memory ics market is forecasted to grow by USD 117921.4 mn during 2025-2030, accelerating at a CAGR of 10.6% during the forecast period. The report on the global memory ics market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.

The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by proliferation of high-performance computing and ai, accelerated adoption of 5g connectivity and edge computing, digital transformation of global automotive industry.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market size data, segment with regional analysis and vendor landscape in addition to an analysis of the key companies. Reports have historic and forecast data.

Market Scope
Base Year2026
End Year2030
Series Year2026-2030
Growth MomentumAccelerate
YOY 20269.6%
CAGR10.6%
Incremental Value$117921.4 mn

Technavio's global memory ics market is segmented as below:

By Type

  • Volatile memory
  • Non-volatile memory
  • Others

By End-User

  • Consumer electronics
  • IT and telecommunication
  • Automotive
  • Healthcare
  • Others

By Application

  • Smartphone and tablets
  • Data centers and servers
  • Automotive electronics
  • Industrial electronics
  • Others

Geography

  • APAC
    • China
    • Japan
    • South Korea
    • India
    • Australia
    • Indonesia
  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • France
    • UK
    • Italy
    • The Netherlands
    • Spain
  • Middle East and Africa
    • UAE
    • South Africa
    • Turkey
  • South America
    • Brazil
    • Argentina
    • Colombia
  • Rest of World (ROW)

This study identifies the strategic migration toward ddr5 and lpddr5x architecture in global computing ecosystems as one of the prime reasons driving the global memory ics market growth during the next few years. Also, advancements in compute express link for disaggregated memory architectures and scaling of 3d nand technology and vertical integration will lead to sizable demand in the market.

The report on the global memory ics market covers the following areas:

  • Global memory ics market sizing
  • Global memory ics market forecast
  • Global memory ics market industry analysis

The robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading global memory ics market vendors that include Analog Devices Inc., Changxin Technology Group Co. Ltd, Fujitsu Ltd., GigaDevice Semiconductor Inc, Infineon Technologies AG, Integrated Silicon Solution Inc, Kioxia Corp., Macronix International Co Ltd, Microchip Technology Inc., Micron Technology Inc., ON Semiconductor Corp., Renesas Electronics Corp., ROHM Co. Ltd., Samsung Electronics Co. Ltd., Silicon Motion Technology Corp., SK hynix Co. Ltd., Solidigm, STMicroelectronics NV, Winbond Electronics Corp., Yangtze RST Co., Ltd. Also, the global memory ics market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.

The publisher presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive primary and secondary research. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast accurate market growth.

Table of Contents

1 Executive Summary

  • 1.1 Market overview
    • Executive Summary - Chart on Market Overview
    • Executive Summary - Data Table on Market Overview
    • Executive Summary - Chart on Global Market Characteristics
    • Executive Summary - Chart on Market by Geography
    • Executive Summary - Chart on Market Segmentation by Type
    • Executive Summary - Chart on Market Segmentation by End-user
    • Executive Summary - Chart on Market Segmentation by Application
    • Executive Summary - Chart on Incremental Growth
    • Executive Summary - Data Table on Incremental Growth
    • Executive Summary - Chart on Company Market Positioning

2 Technavio Analysis

  • 2.1 Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria
    • Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria
  • 2.2 Criticality of inputs and Factors of differentiation
  • 2.3 Factors of disruption
  • 2.4 Impact of drivers and challenges

3 Market Landscape

  • 3.1 Market ecosystem
  • 3.2 Market characteristics
  • 3.3 Value chain analysis

4 Market Sizing

  • 4.1 Market definition
  • 4.2 Market segment analysis
    • Market segments
  • 4.3 Market size 2025
  • 4.4 Market outlook: Forecast for 2025-2030

5 Historic Market Size

  • 5.1 Global Memory ICs Market 2020 - 2024
    • Historic Market Size - Data Table on Global Memory ICs Market 2020 - 2024 ($ million)
  • 5.2 Type segment analysis 2020 - 2024
    • Historic Market Size - Type Segment 2020 - 2024 ($ million)
  • 5.3 End-user segment analysis 2020 - 2024
    • Historic Market Size - End-user Segment 2020 - 2024 ($ million)
  • 5.4 Application segment analysis 2020 - 2024
    • Historic Market Size - Application Segment 2020 - 2024 ($ million)
  • 5.5 Geography segment analysis 2020 - 2024
    • Historic Market Size - Geography Segment 2020 - 2024 ($ million)
  • 5.6 Country segment analysis 2020 - 2024
    • Historic Market Size - Country Segment 2020 - 2024 ($ million)

6 Qualitative Analysis

  • 6.1 Impact of AI on Global Memory ICs Market

7 Five Forces Analysis

  • 7.1 Five forces summary
    • Five forces analysis - Comparison between 2025 and 2030
  • 7.2 Bargaining power of buyers
    • Bargaining power of buyers - Impact of key factors 2025 and 2030
  • 7.3 Bargaining power of suppliers
    • Bargaining power of suppliers - Impact of key factors in 2025 and 2030
  • 7.4 Threat of new entrants
    • Threat of new entrants - Impact of key factors in 2025 and 2030
  • 7.5 Threat of substitutes
    • Threat of substitutes - Impact of key factors in 2025 and 2030
  • 7.6 Threat of rivalry
    • Threat of rivalry - Impact of key factors in 2025 and 2030
  • 7.7 Market condition

