晶圆检测设备市场 - 2024 年至 2029 年预测

晶圆检测设备市场预计将从2022年的2,628,062,000美元增加到2029年的4,154,244,000美元，复合年增长率为6.76%。

晶圆检测设备市场受到多种因素的推动，最显着的是人工智慧、5G 和自动驾驶汽车等应用推动的对先进半导体的需求不断增长。

对先进晶片的需求激增正在推动对高科技晶圆检测解决方案的需求。电子束检测 (E-Beam)、X 光检测和人工智慧缺陷分析等先进检测技术正在彻底改变产业的准确性和效率。

蓬勃发展的半导体製造业正在推动市场成长。

由于小型化设备的采用趋势不断增加以及关键地区（尤其是亚太地区）半导体生产的蓬勃发展，晶圆检测设备市场预计将以稳定的速度成长。此外，日立和东丽等大公司对晶圆检测技术的积极投资也进一步加速了市场成长。

研究机构、测试设备製造商和晶片製造商之间的合作正在加速先进测试解决方案的进步和接受度。此外，半导体产业协会（SIA）报告称，2023 年 10 月全球半导体产业销售额达 466 亿美元。与 2023 年 9 月的总额 449 亿美元相比，成长了 3.9%，但比 2022 年 10 月的总额 469 亿美元略有下降 0.7%。根据半导体产业团体预测，2022年半导体销售额将达到前所未有的5,740亿美元。这项记录凸显了晶圆检测设备对于确保整个製造过程的品管和可靠性的重要性。

此外，由于这些因素的累积影响，晶圆检测设备市场可望显着成长。透过认识并适应这些驱动因素和新兴趋势，相关人员可以重新制定策略，并为不断发展的半导体产业尖端检测解决方案的持续发展做出贡献。

主要市场开拓：

• 2023 年 12 月，日立高科发布了 DI4600 暗场晶圆缺陷检测系统，旨在提高图案晶圆缺陷检测的吞吐量和准确性。 DI4600升级了侦测能力。
• 2023年11月，Spirox Co., Ltd.与其子公司Southport Co., Ltd.合作，发布了革命性的无损缺陷检测设备JadeSiC-NK。它利用最先进的非线性光学技术，能够对 SiC基板进行全面扫描，精确定位整个晶圆的关键缺陷，而不会造成损坏。

主要企业

• 日立有限公司是全球领先的晶圆检测设备供应商之一。本公司的「LS系列」能够以高吞吐量侦测各种微小异物。
• 东丽晶圆检测设备提供了改进的快速检测性能，尤其是“INSPECTRA”系列。
• Sonics 自动和手动晶圆侦测系统的范围从 100mm 到 300mm，并提供广泛的分析功能。

目录

第一章 简介

• 市场概况
• 市场定义
• 调查范围
• 市场区隔
• 货币
• 先决条件
• 基准年和预测年时间表
• 相关人员的主要利益

第二章调查方法

• 研究设计
• 调查过程

第三章执行摘要

• 主要发现
• 分析师观点

第四章市场动态

• 市场驱动因素
• 市场限制因素
• 波特五力分析
• 产业价值链分析
• 分析师观点

第五章晶圆检测设备市场：依类型

• 介绍
• 图案化晶圆检测设备
  • 市场趋势和机会
  • 成长前景
  • 地理盈利和见解
• 无图案晶圆检测设备
  • 市场趋势和机会
  • 成长前景
  • 地理盈利和见解

第六章晶圆检测设备市场：依技术分类

• 介绍
• 电子束检查
  • 市场趋势和机会
  • 成长前景
  • 地理盈利和见解
• 光学检定
  • 市场趋势和机会
  • 成长前景
  • 地理盈利和见解

第七章晶圆检测设备市场：按地区

• 介绍
• 北美洲
  • 按类型
  • 依技术
  • 按国家/地区
• 南美洲
  • 按类型
  • 依技术
  • 按国家/地区
• 欧洲
  • 按类型
  • 依技术
  • 按国家/地区
• 中东/非洲
  • 按类型
  • 依技术
  • 按国家/地区
• 亚太地区
  • 按类型
  • 依技术
  • 按国家/地区

第八章竞争环境及分析

• 主要企业及策略分析
• 市场占有率分析
• 合併、收购、协议和合作
• 竞争仪表板

第九章 公司简介

• KLA Corporation
• Rudolph Technologies, Inc.
• ASML Holdings NV
• Hitachi, Ltd.
• Applied Materials, Inc.
• Toray Industries.
• Microtronic, Inc.
• Sonix Inc.

The wafer inspection equipment market is projected to rise at a compound annual growth rate (CAGR) of 6.76% to reach a market valuation of US$4,154.244 million by 2029, from US$2,628.062 million in 2022.

