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市场调查报告书
商品编码
1775336

半导体封装材料市场－2025年至2030年的预测

Semiconductor Packaging Material Market - Forecasts from 2025 to 2030
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 141 Pages | 商品交期: 最快1-2个工作天内

价格
简介目录

半导体封装材料市场预计将从 2025 年的 224.76 亿美元成长到 2030 年的 289.53 亿美元，复合年增长率为 5.20%。

半导体封装材料对于保护积体电路 (IC) 和半导体免受腐蚀和环境损害，以及确保晶片连接稳定至关重要。这些材料在汽车、航太、电子、製造和医疗保健等行业中至关重要，是生产流程中的关键组成部分。本摘要专为行业专业人士量身定制，重点关注基于 2024 年以后市场发展的半导体封装材料市场趋势、驱动因素和限制因素。

市场趋势

半导体封装材料市场与全球半导体产业紧密相连。製造业、汽车业及相关产业的大量投资推动了快速工业化进程，这是市场成长的主要驱动力。物联网 (IoT)、机器学习和人工智慧 (AI) 等技术的日益普及预计将对市场发展产生重大影响。智慧型手机、笔记型电脑和电动车 (EV) 等电子产品的需求不断增长，与半导体市场的扩张直接相关，这对封装材料产业产生了积极影响。

亚太地区预计将凭藉其主要产业集中、低廉的人事费用、不断增长的电子设备需求以及持续的技术进步，占据市场主导地位。然而，该地区也面临全球半导体晶片短缺和原材料成本上涨等挑战，这些挑战可能会阻碍未来的成长。

关键市场驱动因素

1. 自动化程度和工业投资增加

由于物联网、自动化、人工智慧和云端基础软体的蓬勃发展，全球工业投资正在飙升。这些技术高度依赖半导体晶片，而半导体晶片对汽车、航太和电子等产业至关重要。对耐用、高性能晶片的需求需要先进的封装材料来确保可靠性和使用寿命。

这一趋势的关键指标是全球机器人密度的上升，其定义为每10,000名产业工人拥有的运作机器人数量。根据国际机器人联合会的数据，製造业的平均机器人密度达到了创纪录的水平，每10,000名员工拥有126台机器人。机器人依靠半导体来处理外部数据，随着自动化程度的提高，预计半导体封装材料的需求将大幅成长。这一趋势凸显了市场乐观的前景，因为封装材料对于支援机器人系统中使用的晶片的耐用性和功能性至关重要。

2. 电子设备的广泛使用

经济成长正在提高全球可支配收入，从而推动对智慧型手机、笔记型电脑和其他消费性电子产品等电子设备的需求。这些设备严重依赖半导体晶片，而半导体晶片需要坚固的封装材料来保护其免受环境损害。电动车和混合动力汽车的广泛普及就是这一趋势的一个显着例子。电动车需要半导体来管理电池、软体系统以及实现各种功能，而所有这些功能都必须防腐蚀且可靠。随着电动车普及率的提高，半导体封装材料市场可望大幅扩张。

市场限制

1. 全球半导体晶片短缺

持续的全球半导体晶片短缺仍然是封装材料市场的重大挑战。高需求与有限供应之间的失衡，加上疫情造成的干扰，对电子和自动化产业带来了巨大压力。晶片产量下降直接影响了封装材料的需求，成为市场成长的瓶颈。儘管市场正在努力恢復，但晶片短缺仍将暂时对半导体封装材料市场构成风险。

2. 原料成本上涨

原材料成本上涨也是主要限制因素。铜价上涨、运输成本上涨、半导体短缺加剧等因素，导致封装材料生产成本上升。这些成本压力可能会降低利润率，增加製造商的财务负担，从而限制市场成长。应对这些挑战需要策略性供应链管理和成本优化。

