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市场调查报告书
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1611872

晶圆级製造设备市场：按类型、应用分类 - 2025-2030 年全球预测

Wafer-level Manufacturing Equipment Market by Type (Assembly Equipment, Wafer Fab Equipment, Wafer-Level Packaging), Applications (Foundry, Integrated Device Manufacturer, Memory) - Global Forecast 2025-2030
出版日期: | 出版商: 360iResearch | 英文 181 Pages | 商品交期: 最快1-2个工作天内

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2023年晶圆级製造设备市值为96.8亿美元，预计2024年将达到105.3亿美元，复合年增长率为8.35%，到2030年将达到169.9亿美元。

晶圆级製造设备对于半导体、积体电路和微电子的生产至关重要，涵盖蚀刻、沉淀、微影术和清洗等多种製程。各种应用（包括我正在应用的通讯、汽车、家用电子电器和工业领域）对更小、更有效率、更具成本效益的电子设备的需求不断增长，推动了对先进製造设备的需求。晶圆级加工可实现高精度和可扩展性，使其应用对于生产高性能零件至关重要，特别是当产业转向物联网和 5G 技术时。由于半导体製造技术的进步、消费性电子产品製造的增加以及人工智慧和连网型设备的日益采用，该市场正在经历强劲增长。

主要市场统计
基准年[2023] 96.8亿美元
预计年份 [2024] 105.3亿美元
预测年份 [2030] 169.9亿美元
复合年增长率（%） 8.35%

关键的成长要素包括技术的快速发展和工厂扩张投资的增加，特别是在作为大规模生产和消费中心的亚太地区。增强的人工智慧功能、边缘运算和需要复杂半导体元件的智慧型设备等新兴趋势带来了潜在的机会。为了抓住这些机会，企业应专注于精密製造、削减成本技术和向开拓地区扩张的创新。儘管成长强劲，市场仍面临资本支出高、与现有技术整合的复杂性以及最终用途产业需求不稳定等挑战。

创新领域包括开发更通用的设备以适应各种晶圆尺寸和物料输送、提高能源效率以及提高自动化程度以提高产量并降低营运成本。也鼓励市场相关人员探索合作和策略伙伴关係，以促进技术进步和增强竞争力。了解半导体市场的周期性特征（以供应链限制和技术趋势快速变化为特征）对于策略规划和永续成长至关重要。透过适应性策略和研发投资来应对这些挑战，可以确保在不断变化的环境中保持弹性并获得市场占有率。

市场动态：快速发展的晶圆级製造设备市场的关键市场洞察

晶圆级製造设备市场正因供需的动态交互作用而转变。透过了解这些不断变化的市场动态，公司可以准备好做出明智的投资决策、完善策略决策并抓住新的商机。全面了解这些趋势可以帮助企业降低政治、地理、技术、社会和经济领域的风险，同时消费行为及其对製造成本的影响以及对采购趋势的影响。

  • 市场驱动因素
    • 扩大电子设备和电动车製造的半导体消费
    • 扩大晶圆级技术在行动、物联网和穿戴式创新领域的应用
    • 製造商努力使设备小型化
  • 市场限制因素
    • 安装维护晶圆製造设备的成本高
  • 市场机会
    • 3D技术在晶圆製造的集成
    • 投资改善扩大晶圆半导体製造
  • 市场挑战
    • 半导体製造的环境问题和严格的製造标准

波特五力：驾驭晶圆级製造设备市场的策略工具

波特的五力框架是了解市场竞争格局的重要工具。波特的五力框架为评估公司的竞争地位和探索策略机会提供了清晰的方法。该框架可帮助公司评估市场动态并确定新业务的盈利。这些见解使公司能够利用自己的优势，解决弱点并避免潜在的挑战，从而确保更强大的市场地位。

