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市场调查报告书
商品编码
1353434
全球功率半导体市场规模、份额和行业趋势分析报告:2023-2030年按按产品、用途、材料和地区分類的展望和预测Global Power Semiconductor Market Size, Share & Industry Trends Analysis Report By Product (Power MOSFET, IGBT, Thyristor, Power Diode, and Others), By Application, By Material (SiC, GaN, and Others), By Regional Outlook and Forecast, 2023 - 2030 |
功率半导体市场规模预计到 2030 年将达到 670 亿美元,预测期内年复合成长率为 4.6%。 2022年市场规模为12.336亿台,成长率为2.7%(2019-2022年)。
根据 KBV Cardinal Matrix 发表的分析,德州仪器 (TI) 是市场领导者。 2022 年 12 月,德州仪器 (TI) 与群光电源 (Chicony Power) 建立合作伙伴关係,借助 TI 带有集成栅极促进因素的半桥GaN FET,将群光电源(Chicony Power) 的适配器尺寸缩小了50%,效率提高了高达94%。我做到了。安森美半导体公司、瑞萨电子公司和英飞凌科技公司等公司是该市场的主要创新者。
市场成长要素
电路在汽车中很重要
汽车零件、马达、空调系统和电动车中的硅基功率金属氧化物半导体场效电晶体(MOSFET)都需要电力电子电路和半导体。功率半导体通常用于包含电气零件和整合晶片的汽车设备中,例如转向、煞车、燃油分配和安全系统。碳化硅和其他高宽频半导体用于接近电路的温度区域。这些半导体减少了电路面积,具有高耐压性,并且能够实现高频开关。此外,多项技术开拓正在推动市场成长,例如线控和线控驱动技术的采用,有助于减轻汽车重量、提高燃油效率并减少排放。
消费性电子设备和无线通讯的需求正在成长
由于全球消费性电子产品的消费不断增加,该市场正在蓬勃发展。如今,许多消费产品都使用半导体,包括通讯设备(例如智慧型手机、平板电脑、智慧手錶和其他小玩意)、电脑(个人和商用电脑都有 PCB)、娱乐系统和家用电器。我需要它。智慧型手机是该领域半导体的主要消费者。近年来,由于行动电话使用量的增加,智慧型手机产业经历了激烈的竞争。互联家庭技术预计将显着推动智慧型装置的需求和物联网 (IoT) 设备的日益普及。功率半导体广泛应用于智慧型手机、平板电脑、智慧手錶、健身手环和通讯设备等便携式轻量消费性电子产品,有助于市场扩张。
市场抑制因素
SiC半导体生产网路与规划週期的复杂性
由于消费性电子设备和无线通讯设备需求增加等要素,市场正在扩大,但全球硅晶圆短缺等要素,加上投资报酬率指标,预计将对市场扩张构成威胁。然而,碳化硅半导体技术的供应链和生产流程的复杂性带来了限制,使其难以跟上不断增长的需求。促进因素以及需要具有三个连接器(+、0V、-)的特定电池可能会使其难以在便携式设备中使用。因此,这些限制可能会限制未来年度的市场扩张。
产品展望
市场依产品分为功率 MOSFET、IGBT、闸流管、功率二极体等。 2022年,功率MOSFET领域占据市场最大收入份额。功率MOSFET具有闸极驱动功率低、开关速度快、频宽高、并行度高、稳健性强、易于驱动、易于偏压、易于应用、易于维修等特点,因此是目前应用最广泛的功率半导体装置。世界。特别是,它最常用作低压开关(低于 200 V)。
应用前景
按应用划分,市场分为 IT 和通讯、电子、工业、汽车、航太和国防、医疗保健、能源和电力等。到 2022 年,能源和电力领域将在市场中占据重要的收入份额。在能源电力领域,功率半导体装置具有许多优势。为了确保成本效益,这些设备非常适合用于配电和公用事业系统,例如配电网路、输电系统和可再生能源基础设施。这些特性包括宽频隙、提高能源效率和降低冷却需求。
材质外观
依材料划分,市场分为碳化硅(SiC)、氮化镓(GaN)等。 2022年,SiC细分市场以最大的收入份额主导市场。该领域的成长是由于电动车和太阳能逆变器的普及导致碳化硅功率装置的使用不断增加。碳化硅的宽频隙能量(3.2eV)、高击穿电压和共同的临界电场有助于创造具有卓越性能的新型功率元件。
区域展望
从区域来看,我们对北美、欧洲、亚太地区和拉丁美洲地区的市场进行了分析。 2022年,亚太地区的市占率最高。亚太地区在全球半导体产业中占据主导地位,随着政府立法的支持,该市场预计将扩大。越南、泰国、马来西亚和新加坡是对该地区市场份额贡献显着的国家。因此,政府目前的「印度製造」计画预计将带来对半导体产业的投资。
The Global Power Semiconductor Market size is expected to reach $67 billion by 2030, rising at a market growth of 4.6% CAGR during the forecast period. In the year 2022, the market attained a volume of 1,233.6 million units, experiencing a growth of 2.7% (2019-2022).