本报告的主要优点

  • 深刻分析：获得涵盖主要和新兴地区的深入市场洞察，重点关注客户群、政府政策和社会经济因素、消费者偏好、垂直行业和其他细分市场。
  • 竞争格局：了解全球主要企业所采用的策略策略，并了解正确策略带来的潜在市场渗透。
  • 市场趋势和驱动因素：探索动态因素和关键市场趋势以及它们将如何影响市场的未来发展。
  • 可行的建议：利用洞察力进行策略决策，在动态环境中开闢新的业务流和收益。
  • 适用范围广：对于新兴企业、科学研究机构、顾问公司、中小企业、大型企业都有利且划算。

它有什么用途？

产业和市场考量、商业机会评估、产品需求预测、打入市场策略、地理扩张、资本支出决策、法律规范与影响、新产品开发、竞争影响

研究范围

  • 2022 年至 2024 年的历史数据和 2025 年至 2030 年的预测数据
  • 成长机会、挑战、供应链前景、法律规范与趋势分析
  • 竞争定位、策略和市场占有率分析
  • 各细分市场和地区（包括国家）的收益成长和预测分析

公司简介（策略、产品、财务资讯、主要发展等）

目录

第一章 引言

  • 市场定义
  • 市场区隔

第二章调查方法

  • 调查数据
  • 先决条件

第三章执行摘要

  • 调查重点

第四章 市场动态

  • 市场驱动因素
  • 市场限制
  • 波特五力分析
    • 供应商的议价能力
    • 买家的议价能力
    • 新进入者的威胁
    • 替代品的威胁
    • 业内竞争对手之间的竞争
  • 产业价值链分析

第五章半导体封装材料市场：依类型分析

  • 介绍
  • 有机基材
  • 键合线
  • 导线架
  • 陶瓷封装
  • 晶片黏接材料
  • 其他的

第六章半导体封装材料市场：产业分析

  • 介绍
  • 家电
  • 车
  • 卫生保健
  • 资讯科技/通讯
  • 航太和国防
  • 其他的

7. 半导体封装材料市场技术分析

  • 介绍
  • 网格阵列
  • 小型封装
  • 四方扁平封装
  • 双扁平无引线
  • 单列直插式封装
  • 双列直插式封装
  • 其他的

8. 半导体封装材料市场：区域分析

  • 介绍
  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 南美洲
    • 巴西
    • 阿根廷
    • 其他的
  • 欧洲
    • 英国
    • 德国
    • 法国
    • 其他的
  • 中东和非洲
    • 阿拉伯聯合大公国
    • 南非
    • 以色列
    • 沙乌地阿拉伯
    • 其他的
  • 亚太地区
    • 中国
    • 日本
    • 印度
    • 澳洲
    • 台湾
    • 韩国
    • 其他的

第九章竞争格局及分析

  • 主要企业和策略分析
  • 新兴企业和市场盈利
  • 合併、收购、协议和合作
  • 供应商竞争力矩阵

第十章 公司简介

  • Dow Inc.
  • Henkel AG & Co. KGaA
  • Sumitomo Chemical Co., Ltd.
  • BASF SE
  • Hitachi Chemical Co., Ltd.
  • DuPont de Nemours, Inc.
  • Samsung Electro-Mechanics Co., Ltd.
  • Shin-Etsu Chemical Co., Ltd.
  • LG Chem Ltd.
  • Jiangsu ChangJian Technology Co., Ltd.
简介目录
Product Code: KSI061612986

The semiconductor packaging material market is expected to grow from USD 22.476 billion in 2025 to USD 28.953 billion in 2030, at a CAGR of 5.20%.

Semiconductor packaging materials are critical for protecting integrated circuits (ICs) and semiconductors from corrosion and environmental damage, ensuring stable chip connections. These materials are essential across industries such as automotive, aerospace, electronics, manufacturing, and healthcare, forming a vital component of the production process. This summary focuses on market trends, driving factors, and restraints for the semiconductor packaging material market, based on developments from 2024 onward, tailored for industry experts.

