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市场调查报告书
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1868855

电子封装市场按封装类型、材料类型、封装技术、最终用途和设备类型划分－2025-2032年全球预测

Electronic Packaging Market by Package Type, Material Type, Packaging Technology, End Use, Equipment Type - Global Forecast 2025-2032
出版日期: | 出版商: 360iResearch | 英文 186 Pages | 商品交期: 最快1-2个工作天内

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预计到 2032 年，电子封装市场规模将达到 131 亿美元，复合年增长率为 17.16%。

关键市场统计数据
基准年 2024 36.9亿美元
预计年份：2025年 43.1亿美元
预测年份 2032 131亿美元
复合年增长率 (%) 17.16%

本文提供了一个电子封装基础知识的入门框架，将材料、製造精度和跨产业产品差异化要求连结起来。

电子封装领域融合了材料科学、製造精度和系统级集成，是现代电子设备可靠性和效率的物理基础。随着装置功能密度的提高和功耗/性能权衡的日益严格，封装选择在消费性电子、汽车、医疗、航太和通讯市场中越来越决定着产品的差异化。本文概述了正在重塑元件封装、测试和整合到大规模组件中的技术、商业性和监管因素。

异质整合技术、供应链在地化、材料创新和监管压力等方面的进步正在重塑电子封装策略

在技​​术创新、供应链重组和终端市场需求不断变化的影响下，电子封装产业正经历着变革性的转变。异质整合和3D封装技术的进步带来了前所未有的元件密度和效能，迫使设计人员重新思考传统的外形规格和散热策略。同时，晶圆级和系统级封装技术的进步正在缩短组装週期，并改变晶粒级复杂性和基板级互连要求之间的平衡。

评估2025年美国关税调整及其对包装供应链采购、供应商多元化和业务永续营运的连锁影响

美国2025年实施的关税政策调整为电子封装企业带来了新的商业复杂性，影响了筹资策略、供应商谈判和成本管理方式。为了降低关税和交付风险，製造商及其采购团队重新调整了供应商策略，优先选择拥有分散生产基地和国内製造能力的合作伙伴。这些调整促使企业做出了一系列商业决策，包括重新谈判长期合约以及加快对区域测试和组装能力的投资。

透过对封装架构、材料系统、整合技术、最终用途限制和设备要求进行详细的細項分析，揭示关键的策略性产品和供应链问题。

基于细分市场的洞察，透过将性能要求映射到特定的封装系列、基板和封装、先进整合技术、最终应用领域以及资本设备需求，揭示了电子封装生态系统中的机会和挑战。在考虑封装类型时，球栅阵列 (BGA) 的各种变体，例如陶瓷 BGA、柱状 BGA、细间距 BGA 和塑胶 BGA，在热学、机械和互连设计方面呈现出不同的权衡取舍。同时，晶片级封装 (CSP) 选项，例如扇入式 CSP、扇出式 CSP、覆晶晶片 CSP 和多晶片 CSP，在可测试性和组装顺序方面带来了独特的考虑。表面黏着技术(SMT) 和通孔安装方法在连接方式和侦测需求方面也存在差异。

区域策略考量：比较近岸外包的优势、监管和永续性压力以及全球主要地区的製造业规模动态

区域趋势对电子封装领域的策略选择有显着影响，塑造供应商生态系统、材料供应和法规遵循路径。在美洲，製造群和先进的测试实验室为国内原始设备製造商 (OEM) 和一级供应商提供了接近性优势，强化了近岸外包和快速原型製作能力的趋势。该地区在设计和系统整合方面的优势也促进了封装工程师和电子系统架构师之间的紧密合作，从而加快了检验週期，并在产品概念和可製造性评估之间建立了更紧密的反馈机制。

竞争格局的特点是技术领先、协作式供应链模式和增值检验服务，这些因素正在推动包装解决方案的差异化。

电子封装领域主要企业的竞争优势源自于其技术领先地位、供应链深度以及超越元件供应的以服务为导向的综合优势。市场领导透过持续投资于流程自动化、先进检测系统和协作工程支援来实现差异化，从而缩短客户采用新型封装方法的学习曲线。材料创新者、设备製造商和契约製造之间的策略联盟十分普遍，从而能够提供端到端的解决方案，降低整合风险并简化认证流程。

为增强韧性、优化先进封装技术的资本配置以及建立跨职能管治以提高可製造性，提供切实可行的领导指南。

为了将这些洞见转化为实际行动，产业领导者应优先考虑能够增强韧性并打造差异化产品能力的重点投资。经营团队必须将资本支出与整合蓝图保持一致，该路线图应重点关注能够进行晶圆级和3D封装製程的模组化设备，并在产品架构演进过程中保留多种选择。同时，对先进检测技术和线上测试的同步投资将透过减少下游返工和加快认证速度，带来品质和经济效益。

本执行摘要所依据的调查方法详细介绍了从业者访谈、技术检验、标准审查和定性三角测量，以深入了解包装和供应链。

本执行摘要依据的研究综合了第一手和第二手证据、结构化访谈以及来自设计、製造和采购领域经验丰富的从业人员的技术检验。第一手资讯是透过与包装工程师、可靠性专家和供应链负责人进行有针对性的讨论获得的，旨在收集组装限制、认证时间表和供应商选择标准的第一手资料。此外，测试和检验负责人的操作层面回馈也补充了这些讨论，以检验流程观察结果和设备利用模式。

总而言之，我们总结了包装策略、供应商多元化和永续实践的协调一致对于实现可靠的差异化和营运韧性的重要性。

总之，电子封装产业正处于一个转折点，材料创新、整合技术和地缘政治因素正在交汇融合，重新定义竞争优势。那些积极主动地将封装选择与系统级目标相结合、投资于适应性强的设备平台并建立跨区域供应链网路的企业，将更有能力应对不确定性并把握技术变革带来的机会。在封装决策中强调可追溯性、严格的认证流程和永续性，将有助于降低长期风险，同时满足受监管的终端用户市场日益复杂的需求。