PESTLE分析：了解外部对晶圆级製造设备市场的影响

外部宏观环境因素对晶圆级製造设备市场的表现动态起着至关重要的作用。对政治、经济、社会、技术、法律和环境因素的分析提供了应对这些影响所需的资讯。透过调查 PESTLE 因素，公司可以更了解潜在的风险和机会。这种分析可以帮助公司预测法规、消费者偏好和经济趋势的变化，并为他们做出积极主动的决策做好准备。

市场占有率分析 了解晶圆级製造设备市场的竞争状况

晶圆级製造设备市场的详细市场占有率分析可以对供应商绩效进行全面评估。公司可以透过比较收益、客户群和成长率等关键指标来揭示其竞争地位。该分析揭示了市场集中、分散和整合的趋势，为供应商提供了製定策略决策所需的洞察力，使他们能够在日益激烈的竞争中占有一席之地。

FPNV定位矩阵晶圆级製造设备市场厂商绩效评估

FPNV定位矩阵是评估晶圆级製造设备市场供应商的重要工具。此矩阵允许业务组织根据商务策略和产品满意度评估供应商，从而做出与其目标相符的明智决策。这四个象限使您能够清晰、准确地划分供应商，并确定最能满足您的策略目标的合作伙伴和解决方案。

策略分析和建议描绘了晶圆级製造设备市场的成功之路

对于旨在加强其在全球市场的影响力的公司来说，晶圆级製造设备市场的策略分析至关重要。透过审查关键资源、能力和绩效指标，公司可以识别成长机会并努力改进。这种方法使您能够克服竞争环境中的挑战，利用新的商机并取得长期成功。

本报告对市场进行了全面分析，涵盖关键重点领域：

1. 市场渗透率：对当前市场环境的详细审查、主要企业的广泛资料、对其在市场中的影响力和整体影响力的评估。

2. 市场开拓：辨识新兴市场的成长机会，评估现有领域的扩张潜力，并提供未来成长的策略蓝图。

3. 市场多元化：分析近期产品发布、开拓地区、关键产业进展、塑造市场的策略投资。

4. 竞争评估与情报：彻底分析竞争格局，检验市场占有率、业务策略、产品系列、认证、监理核准、专利趋势、主要企业的技术进步等。

5. 产品开发与创新：重点在于有望推动未来市场成长的最尖端科技、研发活动和产品创新。

我们也回答重要问题，以帮助相关人员做出明智的决策：

1.目前的市场规模和未来的成长预测是多少？

2. 哪些产品、区隔市场和地区提供最佳投资机会？

3.塑造市场的主要技术趋势和监管影响是什么？

4.主要厂商的市场占有率和竞争地位如何？

5. 推动供应商市场进入和退出策略的收益来源和策略机会是什么？

目录

第一章 前言

第二章调查方法

第三章执行摘要

第四章市场概况

第五章市场洞察

  • 市场动态
    • 促进因素
      • 电子设备和电动车製造的半导体消费量增加
      • 扩大晶圆级技术在行动、物联网和穿戴式创新的应用
      • 製造商为设备小型化所做的努力
    • 抑制因素
      • 安装和维护晶圆製造设备的成本很高。
    • 机会
      • 将 3D 技术整合到晶圆级製造中
      • 投资改善扩大晶圆半导体製造
    • 任务
      • 半导体製造的环境问题和严格的製造标准
  • 市场区隔分析
  • 波特五力分析
  • PESTEL分析
    • 政治的
    • 经济
    • 社群
    • 技术的
    • 合法地
    • 环境

第六章晶圆级製造设备市场：依类型

  • 组装设备
  • 晶圆製造设备
  • 晶圆级封装

第七章晶圆级製造设备市场：依应用分类

  • 铸造厂
  • 整合设备製造商
  • 记忆

第八章北美和南美晶圆级製造设备市场

  • 阿根廷
  • 巴西
  • 加拿大
  • 墨西哥
  • 美国

第九章亚太地区晶圆级製造设备市场

  • 澳洲
  • 中国
  • 印度
  • 印尼
  • 日本
  • 马来西亚
  • 菲律宾
  • 新加坡
  • 韩国
  • 台湾
  • 泰国
  • 越南

