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市场调查报告书
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1698495

半导体后端设备市场：未来预测（2025-2030年）

Semiconductor Back-End Equipment Market - Forecasts from 2025 to 2030
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 155 Pages | 商品交期: 最快1-2个工作天内

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简介目录

预计半导体后端设备市场将以 6.89% 的复合年增长率成长，从 2025 年的 1,130.06 亿美元成长到 2030 年的 1,576.93 亿美元。

由于笔记型电脑、数位相机和智慧型手机等电子产品对小型设备的需求不断增加及其功能的不断发展，预计市场将会扩大。随着积体电路（IC）设计变得越来越复杂，并且需要引入更多的半导体产品来製造IC，对半导体后端设备的需求正在稳步增长。半导体用于积体电路开发，以降低成本、加快大规模生产并提高成品的营运价值。

市场趋势：

  • 半导体需求快速成长：受各工业领域应用不断扩大的推动，全球对半导体的需求持续成长。新兴企业和年轻公司越来越多地转向原始设计製造商 (ODM) 和外包半导体组装和测试 (OSAT) 供应商来满足其产品开发和生产需求。为了减少对海外供应商的依赖，世界各国政府都优先考虑本地半导体製造，鼓励现有製造商的直接投资，并提供一个支持性的法规结构。例如，半导体产业协会（SIA）报告称，2024年全球半导体销售额将达到6,276亿美元，较2023年的5,268亿美元成长19.1%。
  • 製造业需求不断增长：半导体製造设备对于生产半导体晶圆、IC晶片、储存晶片、电路和其他组件至关重要。硅晶圆製造设备在製造的早期阶段发挥关键作用，而晶圆加工设备——包括微影术、蚀刻、化学气相沉积、计量和製程/品管设备——对工作流程至关重要。由于各种终端用户应用对分立元件、功率半导体和高功率模组的需求不断增加，预计半导体后端设备市场将会扩大。此外，将多种半导体功能整合到单一晶片上的趋势正在推动消费者对更小、更紧凑的产品的偏好，而后处理设备主要用于将这些组件组装到整合晶片上。
  • 亚太地区快速成长：预计预测期内亚太地区半导体后端设备市场将快速成长。这一快速成长是由国内领先供应商的战略投资和该地区成熟半导体产业的扩张所推动的。随着晶片消费量的增加，预计未来四年亚太半导体市场规模将达到美洲的三倍。 5G技术的推出进一步推动了该地区对半导体晶片的需求，刺激了製造设备市场的成长。 5G 的进步预计将显着增强全球数位基础设施。

报告中介绍的主要企业包括 ASML Holding NV、应用材料、Lam Research、东京电子、Rapidus Corporation、KLA Corporation 和 Onto Innovation Inc.

本报告的主要优点

  • 深刻分析：获得涵盖主要地区和新兴地区的深入市场洞察，重点关注客户群、政府政策和社会经济因素、消费者偏好、垂直行业和其他子区隔。
  • 竞争格局：了解全球主要企业所采用的策略策略，并了解正确策略带来的潜在市场渗透。
  • 市场驱动因素和未来趋势：探索动态因素和关键市场趋势以及它们将如何影响市场的未来发展。
  • 可行的建议：利用洞察力进行策略决策，在动态环境中开闢新的业务流和收益。
  • 适用范围广：对于新兴企业、研究机构、顾问公司、中小企业和大型企业来说，它都是实用且具有成本效益的。

它有什么用途？

产业与市场洞察、商业机会评估、产品需求预测、打入市场策略、地理扩张、资本支出决策、法律规范与影响、新产品开发、竞争影响

分析范围

  • 历史资料（2022-2024）和预测资料（2025-2030）
  • 成长机会、挑战、供应链前景、法规结构、顾客行为、趋势分析
  • 竞争对手定位、策略和市场占有率分析
  • 按部门和地区（国家）分類的收益成长和预测分析
  • 公司概况（策略、产品、财务资讯、主要趋势等）