目录

第一章：序言

第二章调查方法

第三章执行摘要

第四章 市场概览

第五章 市场洞察

  • 采用3D整合式扇出型封装技术製造5G设备高密度移动处理器
  • 将氮化镓功率元件整合到用于汽车应用的先进构装基板中
  • 引入嵌入式晶片封装解决方案，以提高穿戴式医疗设备的效能
  • 采用晶圆级扇出面板封装技术，以降低成本并提高生产效率。
  • 开发含石墨烯填料的导热环氧树脂模塑料，用于高功率模组的温度控管
  • 为了提高 AI 加速器封装的频宽，采用穿透硅通孔(TSV) 技术的 3D 堆迭记忆体正被越来越多地采用。
  • 扩大电子封装领域环保无铅焊料替代品的使用范围，以符合全球环境标准

第六章：美国关税的累积影响，2025年

第七章：人工智慧的累积影响，2025年

8. 依封装类型分類的电子封装市场

  • 球栅阵列
    • 陶瓷BGA
    • 柱状BGA
    • 细间距BGA
    • 塑胶BGA
  • 晶片级封装
    • 扇入式CSP
    • 扇出型 CSP
    • 覆晶CSP
    • 多晶片CSP
  • 覆晶
  • 表面黏着技术
  • 通孔

9. 依材料类型分類的电子封装市场

  • 陶瓷
  • 复合材料
  • 金属
    • 铝
    • 铜
    • 银
  • 聚合物
    • 丙烯酸纤维
    • 环氧模塑料
    • 聚酰亚胺
    • 硅酮

10. 依封装技术分類的电子封装市场

  • 3D包装
    • 晶粒
    • 晶粒到晶圆
    • 硅穿孔
  • 覆晶
  • 系统套件
    • 多晶片模组
    • 包装上的包装
    • 带有被动元件的SiP
  • 晶圆级封装
  • 焊线

11. 依最终用途分類的电子封装市场

  • 航太/国防
  • 车
    • 高级驾驶辅助系统
    • 人体电子系统
    • 资讯娱乐和车载资讯系统
    • LED照明
    • 动力传动系统电子系统
  • 家用电子电器
    • 个人电脑和笔记型电脑
    • 智慧型手机
    • 药片
    • 电视机
    • 穿戴式装置
  • 医疗设备
  • 电讯

第十二章 按元件分類的电子封装市场

  • 组装设备
    • 晶片黏合机
    • 分配设备
    • 取放机
    • 引线键合机
  • 搬运和定位设备
  • 检验和测试设备
    • 自动光学检测
    • 电气测试设备
    • X射线
  • 焊接设备

第十三章：按地区分類的电子封装市场

  • 美洲
    • 北美洲
    • 拉丁美洲
  • 欧洲、中东和非洲
    • 欧洲
    • 中东
    • 非洲
  • 亚太地区

第十四章：电子封装市场（依类别划分）

  • ASEAN
  • GCC
  • EU
  • BRICS
  • G7
  • NATO

第十五章 各国电子封装市场

  • 美国
  • 加拿大
  • 墨西哥
  • 巴西
  • 英国
  • 德国
  • 法国
  • 俄罗斯
  • 义大利
  • 西班牙
  • 中国
  • 印度
  • 日本
  • 澳洲
  • 韩国

第十六章 竞争格局

  • 2024年市占率分析
  • FPNV定位矩阵，2024
  • 竞争分析
    • ASE Technology Holding Co., Ltd.
    • Amkor Technology, Inc.
    • Siliconware Precision Industries Co., Ltd.
    • JCET Group Co., Ltd.
    • Powertech Technology Inc.
    • UTAC Holdings Ltd.
    • ChipMOS Technologies Inc.
    • King Yuan Electronics Co., Ltd.
    • Chipbond Technology Corporation
    • Tianshui Huatian Technology Co., Ltd.
Product Code: MRR-3C68ED2D0EE7

The Electronic Packaging Market is projected to grow by USD 13.10 billion at a CAGR of 17.16% by 2032.

KEY MARKET STATISTICS
Base Year [2024] USD 3.69 billion
Estimated Year [2025] USD 4.31 billion
Forecast Year [2032] USD 13.10 billion
CAGR (%) 17.16%

Introductory framing of electronic packaging fundamentals that connects materials, manufacturing precision, and cross-industry imperatives for product differentiation

The electronic packaging domain sits at the intersection of materials science, manufacturing precision, and system-level integration, forming the physical substrate that enables modern electronics to perform reliably and efficiently. As device functionality densifies and power-performance trade-offs tighten, packaging decisions increasingly determine product differentiation across consumer, automotive, medical, aerospace, and telecom markets. This introduction frames the technical, commercial, and regulatory forces that are reshaping how components are packaged, tested, and integrated into larger assemblies.

Over recent years, shifts in end-use requirements have elevated the role of packaging architects from passive carriers of silicon to active contributors to thermal management, signal integrity, and mechanical robustness. Consequently, packaging strategies now demand closer alignment with semiconductor roadmaps, substrate and underfill selection, and advanced interconnect techniques. This section outlines those converging imperatives, emphasizing the need for cross-functional collaboration between design, supply chain, and quality assurance teams to mitigate risk, control cost, and accelerate time-to-revenue.

Importantly, stakeholders are navigating a landscape where supply continuity, materials traceability, and compliance obligations carry equal weight with performance metrics. The following analysis illuminates these dynamics and sets the stage for deeper discussion of technological displacement, tariff-driven adjustments, segmentation-specific insights, and regional strategic considerations.

