查看购物车
  • Traditional Chinese
  • English
  • Japanese
封面
市场调查报告书
商品编码
1914306

晶圆CMP材料市场按产品类型、晶圆尺寸、颗粒尺寸、应用和最终用途产业划分－2026-2032年全球预测

CMP Materials for Wafers Market by Product Type, Wafer Size, Particle Size, Application, End Use Industry - Global Forecast 2026-2032
出版日期: | 出版商: 360iResearch | 英文 191 Pages | 商品交期: 最快1-2个工作天内

价格

※ 本网页内容可能与最新版本有所差异。详细情况请与我们联繫。

预计到 2025 年，CMP 材料（晶圆用）市值将达到 28.2 亿美元，到 2026 年将成长到 30.1 亿美元，到 2032 年将达到 44.4 亿美元，复合年增长率为 6.67%。

关键市场统计数据
基准年 2025 28.2亿美元
预计年份：2026年 30.1亿美元
预测年份 2032 44.4亿美元
复合年增长率 (%) 6.67%

本文概述了CMP耗材在先进晶圆製造中的关键作用，以及不断变化的製程需求如何推动技术和供应链的发展。

本执行摘要为晶圆製造中使用的化学机械抛光 (CMP) 材料建立了一个战略框架，并重点阐述了这些材料在整个半导体价值链中的作用。 CMP 耗材包括垫片材料、试剂化学品和各种浆料，它们协同作用，实现晶圆平坦化、缺陷控制以及为后续光刻和蚀刻步骤进行表面处理。随着晶圆厂向先进节点设计和高密度封装发展，对 CMP 输入材料的技术要求也日益严格，需要对颗粒尺寸分布、材料纯度、垫片表面形貌和化学成分进行更精确的控制。

技术规模化、确保供应链韧性的需求以及永续性的必要性正在同时重新定义 CMP 材料的开发和筹资策略。

CMP材料领域正经历变革性的转变，这些转变正在重塑产品开发重点和供应商选择标准。其中一个关键变化是技术层面的。随着製程节点不断缩小和封装製程日益复杂，亚微米级颗粒控制和超高纯度化学品的重要性也日益凸显。製造商现在要求配方能够在具有复杂表面形貌的区域内可靠地实现平整度，同时最大限度地减少缺陷并实现可重复的终点控制。因此，研发工作正转向开发能够平衡去除率和表面完整性的复杂磨料和特殊化学品。

到2025年，美国累积贸易措施如何重塑了CMP材料供应链的供应商策略、资格认证重点和风险管理？

美国在2025年前实施的累积政策和贸易措施，即使从定性而非定量角度衡量，也对化学机械加工（CMP）材料的供应链组成和成本结构产生了显着影响。关税调整和出口限制加速了对单一供应商依赖性的重新评估，迫使原始设备製造商（OEM）和材料供应商实现供应基础多元化，并重新考虑近岸外包作为策略选择。这影响了供应商的选择时间、前置作业时间预期以及对具备本地或双重采购能力的供应商的优先排序。

基于细分市场的深入洞察揭示了产品类型、应用特定要求、晶圆尺寸、磨料粒径范围和最终用户产业如何决定CMP材料的优先顺序。

详细的市场区隔分析揭示了不同产品类型、应用、晶圆尺寸、粒径类别和终端用户产业在技术优先顺序和采用路径上的差异。基于产品类型，市场分析从垫片材料、试剂化学和浆料材料三个方面展开。在浆料材料方面，氧化铝基复合磨料、二氧化硅基磨料和特殊磨料配方技术正逐渐成为技术重点，每种技术在去除率、选择性和缺陷控制方面各有侧重。垫片材料也在不断发展，采用工程化的微纹理和预处理技术，而试剂化学则着重于pH值控制、腐蚀抑制和磨料悬浮液稳定性。

区域趋势及其对美洲、欧洲、中东和非洲以及亚太地区製造地采购、认证和产能投资的策略影响

区域趋势持续影响材料采购、产能投资和合作模式等方面的策略选择。美洲地区已成为先进封装和专用逻辑晶片製造的中心，推动了当地对高性能浆料和焊盘技术的需求，以支援不断发展的装置结构。该地区的供应链决策强调供应商的接近性、快速响应的技术支援以及能够满足汽车和通讯行业严格可靠性标准的强大品质系统。

竞争趋势表明，技术差异化、协作开发和一体化支援服务将决定CMP材料领域供应商的长期生存能力。

CMP材料製造商和特殊化学品供应商之间的竞争格局呈现出多元化的特点，既有老牌企业，也有专注于特定领域的专业公司，还有垂直整合型企业。领先的供应商通常将深厚的材料科学专业知识与製程层面的支援相结合，提供应用工程服务、即时监控解决方案，并与晶圆製造商建立联合开发伙伴关係。这些能力能够加快生产现场问题的解决速度，并缩短新配方在多种晶圆尺寸和应用场景下的验证时间。

领导企业可以采取切实可行的策略步骤，以加快认证流程、深化供应商伙伴关係，并将永续性和韧性融入其CMP材料专案中。

业界领导者应采取若干切实可行的措施，使其化学机械抛光（CMP）材料策略与不断发展的技术和供应链实际情况相适应。首先，投资于跨职能认证项目，以加速对浆料、焊盘和试剂进行多地点、多晶圆尺寸的检验。标准化通讯协定并利用共用测试矩阵可以减少晶圆厂之间的差异，并加快实现稳定生产的速度。其次，优先考虑包含技术支援、共同故障排除和共同开发管道的供应商伙伴关係模式，因为与单纯的交易型供应关係相比，这种合作关係能够更快地解决产量比率和缺陷问题。

本执行摘要的调查方法结合了初步访谈、技术文献综合和实验室检验结果，以提供可复製和可操作的分析性见解。

本执行执行摘要的研究采用混合方法，结合了访谈、技术文献综述和实验室检验，最终得出基于实务经验和资料驱动分析的结论。关键资讯是透过与晶圆製造和材料製造领域的製程工程师、采购主管和研发经理进行结构化讨论收集的，重点是材料性能特征、认证流程和供应链挑战。此外，一项补充性的技术文献综述整合了同行评审的材料科学研究和供应商的技术出版物，以检验有关磨料化学、抛光垫表面形貌效应和颗粒尺寸影响的性能声明。

