市场调查报告书
商品编码
1465983
Chiplet 市场:按处理器、封装技术和最终用途划分 - 2024-2030 年全球预测Chiplet Market by Processor, Packaging Technology, End-use - Global Forecast 2024-2030 |
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预计2023年Chiplet市场规模为97.5亿美元,2024年将达128.4亿美元,2030年将达到836.2亿美元,复合年增长率为35.91%。
小晶片是单独的晶粒,每个晶片都封装了精心製作的子系统或较大积体电路 (IC) 的组件,并将它们精确有效地互连。这种模组化的系统设计方法允许製造商透过组合较小的晶片组件(小晶片)来建造大型、复杂的半导体装置。 Chiplet 为传统单晶片 IC 设计提供了一种经济高效的变体,对于电子和数位系统的发展至关重要,尤其是在半导体领域。这种技术市场的扩张主要是由对半导体经济高效生产和性能改进的追求、资料量的快速增加以及人工智慧 (AI)、机器学习 (ML) 和物联网 (IoT) 的进步所推动的。 。然而,复杂的设计要求和互通性障碍给全球小晶片市场带来了重大挑战。 Chiplet 设计流程的改进、新应用的探索以及新 Chiplet 封装技术的发明描述了 Chiplet 市场创新和成长的巨大潜力。
主要市场统计 | |
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基准年[2023] | 97.5亿美元 |
预测年份 [2024] | 128.4亿美元 |
预测年份 [2030] | 836.2亿美元 |
复合年增长率(%) | 35.91% |
处理器:更多采用 FPGA,透过 AI 整合提供硬体定制
APU,也称为加速处理单元,是一种在单一晶片上整合中央处理单元 (CPU) 和图形处理单元 (GPU) 的晶片,使其能够有效平衡地执行图形和数位密集型任务。 APU 的需求经常出现在小型系统、单板电脑和便携式设备中,其中电源效率和紧凑性至关重要。 AI ASIC Compressor 是一款专用AI 工作负载设计的自订晶片。这些专用晶片透过实现高效能运算同时降低功耗来加速人工智慧应用。这种小晶片解决方案是人工智慧高度整合的地方的首选,例如云端伺服器、机器学习系统和机器人。中央处理器是电脑的主要部件,执行电脑内部的大部分处理工作。 CPU 具有高度通用性,可处理各种工作负载。 CPU 需求偏好最常见于日常电脑系统、笔记型电脑、伺服器环境、资料中心等。 FPGA 是一种具有可程式逻辑元件和互连的半导体装置。 FPGA 是原型製作、雷达和影像处理、软体定义无线电、加密、讯号处理等领域的首选,具体取决于您的需求。 GPU 旨在处理图形渲染任务,并大量用于游戏、影片编辑、动画、3D 渲染以及最近的机器学习任务。
封装技术:采用覆晶球栅阵列技术,降低寄生电感和电容,提供优越的电气性能。
随着最终用途设备变得更小,家用电子电器中小晶片的新可能性
在汽车领域,小晶片因其高能源效率和高性能而在 ADAS(高级驾驶辅助系统)和电动车 (EV) 中发挥的作用而受到关注。小晶片在消费性电子产品、智慧型手机、智慧电视、笔记型电脑和其他设备中至关重要。在电子产业中,基于需求的小晶片偏好围绕着提高性能同时减小产品尺寸的能力。在国防和航太领域,小晶片促进了先进雷达系统、太空船和军事设备的开发。国防和航太领域青睐小晶片的性能、耐用性和能源效率。在医疗领域,小晶片用于医疗成像设备、穿戴式健康监视器和其他设备。 Chiplet 因其高可靠性、低功耗和紧凑的尺寸而受到青睐。在製造领域,小晶片正在纳入自动化和机器人应用。 Chiplet 在这一领域受到青睐,因为它们可以提高生产效率。 IT 和通讯业正在其庞大的网路基础设施中利用小晶片,为 5G 及其他技术提供坚实的支柱。 Chiplet 在通讯业中受到青睐,因为它们可以以低延迟处理大量资料。
区域洞察
在美洲,特别是在美国和加拿大,对小晶片的需求主要是由高科技和云端应用的成长所推动的。就消费趋势而言,对混合运算平台和小型电子产品的日益偏好正在加速对美洲小晶片市场的需求。在欧盟 (EU) 各国主要供应商的引领下,欧洲小晶片市场正在蓬勃发展。最近成立了一个德国联盟,以确保小晶片供应链的安全并促进欧洲的最终组装,从而为该地区的小晶片市场创造潜在需求。中东及非洲地区Chiplet市场潜力大,大力推动Chiplet在地化生产,提高技术自给率。亚太地区是日本、中国和韩国等主要技术先进国家和半导体製造商的所在地,为全球小晶片市场提供了利润丰厚的机会。亚太地区小晶片市场的扩张是由政府和私人对电子製造投资的大幅成长所推动的。
FPNV定位矩阵
FPNV定位矩阵对于评估chiplet市场至关重要。我们检视与业务策略和产品满意度相关的关键指标,以对供应商进行全面评估。这种深入的分析使用户能够根据自己的要求做出明智的决策。根据评估,供应商被分为四个成功程度不同的像限。最前线 (F)、探路者 (P)、利基 (N) 和重要 (V)。
市场占有率分析
市场占有率分析是一种综合工具,可以对 Chiplet 市场供应商的现状进行深入而深入的研究。全面比较和分析供应商在整体收益、基本客群和其他关键指标方面的贡献,以便更好地了解公司的绩效及其在争夺市场占有率时面临的挑战。此外,该分析还提供了对该细分市场竞争特征的宝贵见解,包括在研究基准年观察到的累积、碎片化主导地位和合併特征等因素。详细程度的提高使供应商能够做出更明智的决策并制定有效的策略,从而在市场上获得竞争优势。
1. 市场渗透率:提供有关主要企业所服务的市场的全面资讯。
2. 市场开拓:我们深入研究利润丰厚的新兴市场,并分析其在成熟细分市场的渗透率。
3. 市场多元化:包括新产品发布、开拓地区、最新发展和投资的详细资讯。
4.竞争力评估与资讯:对主要企业的市场占有率、策略、产品、认证、监管状况、专利状况、製造能力等进行全面评估。
5. 产品开发与创新:包括对未来技术、研发活动以及突破性产品开发的见解。
1. Chiplet市场的市场规模和预测是多少?
2.在chiplet市场的预测期内,我们应该考虑投资哪些产品和应用?
3. Chiplet市场的技术趋势和法规结构是什么?
4.chiplet市场主要厂商的市场占有率是多少?
5.进入chiplet市场的合适型态和策略手段是什么?
[186 Pages Report] The Chiplet Market size was estimated at USD 9.75 billion in 2023 and expected to reach USD 12.84 billion in 2024, at a CAGR 35.91% to reach USD 83.62 billion by 2030.
