扇出型封装市场：2025-2030 年预测

在 2022-2030 年的预测期内，扇出型封装市场将以 9.78% 的复合年增长率成长。

任何具有从晶片表面向外展开的连接以容纳更多外部 I/O 的封装都称为扇出型封装。在传统的扇出型封装中，晶粒完全浸入环氧模塑胶中，而不是放置在基板或内插器上。它们正在迅速取代更老、更成熟的封装层（PoP）和逻辑记忆体系统。此外，人工智慧和机器学习在多个行业中的应用日益广泛，推动了高效能运算的采用。

市场趋势：

• ECP 技术推动扇出型封装：预计在整个预测期内，扇出型封装解决方案市场将受到封装晶片封装 (ECP) 技术整合的推动。自从网路和多媒体出现以来，透过积体电路实现电子设备的小型化已经成为现代生活的必需品。
• 主要特点和应用：此技术依赖巨柱镀层和线路重布(RDL) 金属等关键元素。针对应用处理器 (AP) 等高脚位应用，该公司将把 inFO-Antenna-in-Package (AiP) 和 inFO-on-Substrate 创新融入扇出型晶圆级封装 (FO-WLP) 产品中。这些解决方案广泛应用于汽车、伺服器、智慧型手机等领域。
• 亚太地区：受中国、日本、印度和韩国等经济强国的推动，亚太地区是该市场的主要参与者。台湾是全球最大半导体製造商的所在地，推动先进封装解决方案（尤其是 PLP）的需求。据半导体行业协会（SIA）称，该地区占全球半导体销售额的 50% 以上，使台湾製造商能够满足日益增长的半导体需求。许多台湾公司正在扩大扇出型封装生产，以加强出口并支持区域市场的成长。

报告中介绍的主要企业包括台积电有限公司、力成科技股份有限公司、安靠科技股份有限公司、日月光股份有限公司、INTEVAC、Camtek、恩智浦半导体、Deca Technologies、长电科技等。

本报告的主要优点

• 深刻分析：获得涵盖主要和新兴地区的深入市场洞察，重点关注客户群、政府政策和社会经济因素、消费者偏好、垂直行业和其他子区隔。
• 竞争格局：了解全球主要企业所采用的策略策略，并了解正确策略带来的潜在市场渗透。
• 市场趋势和驱动因素：探索动态因素和关键市场趋势以及它们将如何影响市场的未来发展。
• 可行的建议：利用洞察力进行策略决策，在动态环境中开闢新的业务流和收益。
• 受众广泛：对于新兴企业、研究机构、顾问公司、中小企业和大型企业都有益且具有成本效益。

它有什么用途？

产业和市场考量、商业机会评估、产品需求预测、打入市场策略、地理扩张、资本支出决策、法律规范与影响、新产品开发、竞争影响

研究范围

• 2022 年至 2024 年的历史数据和 2025 年至 2030 年的预测数据
• 成长机会、挑战、供应链前景、法律规范与趋势分析
• 竞争定位、策略和市场占有率分析
• 收益成长和预测分析（包括国家在内的细分市场和地区）
• 公司概况（策略、产品、财务资讯、主要趋势等）

目录

第一章执行摘要

第二章市场概述

• 市场概览
• 市场定义
• 研究范围
• 市场区隔

第三章 商业景气

• 市场驱动因素
• 市场限制
• 市场机会
• 波特五力分析
• 产业价值链分析
• 政策法规
• 策略建议

第四章 技术展望

第五章 扇出型封装市场（依类型）

• 介绍
• 核心扇出
• 高密度扇出
• 超高密度扇出

第六章 扇出型封装市场（依载体尺寸）

• 介绍
• 300mm
• 600mm
• 其他的

第七章 扇出型封装市场（依材料类型）

• 介绍
• 基板
• 封装材料
• 线路重布(RDL) 材料
• 其他的

第八章 扇出型封装市场（依最终用户）

• 介绍
• 铸件
• 整合设备製造商 (IDM)
• 外包半导体组装和测试（OSAT）

第九章 扇出型封装市场（依地区）

• 介绍
• 美洲
  • 美国
• 欧洲、中东和非洲
  • 德国
  • 荷兰
  • 其他的
• 亚太地区
  • 中国
  • 日本
  • 台湾
  • 韩国
  • 其他的

第十章竞争格局及分析

• 主要企业和策略分析
• 市场占有率分析
• 合併、收购、协议和合作
• 竞争仪錶板

第十一章 公司简介

• TSMC Ltd.
• Powertech Technology Inc.
• Amkor Technology Inc.
• ASE Inc.
• INTEVAC
• Camtek
• NXP Semiconductors
• Deca Technologies
• JCET Global

第十二章 附录

• 货币
• 先决条件
• 基准年和预测年时间表
• 相关人员的主要利益
• 调查方法
• 简称

The Fan-Out Packaging Market will grow at a CAGR of 9.78% during the forecast period of 2022-2030.

Any package with connections fanning out from the chip surface to accommodate more external I/Os is referred to as fan-out packaging. The dies are completely submerged in an epoxy mold compound with conventional fan-out packaging rather than placed on a substrate or interposer. They are rapidly replacing the older, more established package-on-package (PoP), memory-on-logic systems. Additionally, the market's adoption of high-performance computing has expanded due to the growing use of artificial intelligence and machine learning in several industries.