总之，我们汇总了决定晶圆厂 CMP 材料竞争优势的技术、策略和永续性优先事项的综合总结。

总之，晶圆CMP材料领域正处于关键的转折点，技术精度、策略性供应链设计和环境因素在此交会融合。随着装置结构日益复杂，精确调配的浆料化学成分、工程化的抛光垫材料以及严格控制的颗粒分布变得愈发重要。同时，贸易和政策的变化正在推动关键投入品的多元化和在地采购。那些能够积极将研发重点与特定应用需求结合，并实施稳健的采购和认证流程的供应商和製造商，将更有利于降低干扰因素并实现效能提升。

目录

第一章：序言

第二章调查方法

  • 研究设计
  • 研究框架
  • 市场规模预测
  • 数据三角测量
  • 调查结果
  • 调查前提
  • 调查限制

第三章执行摘要

  • 首席主管观点
  • 市场规模和成长趋势
  • 2025年市占率分析
  • FPNV定位矩阵，2025
  • 新的商机
  • 下一代经营模式
  • 产业蓝图

第四章 市场概览

  • 产业生态系与价值链分析
  • 波特五力分析
  • PESTEL 分析
  • 市场展望
  • 上市策略

第五章 市场洞察

  • 消费者洞察与终端用户观点
  • 消费者体验基准
  • 机会地图
  • 分销通路分析
  • 价格趋势分析
  • 监理合规和标准框架
  • ESG与永续性分析
  • 中断和风险情景
  • 投资报酬率和成本效益分析

第六章：美国关税的累积影响，2025年

第七章：人工智慧的累积影响，2025年

8. 晶圆CMP材料市场（依产品类型划分）

  • 垫片材质
  • 试剂化学品
  • 浆料
    • 氧化铝基
    • 复合磨料
    • 二氧化硅基
    • 特殊磨料

9. 依晶圆尺寸分類的晶圆CMP材料市场

  • 200mm
  • 300mm
  • 小于200毫米

10. 晶圆CMP材料市场（依粒径划分）

  • 1-3微米
  • 3微米或以上
  • 亚微米

第十一章 晶圆CMP材料市场（依应用领域划分）

  • 铸造服务
  • LED元件
  • 逻辑装置
  • 储存装置
    • DRAM
    • NAND快闪记忆体

12. 晶圆CMP材料市场依最终用途产业划分

  • 汽车电子
  • 家用电子电器
  • 电讯

第十三章 晶圆CMP材料市场（依地区划分）

  • 美洲
    • 北美洲
    • 拉丁美洲
  • 欧洲、中东和非洲
    • 欧洲
    • 中东
    • 非洲
  • 亚太地区

第十四章 晶圆CMP材料市场（依组别划分）

  • ASEAN
  • GCC
  • EU
  • BRICS
  • G7
  • NATO

第十五章 各国晶圆CMP材料市场

  • 美国
  • 加拿大
  • 墨西哥
  • 巴西
  • 英国
  • 德国
  • 法国
  • 俄罗斯
  • 义大利
  • 西班牙
  • 中国
  • 印度
  • 日本
  • 澳洲
  • 韩国

第十六章：美国晶圆CMP材料市场

第十七章：中国晶圆CMP材料市场

第十八章 竞争格局

  • 市场集中度分析，2025年
    • 浓度比（CR）
    • 赫芬达尔-赫希曼指数 (HHI)
  • 近期趋势及影响分析，2025 年
  • 2025年产品系列分析
  • 基准分析，2025 年
  • 3M Company
  • AGC Inc.
  • Anjimirco Shanghai
  • BASF SE
  • Cabot Corporation
  • DuPont de Nemours, Inc.
  • Entegris, Inc.
  • Fujibo Holdings
  • Fujifilm Holdings Corporation
  • Fujimi Incorporated
  • Hitachi High-Technologies Corporation
  • Hubei Dinglong
  • JSR Corporation
  • KC Tech
  • Merck KGaA
Product Code: MRR-AE420CB13BEE

The CMP Materials for Wafers Market was valued at USD 2.82 billion in 2025 and is projected to grow to USD 3.01 billion in 2026, with a CAGR of 6.67%, reaching USD 4.44 billion by 2032.

KEY MARKET STATISTICS
Base Year [2025] USD 2.82 billion
Estimated Year [2026] USD 3.01 billion
Forecast Year [2032] USD 4.44 billion
CAGR (%) 6.67%

Framing the critical role of CMP consumables in advanced wafer fabrication and how evolving process demands are elevating technical and supply chain requirements

This executive summary establishes the strategic framing for chemical mechanical planarization materials used in wafer fabrication, emphasizing the role these materials play across the semiconductor value chain. CMP consumables include pad materials, reagent chemicals, and a diverse slate of slurry materials that together enable planarization, defect control, and surface conditioning for successive lithography and etch steps. As fabs push into advanced node designs and higher density packaging, the technical requirements for CMP inputs have tightened, driving more rigorous control of particle size distributions, material purity, pad topography, and chemical formulations.

Against this backdrop, manufacturers and supply chain stakeholders face a nexus of challenges and opportunities. Cost pressures, sustainability expectations, and the drive for yield improvement compel continuous innovation in abrasive compositions, polymeric pad architectures, and reagent chemistries. At the same time, capacity shifts in wafer production and evolving end use demands from automotive electronics, consumer devices, and telecommunications change the profile of material consumption. This section sets the stage for a detailed exploration of these dynamics, emphasizing the practical implications for procurement, quality assurance, and collaborative development between material suppliers and fabs.