8 Market Segmentation by Type

  • 8.1 Market segments
  • 8.2 Comparison by Type
  • 8.3 Volatile memory - Market size and forecast 2025-2030
  • 8.4 Non-volatile memory - Market size and forecast 2025-2030
  • 8.5 Others - Market size and forecast 2025-2030
  • 8.6 Market opportunity by Type
    • Market opportunity by Type ($ million)

9 Market Segmentation by End-user

  • 9.1 Market segments
  • 9.2 Comparison by End-user
  • 9.3 Consumer electronics - Market size and forecast 2025-2030
  • 9.4 IT and telecommunication - Market size and forecast 2025-2030
  • 9.5 Automotive - Market size and forecast 2025-2030
  • 9.6 Healthcare - Market size and forecast 2025-2030
  • 9.7 Others - Market size and forecast 2025-2030
  • 9.8 Market opportunity by End-user
    • Market opportunity by End-user ($ million)

10 Market Segmentation by Application

  • 10.1 Market segments
  • 10.2 Comparison by Application
  • 10.3 Smartphone and tablets - Market size and forecast 2025-2030
  • 10.4 Data centers and servers - Market size and forecast 2025-2030
  • 10.5 Automotive electronics - Market size and forecast 2025-2030
  • 10.6 Industrial electronics - Market size and forecast 2025-2030
  • 10.7 Others - Market size and forecast 2025-2030
  • 10.8 Market opportunity by Application
    • Market opportunity by Application ($ million)

11 Customer Landscape

  • 11.1 Customer landscape overview
    • Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria

12 Geographic Landscape

  • 12.1 Geographic segmentation
  • 12.2 Geographic comparison
  • 12.3 APAC - Market size and forecast 2025-2030
    • 12.3.1 China - Market size and forecast 2025-2030
    • 12.3.2 Japan - Market size and forecast 2025-2030
    • 12.3.3 South Korea - Market size and forecast 2025-2030
    • 12.3.4 India - Market size and forecast 2025-2030
    • 12.3.5 Australia - Market size and forecast 2025-2030
    • 12.3.6 Indonesia - Market size and forecast 2025-2030
  • 12.4 North America - Market size and forecast 2025-2030
    • 12.4.1 US - Market size and forecast 2025-2030
    • 12.4.2 Canada - Market size and forecast 2025-2030
    • 12.4.3 Mexico - Market size and forecast 2025-2030
  • 12.5 Europe - Market size and forecast 2025-2030
    • 12.5.1 Germany - Market size and forecast 2025-2030
    • 12.5.2 France - Market size and forecast 2025-2030
    • 12.5.3 UK - Market size and forecast 2025-2030
    • 12.5.4 Italy - Market size and forecast 2025-2030
    • 12.5.5 The Netherlands - Market size and forecast 2025-2030
    • 12.5.6 Spain - Market size and forecast 2025-2030
  • 12.6 Middle East and Africa - Market size and forecast 2025-2030
    • 12.6.1 Saudi Arabia - Market size and forecast 2025-2030
    • 12.6.2 UAE - Market size and forecast 2025-2030
    • 12.6.3 South Africa - Market size and forecast 2025-2030
    • 12.6.4 Israel - Market size and forecast 2025-2030
    • 12.6.5 Turkey - Market size and forecast 2025-2030
  • 12.7 South America - Market size and forecast 2025-2030
    • 12.7.1 Brazil - Market size and forecast 2025-2030
    • 12.7.2 Argentina - Market size and forecast 2025-2030
    • 12.7.3 Colombia - Market size and forecast 2025-2030
  • 12.8 Market opportunity by geography
    • Market opportunity by geography ($ million)
    • Data Tables on Market opportunity by geography ($ million)

13 Drivers, Challenges, and Opportunity

  • 13.1 Market drivers
    • Proliferation of high-performance computing and AI
    • Accelerated adoption of 5G connectivity and edge computing
    • Digital transformation of global automotive industry
  • 13.2 Market challenges
    • Geopolitical volatility and macroeconomic uncertainty
    • Technical limitations and escalation of research and development costs
    • Environmental regulation and resource scarcity
  • 13.3 Impact of drivers and challenges
    • Impact of drivers and challenges in 2025 and 2030
  • 13.4 Market opportunities
    • Strategic migration toward DDR5 and LPDDR5X architecture in global computing ecosystems
    • Advancements in compute express link for disaggregated memory architectures
    • Scaling of 3D NAND technology and vertical integration

14 Competitive Landscape

  • 14.1 Overview
  • 14.2 Competitive Landscape
    • Overview on criticality of inputs and factors of differentiation
  • 14.3 Landscape disruption
    • Overview on factors of disruption
  • 14.4 Industry risks
    • Impact of key risks on business