How advances in heterogeneous integration, supply chain localization, materials innovation, and regulatory pressures are collectively reshaping electronic packaging strategies

The electronic packaging landscape is undergoing transformative shifts driven by technological innovation, supply chain restructuring, and evolving end-market demands. Advances in heterogeneous integration and three-dimensional packaging techniques are enabling unprecedented component density and performance, pushing designers to rethink traditional form factors and thermal strategies. At the same time, progress in wafer-level and system-in-package technologies is compressing assembly cycles and altering the balance between die-level complexity and board-level interconnect requirements.

Concurrently, supply chain dynamics are evolving as procurement teams diversify supplier portfolios and invest in localized capabilities to reduce single-source exposure. Materials innovation-ranging from novel polymers engineered for high thermal conductivity to metallurgy developments for finer pitch interconnects-is enabling new assembly approaches while imposing fresh qualification regimes. Regulatory and compliance environments are tightening across several jurisdictions, leading to more rigorous documentation and traceability expectations for materials and process controls.

These shifts are compounded by the need for sustainability and circularity considerations to be embedded into packaging choices. Manufacturers are prioritizing low-waste assembly techniques, recyclable substrates, and redesigns that facilitate repairability and end-of-life recovery. Together, these trends are redefining how industry participants allocate R&D spend, prioritize capital equipment upgrades, and partner across the value chain to capture emerging opportunities.

Assessment of the 2025 United States tariff adjustments and their cascading effects on sourcing, supplier diversification, and operational resilience across packaging supply chains

Tariff policy adjustments in the United States in 2025 introduced an additional layer of commercial complexity for firms engaged in electronic packaging, influencing sourcing strategies, supplier negotiations, and cost management practices. Manufacturers and their procurement teams reassessed supplier footprints, increasingly favoring partners with diversified production bases or onshore capacity to mitigate tariff exposure and delivery risk. These adjustments prompted a cascade of operational decisions, from renegotiating long-term agreements to accelerating investments in regional testing and assembly capabilities.

In response, design and product management functions evaluated componentization to minimize cross-border value transfer in sensitive lines, opting where feasible to increase module-level integration or localize final assembly. Logistics providers and contract manufacturers adapted service offerings to include tariff-aware routing and duty engineering, seeking to optimize landed costs while preserving lead-time reliability. Financial teams reworked cost models to capture tariff volatility, embedding scenario planning into monthly reviews and capital allocation deliberations.

The tariff environment also intensified interest in supplier relationship management and qualification of alternate materials that could be sourced domestically or from preferred trade partner countries. These dynamics heightened the importance of supplier transparency around origin, processing steps, and certificate of origin documentation. Collectively, the 2025 tariff measures accelerated strategic reorientation across procurement, operations, and product development functions, with organizations prioritizing resilience and agility in parallel with performance objectives.

In-depth segmentation analysis linking package architectures, material systems, integration technologies, end-use constraints, and equipment requirements to reveal strategic product and supply chain imperatives

Segmentation-driven insights illuminate opportunity and vulnerability across the electronic packaging ecosystem by mapping performance requirements to distinct package families, substrate and encapsulant materials, advanced integration techniques, end-use verticals, and capital equipment needs. When considering package type, Ball Grid Array variants such as Ceramic BGA, Column BGA, Fine-Pitch BGA, and Plastic BGA present differentiated thermal, mechanical, and routing trade-offs while Chip Scale Package options including Fan-In CSP, Fan-Out CSP, Flip Chip CSP, and Multi-Chip CSP introduce distinct testability and assembly sequencing considerations. Surface Mount and Through Hole approaches further diversify attachment methodologies and inspection needs.

Material type segmentation underscores how Ceramics, Composites, Metals, and Polymers drive both performance envelopes and process controls. Within metals, aluminum, copper, and silver offer discrete thermal and electrical characteristics that influence heat spreading and interconnect reliability, while polymer options such as acrylic, epoxy mold compound, polyimide, and silicone dictate adhesion, flexibility, and dielectric behavior. Packaging technology segmentation highlights the operational and design implications of 3D Packaging, Flip Chip, System In Package, Wafer Level Packaging, and Wire Bond techniques; subcategories like Die to Die, Die to Wafer, Through Silicon Via, Multi-Chip Module, Package on Package, and SiP with passive components demand specialized test regimes and equipment flows.

End use segmentation across Aerospace & Defense, Automotive, Consumer Electronics, Medical Devices, and Telecommunications reveals diverging qualification timelines, reliability thresholds, and regulatory expectations; automotive subsegments such as Advanced Driver Assistance Systems, Body Electronics, Infotainment & Telematics, LED Lighting, and Powertrain Electronics impose varying durability and thermal stress profiles, while consumer subsegments spanning PCs & Laptops, Smartphones, Tablets, Televisions, and Wearables prioritize miniaturization and cost per function. Equipment type segmentation that includes Assembly Equipment, Handling & Positioning Equipment, Inspection & Testing Equipment, and Soldering Equipment further clarifies capital investment priorities, where assembly categories like die bonders, dispensing equipment, pick & place machines, and wire bonders and inspection modalities including automated optical inspection, electrical testing equipment, and X-ray inspection determine factory throughput and yield optimization strategies.

Taken together, these segmentation lenses allow stakeholders to align technology roadmaps with procurement decisions and capital allocation, ensuring product architectures and supplier ecosystems are built to meet specific reliability, cost, and integration demands.