How technological miniaturization, supply chain resilience imperatives, and sustainability mandates are simultaneously redefining CMP materials development and procurement strategies

The CMP materials landscape has been redefined by several transformative shifts that are altering product development priorities and supplier selection criteria. One major shift is technological: the steady progression to smaller nodes and more complex packaging has elevated the importance of submicron particle control and ultra-high-purity chemistries. Manufacturers now require formulations that can reliably deliver planarity across highly topographic surfaces while minimizing defectivity and enabling repeatable endpoint control. As a result, research and development has pivoted toward composite abrasives and specialty chemistries that balance removal rate with surface integrity.

Another important shift is strategic: supply chain resilience and regional diversification have moved from optional considerations to core business strategies. Companies are increasingly balancing cost efficiency with security of supply, seeking multiple qualified sources and deeper supplier partnerships. Concurrently, sustainability and regulatory compliance have gained prominence; customers demand lower chemical footprints, reduced waste, and transparent lifecycle data. These expectations are driving investments in closed-loop processes, more environmentally benign reagent options, and pad recycling or refurbishing programs. Together, these technological, strategic, and regulatory forces are catalyzing a new era of collaboration between materials developers, equipment makers, and wafer fabricators, fostering co-innovation that blends materials science with process engineering.

How cumulative US trade measures through 2025 have reshaped supplier strategies, qualification priorities, and risk management across CMP material supply chains

The cumulative policy and trade measures implemented by the United States through 2025 have had a material influence on supply chain configuration and cost structures for CMP materials, even when measured qualitatively rather than quantitatively. Tariff-related adjustments and export controls have accelerated the re-evaluation of single-source dependencies, prompting original equipment manufacturers and materials suppliers to diversify supplier bases and to reconsider nearshoring as a strategic option. These actions have affected supplier selection timelines, lead-time expectations, and the prioritization of suppliers with local manufacturing or dual-sourcing capabilities.

In operational terms, the shifting tariff landscape has incentivized investments in domestic processing capacity for certain high-purity chemicals and abrasive formulations to reduce exposure to cross-border friction. At the same time, some upstream raw material flows have rerouted through alternative logistics corridors, increasing inventory buffers and elevating working capital requirements for procurement teams. For technology teams, the tariff dynamics have reinforced the need for qualification plans that include multi-site validation to mitigate disruption risk. Overall, trade measures have catalyzed a more defensive posture across the supply chain, one that favors agility, supplier collaboration, and manufacturing footprints aligned with geopolitical risk profiles.

Deep segmentation-driven insights that reveal how product types, application-specific requirements, wafer dimensions, abrasive particle ranges, and end-use industries determine CMP material priorities

A granular review of segmentation reveals differentiated technical priorities and adoption pathways across product types, applications, wafer sizes, particle size categories, and end use industries. Based on product type, the market is studied across pad materials, reagent chemicals, and slurry materials. Within slurry materials, the technical conversation increasingly centers on alumina-based, composite abrasives, silica-based, and specialty abrasive formulations, each offering distinct tradeoffs in removal rate, selectivity, and defectivity control. Pad materials continue to evolve with engineered microtextures and conditioning regimes, while reagent chemistries emphasize pH control, corrosion inhibition, and stabilization of abrasive suspensions.

Based on application, the market is studied across foundry services, LED devices, logic devices, and memory devices. Memory device processing in particular is examined with additional granularity across DRAM and NAND Flash, where surface planarity demands and defect sensitivity differ significantly; DRAM applications often emphasize uniform removal across large device areas, whereas NAND Flash processes may prioritize localized planarity and interface integrity. Based on wafer size, the market is studied across 200 mm, 300 mm, and below 200 mm substrates, with larger wafers driving economies of scale but also imposing stricter uniformity and slurry distribution controls. Based on particle size, the market is studied across 1-3 μm, above 3 μm, and submicron categories, with submicron abrasives gaining traction where ultra-low defectivity and fine finishing are required. Finally, based on end use industry, the market is studied across automotive electronics, consumer electronics, and telecommunications, sectors whose differing reliability and performance specifications shape acceptable tolerance thresholds, qualification cycles, and supply chain expectations.

Taken together, these segmentation lenses show that suppliers and fabricators must pursue multi-dimensional strategies. Product developers need to match abrasive chemistry and pad architecture to application-specific removal profiles, while procurement and quality teams need to maintain flexible qualification roadmaps that cover multiple wafer sizes and particle distributions. In practice, that means prioritizing cross-functional collaboration, investing in application-specific testing, and creating modular supply agreements that can adapt as device portfolios shift. This segmentation-informed approach enables more precise alignment of material selection with device performance goals and operational constraints.

Regional dynamics and strategic implications for sourcing, qualification, and capacity investments across the Americas, Europe Middle East & Africa, and Asia-Pacific manufacturing hubs

Regional dynamics continue to shape strategic choices for material sourcing, capacity investment, and collaboration models. The Americas region has become a focal point for advanced packaging and certain logic fabs, encouraging localized demand for high-performance slurries and pad technologies that support evolving device architectures. Supply chain decisions in this region place a premium on supplier proximity, rapid technical support, and robust quality systems that can meet critical automotive and telecommunications reliability standards.

Europe, Middle East & Africa present a heterogeneous landscape where regulatory stringency, sustainability expectations, and specialized manufacturing pockets influence material selection and supplier engagement. In several European markets, the emphasis on environmental compliance has pushed suppliers to prioritize lower-emission chemistries and enhanced waste management practices. In contrast, the Middle East and Africa markets often prioritize foundational capacity building and partner-driven technology transfer to accelerate local fabrication capabilities. Asia-Pacific remains the dominant driver of wafer production and innovation, spanning a wide spectrum from foundries and memory fabs to consumer electronics assembly. This region's scale fosters rapid iteration in slurry and pad development and supports large-volume qualification programs, but it also intensifies competition among suppliers to provide cost-effective, high-performance materials while addressing regional logistics and regulatory nuances.

Competitive landscape dynamics show why technical differentiation, collaborative development, and integrated support services determine long-term supplier viability in CMP materials

The competitive environment among CMP materials manufacturers and specialty chemical suppliers is characterized by a mix of established incumbents, focused niche players, and vertically integrated firms. Leading suppliers typically combine deep materials science expertise with process-level support, offering application engineering services, in-situ monitoring solutions, and co-development partnerships with wafer fabricators. These capabilities enable faster problem resolution in production and reduce the time required to qualify new formulations across multiple wafer sizes and applications.