第十章 欧洲、中东、非洲晶圆级製造设备市场

  • 丹麦
  • 埃及
  • 芬兰
  • 法国
  • 德国
  • 以色列
  • 义大利
  • 荷兰
  • 奈及利亚
  • 挪威
  • 波兰
  • 卡达
  • 俄罗斯
  • 沙乌地阿拉伯
  • 南非
  • 西班牙
  • 瑞典
  • 瑞士
  • 土耳其
  • 阿拉伯聯合大公国
  • 英国

第十一章竞争格局

  • 2023 年市场占有率分析
  • FPNV 定位矩阵，2023
  • 竞争情境分析
  • 战略分析和建议

公司名单

  • Advanced Dicing Technologies Ltd.
  • Applied Materials, Inc.
  • ASML Holding NV
  • BE Semiconductor Industries NV
  • Canon Inc.
  • DISCO Corp.
  • EV Group
  • Ferrotec Holdings Corporation
  • Hitachi, Ltd.
  • Intel Corporation
  • JEOL Ltd
  • KLA Corporation
  • Kulicke and Soffa Industries Inc
  • Lam Research Corporation
  • Modutek Corporation
  • Nikon Corporation
  • Nissin Ion Equipment Co., Ltd.
  • Nordson Corporation
  • Onto Innovation Inc.
  • PI（Physik Instrumente）LP
  • Plasma-Therm, LLC
  • Screen Holdings Co. Ltd
  • Sumitomo Precision Products Co., Ltd
  • Tokyo Seimitsu Co., Ltd.
  • ULVAC, Inc
  • Veeco Instruments Inc.
Product Code: MRR-B1685377916C

The Wafer-level Manufacturing Equipment Market was valued at USD 9.68 billion in 2023, expected to reach USD 10.53 billion in 2024, and is projected to grow at a CAGR of 8.35%, to USD 16.99 billion by 2030.

Wafer-level manufacturing equipment is crucial in the production of semiconductors, integrated circuits, and microelectronics, encompassing a range of processes such as etching, deposition, lithography, and cleaning. The necessity for advanced manufacturing equipment is spurred by the escalating demand for smaller, more efficient, and cost-effective electronic devices across various applications, including telecommunications, automotive, consumer electronics, and industrial sectors. As wafer-level processing enables high precision and scalability, its application is vital in producing high-performance components, particularly as industries transition towards IoT and 5G technologies. This market experiences robust growth driven by technological advancements in semiconductor fabrication, increased consumer electronics manufacturing, and the rising proliferation of artificial intelligence and connected devices.

KEY MARKET STATISTICS
Base Year [2023] USD 9.68 billion
Estimated Year [2024] USD 10.53 billion
Forecast Year [2030] USD 16.99 billion
CAGR (%) 8.35%

Key growth influencers include the rapid pace of technological evolution and increasing investment in fab expansion, especially within Asia-Pacific regions, which serve as both massive production and consumption hubs. Potential opportunities arise from emerging trends like augmenting AI capabilities, edge computing, and smart devices, which require sophisticated and refined semiconductor components. To seize these opportunities, firms should focus on innovation in precision manufacturing, cost-reduction techniques, and expansion into untapped geographies. Despite this dynamic growth, the market faces challenges including high capital expenditure, the complexity of integration with existing technologies, and volatile demand from end-use sectors.

Innovation areas encompass the development of versatile equipment capable of handling diverse wafer sizes and materials, improving energy efficiency, and enhancing automation for higher throughput and reduced operational costs. Market players are also encouraged to explore collaborations and strategic partnerships that foster technological advancements and provide competitive leverage. Understanding the cyclical nature of the semiconductor market, characterized by supply chain constraints and rapid shifts in technology trends, is vital for strategic planning and sustained growth. Addressing these challenges with adaptive strategies and investment in R&D could ensure resilience and capture market share in the evolving landscape.