Chiplets are individual silicon dies, each encapsulating a carefully crafted subsystem or component of a larger Integrated Circuit (IC), which are then interconnected precisely and efficiently. This modular approach in system design allows manufacturers to build large, complex semiconductor devices by combining smaller chip components, or chiplets, which can be tailor-made for specific functionalities. Chiplets are pivotal in formulating electronic and digital systems, especially in the semiconductor sector, providing cost-efficient variants to traditional monolithic IC design. This technology market's expansion is primarily propelled by the quest for cost-effective production and enhanced performance in semiconductors, spiked data volumes, and progressions in artificial intelligence (AI), machine learning (ML), and the Internet of Things (IoT). However, intricate design requirements and interoperability obstacles pose significant challenges for the global chiplet market. Refining the chiplet design process, investigating new applications, and inventing new packaging techniques for chiplets offer immense potential for innovation and growth for the chiplet market.
KEY MARKET STATISTICS | |
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Base Year [2023] | USD 9.75 billion |
Estimated Year [2024] | USD 12.84 billion |
Forecast Year [2030] | USD 83.62 billion |
CAGR (%) | 35.91% |
Processor: Growing deployment of FPGAs offering hardware customization with integrated AI
The APU, also known as an accelerated processing unit, is a chip that integrates both a central processing unit (CPU) and graphic processing unit (GPU) on one piece of silicon, efficiently balancing graphic and numeric intensive tasks. The need-based preference for an APU is often seen in small form-factor systems, single-board computers, and portable devices where power efficiency and compactness are paramount. The AI ASIC Compressor is a custom chip designed specifically for AI workloads. These dedicated chips accelerate AI applications by enabling high-performance calculations with reduced power consumption. This chiplet solution is preferred where AI is heavily integrated, such as in cloud servers, machine learning systems, and robotics. The central processing unit is a primary component of a computer that performs the majority of processing inside the computer. CPUs are highly versatile and can manage a wide variety of workloads. The need-based preference for CPUs is seen most generically in everyday computer systems, laptops, server environments, and data centers. FPGA is a semiconductor device that has programmable logic components and interconnects. FPGAs have a need-based preference in prototyping, radar and image processing, software-defined radios, encryption, signal processing, and more. GPU is designed to handle graphics rendering tasks with proficiency and is heavily used in gaming, video editing, animation, 3D rendering, and, more recently, machine learning tasks.