半导体后端设备市场区隔：

一步步

  • 晶圆检测
  • 黏合
  • 切块
  • 测量
  • 组装和包装

按地区

  • 美洲
  • 美国
  • 欧洲、中东和非洲
  • 德国
  • 荷兰
  • 其他的
  • 亚太地区
  • 中国
  • 日本
  • 台湾
  • 韩国
  • 其他的

目录

第一章执行摘要

第二章市场概述

  • 市场概览
  • 市场定义
  • 分析范围
  • 市场区隔

第三章 商业景气

  • 市场驱动因素
  • 市场限制
  • 市场机会
  • 波特五力分析
  • 产业价值链分析
  • 政策法规
  • 策略建议

第四章 技术展望

第五章 半导体后端设备市场（依工序）

  • 介绍
  • 晶圆检测
  • 黏合
  • 切块
  • 测量
  • 组装和包装

第六章 半导体后端设备市场（依区域）

  • 介绍
  • 美洲
    • 美国
  • 欧洲、中东和非洲
    • 德国
    • 荷兰
    • 其他的
  • 亚太地区
    • 中国
    • 日本
    • 台湾
    • 韩国
    • 其他的

第七章竞争格局及分析

  • 主要企业和策略分析
  • 市场占有率分析
  • 企业合併、协议、商业合作
  • 竞争仪錶板

第八章 公司简介

  • ASML Holding NV
  • Applied Materials
  • Lam Research
  • Tokyo Electron Limited
  • Rapidus Corporation
  • KLA Corporation
  • Onto Innovation Inc.
  • SCREEN Holdings Co., Ltd.
  • Toshiba Corporation

第九章 附录

  • 货币
  • 先决条件
  • 基准年和预测年时间表
  • 相关人员的主要利益
  • 分析方法
  • 简称
简介目录
Product Code: KSI061614890

The semiconductor back-end equipment market is expected to grow at a CAGR of 6.89%, reaching a market size of US$157.693 billion in 2030 from US$113.006 billion in 2025.

The market is expected to grow due to the increasing demand for small devices and functional advancements in electronic goods like laptops, digital cameras, smartphones, and others. Since integrated circuit (IC) designs are becoming highly complex and more semiconductor products must be introduced to manufacture ICs, the demand for semiconductor back-end equipment is increasing steadily. Semiconductors are used in IC development because they lower costs, speed up mass production, and increase the operational value of the finished product.

Market Trends:

  • Surging Semiconductor Demand: Global demand for semiconductors is on the rise, driven by expanding applications across various industries. Emerging and younger companies are increasingly turning to Original Design Manufacturers (ODMs) and Outsourced Semiconductor Assembly and Test (OSAT) providers to meet their product development and production needs. Governments worldwide are prioritizing local semiconductor manufacturing to lessen dependence on foreign suppliers, encouraging direct investments from established manufacturers and offering supportive regulatory frameworks. For example, the Semiconductor Industry Association (SIA) reported that global semiconductor sales hit US$627.6 billion in 2024, reflecting a 19.1% increase from the US$526.8 billion recorded in 2023.
  • Growing Needs in Manufacturing: Semiconductor manufacturing equipment is essential for producing semiconductor wafers, IC chips, memory chips, circuits, and other components. Silicon wafer production equipment plays a key role in the initial stages of manufacturing, while wafer processing tools-such as photolithography machines, etching devices, chemical vapor deposition systems, measurement tools, and process/quality control equipment-are critical to the workflow. The market for semiconductor back-end equipment is expected to grow due to increasing demand for discrete devices, power semiconductors, and high-power modules across various end-user applications. Additionally, the trend of integrating multiple semiconductor functions onto a single chip is gaining traction as consumers favor smaller, compact products, with back-end equipment primarily used for assembling these components into a unified chip.
  • Exponential Growth in Asia Pacific: The Asia-Pacific semiconductor back-end equipment market is set to experience rapid growth during the forecast period. This surge is driven by strategic investments from leading domestic suppliers and the expansion of the region's well-established semiconductor industry. With chip consumption on the rise, the Asia-Pacific semiconductor market is projected to triple in size compared to the Americas over the next four years. The rollout of 5G technology has further amplified demand for semiconductor chips in the region, spurring growth in the market for manufacturing equipment. This advancement in 5G is expected to significantly enhance digital infrastructure worldwide.