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving Wafer-level Manufacturing Equipment Market

The Wafer-level Manufacturing Equipment Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

  • Market Drivers
    • Growing consumption of semiconductors for electronic and EV manufacturing
    • Expanding use in Mobile, IoT and Wearable innovations through wafer-level technologies
    • Manufacturers efforts to achieve miniaturization of devices
  • Market Restraints
    • High cost of installation and maintenance of wafer manufacturing facilities
  • Market Opportunities
    • Integration of 3D technology in wafer-level manufacturing
    • Investment to improve and expand wafer semiconductor manufacturing
  • Market Challenges
    • Environmental concerns of semiconductor manufacturing and stringent fabrication standards

Porter's Five Forces: A Strategic Tool for Navigating the Wafer-level Manufacturing Equipment Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the Wafer-level Manufacturing Equipment Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the Wafer-level Manufacturing Equipment Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the Wafer-level Manufacturing Equipment Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the Wafer-level Manufacturing Equipment Market

A detailed market share analysis in the Wafer-level Manufacturing Equipment Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the Wafer-level Manufacturing Equipment Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the Wafer-level Manufacturing Equipment Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Strategy Analysis & Recommendation: Charting a Path to Success in the Wafer-level Manufacturing Equipment Market

A strategic analysis of the Wafer-level Manufacturing Equipment Market is essential for businesses looking to strengthen their global market presence. By reviewing key resources, capabilities, and performance indicators, business organizations can identify growth opportunities and work toward improvement. This approach helps businesses navigate challenges in the competitive landscape and ensures they are well-positioned to capitalize on newer opportunities and drive long-term success.

Key Company Profiles

The report delves into recent significant developments in the Wafer-level Manufacturing Equipment Market, highlighting leading vendors and their innovative profiles. These include Advanced Dicing Technologies Ltd., Applied Materials, Inc., ASML Holding N.V., BE Semiconductor Industries NV, Canon Inc., DISCO Corp., EV Group, Ferrotec Holdings Corporation, Hitachi, Ltd., Intel Corporation, JEOL Ltd, KLA Corporation, Kulicke and Soffa Industries Inc, Lam Research Corporation, Modutek Corporation, Nikon Corporation, Nissin Ion Equipment Co., Ltd., Nordson Corporation, Onto Innovation Inc., PI (Physik Instrumente) L.P., Plasma-Therm, LLC, Screen Holdings Co. Ltd, Sumitomo Precision Products Co., Ltd, Tokyo Seimitsu Co., Ltd., ULVAC, Inc, and Veeco Instruments Inc..

Market Segmentation & Coverage

This research report categorizes the Wafer-level Manufacturing Equipment Market to forecast the revenues and analyze trends in each of the following sub-markets:

  • Based on Type, market is studied across Assembly Equipment, Wafer Fab Equipment, and Wafer-Level Packaging.
  • Based on Applications, market is studied across Foundry, Integrated Device Manufacturer, and Memory.
  • Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

  • 5.1. Market Dynamics
    • 5.1.1. Drivers
      • 5.1.1.1. Growing consumption of semiconductors for electronic and EV manufacturing
      • 5.1.1.2. Expanding use in Mobile, IoT and Wearable innovations through wafer-level technologies
      • 5.1.1.3. Manufacturers efforts to achieve miniaturization of devices
    • 5.1.2. Restraints
      • 5.1.2.1. High cost of installation and maintenance of wafer manufacturing facilities
    • 5.1.3. Opportunities
      • 5.1.3.1. Integration of 3D technology in wafer-level manufacturing
      • 5.1.3.2. Investment to improve and expand wafer semiconductor manufacturing
    • 5.1.4. Challenges
      • 5.1.4.1. Environmental concerns of semiconductor manufacturing and stringent fabrication standards
  • 5.2. Market Segmentation Analysis
  • 5.3. Porter's Five Forces Analysis
    • 5.3.1. Threat of New Entrants
    • 5.3.2. Threat of Substitutes
    • 5.3.3. Bargaining Power of Customers
    • 5.3.4. Bargaining Power of Suppliers
    • 5.3.5. Industry Rivalry
  • 5.4. PESTLE Analysis
    • 5.4.1. Political
    • 5.4.2. Economic
    • 5.4.3. Social
    • 5.4.4. Technological
    • 5.4.5. Legal
    • 5.4.6. Environmental