At the same time, smaller, agile companies often differentiate through rapid innovation cycles and the ability to commercialize specialty abrasives or reagent blends tailored to narrow process windows. Strategic collaboration between large and small organizations-whether through joint development agreements, licensing, or supply partnerships-has become a pragmatic strategy to accelerate the deployment of advanced materials. In addition, some equipment manufacturers have expanded their service portfolios to include consumable optimization, which blurs traditional vendor boundaries and creates new channels for integrated solutions. Together, these dynamics foster a competitive ecosystem where technical differentiation, responsiveness, and the capacity to support multi-site qualifications determine long-term supplier viability.

Actionable strategic steps for leaders to accelerate qualification, deepen supplier partnerships, and embed sustainability and resilience into CMP materials programs

Industry leaders should take several practical, actionable steps to align their CMP materials strategies with evolving technology and supply chain realities. First, invest in cross-functional qualification programs that expedite multi-site and multi-wafer-size validation of slurries, pads, and reagents. By standardizing protocols and leveraging shared test matrices, organizations can reduce variability across fabs and shorten time to stable production. Second, prioritize supplier partnership models that embed technical support, joint troubleshooting, and co-development pathways, because these collaborative arrangements deliver faster resolution of yield and defect issues than transactional supply relationships.

Third, accelerate adoption of sustainability best practices by incorporating lifecycle assessments into supplier selection and by piloting lower-impact reagent chemistries and pad refurbishment programs. These measures not only reduce regulatory exposure but also respond to customer preferences for greener processes. Fourth, enhance resilience through dual sourcing and by qualifying geographically diverse suppliers for critical inputs, while maintaining clear processes for rapid supplier substitution. Fifth, align R&D roadmaps with end use industry needs-working closely with automotive, telecommunications, and consumer electronics stakeholders to ensure materials meet long-term reliability and performance expectations. Taken together, these actions will strengthen operational agility, reduce risk, and increase the probability that material choices will support both short-term production goals and long-term strategic objectives.

Methodological framework combining primary interviews, technical literature synthesis, and laboratory validation notes to ground insights in reproducible and practical analysis

The research underpinning this executive summary uses a mixed-method approach that combines primary interviews, technical literature review, and laboratory validation insights to ensure conclusions are grounded in both practice and data-driven analysis. Primary inputs were gathered through structured discussions with process engineers, procurement leaders, and R&D managers across wafer fabrication and materials manufacturing, focusing on material performance attributes, qualification workflows, and supply chain challenges. Complementary technical literature review synthesized peer-reviewed materials science studies and supplier technical bulletins to validate performance claims related to abrasive chemistries, pad topography effects, and particle size impacts.

Where available, laboratory validation case notes and anonymized process characterizations were incorporated to illustrate typical tradeoffs among removal rate, surface roughness, and defectivity. The methodology emphasizes transparency in assumptions, and the analytical approach privileges reproducible test parameters and real-world qualification constraints. Finally, regional intelligence was developed by triangulating supplier footprints, public filings, and industry conference disclosures to capture shifts in capacity and strategic partnerships without relying on private or proprietary datasets. Together, these methods provide a robust foundation for the insights and recommendations presented earlier.

Concluding synthesis of technical, strategic, and sustainability priorities that will determine competitive advantage in CMP materials for wafer fabrication

In conclusion, the CMP materials landscape for wafers is at an inflection point where technical precision, strategic supply chain design, and environmental stewardship converge. The increasing complexity of device architectures places a premium on finely tuned slurry chemistries, engineered pad materials, and tightly controlled particle distributions, while trade and policy shifts incentivize diversification and localization of key inputs. Suppliers and fabricators who proactively align R&D priorities with application-specific requirements, while implementing resilient procurement and qualification practices, will be best positioned to mitigate disruption and capture performance gains.

Moving forward, the balance between innovation and operational consistency will determine competitive differentiation. Organizations that foster deep technical partnerships, adopt standardized multi-site validation protocols, and incorporate sustainability metrics into material selection will both reduce risk and create enduring value for device manufacturers and end users alike.

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Definition
  • 1.3. Market Segmentation & Coverage
  • 1.4. Years Considered for the Study
  • 1.5. Currency Considered for the Study
  • 1.6. Language Considered for the Study
  • 1.7. Key Stakeholders

2. Research Methodology

  • 2.1. Introduction
  • 2.2. Research Design
    • 2.2.1. Primary Research
    • 2.2.2. Secondary Research
  • 2.3. Research Framework
    • 2.3.1. Qualitative Analysis
    • 2.3.2. Quantitative Analysis
  • 2.4. Market Size Estimation
    • 2.4.1. Top-Down Approach
    • 2.4.2. Bottom-Up Approach
  • 2.5. Data Triangulation
  • 2.6. Research Outcomes
  • 2.7. Research Assumptions
  • 2.8. Research Limitations

3. Executive Summary

  • 3.1. Introduction
  • 3.2. CXO Perspective
  • 3.3. Market Size & Growth Trends
  • 3.4. Market Share Analysis, 2025
  • 3.5. FPNV Positioning Matrix, 2025
  • 3.6. New Revenue Opportunities
  • 3.7. Next-Generation Business Models
  • 3.8. Industry Roadmap

4. Market Overview

  • 4.1. Introduction
  • 4.2. Industry Ecosystem & Value Chain Analysis
    • 4.2.1. Supply-Side Analysis
    • 4.2.2. Demand-Side Analysis
    • 4.2.3. Stakeholder Analysis
  • 4.3. Porter's Five Forces Analysis
  • 4.4. PESTLE Analysis
  • 4.5. Market Outlook
    • 4.5.1. Near-Term Market Outlook (0-2 Years)
    • 4.5.2. Medium-Term Market Outlook (3-5 Years)
    • 4.5.3. Long-Term Market Outlook (5-10 Years)
  • 4.6. Go-to-Market Strategy