15 Competitive Analysis

  • 15.1 Companies profiled
    • Companies covered
  • 15.2 Company ranking index
    • Company ranking index
  • 15.3 Market positioning of companies
    • Matrix on companies position and classification
  • 15.4 Analog Devices Inc.
    • Analog Devices Inc. - Overview
    • Analog Devices Inc. - Business segments
    • Analog Devices Inc. - Key news
    • Analog Devices Inc. - Key offerings
    • Analog Devices Inc. - Segment focus
    • SWOT
  • 15.5 Changxin Technology Group Co. Ltd
    • Changxin Technology Group Co. Ltd - Overview
    • Changxin Technology Group Co. Ltd - Product / Service
    • Changxin Technology Group Co. Ltd - Key offerings
    • SWOT
  • 15.6 GigaDevice Semiconductor Inc
    • GigaDevice Semiconductor Inc - Overview
    • GigaDevice Semiconductor Inc - Product / Service
    • GigaDevice Semiconductor Inc - Key offerings
    • SWOT
  • 15.7 Infineon Technologies AG
    • Infineon Technologies AG - Overview
    • Infineon Technologies AG - Business segments
    • Infineon Technologies AG - Key news
    • Infineon Technologies AG - Key offerings
    • Infineon Technologies AG - Segment focus
    • SWOT
  • 15.8 Kioxia Corp.
    • Kioxia Corp. - Overview
    • Kioxia Corp. - Product / Service
    • Kioxia Corp. - Key offerings
    • SWOT
  • 15.9 Macronix International Co Ltd
    • Macronix International Co Ltd - Overview
    • Macronix International Co Ltd - Product / Service
    • Macronix International Co Ltd - Key offerings
    • SWOT
  • 15.10 Microchip Technology Inc.
    • Microchip Technology Inc. - Overview
    • Microchip Technology Inc. - Business segments
    • Microchip Technology Inc. - Key news
    • Microchip Technology Inc. - Key offerings
    • Microchip Technology Inc. - Segment focus
    • SWOT
  • 15.11 Micron Technology Inc.
    • Micron Technology Inc. - Overview
    • Micron Technology Inc. - Business segments
    • Micron Technology Inc. - Key news
    • Micron Technology Inc. - Key offerings
    • Micron Technology Inc. - Segment focus
    • SWOT
  • 15.12 Renesas Electronics Corp.
    • Renesas Electronics Corp. - Overview
    • Renesas Electronics Corp. - Business segments
    • Renesas Electronics Corp. - Key news
    • Renesas Electronics Corp. - Key offerings
    • Renesas Electronics Corp. - Segment focus
    • SWOT
  • 15.13 ROHM Co. Ltd.
    • ROHM Co. Ltd. - Overview
    • ROHM Co. Ltd. - Business segments
    • ROHM Co. Ltd. - Key news
    • ROHM Co. Ltd. - Key offerings
    • ROHM Co. Ltd. - Segment focus
    • SWOT
  • 15.14 Samsung Electronics Co. Ltd.
    • Samsung Electronics Co. Ltd. - Overview
    • Samsung Electronics Co. Ltd. - Business segments
    • Samsung Electronics Co. Ltd. - Key news
    • Samsung Electronics Co. Ltd. - Key offerings
    • Samsung Electronics Co. Ltd. - Segment focus
    • SWOT
  • 15.15 SK hynix Co. Ltd.
    • SK hynix Co. Ltd. - Overview
    • SK hynix Co. Ltd. - Product / Service
    • SK hynix Co. Ltd. - Key news
    • SK hynix Co. Ltd. - Key offerings
    • SWOT
  • 15.16 STMicroelectronics NV
    • STMicroelectronics NV - Overview
    • STMicroelectronics NV - Business segments
    • STMicroelectronics NV - Key news
    • STMicroelectronics NV - Key offerings
    • STMicroelectronics NV - Segment focus
    • SWOT
  • 15.17 Winbond Electronics Corp.
    • Winbond Electronics Corp. - Overview
    • Winbond Electronics Corp. - Business segments
    • Winbond Electronics Corp. - Key news
    • Winbond Electronics Corp. - Key offerings
    • Winbond Electronics Corp. - Segment focus
    • SWOT
  • 15.18 Yangtze RST Co., Ltd
    • Yangtze RST Co., Ltd - Overview
    • Yangtze RST Co., Ltd - Product / Service
    • Yangtze RST Co., Ltd - Key offerings
    • SWOT

16 Appendix

  • 16.1 Scope of the report
    • Market definition
    • Objectives
    • Notes and caveats
  • 16.2 Inclusions and exclusions checklist
    • Inclusions checklist
    • Exclusions checklist
  • 16.3 Currency conversion rates for US$
    • Currency conversion rates for US$
  • 16.4 Research methodology
    • Research methodology
  • 16.5 Data procurement
    • Information sources
  • 16.6 Data validation
    • Data validation
  • 16.7 Validation techniques employed for market sizing
    • Validation techniques employed for market sizing
  • 16.8 Data synthesis
    • Data synthesis
  • 16.9 360 degree market analysis
    • 360 degree market analysis
  • 16.10 List of abbreviations
    • List of abbreviations