6. Wafer-level Manufacturing Equipment Market, by Type

  • 6.1. Introduction
  • 6.2. Assembly Equipment
  • 6.3. Wafer Fab Equipment
  • 6.4. Wafer-Level Packaging

7. Wafer-level Manufacturing Equipment Market, by Applications

  • 7.1. Introduction
  • 7.2. Foundry
  • 7.3. Integrated Device Manufacturer
  • 7.4. Memory

8. Americas Wafer-level Manufacturing Equipment Market

  • 8.1. Introduction
  • 8.2. Argentina
  • 8.3. Brazil
  • 8.4. Canada
  • 8.5. Mexico
  • 8.6. United States

9. Asia-Pacific Wafer-level Manufacturing Equipment Market

  • 9.1. Introduction
  • 9.2. Australia
  • 9.3. China
  • 9.4. India
  • 9.5. Indonesia
  • 9.6. Japan
  • 9.7. Malaysia
  • 9.8. Philippines
  • 9.9. Singapore
  • 9.10. South Korea
  • 9.11. Taiwan
  • 9.12. Thailand
  • 9.13. Vietnam

10. Europe, Middle East & Africa Wafer-level Manufacturing Equipment Market

  • 10.1. Introduction
  • 10.2. Denmark
  • 10.3. Egypt
  • 10.4. Finland
  • 10.5. France
  • 10.6. Germany
  • 10.7. Israel
  • 10.8. Italy
  • 10.9. Netherlands
  • 10.10. Nigeria
  • 10.11. Norway
  • 10.12. Poland
  • 10.13. Qatar
  • 10.14. Russia
  • 10.15. Saudi Arabia
  • 10.16. South Africa
  • 10.17. Spain
  • 10.18. Sweden
  • 10.19. Switzerland
  • 10.20. Turkey
  • 10.21. United Arab Emirates
  • 10.22. United Kingdom

11. Competitive Landscape

  • 11.1. Market Share Analysis, 2023
  • 11.2. FPNV Positioning Matrix, 2023
  • 11.3. Competitive Scenario Analysis
  • 11.4. Strategy Analysis & Recommendation

Companies Mentioned

  • 1. Advanced Dicing Technologies Ltd.
  • 2. Applied Materials, Inc.
  • 3. ASML Holding N.V.
  • 4. BE Semiconductor Industries NV
  • 5. Canon Inc.
  • 6. DISCO Corp.
  • 7. EV Group
  • 8. Ferrotec Holdings Corporation
  • 9. Hitachi, Ltd.
  • 10. Intel Corporation
  • 11. JEOL Ltd
  • 12. KLA Corporation
  • 13. Kulicke and Soffa Industries Inc
  • 14. Lam Research Corporation
  • 15. Modutek Corporation
  • 16. Nikon Corporation
  • 17. Nissin Ion Equipment Co., Ltd.
  • 18. Nordson Corporation
  • 19. Onto Innovation Inc.
  • 20. PI (Physik Instrumente) L.P.
  • 21. Plasma-Therm, LLC
  • 22. Screen Holdings Co. Ltd
  • 23. Sumitomo Precision Products Co., Ltd
  • 24. Tokyo Seimitsu Co., Ltd.
  • 25. ULVAC, Inc
  • 26. Veeco Instruments Inc.