The Wafer Inspection Equipment Market is being propelled by various factors, with a notable one being the escalating demand for advanced semiconductors, particularly driven by applications such as AI, 5G, and autonomous vehicles.

This surge in demand for sophisticated chips is intensifying the need for high-tech wafer inspection solutions. Advanced inspection technologies like Electron Beam Inspection (E-Beam), X-ray inspection, and AI-powered defect analysis are revolutionizing accuracy and efficiency in the industry.

Booming semiconductor manufacturing has stimulated market growth.

The wafer inspection equipment market is predicted to grow at a steady growth rate which is attributable to the growing trend of miniaturized devices adoption coupled with the booming semiconductor production in major regions, especially Asia Pacific. In addition, favorable investments in wafer detection technology by major players such as Hitachi, and Toray Industries have further caused an upward market trajectory.

Collaborations between research institutions, inspection equipment manufacturers, and chipmakers are accelerating the advancement and acceptance of pioneering inspection solutions. Moreover, the Semiconductor Industry Association (SIA) Reported That worldwide semiconductor industry sales reached $46.6 billion in October 2023. This represents a 3.9% rise compared to September 2023's total of $44.9 billion but a slight decrease of 0.7% from October 2022's total of $46.9 billion. Notably, the semiconductor industry has witnessed remarkable growth, with semiconductor sales reaching an unprecedented $574 billion in 2022 according to a semiconductor industry association. This record underscores the significance of wafer inspection equipment in ensuring quality control and reliability throughout the manufacturing process.

Furthermore, the wafer inspection equipment market is poised for significant growth, driven by the cumulative impact of these factors. Recognizing and adapting to these drivers and emerging trends will enable stakeholders to refine their strategies and contribute to the ongoing advancement of cutting-edge inspection solutions for the ever-evolving semiconductor industry.

Key Market Developments:

• December 2023, Hitachi High-Tech introduced the DI4600 Dark Field Wafer Defect Inspection System, aiming to deliver enhanced throughput and precision in detecting defects on patterned wafers. The DI4600 has upgraded detection capabilities. It has faster wafer transfer times and enhanced operational efficiency during inspection processes.
• November 2023, Spirox Corporation, in partnership with its subsidiary Southport Corporation, unveiled the groundbreaking JadeSiC-NK non-destructive defect inspection system. Utilizing cutting-edge non-linear optical technology, enables comprehensive scanning of SiC substrates, pinpointing critical defects throughout the entire wafer without causing damage.

Key Players:

• Hitachi Ltd. is among the leading global providers of wafer inspection equipment. The company's "LS Series" provides throughput detection of various types of small contaminants.
• Toray Industries wafer inspection equipment offers improve and swift inspection performance, especially its "INSPECTRA" series.
• Sonix Inc.'s automated and manual wafer inspection system ranges from 100mm to 300mm and provides extensive analytical capabilities.

Segmentation:

By Type

• Patterned Wafer Inspection System
• Non-Patterned Wafer Inspection System

By Technology

• E-Beam Inspection
• Optical Inspection

By Geography

• North America
• USA
• Canada
• Mexico
• South America
• Brazil
• Others
• Europe
• Germany
• France
• United Kingdom
• Others
• Middle East and Africa
• Israel
• Others
• Asia Pacific
• China
• Japan
• South Korea
• Taiwan
• Others

TABLE OF CONTENTS

1. INTRODUCTION

• 1.1. Market Overview
• 1.2. Market Definition
• 1.3. Scope of the Study
• 1.4. Market Segmentation
• 1.5. Currency
• 1.6. Assumptions
• 1.7. Base, and Forecast Years Timeline
• 1.8. Key benefits for the stakeholders

2. RESEARCH METHODOLOGY

• 2.1. Research Design
• 2.2. Research Process

3. EXECUTIVE SUMMARY

• 3.1. Key Findings
• 3.2. Analyst View

4. MARKET DYNAMICS

• 4.1. Market Drivers
• 4.2. Market Restraints
• 4.3. Porter's Five Forces Analysis
  • 4.3.1. Bargaining Power of Suppliers
  • 4.3.2. Bargaining Power of Buyers
  • 4.3.3. Threat of New Entrants
  • 4.3.4. Threat of Substitutes
  • 4.3.5. Competitive Rivalry in the Industry
• 4.4. Industry Value Chain Analysis
• 4.5. Analyst View