Power semiconductors are often found in automotive equipment, including steering, braking, fuel distribution, and safety systems with electrical components and integrated chips. Thus, the Automotive segment captured $1,709.7 million revenue in the year 2022. Power semiconductors aid in the need for high-efficiency power conversion, the development of advanced lighting systems, and the implementation of stricter emission regulations. The rapid adoption of electric and hybrid vehicles, improvements in autonomous driving technology, and rising demand for vehicle connectivity and V2X communication are propelling the growth of this segment. Additionally, power semiconductors aid in the need for high-efficiency power conversion, the development of advanced lighting systems, and the implementation of stricter emission regulations.
The major strategies followed by the market participants are Partnerships as the key developmental strategy to keep pace with the changing demands of end users. For instance, In July, 2023, Onsemi joined hands with BorgWarner Inc., to enhance the performance of electric vehicles. Additionally, In February, 2023, Infineon Technologies teamed up with Infinitum, to bring enhanced energy-efficient motor controls with silicon carbide and other materials to the market.
Based on the Analysis presented in the KBV Cardinal matrix; Texas Instruments Inc. is the forerunners in the Market. In December, 2022, Texas Instruments signed a partnership with Chicony Power, to decrease the size of the chicony's adapter by 50% and enhance efficiency by up to 94% with the help of TI's half-bridge GaN FET with an integrated gate driver. Companies such as ON Semiconductor Corporation, Renesas Electronics Corporation, and Infineon Technologies AG are some of the key innovators in the Market.
Market Growth Factors
Circuits are crucial in the automotive industry
Automobile components, motors, air conditioning systems, and silicon-based power metal-oxide-semiconductor field-effect transistors (MOSFETs) in electric vehicles all require power electronic circuits and semiconductors. Power semiconductors are often found in automotive equipment, including steering, braking, fuel distribution, and safety systems with electrical components and integrated chips. Silicon carbide and other high wideband semiconductors are used close to temperature sites in circuits. They reduce the circuit area, have high breakdown voltage, and allow switching at higher frequencies. Additionally, several technological developments are boosting market growth, such as using x-by-wire or drive-by-wire technologies that help reduce vehicle weight, fuel efficiency, and emissions.
Consumer electronics and wireless communications are in greater demand
The market is growing favourably due to the rising consumption of consumer electronics products worldwide. Today, many consumer products, including communication devices (such as smartphones, tablets, smartwatches, and other gadgets), computers (personal and corporate computers feature PCBs), entertainment systems, and home appliances, require semiconductors. The smartphone is the main consumer of semiconductors in this sector. The smartphone industry has experienced intense competition in recent years due to increased mobile phone usage. The demand for smart devices and the growing use of Internet of Things (IoT) devices are expected to be significantly fuelled by connected home technology. The power semiconductor's widespread use in portable, lightweight consumer gadgets, including smartphones, tablets, smartwatches, fitness bands, and communication devices, contributes to the market's expansion.