Market Trends:

• Boost from ECP Technology in Fan-Out Packaging: The Fan-Out Packaging Solutions market is set to experience growth spurred by the integration of Encapsulated Chip Package (ECP) technology throughout the forecast period. Since the advent of the Internet and multimedia, the miniaturization of electronics through integrated circuits has become integral to modern life.
• Key Features and Applications: This technology relies on critical elements like mega pillar plating and redistribution layer (RDL) metal. It targets high-pin-count applications, such as application processors (AP), with companies planning to incorporate inFO-Antenna-in-Package (AiP) and inFO-on-Substrate innovations into their Fan-Out Wafer Level Packaging (FO-WLP) offerings. These solutions are widely used in automobiles, servers, and smartphones. Additionally, firms are refining fabrication techniques for High-Density Fan-Out Wafer Level Packaging (FOWLP) to meet rising demand.
• Asia-Pacific: The Asia-Pacific region, led by economic powerhouses like China, Japan, India, and South Korea, is a key player in this market. Taiwan, home to some of the world's largest semiconductor producers, drives demand for advanced packaging solutions, particularly in PLPs. According to the Semiconductor Industry Association (SIA), the region accounts for over 50% of global semiconductor sales, enabling Taiwanese manufacturers to supply FOWLP for expanding semiconductor needs. Many companies in Taiwan are ramping up fan-out packaging production, enhancing exports and supporting regional market growth.

Some of the major players covered in this report include TSMC Limited, Powertech Technology Inc, Amkor Technology Inc, ASE Inc, INTEVAC, Camtek, NXP Semiconductor, Deca Technologies, and JCET Global, among others:

Key Benefits of this Report:

• Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
• Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
• Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
• Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
• Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

What do businesses use our reports for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

• Historical data from 2022 to 2024 & forecast data from 2025 to 2030
• Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
• Competitive Positioning, Strategies, and Market Share Analysis
• Revenue Growth and Forecast Assessment of segments and regions including countries
• Company Profiling (Strategies, Products, Financial Information, and Key Developments among others)

Fan-Out Packaging Market Segmentation:

By Type

• Core Fan-out
• High-density Fan-out
• Ultra-high-density Fan-out

By Carrier Size

• 300mm
• 600mm
• Others

By Material Type

• Substrate Materials
• Encapsulation Materials
• Redistribution Layer (RDL) Materials
• Others

By End-User

• Foundries
• Integrated Device Manufacturers (IDM)
• Outsourced Semiconductor Assembly and Test (OSAT)

By Region

• Americas
• USA
• Europe, Middle East, and Africa
• Germany
• Netherlandss
• Others
• Asia Pacific
• China
• Japan
• Taiwan
• South Korea
• Others

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

2. MARKET SNAPSHOT

• 2.1. Market Overview
• 2.2. Market Definition
• 2.3. Scope of the Study
• 2.4. Market Segmentation

3. BUSINESS LANDSCAPE

• 3.1. Market Drivers
• 3.2. Market Restraints
• 3.3. Market Opportunities
• 3.4. Porter's Five Forces Analysis
• 3.5. Industry Value Chain Analysis
• 3.6. Policies and Regulations
• 3.7. Strategic Recommendations

4. TECHNOLOGICAL OUTLOOK

5. FAN-OUT PACKAGING MARKET BY TYPE

• 5.1. Introduction
• 5.2. Core Fan-out
• 5.3. High-density Fan-out
• 5.4. Ultra-high-density Fan-out

6. FAN-OUT PACKAGING MARKET BY CARRIER SIZE

• 6.1. Introduction
• 6.2. 300mm
• 6.3. 600mm
• 6.4. Others

7. FAN-OUT PACKAGING MARKET BY MATERIAL TYPE

• 7.1. Introduction
• 7.2. Substrate Materials
• 7.3. Encapsulation Materials
• 7.4. Redistribution Layer (RDL) Materials
• 7.5. Others

8. FAN-OUT PACKAGING MARKET BY END-USER

• 8.1. Introduction
• 8.2. Foundries
• 8.3. Integrated Device Manufacturers (IDM)
• 8.4. Outsourced Semiconductor Assembly and Test (OSAT)

9. FAN-OUT PACKAGING MARKET BY GEOGRAPHY

• 9.1. Introduction
• 9.2. Americas
  • 9.2.1. USA
• 9.3. Europe, Middle East, and Africa
  • 9.3.1. Germany
  • 9.3.2. Netherlandss
  • 9.3.3. Others
• 9.4. Asia Pacific
  • 9.4.1. China
  • 9.4.2. Japan
  • 9.4.3. Taiwan
  • 9.4.4. South Korea
  • 9.4.5. Others

10. COMPETITIVE ENVIRONMENT AND ANALYSIS

• 10.1. Major Players and Strategy Analysis
• 10.2. Market Share Analysis
• 10.3. Mergers, Acquisitions, Agreements, and Collaborations
• 10.4. Competitive Dashboard

11. COMPANY PROFILES

• 11.1. TSMC Ltd.
• 11.2. Powertech Technology Inc.
• 11.3. Amkor Technology Inc.
• 11.4. ASE Inc.
• 11.5. INTEVAC
• 11.6. Camtek
• 11.7. NXP Semiconductors
• 11.8. Deca Technologies
• 11.9. JCET Global

12. APPENDIX

• 12.1. Currency
• 12.2. Assumptions
• 12.3. Base and Forecast Years Timeline
• 12.4. Key benefits for the stakeholders
• 12.5. Research Methodology
• 12.6. Abbreviations