市场调查报告书
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1466275
相机模组市场:按製程、组件、介面、像素、应用划分 - 2024-2030 年全球预测Camera Module Market by Process (Chip-On-Board (COB) Camera Module, Flip-Chip Camera Module), Component (Digital Signal Processing, Image Sensor, Infrared Filter), Interface, Pixel, Application - Global Forecast 2024-2030 |
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预计2023年相机模组市场规模为363亿美元,预计2024年将达390亿美元,2030年将达604.4亿美元,复合年增长率为7.55%。
全球相机模组市场正在响应家用电子电器和工业应用中对高品质成像和感测解决方案日益增长的需求。这些模组包括影像感测器、镜头组件、音圈马达、红外线截止滤光片以及捕捉高解析度影像和影片的印刷电路基板。日益严重的安全问题和智慧型手机技术的快速发展正在推动对先进监控系统和高品质摄影机的需求。此外,汽车行业越来越多地采用 ADAS(高级驾驶员辅助系统),这需要高效的相机模组功能。与相机模组生产相关的高成本以及与相机模组相关的品质问题阻碍了市场的成长。智慧城市对视讯监控的需求、3D 深度感测技术的进步以及对可穿戴和物联网应用相机模组小型化的日益关注预计将创造市场机会。
主要市场统计 | |
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基准年[2023] | 363亿美元 |
预测年份 [2024] | 390亿美元 |
预测年份 [2030] | 604.4亿美元 |
复合年增长率(%) | 7.55% |
小型製程设备中板载晶片(COB)相机模组的普及
板载晶片(COB) 和覆晶技术为相机模组产业的某些应用提供了独特的优势。板载晶片(COB) 模组为空间受限的便携式设备提供了小型轻量的解决方案。此技术可确保更快的资料传输、更好的热性能以及因减少讯号干扰而提高的影像品质。覆晶相机模组采用一种称为覆晶接合的先进封装技术,该技术将影像晶粒晶片直接连接到印刷电路基板(PCB),而无需使用打线接合。其结果是比传统 COB 设计更矮,组件之间的电气途径更短,从而实现更快的资料传输和更低的讯号杂讯。选择 COB 或覆晶相机模组取决于设备尺寸限制、所需的影像品质、资料传输速率、功耗要求和成本考虑因素。
组成部分:由于对高解析度影像的需求不断增加,影像感测器快速增长
相机模组市场的高品质影像和视讯製作依赖数位讯号处理 (DSP)、影像感测器、红外线滤光片、镜头、软板和印刷电路基板(PCB) 等组件。数位讯号处理 (DSP) 可增强原始影像资料,以确保清晰的影像和准确的色彩再现,并支援降噪和镜头失真校正等关键功能。影像感测器将光转换为电子讯号,在决定相机模组的影像品质方面发挥重要作用。红外线滤光片可去除不必要的红外线辐射,这些辐射可能会导致户外应用中的颜色失真。非球面镜头因其紧凑的设计和减少球面像差的能力而受到欢迎。软基板和 PCB 产业对高密度互连 (HDI)基板的需求量很大,以支援相机模组市场的小型化趋势。了解相机模组中每个组件的重要性可以根据特定应用需求选择最佳解决方案,同时鼓励业界不断创新以突破相机模组技术的界限。
介面相机串列介面(CSI) 的需求量很大,因为它适用于行动装置、物联网设备和其他小型应用。