Regional strategic considerations that compare nearshoring benefits, regulatory and sustainability pressures, and manufacturing scale dynamics across major global geographies

Regional dynamics exert strong influence on strategic choices in electronic packaging, shaping supplier ecosystems, materials availability, and regulatory compliance pathways. In the Americas, manufacturing clusters and advanced test labs provide proximity advantages for domestic OEMs and Tier 1 suppliers, reinforcing trends toward nearshoring and rapid prototyping capabilities. This region's strengths in design and systems integration also support close collaboration between packaging engineers and electronic system architects, enabling accelerated validation cycles and tighter feedback loops between product concept and manufacturability assessments.

Across Europe, Middle East & Africa, regulatory rigor and emphasis on sustainability are driving investments in traceable material chains and high-reliability assembly practices. Certification and qualification processes in this region often require extended testing under stringent environmental regimes, influencing component selection and materials engineering choices. Local supply bases in Europe prioritize precision manufacturing and specialized substrates, offering differentiated capabilities for applications that demand extreme reliability and long operational life.

The Asia-Pacific region remains a central node for high-volume assembly, materials supply, and equipment manufacturing, supporting rapid scale-up and cost-efficient production. Its ecosystem benefits from deep supplier networks for substrates, solder materials, and interconnect solutions, as well as concentrated capital equipment manufacturers. Nevertheless, companies operating here must navigate varied regulatory standards, workforce skill disparities, and increasing pressure to adopt sustainable processing practices. Collectively, these regional characteristics should guide strategic decisions on capacity placement, supplier qualification, and localized product configuration to balance cost, performance, and risk.

Competitive landscape characterization emphasizing technology leadership, collaborative supply chain models, and value-added validation services that drive differentiation in packaging solutions

Competitive positioning among leading companies in the electronic packaging space reflects a blend of technological leadership, supply chain depth, and service-oriented offerings that extend beyond component provision. Market leaders distinguish themselves through sustained investments in process automation, advanced inspection systems, and collaborative engineering support that shortens learning curves for customers integrating novel packaging approaches. Strategic partnerships between materials innovators, equipment makers, and contract manufacturers are common, enabling end-to-end solutions that reduce integration risk and streamline qualification timelines.

Many established firms complement product portfolios with comprehensive validation and failure analysis services, which assist customers in meeting stringent reliability requirements and regulatory submissions. These value-added capabilities are increasingly important as packaging architectures grow more complex and test vectors multiply. In addition, forward-looking companies are embedding sustainability criteria into product roadmaps, offering materials with improved recyclability profiles or developing assembly processes that reduce waste and energy consumption.

New entrants and specialized suppliers are also reshaping competition by focusing on niche capabilities such as high-density interposers, novel underfill chemistries, or compact thermal spreaders that address specific pain points for telemetry, automotive safety, or wearable applications. Collectively, the competitive landscape rewards organizations that can couple deep technical expertise with flexible manufacturing footprints and transparent supply chain practices.

Actionable leadership directives to strengthen resilience, optimize capital allocation for advanced packaging capabilities, and institutionalize cross-functional governance for manufacturability

To translate insight into action, industry leaders should prioritize targeted investments that reinforce resilience while unlocking differentiated product capabilities. Executives must align capital expenditure with integration roadmaps that favor modular equipment capable of supporting wafer-level and three-dimensional packaging processes, thereby preserving optionality as product architectures evolve. Parallel investments in advanced inspection and in-line testing reduce downstream rework and accelerate time-to-qualification, delivering both quality and financial benefits.

Procurement and engineering teams should formalize multi-sourcing frameworks that incorporate dual-qualified suppliers and regional redundancy, reducing exposure to trade policy shifts and single-point failures. Strengthening supplier transparency through enhanced documentation, traceability of materials, and joint risk assessments will improve responsiveness during disruptions. At the same time, R&D teams should prioritize materials selection that balances thermal and mechanical requirements with recyclability and regulatory compliance, ensuring designs meet both performance and sustainability objectives.

Finally, leadership should cultivate cross-functional governance that brings product management, reliability engineering, and supply chain stakeholders into early-stage packaging decisions. Embedding clear stage gates for manufacturability, testability, and end-of-life handling within product development cycles will minimize late-stage surprises and enable predictable ramping of new product introductions.

Transparent research methodology detailing practitioner interviews, technical validation, standards review, and qualitative triangulation used to derive packaging and supply chain insights

The research underpinning this executive summary synthesizes primary and secondary evidence, structured interviews, and technical validation from experienced practitioners across design, manufacturing, and procurement functions. Primary inputs were obtained through targeted discussions with packaging engineers, reliability specialists, and supply chain leaders to capture first-hand perspectives on assembly constraints, qualification timelines, and vendor selection criteria. These conversations were complemented by operator-level feedback from test and inspection personnel to validate process flow observations and equipment utilization patterns.

Secondary analysis incorporated peer-reviewed literature, standards documentation, and publicly available regulatory guidance to ensure technical assertions align with industry norms and evolving compliance frameworks. Comparative evaluation of equipment capability sets, materials datasheets, and failure analysis reports informed assessments of technology readiness and integration complexity. Where possible, findings were triangulated across multiple sources to increase confidence in conclusions and to identify commonalities that transcend individual use cases.

Methodologically, the analysis emphasizes qualitative rigor and cross-validation over quantitative extrapolation. The research approach was deliberately iterative, allowing emerging themes from practitioner interviews to direct additional inquiry and to refine the framing of segmentation and regional insights presented herein.

Conclusion synthesizing why alignment of packaging strategy, supplier diversification, and sustainable practices is critical to achieving reliable differentiation and operational resilience

In closing, the electronic packaging sector is at a pivotal juncture where material innovation, integration techniques, and geopolitical considerations converge to redefine competitive advantage. Organizations that proactively align packaging choices with system-level objectives, invest in adaptable equipment platforms, and cultivate multi-regional supply networks will be better positioned to navigate uncertainty and capitalize on technology transitions. Emphasizing traceability, qualification rigor, and sustainability in packaging decisions will reduce long-term risk while meeting the heightened expectations of regulated end-use markets.