Market Trends

The semiconductor packaging material market is closely tied to the global semiconductor industry. Rapid industrialization, fueled by significant investments in manufacturing, automotive, and related sectors, is a primary driver of market growth. The increasing penetration of technologies such as the Internet of Things (IoT), machine learning, and artificial intelligence (AI) is expected to significantly influence market development. The growing demand for electronic gadgets, including smartphones, laptops, and electric vehicles (EVs), directly correlates with the semiconductor market's expansion, positively impacting the packaging material sector.

The Asia-Pacific region is projected to dominate the market due to its concentration of key industries, low labor costs, rising demand for electronics, and ongoing technological advancements. However, the market faces challenges, including a global shortage of semiconductor chips and rising raw material costs, which could hinder growth in the coming years.

Key Market Drivers

1. Rising Automation and Industrial Investment

Global industrial investment is surging, driven by widespread adoption of IoT, automation, AI, and cloud-based software. These technologies rely heavily on semiconductor chips, which are integral to industries like automotive, aerospace, and electronics. The demand for durable, high-performance chips necessitates advanced packaging materials to ensure reliability and longevity.

A key indicator of this trend is the global rise in robot density, defined as the number of operational robots per 10,000 industrial workers. According to the International Federation of Robotics, the average robot density in manufacturing reached a record 126 units per 10,000 employees. Robots depend on semiconductors for processing external data, and as automation continues to grow, the demand for semiconductor packaging materials is expected to increase significantly. This trend underscores the market's positive outlook, as packaging materials are critical for supporting the durability and functionality of chips used in robotic systems.

2. Growing Adoption of Electronic Gadgets

Economic growth has boosted disposable incomes worldwide, leading to higher demand for electronic gadgets such as smartphones, laptops, and other consumer electronics. These devices rely heavily on semiconductor chips, driving the need for robust packaging materials to protect them from environmental damage. The rise in electric and hybrid vehicle adoption is a notable example of this trend. EVs require semiconductors for battery management, software systems, and various functionalities, all of which must be corrosion-free and reliable. As EV adoption grows, the semiconductor packaging material market is well-positioned for significant expansion.

Market Restraints

1. Global Semiconductor Chip Shortage

The ongoing global shortage of semiconductor chips remains a significant challenge for the packaging material market. The imbalance between high demand and limited supply, exacerbated by disruptions from the pandemic, has strained the electronics and automation industries. Reduced chip production directly impacts the demand for packaging materials, creating a bottleneck for market growth. Although recovery efforts are underway, the chip shortage continues to pose a risk to the semiconductor packaging material market in the near term.

2. Rising Raw Material Costs

The increasing cost of raw materials presents another major restraint. Factors such as rising copper prices, elevated shipping costs, and the ongoing semiconductor shortage contribute to higher production costs for packaging materials. These cost pressures could limit market growth by reducing profit margins and increasing the financial burden on manufacturers. Addressing these challenges will require strategic supply chain management and cost-optimization efforts.

Key Benefits of this Report:

  • Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
  • Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
  • Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
  • Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
  • Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

What do businesses use our reports for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

  • Historical data from 2022 to 2024 & forecast data from 2025 to 2030
  • Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
  • Competitive Positioning, Strategies, and Market Share Analysis
  • Revenue Growth and Forecast Assessment of segments and regions including countries

Company Profiling (Strategies, Products, Financial Information, and Key Developments among others.

By Type

  • Organic Substrates
  • Bonding Wires
  • Lead-frames
  • Ceramic Package
  • Die Attach Material
  • Others

By Industry Vertical

  • Consumer Electronics
  • Automotive
  • Healthcare
  • IT & Telecommunication
  • Aerospace and Defense
  • Others

By Technology

  • Grid Array
  • Small Outline Package
  • Quad Flat Package
  • Dual-flat no-leads
  • Single In-Line Package
  • Dual In-Line Package
  • Others