相机并行介面 (CPI) 和相机串列介面(CSI) 是将相机模组连接到主机设备的两种不同方式。相机并行介面 (CPI) 是一种较古老、更传统的方法,它使用多条资料线进行高速并行通讯,非常适合工业视觉系统和高速视讯处理等高频宽、低延迟应用。相机串列介面 (CSI) 使用差分讯号透过更少的讯号线串列传输影像资料,从而减少电磁干扰 (EMI)、提高抗杂讯并延长电缆长度。受益于 CSI 的应用包括智慧型手机、平板电脑、无人机和物联网设备,在这些设备中,更小的外形尺寸和更低的功耗至关重要。 CPI 和 CSI 之间的选择取决于您的特定应用要求。 CPI 适用于需要最小延迟的高频宽应用,而降低的功耗、紧凑的设计和卓越的 EMI 性能使 CSI 适用于电源资源有限的小型设备。
应用:智慧型手机、平板电脑和个人电脑中相机模组的使用越来越多。
相机模组是汽车、消费性电子、国防、工业、医疗和个人电脑设备等多个领域的重要组件。在汽车产业,ADAS(高级驾驶辅助系统)、后视摄影机、自动驾驶汽车等功能都依赖相机模组。在消费性电子市场,数位相机、运动摄影机、无人机、 VR头戴装置等都需要高品质的相机模组。在国防和航太领域,相机模组对于监视系统、侦察无人机/无人机、卫星成像系统等至关重要。在工业中,相机模组用于机器视觉系统的自动化机器人。在医疗领域,需要用于内视镜、显微镜和诊断设备等眼科设备的专用相机模组。相机模组是智慧型手机、平板电脑和个人电脑拍照和视讯通话的必备组件。
区域洞察
在美洲地区,相机模组的需求主要由智慧型手机、整合ADAS(高级驾驶辅助系统)的汽车应用、安全和监控系统以及消费性电子产品等关键产业推动。在美国和加拿大,消费者在购买相机模组时优先考虑高品质的影像捕捉和录影功能。在EMEA(欧洲、中东和非洲)地区,由于智慧型手机普及的不断提高和汽车工业的扩张,对相机模组的需求正在稳步增长。特别是在欧洲,我们致力于推出严格的法规,要求车辆配备 ADAS,从而推动汽车产业对先进相机模组的需求。在中东和非洲,某些地区的地缘政治不稳定增加了安全疑虑和对有效监控系统的需求。由于快速的都市化、可支配收入的增加推动消费者对智慧型手机和数位相机等电子设备的支出,以及强劲的工业成长推动汽车生产,亚太地区在相机模组的需求方面拥有全球最大的市场占有率。
FPNV定位矩阵
FPNV定位矩阵对于评估相机模组市场至关重要。我们检视与业务策略和产品满意度相关的关键指标,以对供应商进行全面评估。这种深入的分析使用户能够根据自己的要求做出明智的决策。根据评估,供应商被分为四个成功程度不同的像限:前沿(F)、探路者(P)、利基(N)和重要(V)。
市场占有率分析
市场占有率分析是一个综合工具,可以对相机模组市场供应商的现状进行深入而详细的研究。全面比较和分析供应商在整体收益、基本客群和其他关键指标方面的贡献,以便更好地了解公司的绩效及其在争夺市场占有率时面临的挑战。此外,该分析还提供了对该行业竞争特征的宝贵见解,包括在研究基准年观察到的累积、分散主导地位和合併特征等因素。详细程度的提高使供应商能够做出更明智的决策并制定有效的策略,以获得市场竞争优势。
1. 市场渗透率:提供有关主要企业所服务的市场的全面资讯。
2. 市场开拓:我们深入研究利润丰厚的新兴市场,并分析其在成熟细分市场的渗透率。
3. 市场多元化:提供有关新产品发布、开拓地区、最新发展和投资的详细资讯。
4. 竞争评估和情报:对主要企业的市场占有率、策略、产品、认证、监管状况、专利状况和製造能力进行全面评估。
5. 产品开发与创新:提供对未来技术、研发活动和突破性产品开发的见解。
1.相机模组市场规模及预测如何?
2.在相机模组市场预测期间内,有哪些产品、细分市场、应用和领域值得考虑投资?
3.相机模组市场的技术趋势和法规结构是什么?
4.相机模组市场主要厂商的市场占有率是多少?
5.进入相机模组市场合适的型态和策略手段是什么?
[197 Pages Report] The Camera Module Market size was estimated at USD 36.30 billion in 2023 and expected to reach USD 39.00 billion in 2024, at a CAGR 7.55% to reach USD 60.44 billion by 2030.