Some of the major players covered in this report include ASML Holding N.V., Applied Materials, Lam Research, Tokyo Electron Limited, Rapidus Corporation, KLA Corporation, Onto Innovation Inc., among others.

Key Benefits of this Report:

  • Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
  • Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
  • Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
  • Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
  • Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

What do businesses use our reports for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

  • Historical data from 2022 to 2024 & forecast data from 2025 to 2030
  • Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
  • Competitive Positioning, Strategies, and Market Share Analysis
  • Revenue Growth and Forecast Assessment of segments and regions including countries
  • Company Profiling (Strategies, Products, Financial Information, and Key Developments among others)

Semiconductor Back-End Equipment Market Segmentation:

By Procedure

  • Wafer Testing
  • Bonding
  • Dicing
  • Metrology
  • Assembly Packaging

By Geography

  • Americas
  • US
  • Europe, the Middle East, and Africa
  • Germany
  • Netherlands
  • Others
  • Asia Pacific
  • China
  • Japan
  • Taiwan
  • South Korea
  • Others

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

2. MARKET SNAPSHOT

  • 2.1. Market Overview
  • 2.2. Market Definition
  • 2.3. Scope of the Study
  • 2.4. Market Segmentation

3. BUSINESS LANDSCAPE

  • 3.1. Market Drivers
  • 3.2. Market Restraints
  • 3.3. Market Opportunities
  • 3.4. Porter's Five Forces Analysis
  • 3.5. Industry Value Chain Analysis
  • 3.6. Policies and Regulations
  • 3.7. Strategic Recommendations

4. TECHNOLOGICAL OUTLOOK

5. SEMICONDUCTOR BACK-END EQUIPMENT MARKET BY PROCEDURE

  • 5.1. Introduction
  • 5.2. Wafer Testing
  • 5.3. Bonding
  • 5.4. Dicing
  • 5.5. Metrology
  • 5.6. Assembly Packaging

6. SEMICONDUCTOR BACK-END EQUIPMENT MARKET BY GEOGRAPHY

  • 6.1. Introduction
  • 6.2. Americas
    • 6.2.1. USA
  • 6.3. Europe, Middle East, and Africa
    • 6.3.1. Germany
    • 6.3.2. Netherlandss
    • 6.3.3. Others
  • 6.4. Asia Pacific
    • 6.4.1. China
    • 6.4.2. Japan
    • 6.4.3. Taiwan
    • 6.4.4. South Korea
    • 6.4.5. Others

7. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 7.1. Major Players and Strategy Analysis
  • 7.2. Market Share Analysis
  • 7.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 7.4. Competitive Dashboard

8. COMPANY PROFILES

  • 8.1. ASML Holding N.V.
  • 8.2. Applied Materials
  • 8.3. Lam Research
  • 8.4. Tokyo Electron Limited
  • 8.5. Rapidus Corporation
  • 8.6. KLA Corporation
  • 8.7. Onto Innovation Inc.
  • 8.8. SCREEN Holdings Co., Ltd.
  • 8.9. Toshiba Corporation

9. APPENDIX

  • 9.1. Currency
  • 9.2. Assumptions
  • 9.3. Base and Forecast Years Timeline
  • 9.4. Key benefits for the stakeholders
  • 9.5. Research Methodology
  • 9.6. Abbreviations