Stakeholders should expect continued acceleration of heterogeneous integration and an attendant increase in cross-disciplinary collaboration between design and manufacturing teams. Those who adopt a deliberate approach to supplier diversification, supplier transparency, and capital planning will mitigate exposure to policy shifts and supply interruptions. Ultimately, success will hinge on the ability to translate packaging innovation into reliable product differentiation while maintaining the operational discipline necessary to deliver consistent quality at scale.

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Stakeholders

2. Research Methodology

3. Executive Summary

4. Market Overview

5. Market Insights

  • 5.1. Adoption of 3D integrated fan-out packaging for high-density mobile processors in 5G devices
  • 5.2. Integration of gallium nitride power devices into advanced package substrates for automotive applications
  • 5.3. Implementation of embedded die packaging solutions to enhance performance of wearable medical devices
  • 5.4. Adoption of wafer-level fan-out panel-based packaging to reduce cost and improve production throughput
  • 5.5. Development of thermally conductive epoxy molding compounds with graphene fillers for heat management in high-power modules
  • 5.6. Rising use of through-silicon via enabled 3D-stacked memory for improved bandwidth in AI accelerator packages
  • 5.7. Expansion of eco-friendly lead-free solder alternatives in electronic packaging to meet global environmental standards

6. Cumulative Impact of United States Tariffs 2025

7. Cumulative Impact of Artificial Intelligence 2025

8. Electronic Packaging Market, by Package Type

  • 8.1. Ball Grid Array
    • 8.1.1. Ceramic BGA
    • 8.1.2. Column BGA
    • 8.1.3. Fine-Pitch BGA
    • 8.1.4. Plastic BGA
  • 8.2. Chip Scale Package
    • 8.2.1. Fan-In CSP
    • 8.2.2. Fan-Out CSP
    • 8.2.3. Flip Chip CSP
    • 8.2.4. Multi-Chip CSP
  • 8.3. Flip Chip
  • 8.4. Surface Mount
  • 8.5. Through Hole

9. Electronic Packaging Market, by Material Type

  • 9.1. Ceramics
  • 9.2. Composites
  • 9.3. Metals
    • 9.3.1. Aluminum
    • 9.3.2. Copper
    • 9.3.3. Silver
  • 9.4. Polymers
    • 9.4.1. Acrylic
    • 9.4.2. Epoxy Mold Compound
    • 9.4.3. Polyimide
    • 9.4.4. Silicone

10. Electronic Packaging Market, by Packaging Technology

  • 10.1. 3D Packaging
    • 10.1.1. Die To Die
    • 10.1.2. Die To Wafer
    • 10.1.3. Through Silicon Via
  • 10.2. Flip Chip
  • 10.3. System In Package
    • 10.3.1. Multi-Chip Module
    • 10.3.2. Package On Package
    • 10.3.3. SiP With Passive
  • 10.4. Wafer Level Packaging
  • 10.5. Wire Bond

11. Electronic Packaging Market, by End Use

  • 11.1. Aerospace & Defense
  • 11.2. Automotive
    • 11.2.1. Advanced Driver Assistance Systems
    • 11.2.2. Body Electronics
    • 11.2.3. Infotainment & Telematics
    • 11.2.4. LED Lighting
    • 11.2.5. Powertrain Electronics
  • 11.3. Consumer Electronics
    • 11.3.1. PCs & Laptops
    • 11.3.2. Smartphones
    • 11.3.3. Tablets
    • 11.3.4. Televisions
    • 11.3.5. Wearables
  • 11.4. Medical Devices
  • 11.5. Telecommunications

12. Electronic Packaging Market, by Equipment Type

  • 12.1. Assembly Equipment
    • 12.1.1. Die Bonders
    • 12.1.2. Dispensing Equipment
    • 12.1.3. Pick & Place Machines
    • 12.1.4. Wire Bonders
  • 12.2. Handling & Positioning Equipment
  • 12.3. Inspection & Testing Equipment
    • 12.3.1. Automated Optical Inspection
    • 12.3.2. Electrical Testing Equipment
    • 12.3.3. X-ray Inspection
  • 12.4. Soldering Equipment

13. Electronic Packaging Market, by Region

  • 13.1. Americas
    • 13.1.1. North America
    • 13.1.2. Latin America
  • 13.2. Europe, Middle East & Africa
    • 13.2.1. Europe
    • 13.2.2. Middle East
    • 13.2.3. Africa
  • 13.3. Asia-Pacific

14. Electronic Packaging Market, by Group

  • 14.1. ASEAN
  • 14.2. GCC
  • 14.3. European Union
  • 14.4. BRICS
  • 14.5. G7
  • 14.6. NATO

15. Electronic Packaging Market, by Country

  • 15.1. United States
  • 15.2. Canada
  • 15.3. Mexico
  • 15.4. Brazil
  • 15.5. United Kingdom
  • 15.6. Germany
  • 15.7. France
  • 15.8. Russia
  • 15.9. Italy
  • 15.10. Spain
  • 15.11. China
  • 15.12. India
  • 15.13. Japan
  • 15.14. Australia
  • 15.15. South Korea

16. Competitive Landscape

  • 16.1. Market Share Analysis, 2024
  • 16.2. FPNV Positioning Matrix, 2024
  • 16.3. Competitive Analysis
    • 16.3.1. ASE Technology Holding Co., Ltd.
    • 16.3.2. Amkor Technology, Inc.
    • 16.3.3. Siliconware Precision Industries Co., Ltd.
    • 16.3.4. JCET Group Co., Ltd.
    • 16.3.5. Powertech Technology Inc.
    • 16.3.6. UTAC Holdings Ltd.
    • 16.3.7. ChipMOS Technologies Inc.
    • 16.3.8. King Yuan Electronics Co., Ltd.
    • 16.3.9. Chipbond Technology Corporation
    • 16.3.10. Tianshui Huatian Technology Co., Ltd.