5. Market Insights

  • 5.1. Consumer Insights & End-User Perspective
  • 5.2. Consumer Experience Benchmarking
  • 5.3. Opportunity Mapping
  • 5.4. Distribution Channel Analysis
  • 5.5. Pricing Trend Analysis
  • 5.6. Regulatory Compliance & Standards Framework
  • 5.7. ESG & Sustainability Analysis
  • 5.8. Disruption & Risk Scenarios
  • 5.9. Return on Investment & Cost-Benefit Analysis

6. Cumulative Impact of United States Tariffs 2025

7. Cumulative Impact of Artificial Intelligence 2025

8. CMP Materials for Wafers Market, by Product Type

  • 8.1. Pad Materials
  • 8.2. Reagent Chemicals
  • 8.3. Slurry Materials
    • 8.3.1. Alumina Based
    • 8.3.2. Composite Abrasives
    • 8.3.3. Silica Based
    • 8.3.4. Specialty Abrasives

9. CMP Materials for Wafers Market, by Wafer Size

  • 9.1. 200 Mm
  • 9.2. 300 Mm
  • 9.3. Below 200 Mm

10. CMP Materials for Wafers Market, by Particle Size

  • 10.1. 1-3 μm
  • 10.2. Above 3 μm
  • 10.3. Submicron

11. CMP Materials for Wafers Market, by Application

  • 11.1. Foundry Services
  • 11.2. LED Devices
  • 11.3. Logic Devices
  • 11.4. Memory Devices
    • 11.4.1. DRAM
    • 11.4.2. NAND Flash

12. CMP Materials for Wafers Market, by End Use Industry

  • 12.1. Automotive Electronics
  • 12.2. Consumer Electronics
  • 12.3. Telecommunications

13. CMP Materials for Wafers Market, by Region

  • 13.1. Americas
    • 13.1.1. North America
    • 13.1.2. Latin America
  • 13.2. Europe, Middle East & Africa
    • 13.2.1. Europe
    • 13.2.2. Middle East
    • 13.2.3. Africa
  • 13.3. Asia-Pacific

14. CMP Materials for Wafers Market, by Group

  • 14.1. ASEAN
  • 14.2. GCC
  • 14.3. European Union
  • 14.4. BRICS
  • 14.5. G7
  • 14.6. NATO

15. CMP Materials for Wafers Market, by Country

  • 15.1. United States
  • 15.2. Canada
  • 15.3. Mexico
  • 15.4. Brazil
  • 15.5. United Kingdom
  • 15.6. Germany
  • 15.7. France
  • 15.8. Russia
  • 15.9. Italy
  • 15.10. Spain
  • 15.11. China
  • 15.12. India
  • 15.13. Japan
  • 15.14. Australia
  • 15.15. South Korea

16. United States CMP Materials for Wafers Market

17. China CMP Materials for Wafers Market

18. Competitive Landscape

  • 18.1. Market Concentration Analysis, 2025
    • 18.1.1. Concentration Ratio (CR)
    • 18.1.2. Herfindahl Hirschman Index (HHI)
  • 18.2. Recent Developments & Impact Analysis, 2025
  • 18.3. Product Portfolio Analysis, 2025
  • 18.4. Benchmarking Analysis, 2025
  • 18.5. 3M Company
  • 18.6. AGC Inc.
  • 18.7. Anjimirco Shanghai
  • 18.8. BASF SE
  • 18.9. Cabot Corporation
  • 18.10. DuPont de Nemours, Inc.
  • 18.11. Entegris, Inc.
  • 18.12. Fujibo Holdings
  • 18.13. Fujifilm Holdings Corporation
  • 18.14. Fujimi Incorporated
  • 18.15. Hitachi High-Technologies Corporation
  • 18.16. Hubei Dinglong
  • 18.17. JSR Corporation
  • 18.18. KC Tech
  • 18.19. Merck KGaA

LIST OF FIGURES

  • FIGURE 1. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, 2018-2032 (USD MILLION)
  • FIGURE 2. GLOBAL CMP MATERIALS FOR WAFERS MARKET SHARE, BY KEY PLAYER, 2025
  • FIGURE 3. GLOBAL CMP MATERIALS FOR WAFERS MARKET, FPNV POSITIONING MATRIX, 2025
  • FIGURE 4. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY PRODUCT TYPE, 2025 VS 2026 VS 2032 (USD MILLION)
  • FIGURE 5. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY WAFER SIZE, 2025 VS 2026 VS 2032 (USD MILLION)
  • FIGURE 6. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY PARTICLE SIZE, 2025 VS 2026 VS 2032 (USD MILLION)
  • FIGURE 7. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY APPLICATION, 2025 VS 2026 VS 2032 (USD MILLION)
  • FIGURE 8. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY END USE INDUSTRY, 2025 VS 2026 VS 2032 (USD MILLION)
  • FIGURE 9. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY REGION, 2025 VS 2026 VS 2032 (USD MILLION)
  • FIGURE 10. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY GROUP, 2025 VS 2026 VS 2032 (USD MILLION)
  • FIGURE 11. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY COUNTRY, 2025 VS 2026 VS 2032 (USD MILLION)
  • FIGURE 12. UNITED STATES CMP MATERIALS FOR WAFERS MARKET SIZE, 2018-2032 (USD MILLION)
  • FIGURE 13. CHINA CMP MATERIALS FOR WAFERS MARKET SIZE, 2018-2032 (USD MILLION)