By Geography

  • North America
  • USA
  • Canada
  • Mexico
  • South America
  • Brazil
  • Argentina
  • Others
  • Europe
  • U.K.
  • Germany
  • France
  • Others
  • Middle East and Africa
  • UAE
  • South Africa
  • Israel
  • Saudi Arabia
  • Others
  • Asia-Pacific
  • China
  • Japan
  • India
  • Australia
  • Taiwan
  • South Korea
  • Others

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. Market Definition
  • 1.2. Market Segmentation

2. RESEARCH METHODOLOGY

  • 2.1. Research Data
  • 2.2. Assumptions

3. EXECUTIVE SUMMARY

  • 3.1. Research Highlights

4. MARKET DYNAMICS

  • 4.1. Market Drivers
  • 4.2. Market Restraints
  • 4.3. Porters Five Forces Analysis
    • 4.3.1. Bargaining Power of Suppliers
    • 4.3.2. Bargaining Power of Buyers
    • 4.3.3. The Threat of New Entrants
    • 4.3.4. Threat of Substitutes
    • 4.3.5. Competitive Rivalry in the Industry
  • 4.4. Industry Value Chain Analysis

5. SEMICONDUCTOR PACKAGING MATERIAL MARKET ANALYSIS, BY TYPE

  • 5.1. Introduction
  • 5.2. Organic Substrates
  • 5.3. Bonding Wires
  • 5.4. Lead-frames
  • 5.5. Ceramic Package
  • 5.6. Die Attach Material
  • 5.7. Others

6. SEMICONDUCTOR PACKAGING MATERIAL MARKET ANALYSIS, BY INDUSTRY VERTICAL

  • 6.1. Introduction
  • 6.2. Consumer Electronics
  • 6.3. Automotive
  • 6.4. Healthcare
  • 6.5. IT & Telecommunication
  • 6.6. Aerospace and Defense
  • 6.7. Others

7. SEMICONDUCTOR PACKAGING MATERIAL MARKET ANALYSIS, BY TECHNOLOGY

  • 7.1. Introduction
  • 7.2. Grid Array
  • 7.3. Small Outline Package
  • 7.4. Quad Flat Package
  • 7.5. Dual-flat no-leads
  • 7.6. Single In-Line Package
  • 7.7. Dual In-Line Package
  • 7.8. Others

8. SEMICONDUCTOR PACKAGING MATERIAL MARKET ANALYSIS, BY GEOGRAPHY

  • 8.1. Introduction
  • 8.2. North America
    • 8.2.1. USA
    • 8.2.2. Canada
    • 8.2.3. Mexico
  • 8.3. South America
    • 8.3.1. Brazil
    • 8.3.2. Argentina
    • 8.3.3. Others
  • 8.4. Europe
    • 8.4.1. U.K.
    • 8.4.2. Germany
    • 8.4.3. France
    • 8.4.4. Others
  • 8.5. Middle East and Africa
    • 8.5.1. UAE
    • 8.5.2. South Africa
    • 8.5.3. Israel
    • 8.5.4. Saudi Arabia
    • 8.5.5. Others
  • 8.6. Asia Pacific
    • 8.6.1. China
    • 8.6.2. Japan
    • 8.6.3. India
    • 8.6.4. Australia
    • 8.6.5. Taiwan
    • 8.6.6. South Korea
    • 8.6.7. Others

9. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 9.1. Major Players and Strategy Analysis
  • 9.2. Emerging Players and Market Lucrativeness
  • 9.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 9.4. Vendor Competitiveness Matrix

10. COMPANY PROFILES

  • 10.1. Dow Inc.
  • 10.2. Henkel AG & Co. KGaA
  • 10.3. Sumitomo Chemical Co., Ltd.
  • 10.4. BASF SE
  • 10.5. Hitachi Chemical Co., Ltd.
  • 10.6. DuPont de Nemours, Inc.
  • 10.7. Samsung Electro-Mechanics Co., Ltd.
  • 10.8. Shin-Etsu Chemical Co., Ltd.
  • 10.9. LG Chem Ltd.
  • 10.10. Jiangsu ChangJian Technology Co., Ltd.