LIST OF FIGURES

  • FIGURE 1. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, 2018-2032 (USD MILLION)
  • FIGURE 2. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY PACKAGE TYPE, 2024 VS 2032 (%)
  • FIGURE 3. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY PACKAGE TYPE, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 4. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL TYPE, 2024 VS 2032 (%)
  • FIGURE 5. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL TYPE, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 6. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY PACKAGING TECHNOLOGY, 2024 VS 2032 (%)
  • FIGURE 7. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY PACKAGING TECHNOLOGY, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 8. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY END USE, 2024 VS 2032 (%)
  • FIGURE 9. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY END USE, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 10. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY EQUIPMENT TYPE, 2024 VS 2032 (%)
  • FIGURE 11. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY EQUIPMENT TYPE, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 12. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY REGION, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 13. AMERICAS ELECTRONIC PACKAGING MARKET SIZE, BY SUBREGION, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 14. NORTH AMERICA ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 15. LATIN AMERICA ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 16. EUROPE, MIDDLE EAST & AFRICA ELECTRONIC PACKAGING MARKET SIZE, BY SUBREGION, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 17. EUROPE ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 18. MIDDLE EAST ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 19. AFRICA ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 20. ASIA-PACIFIC ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 21. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY GROUP, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 22. ASEAN ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 23. GCC ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 24. EUROPEAN UNION ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 25. BRICS ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 26. G7 ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 27. NATO ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 28. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 29. ELECTRONIC PACKAGING MARKET SHARE, BY KEY PLAYER, 2024
  • FIGURE 30. ELECTRONIC PACKAGING MARKET, FPNV POSITIONING MATRIX, 2024