Market Restraining Factors
Complexity of the SiC semiconductor production network and planning cycle
While the market is expanding as a result of factors like increased consumer electronics and wireless communication devices' demand, factors such as the global silicon wafer shortage combined with ROI metrics, are predicted to pose a threat to that expansion. However, the intricacy of the SiC semiconductor technology's supply chain and production process is a constraint that could make it difficult to keep up with the rising demand. Due to the requirement for additional DC-DC drivers or specific batteries with three connectors (+, 0V, and -) could make it difficult for them to be used in portable equipment. Therefore, these constraints may limit market expansion in the coming years.
Product Outlook
Based on product, the market is segmented into power MOSFET, IGBT, thyristor, power diode, and others. In 2022, the power MOSFET segment witnessed the largest revenue share in the market. The power MOSFET is the world's most widely used power semiconductor device because of its low gate drive power, quick switching speed, wide bandwidth, simple advanced paralleling capability, robustness, easy drive, easy biasing, simplicity of application, and ease of repair. It is particularly the most often used low-voltage switch (less than 200 V).
Application Outlook
On the basis of application, the market is classified into IT & telecom, electronics, industrial, automotive, aerospace & defence, healthcare, energy & power, and others. The energy & power segment covered a considerable revenue share in the market in 2022. In the energy & power sector, power semiconductor devices have many advantages. To ensure cost-effectiveness, these devices are ideal for use in power distribution and utility systems, such as distribution grids, transmission systems, and renewable energy infrastructure. These features include a wide band gap, enhanced energy efficiency, and reduced cooling requirements.
Material Outlook
Based on material, the market is classified into silicon carbide (SiC), gallium nitride (GaN), and others. In 2022, the SiC segment dominated the market with the maximum revenue share. The growth of the segment is owed to the increasing usage of SiC power devices along with the increased popularity of electric vehicles and photovoltaic inverters. In order to create novel power devices with excellent performance, it is convenient to take advantage of silicon carbide's wider bandgap energy (3.2eV), high breakdown voltage, and usual critical electric field.
Regional Outlook
Region wise, the market is analysed across North America, Europe, Asia Pacific, and LAMEA. In 2022, the Asia Pacific region generated the highest revenue share in the market. The market will expand in the Asia Pacific region due to the region's dominance in the global semiconductor industry and the support of government laws. Vietnam, Thailand, Malaysia, and Singapore are some nations that considerably contribute to the region's market share. As a result, the government's present Make in India initiative is anticipated to lead to investments in the semiconductor industry.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Infineon Technologies AG. Texas Instruments Inc., STMicroelectronics N.V., NXP Semiconductors N.V., ON Semiconductor Corporation, Mitsubishi Electric Corporation, Renesas Electronics Corporation, Toshiba Corporation, Fuji Electric Co., Ltd. and Hitachi, Ltd.
Recent Strategies Deployed in Power Semiconductor Market
Partnerships, Collaborations and Agreements:
Jul-2023: onsemi joined hands with BorgWarner Inc., a global company engaged in offering advanced sustainable mobility solutions. Through this collaboration, BorgWarner would combine onsemi EliteSiC 1200 V and 750 V power devices into its VIPER power modules for solutions of its traction inverter to enhance the performance of electric vehicles.
Jun-2023: Renesas Electronics Corporation collaborated with Nidec Corporation, a Japanese manufacturer and distributor of electric motors. This collaboration aims to develop the semiconductor solutions for E-Axle (X-in-1 system) that combines power electronics and an EV drive motor for electric vehicles (EVs).
Feb-2023: Infineon Technologies teamed up with Infinitum, a creator of the breakthrough, sustainable air core motor. The collaboration aims to bring enhanced energy-efficient motor controls with silicon carbide and other materials to the market.
Jan-2023: Infineon Technologies AG came into partnership with Resonac Corporation, a Japan-based chemical company. Under this partnership, companies would go on with the supply of SiC materials for power semiconductors to Infineon and together develop technologies related to SiC materials.