5. WAFER INSPECTION EQUIPMENT MARKET BY TYPE

• 5.1. Introduction
• 5.2. Patterned Wafer Inspection System
  • 5.2.1. Market Trends and Opportunities
  • 5.2.2. Growth Prospects
  • 5.2.3. Geographic Lucrativeness and Insights
• 5.3. Non-Patterned Wafer Inspection System
  • 5.3.1. Market Trends and Opportunities
  • 5.3.2. Growth Prospects
  • 5.3.3. Geographic Lucrativeness and Insights

6. WAFER INSPECTION EQUIPMENT MARKET BY TECHNOLOGY

• 6.1. Introduction
• 6.2. E-Beam Inspection
  • 6.2.1. Market Trends and Opportunities
  • 6.2.2. Growth Prospects
  • 6.2.3. Geographic Lucrativeness and Insights
• 6.3. Optical Inspection
  • 6.3.1. Market Trends and Opportunities
  • 6.3.2. Growth Prospects
  • 6.3.3. Geographic Lucrativeness and Insights

7. WAFER INSPECTION EQUIPMENT MARKET BY GEOGRAPHY

• 7.1. Introduction
• 7.2. North America
  • 7.2.1. By Type
  • 7.2.2. By Technology
  • 7.2.3. By Country
    • 7.2.3.1. USA
      • 7.2.3.1.1. Market Trends and Opportunities
      • 7.2.3.1.2. Growth Prospects
    • 7.2.3.2. Canada
      • 7.2.3.2.1. Market Trends and Opportunities
      • 7.2.3.2.2. Growth Prospects
    • 7.2.3.3. Mexico
      • 7.2.3.3.1. Market Trends and Opportunities
      • 7.2.3.3.2. Growth Prospects
• 7.3. South America
  • 7.3.1. By Type
  • 7.3.2. By Technology
  • 7.3.3. By Country
    • 7.3.3.1. Brazil
      • 7.3.3.1.1. Market Trends and Opportunities
      • 7.3.3.1.2. Growth Prospects
    • 7.3.3.2. Others
      • 7.3.3.2.1. Market Trends and Opportunities
      • 7.3.3.2.2. Growth Prospects
• 7.4. Europe
  • 7.4.1. By Type
  • 7.4.2. By Technology
  • 7.4.3. By Country
    • 7.4.3.1. Germany
      • 7.4.3.1.1. Market Trends and Opportunities
      • 7.4.3.1.2. Growth Prospects
    • 7.4.3.2. France
      • 7.4.3.2.1. Market Trends and Opportunities
      • 7.4.3.2.2. Growth Prospects
    • 7.4.3.3. United Kingdom
      • 7.4.3.3.1. Market Trends and Opportunities
      • 7.4.3.3.2. Growth Prospects
    • 7.4.3.4. Others
      • 7.4.3.4.1. Market Trends and Opportunities
      • 7.4.3.4.2. Growth Prospects
• 7.5. Middle East and Africa
  • 7.5.1. By Type
  • 7.5.2. By Technology
  • 7.5.3. By Country
    • 7.5.3.1. Israel
      • 7.5.3.1.1. Market Trends and Opportunities
      • 7.5.3.1.2. Growth Prospects
    • 7.5.3.2. Others
      • 7.5.3.2.1. Market Trends and Opportunities
      • 7.5.3.2.2. Growth Prospects
• 7.6. Asia Pacific
  • 7.6.1. By Type
  • 7.6.2. By Technology
  • 7.6.3. By Country
    • 7.6.3.1. China
      • 7.6.3.1.1. Market Trends and Opportunities
      • 7.6.3.1.2. Growth Prospects
    • 7.6.3.2. Japan
      • 7.6.3.2.1. Market Trends and Opportunities
      • 7.6.3.2.2. Growth Prospects
    • 7.6.3.3. South Korea
      • 7.6.3.3.1. Market Trends and Opportunities
      • 7.6.3.3.2. Growth Prospects
    • 7.6.3.4. Taiwan
      • 7.6.3.4.1. Market Trends and Opportunities
      • 7.6.3.4.2. Growth Prospects
    • 7.6.3.5. Others
      • 7.6.3.5.1. Market Trends and Opportunities
      • 7.6.3.5.2. Growth Prospects

8. COMPETITIVE ENVIRONMENT AND ANALYSIS

• 8.1. Major Players and Strategy Analysis
• 8.2. Market Share Analysis
• 8.3. Mergers, Acquisitions, Agreements, and Collaborations
• 8.4. Competitive Dashboard

9. COMPANY PROFILES

• 9.1. KLA Corporation
• 9.2. Rudolph Technologies, Inc.
• 9.3. ASML Holdings N.V.
• 9.4. Hitachi, Ltd.
• 9.5. Applied Materials, Inc.
• 9.6. Toray Industries.
• 9.7. Microtronic, Inc.
• 9.8. Sonix Inc.