LIST OF TABLES

  • TABLE 1. ELECTRONIC PACKAGING MARKET SEGMENTATION & COVERAGE
  • TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2024
  • TABLE 3. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, 2018-2024 (USD MILLION)
  • TABLE 4. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, 2025-2032 (USD MILLION)
  • TABLE 5. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY PACKAGE TYPE, 2018-2024 (USD MILLION)
  • TABLE 6. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY PACKAGE TYPE, 2025-2032 (USD MILLION)
  • TABLE 7. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY BALL GRID ARRAY, 2018-2024 (USD MILLION)
  • TABLE 8. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY BALL GRID ARRAY, 2025-2032 (USD MILLION)
  • TABLE 9. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY BALL GRID ARRAY, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 10. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY BALL GRID ARRAY, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 11. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY BALL GRID ARRAY, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 12. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY BALL GRID ARRAY, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 13. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY BALL GRID ARRAY, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 14. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY BALL GRID ARRAY, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 15. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY CERAMIC BGA, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 16. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY CERAMIC BGA, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 17. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY CERAMIC BGA, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 18. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY CERAMIC BGA, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 19. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY CERAMIC BGA, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 20. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY CERAMIC BGA, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 21. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY COLUMN BGA, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 22. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY COLUMN BGA, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 23. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY COLUMN BGA, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 24. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY COLUMN BGA, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 25. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY COLUMN BGA, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 26. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY COLUMN BGA, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 27. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY FINE-PITCH BGA, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 28. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY FINE-PITCH BGA, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 29. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY FINE-PITCH BGA, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 30. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY FINE-PITCH BGA, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 31. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY FINE-PITCH BGA, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 32. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY FINE-PITCH BGA, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 33. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY PLASTIC BGA, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 34. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY PLASTIC BGA, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 35. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY PLASTIC BGA, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 36. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY PLASTIC BGA, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 37. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY PLASTIC BGA, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 38. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY PLASTIC BGA, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 39. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY CHIP SCALE PACKAGE, 2018-2024 (USD MILLION)
  • TABLE 40. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY CHIP SCALE PACKAGE, 2025-2032 (USD MILLION)
  • TABLE 41. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY CHIP SCALE PACKAGE, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 42. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY CHIP SCALE PACKAGE, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 43. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY CHIP SCALE PACKAGE, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 44. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY CHIP SCALE PACKAGE, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 45. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY CHIP SCALE PACKAGE, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 46. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY CHIP SCALE PACKAGE, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 47. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY FAN-IN CSP, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 48. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY FAN-IN CSP, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 49. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY FAN-IN CSP, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 50. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY FAN-IN CSP, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 51. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY FAN-IN CSP, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 52. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY FAN-IN CSP, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 53. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY FAN-OUT CSP, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 54. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY FAN-OUT CSP, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 55. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY FAN-OUT CSP, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 56. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY FAN-OUT CSP, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 57. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY FAN-OUT CSP, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 58. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY FAN-OUT CSP, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 59. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY FLIP CHIP CSP, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 60. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY FLIP CHIP CSP, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 61. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY FLIP CHIP CSP, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 62. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY FLIP CHIP CSP, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 63. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY FLIP CHIP CSP, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 64. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY FLIP CHIP CSP, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 65. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY MULTI-CHIP CSP, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 66. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY MULTI-CHIP CSP, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 67. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY MULTI-CHIP CSP, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 68. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY MULTI-CHIP CSP, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 69. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY MULTI-CHIP CSP, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 70. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY MULTI-CHIP CSP, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 71. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY FLIP CHIP, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 72. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY FLIP CHIP, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 73. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY FLIP CHIP, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 74. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY FLIP CHIP, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 75. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY FLIP CHIP, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 76. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY FLIP CHIP, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 77. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY SURFACE MOUNT, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 78. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY SURFACE MOUNT, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 79. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY SURFACE MOUNT, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 80. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY SURFACE MOUNT, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 81. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY SURFACE MOUNT, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 82. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY SURFACE MOUNT, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 83. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY THROUGH HOLE, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 84. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY THROUGH HOLE, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 85. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY THROUGH HOLE, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 86. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY THROUGH HOLE, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 87. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY THROUGH HOLE, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 88. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY THROUGH HOLE, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 89. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL TYPE, 2018-2024 (USD MILLION)
  • TABLE 90. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL TYPE, 2025-2032 (USD MILLION)
  • TABLE 91. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY CERAMICS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 92. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY CERAMICS, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 93. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY CERAMICS, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 94. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY CERAMICS, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 95. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY CERAMICS, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 96. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY CERAMICS, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 97. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY COMPOSITES, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 98. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY COMPOSITES, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 99. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY COMPOSITES, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 100. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY COMPOSITES, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 101. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY COMPOSITES, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 102. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY COMPOSITES, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 103. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY METALS, 2018-2024 (USD MILLION)
  • TABLE 104. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY METALS, 2025-2032 (USD MILLION)
  • TABLE 105. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY METALS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 106. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY METALS, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 107. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY METALS, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 108. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY METALS, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 109. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY METALS, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 110. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY METALS, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 111. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY ALUMINUM, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 112. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY ALUMINUM, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 113. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY ALUMINUM, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 114. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY ALUMINUM, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 115. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY ALUMINUM, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 116. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY ALUMINUM, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 117. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY COPPER, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 118. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY COPPER, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 119. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY COPPER, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 120. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY COPPER, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 121. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY COPPER, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 122. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY COPPER, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 123. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY SILVER, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 124. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY SILVER, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 125. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY SILVER, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 126. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY SILVER, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 127. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY SILVER, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 128. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY SILVER, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 129. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY POLYMERS, 2018-2024 (USD MILLION)
  • TABLE 130. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY POLYMERS, 2025-2032 (USD MILLION)
  • TABLE 131. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY POLYMERS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 132. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY POLYMERS, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 133. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY POLYMERS, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 134. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY POLYMERS, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 135. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY POLYMERS, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 136. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY POLYMERS, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 137. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY ACRYLIC, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 138. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY ACRYLIC, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 139. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY ACRYLIC, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 140. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY ACRYLIC, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 141. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY ACRYLIC, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 142. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY ACRYLIC, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 143. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY EPOXY MOLD COMPOUND, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 144. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY EPOXY MOLD COMPOUND, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 145. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY EPOXY MOLD COMPOUND, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 146. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY EPOXY MOLD COMPOUND, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 147. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY EPOXY MOLD COMPOUND, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 148. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY EPOXY MOLD COMPOUND, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 149. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY POLYIMIDE, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 150. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY POLYIMIDE, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 151. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY POLYIMIDE, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 152. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY POLYIMIDE, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 153. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY POLYIMIDE, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 154. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY POLYIMIDE, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 155. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY SILICONE, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 156. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY SILICONE, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 157. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY SILICONE, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 158. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY SILICONE, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 159. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY SILICONE, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 160. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY SILICONE, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 161. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2024 (USD MILLION)