LIST OF TABLES

  • TABLE 1. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, 2018-2032 (USD MILLION)
  • TABLE 2. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
  • TABLE 3. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY PAD MATERIALS, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 4. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY PAD MATERIALS, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 5. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY PAD MATERIALS, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 6. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY REAGENT CHEMICALS, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 7. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY REAGENT CHEMICALS, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 8. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY REAGENT CHEMICALS, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 9. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY SLURRY MATERIALS, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 10. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY SLURRY MATERIALS, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 11. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY SLURRY MATERIALS, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 12. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY SLURRY MATERIALS, 2018-2032 (USD MILLION)
  • TABLE 13. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY ALUMINA BASED, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 14. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY ALUMINA BASED, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 15. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY ALUMINA BASED, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 16. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY COMPOSITE ABRASIVES, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 17. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY COMPOSITE ABRASIVES, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 18. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY COMPOSITE ABRASIVES, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 19. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY SILICA BASED, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 20. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY SILICA BASED, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 21. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY SILICA BASED, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 22. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY SPECIALTY ABRASIVES, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 23. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY SPECIALTY ABRASIVES, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 24. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY SPECIALTY ABRASIVES, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 25. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY WAFER SIZE, 2018-2032 (USD MILLION)
  • TABLE 26. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY 200 MM, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 27. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY 200 MM, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 28. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY 200 MM, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 29. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY 300 MM, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 30. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY 300 MM, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 31. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY 300 MM, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 32. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY BELOW 200 MM, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 33. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY BELOW 200 MM, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 34. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY BELOW 200 MM, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 35. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY PARTICLE SIZE, 2018-2032 (USD MILLION)
  • TABLE 36. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY 1-3 MM, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 37. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY 1-3 MM, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 38. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY 1-3 MM, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 39. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY ABOVE 3 MM, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 40. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY ABOVE 3 MM, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 41. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY ABOVE 3 MM, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 42. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY SUBMICRON, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 43. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY SUBMICRON, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 44. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY SUBMICRON, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 45. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 46. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY FOUNDRY SERVICES, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 47. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY FOUNDRY SERVICES, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 48. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY FOUNDRY SERVICES, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 49. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY LED DEVICES, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 50. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY LED DEVICES, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 51. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY LED DEVICES, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 52. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY LOGIC DEVICES, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 53. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY LOGIC DEVICES, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 54. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY LOGIC DEVICES, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 55. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY MEMORY DEVICES, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 56. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY MEMORY DEVICES, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 57. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY MEMORY DEVICES, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 58. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 59. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY DRAM, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 60. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY DRAM, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 61. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY DRAM, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 62. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY NAND FLASH, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 63. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY NAND FLASH, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 64. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY NAND FLASH, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 65. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY END USE INDUSTRY, 2018-2032 (USD MILLION)