LIST OF FIGURES

  • FIGURE 1. WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET RESEARCH PROCESS
  • FIGURE 2. WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, 2023 VS 2030
  • FIGURE 3. GLOBAL WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, 2018-2030 (USD MILLION)
  • FIGURE 4. GLOBAL WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 5. GLOBAL WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 6. GLOBAL WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY TYPE, 2023 VS 2030 (%)
  • FIGURE 7. GLOBAL WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY TYPE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 8. GLOBAL WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY APPLICATIONS, 2023 VS 2030 (%)
  • FIGURE 9. GLOBAL WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY APPLICATIONS, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 10. AMERICAS WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 11. AMERICAS WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 12. UNITED STATES WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY STATE, 2023 VS 2030 (%)
  • FIGURE 13. UNITED STATES WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 14. ASIA-PACIFIC WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 15. ASIA-PACIFIC WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 16. EUROPE, MIDDLE EAST & AFRICA WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 17. EUROPE, MIDDLE EAST & AFRICA WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 18. WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SHARE, BY KEY PLAYER, 2023
  • FIGURE 19. WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET, FPNV POSITIONING MATRIX, 2023

LIST OF TABLES

  • TABLE 1. WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SEGMENTATION & COVERAGE
  • TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2023
  • TABLE 3. GLOBAL WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, 2018-2030 (USD MILLION)
  • TABLE 4. GLOBAL WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 5. GLOBAL WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 6. WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET DYNAMICS
  • TABLE 7. GLOBAL WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 8. GLOBAL WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY ASSEMBLY EQUIPMENT, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 9. GLOBAL WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY WAFER FAB EQUIPMENT, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 10. GLOBAL WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY WAFER-LEVEL PACKAGING, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 11. GLOBAL WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY APPLICATIONS, 2018-2030 (USD MILLION)
  • TABLE 12. GLOBAL WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY FOUNDRY, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 13. GLOBAL WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY INTEGRATED DEVICE MANUFACTURER, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 14. GLOBAL WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY MEMORY, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 15. AMERICAS WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 16. AMERICAS WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY APPLICATIONS, 2018-2030 (USD MILLION)
  • TABLE 17. AMERICAS WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 18. ARGENTINA WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 19. ARGENTINA WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY APPLICATIONS, 2018-2030 (USD MILLION)
  • TABLE 20. BRAZIL WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 21. BRAZIL WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY APPLICATIONS, 2018-2030 (USD MILLION)
  • TABLE 22. CANADA WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 23. CANADA WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY APPLICATIONS, 2018-2030 (USD MILLION)
  • TABLE 24. MEXICO WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 25. MEXICO WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY APPLICATIONS, 2018-2030 (USD MILLION)
  • TABLE 26. UNITED STATES WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 27. UNITED STATES WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY APPLICATIONS, 2018-2030 (USD MILLION)
  • TABLE 28. UNITED STATES WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY STATE, 2018-2030 (USD MILLION)
  • TABLE 29. ASIA-PACIFIC WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 30. ASIA-PACIFIC WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY APPLICATIONS, 2018-2030 (USD MILLION)
  • TABLE 31. ASIA-PACIFIC WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 32. AUSTRALIA WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 33. AUSTRALIA WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY APPLICATIONS, 2018-2030 (USD MILLION)
  • TABLE 34. CHINA WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 35. CHINA WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY APPLICATIONS, 2018-2030 (USD MILLION)
  • TABLE 36. INDIA WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 37. INDIA WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY APPLICATIONS, 2018-2030 (USD MILLION)
  • TABLE 38. INDONESIA WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 39. INDONESIA WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY APPLICATIONS, 2018-2030 (USD MILLION)
  • TABLE 40. JAPAN WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 41. JAPAN WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY APPLICATIONS, 2018-2030 (USD MILLION)