  • TABLE 162. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY PACKAGING TECHNOLOGY, 2025-2032 (USD MILLION)
  • TABLE 163. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY 3D PACKAGING, 2018-2024 (USD MILLION)
  • TABLE 164. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY 3D PACKAGING, 2025-2032 (USD MILLION)
  • TABLE 165. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY 3D PACKAGING, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 166. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY 3D PACKAGING, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 167. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY 3D PACKAGING, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 168. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY 3D PACKAGING, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 169. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY 3D PACKAGING, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 170. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY 3D PACKAGING, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 171. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY DIE TO DIE, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 172. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY DIE TO DIE, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 173. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY DIE TO DIE, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 174. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY DIE TO DIE, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 175. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY DIE TO DIE, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 176. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY DIE TO DIE, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 177. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY DIE TO WAFER, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 178. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY DIE TO WAFER, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 179. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY DIE TO WAFER, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 180. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY DIE TO WAFER, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 181. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY DIE TO WAFER, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 182. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY DIE TO WAFER, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 183. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY THROUGH SILICON VIA, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 184. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY THROUGH SILICON VIA, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 185. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY THROUGH SILICON VIA, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 186. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY THROUGH SILICON VIA, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 187. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY THROUGH SILICON VIA, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 188. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY THROUGH SILICON VIA, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 189. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY FLIP CHIP, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 190. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY FLIP CHIP, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 191. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY FLIP CHIP, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 192. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY FLIP CHIP, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 193. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY FLIP CHIP, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 194. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY FLIP CHIP, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 195. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY SYSTEM IN PACKAGE, 2018-2024 (USD MILLION)
  • TABLE 196. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY SYSTEM IN PACKAGE, 2025-2032 (USD MILLION)
  • TABLE 197. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY SYSTEM IN PACKAGE, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 198. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY SYSTEM IN PACKAGE, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 199. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY SYSTEM IN PACKAGE, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 200. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY SYSTEM IN PACKAGE, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 201. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY SYSTEM IN PACKAGE, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 202. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY SYSTEM IN PACKAGE, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 203. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY MULTI-CHIP MODULE, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 204. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY MULTI-CHIP MODULE, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 205. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY MULTI-CHIP MODULE, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 206. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY MULTI-CHIP MODULE, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 207. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY MULTI-CHIP MODULE, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 208. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY MULTI-CHIP MODULE, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 209. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY PACKAGE ON PACKAGE, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 210. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY PACKAGE ON PACKAGE, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 211. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY PACKAGE ON PACKAGE, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 212. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY PACKAGE ON PACKAGE, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 213. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY PACKAGE ON PACKAGE, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 214. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY PACKAGE ON PACKAGE, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 215. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY SIP WITH PASSIVE, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 216. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY SIP WITH PASSIVE, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 217. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY SIP WITH PASSIVE, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 218. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY SIP WITH PASSIVE, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 219. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY SIP WITH PASSIVE, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 220. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY SIP WITH PASSIVE, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 221. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY WAFER LEVEL PACKAGING, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 222. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY WAFER LEVEL PACKAGING, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 223. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY WAFER LEVEL PACKAGING, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 224. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY WAFER LEVEL PACKAGING, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 225. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY WAFER LEVEL PACKAGING, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 226. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY WAFER LEVEL PACKAGING, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 227. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY WIRE BOND, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 228. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY WIRE BOND, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 229. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY WIRE BOND, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 230. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY WIRE BOND, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 231. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY WIRE BOND, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 232. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY WIRE BOND, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 233. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY END USE, 2018-2024 (USD MILLION)
  • TABLE 234. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY END USE, 2025-2032 (USD MILLION)
  • TABLE 235. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY AEROSPACE & DEFENSE, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 236. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY AEROSPACE & DEFENSE, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 237. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY AEROSPACE & DEFENSE, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 238. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY AEROSPACE & DEFENSE, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 239. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY AEROSPACE & DEFENSE, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 240. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY AEROSPACE & DEFENSE, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 241. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY AUTOMOTIVE, 2018-2024 (USD MILLION)
  • TABLE 242. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY AUTOMOTIVE, 2025-2032 (USD MILLION)
  • TABLE 243. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY AUTOMOTIVE, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 244. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY AUTOMOTIVE, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 245. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY AUTOMOTIVE, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 246. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY AUTOMOTIVE, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 247. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY AUTOMOTIVE, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 248. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY AUTOMOTIVE, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 249. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY ADVANCED DRIVER ASSISTANCE SYSTEMS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 250. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY ADVANCED DRIVER ASSISTANCE SYSTEMS, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 251. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY ADVANCED DRIVER ASSISTANCE SYSTEMS, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 252. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY ADVANCED DRIVER ASSISTANCE SYSTEMS, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 253. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY ADVANCED DRIVER ASSISTANCE SYSTEMS, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 254. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY ADVANCED DRIVER ASSISTANCE SYSTEMS, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 255. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY BODY ELECTRONICS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 256. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY BODY ELECTRONICS, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 257. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY BODY ELECTRONICS, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 258. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY BODY ELECTRONICS, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 259. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY BODY ELECTRONICS, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 260. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY BODY ELECTRONICS, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 261. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY INFOTAINMENT & TELEMATICS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 262. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY INFOTAINMENT & TELEMATICS, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 263. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY INFOTAINMENT & TELEMATICS, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 264. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY INFOTAINMENT & TELEMATICS, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 265. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY INFOTAINMENT & TELEMATICS, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 266. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY INFOTAINMENT & TELEMATICS, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 267. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY LED LIGHTING, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 268. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY LED LIGHTING, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 269. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY LED LIGHTING, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 270. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY LED LIGHTING, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 271. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY LED LIGHTING, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 272. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY LED LIGHTING, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 273. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY POWERTRAIN ELECTRONICS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 274. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY POWERTRAIN ELECTRONICS, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 275. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY POWERTRAIN ELECTRONICS, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 276. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY POWERTRAIN ELECTRONICS, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 277. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY POWERTRAIN ELECTRONICS, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 278. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY POWERTRAIN ELECTRONICS, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 279. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2024 (USD MILLION)
  • TABLE 280. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, 2025-2032 (USD MILLION)
  • TABLE 281. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 282. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 283. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 284. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 285. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 286. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 287. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY PCS & LAPTOPS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 288. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY PCS & LAPTOPS, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 289. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY PCS & LAPTOPS, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 290. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY PCS & LAPTOPS, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 291. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY PCS & LAPTOPS, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 292. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY PCS & LAPTOPS, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 293. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY SMARTPHONES, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 294. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY SMARTPHONES, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 295. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY SMARTPHONES, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 296. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY SMARTPHONES, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 297. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY SMARTPHONES, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 298. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY SMARTPHONES, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 299. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY TABLETS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 300. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY TABLETS, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 301. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY TABLETS, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 302. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY TABLETS, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 303. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY TABLETS, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 304. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY TABLETS, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 305. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY TELEVISIONS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 306. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY TELEVISIONS, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 307. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY TELEVISIONS, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 308. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY TELEVISIONS, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 309. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY TELEVISIONS, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 310. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY TELEVISIONS, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 311. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY WEARABLES, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 312. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY WEARABLES, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 313. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY WEARABLES, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 314. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY WEARABLES, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 315. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY WEARABLES, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 316. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY WEARABLES, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 317. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY MEDICAL DEVICES, BY REGION, 2018-2024 (U