Dec-2022: NXP Semiconductors came into an agreement with Delta Electronics, Inc., a provider of power and thermal management solutions globally. Under this collaboration, both companies would develop traction inverter and power conversion platforms for next-generation electric vehicles.
Dec-2022: Texas Instruments signed a partnership with Chicony Power, a manufacturer, and marketer of power supplies and LED lighting products. Following this partnership, companies would design 65-W laptop power adapters. Furthermore, both companies would decrease the size of the chicony's adapter by 50% and enhance efficiency by up to 94% with the help of TI's half-bridge GaN FET with an integrated gate driver.
Sep-2022: Renesas Electronics Corporation signed an agreement with VinFast, a Vietnam-based global EV maker. This agreement would include the development of automotive technology for electric vehicles (EVs) and delivery of system components. Moreover, Renesas would offer a wide range of products to VinFast, which consists of SoCs, microcontrollers, analog and power semiconductors.
Jul-2022: STMicroelectronics N.V. partnered with GlobalFoundries Inc., a global semiconductor contract manufacturing and design company. Under this partnership, companies would aim to open a brand new, high-volume semiconductor manufacturing facility in Crolles (France). This partnership helped STMicroelectronics to expand its feet in the French market. Additionally, it will reinforce the European and French FD-SOI ecosystem.
Jun-2022: Renesas Electronics Corporation partnered with Tata Motors Ltd. (TML) and Tejas Networks Ltd., both subsidiaries of Tata Group, an India-based global company. Under this partnership, both companies aim to enhance semiconductor solutions across electronic systems for Indian and growing markets. Additionally, both companies accelerated the growth in advanced electronics and its multitudes of applications for the market.
Mar-2022: NXP teamed up with Hitachi Energy, a global technology company engaged in advancing a sustainable energy future. Following this collaboration, both companies would integrate NXP's GD3160 isolated gate driver and Hitachi Energy's RoadPak SiC power modules to bring reliable, functionally safe, and efficient ePowertrains to commercialize more rapidly.
Product Launches and Product Expansion:
Dec-2022: Toshiba introduced TK055U60Z1, the first MOSFET of the 600V DTMOSVI series. The launched product provides a 13 percent RDS (on) advancement over similar devices released in its earlier DTMOSIV-H series.
May-2022: Hitachi Energy released RoadPak, a leading power semiconductor module for electric vehicles. The RoadPak module utilizes advanced silicon carbide (SiC) technology to achieve outstanding levels of power density for reliability, faster charging, over the vehicle's lifetime, and the minimum possible power losses for the highest potential driving range.
Acquisitions and Mergers:
Feb-2023: Mitsubishi Electric Corporation completed the acquisition of Scibreak AB, a Sweden-based company engaged in commercializing new technology for interrupting electric current. Through this acquisition, both companies would work together on developing DCCB technologies for high-voltage direct current (HVDC) systems, and Mitsubishi Electric utilizing Scibreak's technology.
Nov-2021: onsemi acquired GT Advanced Technologies, a company engaged in providing silicon carbide (SiC). This acquisition strengthens onsemi's capability to secure and grow the supply of SiC. Moreover, the acquisition empowers onsemi's ability to propel innovation and invest in dynamic, high-growth technologies.
Jun-2021: Texas Instruments Incorporated signed an agreement to acquire the 300-mm semiconductor factory of Micron Technology, a company specializing in innovative memory and storage solutions. This acquisition strengthens competitive advantage in manufacturing and technology and is part of long-term capacity planning.
Geographical Expansions:
Sep-2021: Infineon opened a new facility in Villach, Austria. The high-tech chip factory for power electronics on 300-millimeter thin wafers aims to fulfil the growing demand for power semiconductors. Moreover, the additional capacity would help Infineon to serve its customers globally.
Market Segments covered in the Report:
By Product (Volume, Million Units, USD Million, 2019-2030)
By Application (Volume, Million Units, USD Million, 2019-2030)
By Material (Volume, Million Units, USD Million, 2019-2030)
By Geography (Volume, Million Units, USD Million, 2019-2030)
Companies Profiled
Unique Offerings from KBV Research