  • TABLE 66. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 67. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 68. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 69. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 70. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY CONSUMER ELECTRONICS, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 71. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY CONSUMER ELECTRONICS, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 72. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY TELECOMMUNICATIONS, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 73. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY TELECOMMUNICATIONS, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 74. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY TELECOMMUNICATIONS, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 75. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 76. AMERICAS CMP MATERIALS FOR WAFERS MARKET SIZE, BY SUBREGION, 2018-2032 (USD MILLION)
  • TABLE 77. AMERICAS CMP MATERIALS FOR WAFERS MARKET SIZE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
  • TABLE 78. AMERICAS CMP MATERIALS FOR WAFERS MARKET SIZE, BY SLURRY MATERIALS, 2018-2032 (USD MILLION)
  • TABLE 79. AMERICAS CMP MATERIALS FOR WAFERS MARKET SIZE, BY WAFER SIZE, 2018-2032 (USD MILLION)
  • TABLE 80. AMERICAS CMP MATERIALS FOR WAFERS MARKET SIZE, BY PARTICLE SIZE, 2018-2032 (USD MILLION)
  • TABLE 81. AMERICAS CMP MATERIALS FOR WAFERS MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 82. AMERICAS CMP MATERIALS FOR WAFERS MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 83. AMERICAS CMP MATERIALS FOR WAFERS MARKET SIZE, BY END USE INDUSTRY, 2018-2032 (USD MILLION)
  • TABLE 84. NORTH AMERICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 85. NORTH AMERICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
  • TABLE 86. NORTH AMERICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY SLURRY MATERIALS, 2018-2032 (USD MILLION)
  • TABLE 87. NORTH AMERICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY WAFER SIZE, 2018-2032 (USD MILLION)
  • TABLE 88. NORTH AMERICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY PARTICLE SIZE, 2018-2032 (USD MILLION)
  • TABLE 89. NORTH AMERICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 90. NORTH AMERICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 91. NORTH AMERICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY END USE INDUSTRY, 2018-2032 (USD MILLION)
  • TABLE 92. LATIN AMERICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 93. LATIN AMERICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
  • TABLE 94. LATIN AMERICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY SLURRY MATERIALS, 2018-2032 (USD MILLION)
  • TABLE 95. LATIN AMERICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY WAFER SIZE, 2018-2032 (USD MILLION)
  • TABLE 96. LATIN AMERICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY PARTICLE SIZE, 2018-2032 (USD MILLION)
  • TABLE 97. LATIN AMERICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 98. LATIN AMERICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 99. LATIN AMERICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY END USE INDUSTRY, 2018-2032 (USD MILLION)
  • TABLE 100. EUROPE, MIDDLE EAST & AFRICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY SUBREGION, 2018-2032 (USD MILLION)
  • TABLE 101. EUROPE, MIDDLE EAST & AFRICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
  • TABLE 102. EUROPE, MIDDLE EAST & AFRICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY SLURRY MATERIALS, 2018-2032 (USD MILLION)
  • TABLE 103. EUROPE, MIDDLE EAST & AFRICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY WAFER SIZE, 2018-2032 (USD MILLION)
  • TABLE 104. EUROPE, MIDDLE EAST & AFRICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY PARTICLE SIZE, 2018-2032 (USD MILLION)
  • TABLE 105. EUROPE, MIDDLE EAST & AFRICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 106. EUROPE, MIDDLE EAST & AFRICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 107. EUROPE, MIDDLE EAST & AFRICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY END USE INDUSTRY, 2018-2032 (USD MILLION)
  • TABLE 108. EUROPE CMP MATERIALS FOR WAFERS MARKET SIZE, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 109. EUROPE CMP MATERIALS FOR WAFERS MARKET SIZE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
  • TABLE 110. EUROPE CMP MATERIALS FOR WAFERS MARKET SIZE, BY SLURRY MATERIALS, 2018-2032 (USD MILLION)
  • TABLE 111. EUROPE CMP MATERIALS FOR WAFERS MARKET SIZE, BY WAFER SIZE, 2018-2032 (USD MILLION)
  • TABLE 112. EUROPE CMP MATERIALS FOR WAFERS MARKET SIZE, BY PARTICLE SIZE, 2018-2032 (USD MILLION)
  • TABLE 113. EUROPE CMP MATERIALS FOR WAFERS MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 114. EUROPE CMP MATERIALS FOR WAFERS MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 115. EUROPE CMP MATERIALS FOR WAFERS MARKET SIZE, BY END USE INDUSTRY, 2018-2032 (USD MILLION)
  • TABLE 116. MIDDLE EAST CMP MATERIALS FOR WAFERS MARKET SIZE, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 117. MIDDLE EAST CMP MATERIALS FOR WAFERS MARKET SIZE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
  • TABLE 118. MIDDLE EAST CMP MATERIALS FOR WAFERS MARKET SIZE, BY SLURRY MATERIALS, 2018-2032 (USD MILLION)
  • TABLE 119. MIDDLE EAST CMP MATERIALS FOR WAFERS MARKET SIZE, BY WAFER SIZE, 2018-2032 (USD MILLION)
  • TABLE 120. MIDDLE EAST CMP MATERIALS FOR WAFERS MARKET SIZE, BY PARTICLE SIZE, 2018-2032 (USD MILLION)
  • TABLE 121. MIDDLE EAST CMP MATERIALS FOR WAFERS MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 122. MIDDLE EAST CMP MATERIALS FOR WAFERS MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 123. MIDDLE EAST CMP MATERIALS FOR WAFERS MARKET SIZE, BY END USE INDUSTRY, 2018-2032 (USD MILLION)
  • TABLE 124. AFRICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 125. AFRICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
  • TABLE 126. AFRICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY SLURRY MATERIALS, 2018-2032 (USD MILLION)
  • TABLE 127. AFRICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY WAFER SIZE, 2018-2032 (USD MILLION)
  • TABLE 128. AFRICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY PARTICLE SIZE, 2018-2032 (USD MILLION)
  • TABLE 129. AFRICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 130. AFRICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 131. AFRICA CMP MATERIALS FOR WAFERS MARKET SIZE, BY END USE INDUSTRY, 2018-2032 (USD MILLION)
  • TABLE 132. ASIA-PACIFIC CMP MATERIALS FOR WAFERS MARKET SIZE, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 133. ASIA-PACIFIC CMP MATERIALS FOR WAFERS MARKET SIZE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