The global camera module market caters to the increasing demand for high-quality imaging and sensing solutions in consumer electronics and industrial applications. These modules include image sensors, lens assemblies, voice coil motors, infrared cut filters, and printed circuit boards that capture high-resolution images and videos. Growing security concerns and rapid smartphone technology advancements propel the need for advanced surveillance systems and higher-quality cameras. In addition, the increasing adoption of advanced driver-assistance systems (ADAS) in the automotive industry requires efficient camera modules for functions, heightening the market growth. High costs associated with the production of camera modules and Quality issues related to the camera module hamper the market growth. The introduction of smart cities resulting in the need for video surveillance, advancement in 3D depth-sensing technologies, and growing focus on miniaturizing camera modules for wearables and IoT applications are expected to create opportunities in the market.
KEY MARKET STATISTICS | |
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Base Year [2023] | USD 36.30 billion |
Estimated Year [2024] | USD 39.00 billion |
Forecast Year [2030] | USD 60.44 billion |
CAGR (%) | 7.55% |
Process: Proliferation of chip-on-board (COB) camera modules for compact devices
Chip-on-board (COB) and flip-chip technologies offer distinct advantages for specific applications in the camera module industry. Chip-on-board (COB) modules provide compact and lightweight solutions suitable for portable devices with space constraints. This technology ensures high-speed data transfer, better thermal performance, and enhanced image quality due to reduced signal interference. Flip-chip camera modules employ an advanced packaging technique called flip-chip bonding that connects the image sensor die directly to the printed circuit board (PCB) without utilizing wire bonds. This results in slimmer profiles compared to traditional COB designs, enabling faster data transmission and lower signal noise due to shorter electrical paths between components. The choice between COB or Flip-Chip camera modules depends on device size constraints, desired image quality, data transfer speeds, power consumption requirements, and cost considerations.
Component: Rapid growth for image sensors due to rising demand for high-resolution images
High-quality image and video production in the camera module market relies on components including digital signal processing (DSP), image sensor, infrared filter, lens, and soft board or printed circuit board (PCB). Digital signal processing (DSP) enhances raw image data to ensure clear images with accurate color reproduction and support essential features such as noise reduction and lens distortion correction. The image sensor transforms light into electronic signals and recreates a vital role in determining the image quality a camera module produces. Infrared filters eliminate unwanted infrared light that can cause color distortion in outdoor applications. Aspheric lenses have gained popularity due to their ability to reduce spherical aberrations while maintaining a compact design. High-density interconnect (HDI) boards are increasingly in demand in the soft board or PCB industry to support miniaturization trends within the camera module market. Understanding the importance of each component within camera modules enables the selection of optimal solutions based on specific application requirements while fostering constant innovation in the industry to push the boundaries of camera module technology.
Interface: Growing demand for camera serial interface (CSI) as they are more suitable for mobile devices, IoT gadgets, and other small form-factor applications
The camera parallel interface (CPI) and camera serial interface (CSI) are two distinct methods for connecting camera modules to host devices. Camera parallel interface (CPI), an older and more traditional approach, utilizes multiple data lines for high-speed parallel communication, making it ideal for high bandwidth and low latency applications, such as industrial vision systems and high-speed video processing. Camera serial interface (CSI) uses a differential signaling scheme to transmit image data serially over fewer signal lines, which results in reduced electromagnetic interference (EMI), improved noise immunity, and longer cable lengths. Applications that benefit from CSI include smartphones, tablets, drones, and IoT devices, where smaller form factors and reduced power consumption are essential. The preference between CPI and CSI depends on the specific application requirements. While CPI may be preferred for high-bandwidth applications with minimal latency needs, reduced power consumption, compact design, and better EMI performance make CSI more fitting for smaller devices with limited power resources.
Application: Growing use of camera modules in smartphones, tablets, and PCs due to high consumer demand for high-quality photography and integration with various applications
Camera modules are vital components in various sectors, including automotive, consumer electronics, defense, industrial, medical, and personal computing devices. In the automotive industry, advanced driver assistance systems (ADAS), rearview cameras, and autonomous vehicles rely on camera modules for functions, including lane departure warnings and parking assistance. The consumer electronics market demands high-quality camera modules for digital cameras, action cameras, drones, and VR headsets. In defense and space applications, camera modules are essential for surveillance systems, reconnaissance drones/UAVs (Unmanned Aerial Vehicles), and satellite imaging systems, among others. The industrial sector utilizes camera modules in machine vision systems automation robotics. Medical applications require specialized camera modules for endoscopy microscopy ophthalmology devices, among other purposes, such as diagnostics equipment. Camera modules are indispensable components of smartphones, tablets, and PCs for capturing photographs and facilitating video calls.