  • TABLE 42. MALAYSIA WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 43. MALAYSIA WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY APPLICATIONS, 2018-2030 (USD MILLION)
  • TABLE 44. PHILIPPINES WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 45. PHILIPPINES WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY APPLICATIONS, 2018-2030 (USD MILLION)
  • TABLE 46. SINGAPORE WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 47. SINGAPORE WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY APPLICATIONS, 2018-2030 (USD MILLION)
  • TABLE 48. SOUTH KOREA WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 49. SOUTH KOREA WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY APPLICATIONS, 2018-2030 (USD MILLION)
  • TABLE 50. TAIWAN WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 51. TAIWAN WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY APPLICATIONS, 2018-2030 (USD MILLION)
  • TABLE 52. THAILAND WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 53. THAILAND WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY APPLICATIONS, 2018-2030 (USD MILLION)
  • TABLE 54. VIETNAM WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 55. VIETNAM WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY APPLICATIONS, 2018-2030 (USD MILLION)
  • TABLE 56. EUROPE, MIDDLE EAST & AFRICA WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 57. EUROPE, MIDDLE EAST & AFRICA WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY APPLICATIONS, 2018-2030 (USD MILLION)
  • TABLE 58. EUROPE, MIDDLE EAST & AFRICA WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 59. DENMARK WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 60. DENMARK WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY APPLICATIONS, 2018-2030 (USD MILLION)
  • TABLE 61. EGYPT WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 62. EGYPT WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY APPLICATIONS, 2018-2030 (USD MILLION)
  • TABLE 63. FINLAND WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 64. FINLAND WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY APPLICATIONS, 2018-2030 (USD MILLION)
  • TABLE 65. FRANCE WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 66. FRANCE WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY APPLICATIONS, 2018-2030 (USD MILLION)
  • TABLE 67. GERMANY WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 68. GERMANY WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY APPLICATIONS, 2018-2030 (USD MILLION)
  • TABLE 69. ISRAEL WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 70. ISRAEL WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY APPLICATIONS, 2018-2030 (USD MILLION)
  • TABLE 71. ITALY WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 72. ITALY WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY APPLICATIONS, 2018-2030 (USD MILLION)
  • TABLE 73. NETHERLANDS WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 74. NETHERLANDS WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY APPLICATIONS, 2018-2030 (USD MILLION)
  • TABLE 75. NIGERIA WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 76. NIGERIA WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY APPLICATIONS, 2018-2030 (USD MILLION)
  • TABLE 77. NORWAY WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 78. NORWAY WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY APPLICATIONS, 2018-2030 (USD MILLION)
  • TABLE 79. POLAND WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 80. POLAND WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY APPLICATIONS, 2018-2030 (USD MILLION)
  • TABLE 81. QATAR WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 82. QATAR WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY APPLICATIONS, 2018-2030 (USD MILLION)
  • TABLE 83. RUSSIA WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 84. RUSSIA WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY APPLICATIONS, 2018-2030 (USD MILLION)
  • TABLE 85. SAUDI ARABIA WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 86. SAUDI ARABIA WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY APPLICATIONS, 2018-2030 (USD MILLION)
  • TABLE 87. SOUTH AFRICA WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 88. SOUTH AFRICA WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY APPLICATIONS, 2018-2030 (USD MILLION)
  • TABLE 89. SPAIN WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 90. SPAIN WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY APPLICATIONS, 2018-2030 (USD MILLION)
  • TABLE 91. SWEDEN WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 92. SWEDEN WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY APPLICATIONS, 2018-2030 (USD MILLION)
  • TABLE 93. SWITZERLAND WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 94. SWITZERLAND WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY APPLICATIONS, 2018-2030 (USD MILLION)
  • TABLE 95. TURKEY WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 96. TURKEY WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY APPLICATIONS, 2018-2030 (USD MILLION)
  • TABLE 97. UNITED ARAB EMIRATES WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 98. UNITED ARAB EMIRATES WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY APPLICATIONS, 2018-2030 (USD MILLION)
  • TABLE 99. UNITED KINGDOM WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 100. UNITED KINGDOM WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SIZE, BY APPLICATIONS, 2018-2030 (USD MILLION)
  • TABLE 101. WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET SHARE, BY KEY PLAYER, 2023
  • TABLE 102. WAFER-LEVEL MANUFACTURING EQUIPMENT MARKET, FPNV POSITIONING MATRIX, 2023