Packaging Technology: Higher adoption of flip chip ball grid array technology for lower parasitic inductance and capacitance for superior electrical performance
End-use: Emerging potential of chiplets in consumer electronics with a trend of miniaturizing devices
In the automotive sector, chiplets are heavily favored for their role in advanced driver-assistance systems (ADAS) and electric vehicles (EVs) due to their energy efficiency and high performance. Chiplets are crucial in consumer electronics, smartphones, smart TVs, laptops, and other devices. The need-based preference for chiplets here revolves around their ability to enhance performance while reducing product size in the electronics industry. In defense and aerospace, chiplets facilitate the development of advanced radar systems, spacecraft, and military-grade equipment. The defense & aerospace sector prefers chiplets with superior performance, durability, and energy efficiency. Within the healthcare sector, chiplets are used in medical imaging devices, wearable health monitors, and other equipment. Chiplets are preferred here for their high reliability, low power consumption, and compact size. In manufacturing, chiplets are incorporated for automation and robotics applications. The preference for chiplets in this sector is influenced by their ability to augment efficiency in production. The telecommunication industry leverages chiplets for its vast network infrastructure, providing a solid backbone for 5G and beyond. The preference for chiplets in telecommunication is attributed to their capabilities to handle high data volumes and low latency.
Regional Insights
In the Americas, especially the United States and Canada, the demand for chiplets is predominantly driven by the growth in high technology and cloud applications. Consumer trends show an escalating preference for hybrid computing platforms and small electronic products, accelerating the demand for the Americas' chiplet market. The market of chiplets in Europe is expanding dynamically, driven by major vendors from different European Union countries. A recent German consortium to secure the supply chain for chiplets and boost final assembly in Europe has been creating potential demand for the chiplet market across the region. The Middle East and Africa's chiplet market showcases great potential attributed to initiatives for fostering local chiplet production and improving technological self-sufficiency. The APAC region, with major technologically advanced countries, such as Japan, China, and South Korea, and predominant semiconductor manufacturers, presents lucrative opportunities for the global chiplet market. The expansion of the chiplet market in the APAC region is driven by a substantial surge in government and private investments in electronic manufacturing.
FPNV Positioning Matrix
The FPNV Positioning Matrix is pivotal in evaluating the Chiplet Market. It offers a comprehensive assessment of vendors, examining key metrics related to Business Strategy and Product Satisfaction. This in-depth analysis empowers users to make well-informed decisions aligned with their requirements. Based on the evaluation, the vendors are then categorized into four distinct quadrants representing varying levels of success: Forefront (F), Pathfinder (P), Niche (N), or Vital (V).
Market Share Analysis
The Market Share Analysis is a comprehensive tool that provides an insightful and in-depth examination of the current state of vendors in the Chiplet Market. By meticulously comparing and analyzing vendor contributions in terms of overall revenue, customer base, and other key metrics, we can offer companies a greater understanding of their performance and the challenges they face when competing for market share. Additionally, this analysis provides valuable insights into the competitive nature of the sector, including factors such as accumulation, fragmentation dominance, and amalgamation traits observed over the base year period studied. With this expanded level of detail, vendors can make more informed decisions and devise effective strategies to gain a competitive edge in the market.
Key Company Profiles
The report delves into recent significant developments in the Chiplet Market, highlighting leading vendors and their innovative profiles. These include Achronix Semiconductor Corporation, Advanced Micro Devices, Inc., Alphawave Semi, Ambarella, Inc., Apple Inc., ASE Technology Holding Co, Ltd, Ayar Labs, Inc., Beijing ESWIN Technology Group Co., Ltd., Broadcom Inc., Cadence Design Systems, Inc., CHIPLET.US, Chipuller, Eliyan, GlobalFoundries Inc., Huawei Technologies Co., Ltd., Intel Corporation, International Business Machines Corporation, JCET Group, Kandou Bus, S.A., Marvell Technology, Inc., MediaTek Inc., Mercury Systems, Inc., Netronome Systems, Inc., NHanced Semiconductors, Inc., NVIDIA Corporation, NXP Semiconductors N.V., Palo Alto Electron, Inc., Qualcomm Incorporated, RANVOUS Inc., Samsung Electronics Co., Ltd., Socionext Inc., STMicroelectronics N.V., Synopsys, Inc., Tachyum, Taiwan Semiconductor Manufacturing Company Limited, Tenstorrent Inc., TongFu Microelectronics Co., Ltd., and X-Celeprint.
Market Segmentation & Coverage
1. Market Penetration: It presents comprehensive information on the market provided by key players.
2. Market Development: It delves deep into lucrative emerging markets and analyzes the penetration across mature market segments.
3. Market Diversification: It provides detailed information on new product launches, untapped geographic regions, recent developments, and investments.
4. Competitive Assessment & Intelligence: It conducts an exhaustive assessment of market shares, strategies, products, certifications, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players.
5. Product Development & Innovation: It offers intelligent insights on future technologies, R&D activities, and breakthrough product developments.
1. What is the market size and forecast of the Chiplet Market?
2. Which products, segments, applications, and areas should one consider investing in over the forecast period in the Chiplet Market?
3. What are the technology trends and regulatory frameworks in the Chiplet Market?
4. What is the market share of the leading vendors in the Chiplet Market?
5. Which modes and strategic moves are suitable for entering the Chiplet Market?