  • TABLE 134. ASIA-PACIFIC CMP MATERIALS FOR WAFERS MARKET SIZE, BY SLURRY MATERIALS, 2018-2032 (USD MILLION)
  • TABLE 135. ASIA-PACIFIC CMP MATERIALS FOR WAFERS MARKET SIZE, BY WAFER SIZE, 2018-2032 (USD MILLION)
  • TABLE 136. ASIA-PACIFIC CMP MATERIALS FOR WAFERS MARKET SIZE, BY PARTICLE SIZE, 2018-2032 (USD MILLION)
  • TABLE 137. ASIA-PACIFIC CMP MATERIALS FOR WAFERS MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 138. ASIA-PACIFIC CMP MATERIALS FOR WAFERS MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 139. ASIA-PACIFIC CMP MATERIALS FOR WAFERS MARKET SIZE, BY END USE INDUSTRY, 2018-2032 (USD MILLION)
  • TABLE 140. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 141. ASEAN CMP MATERIALS FOR WAFERS MARKET SIZE, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 142. ASEAN CMP MATERIALS FOR WAFERS MARKET SIZE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
  • TABLE 143. ASEAN CMP MATERIALS FOR WAFERS MARKET SIZE, BY SLURRY MATERIALS, 2018-2032 (USD MILLION)
  • TABLE 144. ASEAN CMP MATERIALS FOR WAFERS MARKET SIZE, BY WAFER SIZE, 2018-2032 (USD MILLION)
  • TABLE 145. ASEAN CMP MATERIALS FOR WAFERS MARKET SIZE, BY PARTICLE SIZE, 2018-2032 (USD MILLION)
  • TABLE 146. ASEAN CMP MATERIALS FOR WAFERS MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 147. ASEAN CMP MATERIALS FOR WAFERS MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 148. ASEAN CMP MATERIALS FOR WAFERS MARKET SIZE, BY END USE INDUSTRY, 2018-2032 (USD MILLION)
  • TABLE 149. GCC CMP MATERIALS FOR WAFERS MARKET SIZE, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 150. GCC CMP MATERIALS FOR WAFERS MARKET SIZE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
  • TABLE 151. GCC CMP MATERIALS FOR WAFERS MARKET SIZE, BY SLURRY MATERIALS, 2018-2032 (USD MILLION)
  • TABLE 152. GCC CMP MATERIALS FOR WAFERS MARKET SIZE, BY WAFER SIZE, 2018-2032 (USD MILLION)
  • TABLE 153. GCC CMP MATERIALS FOR WAFERS MARKET SIZE, BY PARTICLE SIZE, 2018-2032 (USD MILLION)
  • TABLE 154. GCC CMP MATERIALS FOR WAFERS MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 155. GCC CMP MATERIALS FOR WAFERS MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 156. GCC CMP MATERIALS FOR WAFERS MARKET SIZE, BY END USE INDUSTRY, 2018-2032 (USD MILLION)
  • TABLE 157. EUROPEAN UNION CMP MATERIALS FOR WAFERS MARKET SIZE, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 158. EUROPEAN UNION CMP MATERIALS FOR WAFERS MARKET SIZE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
  • TABLE 159. EUROPEAN UNION CMP MATERIALS FOR WAFERS MARKET SIZE, BY SLURRY MATERIALS, 2018-2032 (USD MILLION)
  • TABLE 160. EUROPEAN UNION CMP MATERIALS FOR WAFERS MARKET SIZE, BY WAFER SIZE, 2018-2032 (USD MILLION)
  • TABLE 161. EUROPEAN UNION CMP MATERIALS FOR WAFERS MARKET SIZE, BY PARTICLE SIZE, 2018-2032 (USD MILLION)
  • TABLE 162. EUROPEAN UNION CMP MATERIALS FOR WAFERS MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 163. EUROPEAN UNION CMP MATERIALS FOR WAFERS MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 164. EUROPEAN UNION CMP MATERIALS FOR WAFERS MARKET SIZE, BY END USE INDUSTRY, 2018-2032 (USD MILLION)
  • TABLE 165. BRICS CMP MATERIALS FOR WAFERS MARKET SIZE, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 166. BRICS CMP MATERIALS FOR WAFERS MARKET SIZE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
  • TABLE 167. BRICS CMP MATERIALS FOR WAFERS MARKET SIZE, BY SLURRY MATERIALS, 2018-2032 (USD MILLION)
  • TABLE 168. BRICS CMP MATERIALS FOR WAFERS MARKET SIZE, BY WAFER SIZE, 2018-2032 (USD MILLION)
  • TABLE 169. BRICS CMP MATERIALS FOR WAFERS MARKET SIZE, BY PARTICLE SIZE, 2018-2032 (USD MILLION)
  • TABLE 170. BRICS CMP MATERIALS FOR WAFERS MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 171. BRICS CMP MATERIALS FOR WAFERS MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 172. BRICS CMP MATERIALS FOR WAFERS MARKET SIZE, BY END USE INDUSTRY, 2018-2032 (USD MILLION)
  • TABLE 173. G7 CMP MATERIALS FOR WAFERS MARKET SIZE, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 174. G7 CMP MATERIALS FOR WAFERS MARKET SIZE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
  • TABLE 175. G7 CMP MATERIALS FOR WAFERS MARKET SIZE, BY SLURRY MATERIALS, 2018-2032 (USD MILLION)
  • TABLE 176. G7 CMP MATERIALS FOR WAFERS MARKET SIZE, BY WAFER SIZE, 2018-2032 (USD MILLION)
  • TABLE 177. G7 CMP MATERIALS FOR WAFERS MARKET SIZE, BY PARTICLE SIZE, 2018-2032 (USD MILLION)
  • TABLE 178. G7 CMP MATERIALS FOR WAFERS MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 179. G7 CMP MATERIALS FOR WAFERS MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 180. G7 CMP MATERIALS FOR WAFERS MARKET SIZE, BY END USE INDUSTRY, 2018-2032 (USD MILLION)
  • TABLE 181. NATO CMP MATERIALS FOR WAFERS MARKET SIZE, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 182. NATO CMP MATERIALS FOR WAFERS MARKET SIZE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
  • TABLE 183. NATO CMP MATERIALS FOR WAFERS MARKET SIZE, BY SLURRY MATERIALS, 2018-2032 (USD MILLION)
  • TABLE 184. NATO CMP MATERIALS FOR WAFERS MARKET SIZE, BY WAFER SIZE, 2018-2032 (USD MILLION)
  • TABLE 185. NATO CMP MATERIALS FOR WAFERS MARKET SIZE, BY PARTICLE SIZE, 2018-2032 (USD MILLION)
  • TABLE 186. NATO CMP MATERIALS FOR WAFERS MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 187. NATO CMP MATERIALS FOR WAFERS MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 188. NATO CMP MATERIALS FOR WAFERS MARKET SIZE, BY END USE INDUSTRY, 2018-2032 (USD MILLION)
  • TABLE 189. GLOBAL CMP MATERIALS FOR WAFERS MARKET SIZE, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 190. UNITED STATES CMP MATERIALS FOR WAFERS MARKET SIZE, 2018-2032 (USD MILLION)
  • TABLE 191. UNITED STATES CMP MATERIALS FOR WAFERS MARKET SIZE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
  • TABLE 192. UNITED STATES CMP MATERIALS FOR WAFERS MARKET SIZE, BY SLURRY MATERIALS, 2018-2032 (USD MILLION)
  • TABLE 193. UNITED STATES CMP MATERIALS FOR WAFERS MARKET SIZE, BY WAFER SIZE, 2018-2032 (USD MILLION)
  • TABLE 194. UNITED STATES CMP MATERIALS FOR WAFERS MARKET SIZE, BY PARTICLE SIZE, 2018-2032 (USD MILLION)
  • TABLE 195. UNITED STATES CMP MATERIALS FOR WAFERS MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 196. UNITED STATES CMP MATERIALS FOR WAFERS MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 197. UNITED STATES CMP MATERIALS FOR WAFERS MARKET SIZE, BY END USE INDUSTRY, 2018-2032 (USD MILLION)
  • TABLE 198. CHINA CMP MATERIALS FOR WAFERS MARKET SIZE, 2018-2032 (USD MILLION)
  • TABLE 199. CHINA CMP MATERIALS FOR WAFERS MARKET SIZE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
  • TABLE 200. CHINA CMP MATERIALS FOR WAFERS MARKET SIZE, BY SLURRY MATERIALS, 2018-2032 (USD MILLION)
  • TABLE 201. CHINA CMP MATERIALS FOR WAFERS MARKET SIZE, BY WAFER SIZE, 2018-2032 (USD MILLION)
  • TABLE 202. CHINA CMP MATERIALS FOR WAFERS MARKET SIZE, BY PARTICLE SIZE, 2018-2032 (USD MILLION)
  • TABLE 203. CHINA CMP MATERIALS FOR WAFERS MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 204. CHINA CMP MATERIALS FOR WAFERS MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 205. CHINA CMP MATERIALS FOR WAFERS MARKET SIZE, BY END USE INDUSTRY, 2018-2032 (USD MILLION)