Regional Insights
In the Americas region, the demand for camera modules is primarily driven by key industries such as smartphones, automotive applications integrating Advanced Driver Assistance Systems (ADAS), security and surveillance systems, and consumer electronics. In the United States and Canada, consumers prioritize high-quality image capture and video recording capabilities when purchasing camera modules. The EMEA region represents steady growth in demand for camera modules due to rising smartphone adoption rates and the expanding automotive sector. Europe, in particular, has been focusing on implementing stringent regulations mandating the use of ADAS features in vehicles, consequently driving the demand for advanced camera modules within the automotive industry. The Middle East and Africa have witnessed increased security concerns and the need for effective surveillance systems due to geopolitical instability in certain regions. The APAC region exhibits the largest market share globally regarding camera module demand attributed to rapid urbanization, increasing disposable income levels driving consumer spending on electronic devices such as smartphones and digital cameras, and strong industrial growth propelling automotive production.
FPNV Positioning Matrix
The FPNV Positioning Matrix is pivotal in evaluating the Camera Module Market. It offers a comprehensive assessment of vendors, examining key metrics related to Business Strategy and Product Satisfaction. This in-depth analysis empowers users to make well-informed decisions aligned with their requirements. Based on the evaluation, the vendors are then categorized into four distinct quadrants representing varying levels of success: Forefront (F), Pathfinder (P), Niche (N), or Vital (V).
Market Share Analysis
The Market Share Analysis is a comprehensive tool that provides an insightful and in-depth examination of the current state of vendors in the Camera Module Market. By meticulously comparing and analyzing vendor contributions in terms of overall revenue, customer base, and other key metrics, we can offer companies a greater understanding of their performance and the challenges they face when competing for market share. Additionally, this analysis provides valuable insights into the competitive nature of the sector, including factors such as accumulation, fragmentation dominance, and amalgamation traits observed over the base year period studied. With this expanded level of detail, vendors can make more informed decisions and devise effective strategies to gain a competitive edge in the market.
Key Company Profiles
The report delves into recent significant developments in the Camera Module Market, highlighting leading vendors and their innovative profiles. These include ams-OSRAM AG, Chicony Electronics Co., Ltd., Cowell e Holdings Inc., Fujifilm Holdings Corporation, Guangzhou Luxvisions Innovation Technology Limited, Immervision, JENOPTIK AG, KYOCERA Corporation, LG Electronics Inc., LITE-ON Technology Corp., Mcnex Co., Ltd., OmniVision Technologies, Inc., Partron Co., Ltd., Primax Electronics Ltd., Q Technology (Group) Company Limited, Rayprus Holding Ltd., Samsung Electro-Mechanics Co., Ltd., Sharp Group, Shenzhen Castle Light Technology Co., Ltd, Shenzhen ChuangMu Technology Co., Ltd, SK Hynix Inc., Sony Group Corporation, STMicroelectronics N.V., Toshiba Corporation, and Truly International Holdings Ltd..
Market Segmentation & Coverage
1. Market Penetration: It presents comprehensive information on the market provided by key players.
2. Market Development: It delves deep into lucrative emerging markets and analyzes the penetration across mature market segments.
3. Market Diversification: It provides detailed information on new product launches, untapped geographic regions, recent developments, and investments.
4. Competitive Assessment & Intelligence: It conducts an exhaustive assessment of market shares, strategies, products, certifications, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players.
5. Product Development & Innovation: It offers intelligent insights on future technologies, R&D activities, and breakthrough product developments.
1. What is the market size and forecast of the Camera Module Market?
2. Which products, segments, applications, and areas should one consider investing in over the forecast period in the Camera Module Market?
3. What are the technology trends and regulatory frameworks in the Camera Module Market?
4. What is the market share of the leading vendors in the Camera Module Market?
5. Which modes and strategic moves are suitable for entering the Camera Module Market?