半导体和 IC 封装材料市场机会、成长动力、产业趋势分析和预测 2024 - 2032

Semiconductor and IC Packaging Materials Market Opportunity, Growth Drivers, Industry Trend Analysis, and Forecast 2024 - 2032

出版日期: 2024年10月01日 | 出版商:

Global Market Insights Inc. | 英文 230 Pages | 商品交期: 2-3个工作天内

价格

简介目录

2023年全球半导体和IC封装材料市场估值为41亿美元，预计2024年至2032年复合年增长率为10%。的设备，增加了对先进封装解决方案的需求。物联网 (IoT) 的兴起也促进了市场的成长，因为智慧家庭、医疗保健和医疗保健製造等行业的连网设备数量激增。根据 GSMA 2023 报告，物联网连线预计将增加一倍以上，从 2022 年的 25 亿增加到 2030 年的超过 50 亿。

连接设备的爆炸性增长推动了对半导体和 IC 的需求，从而对提供保护、高效散热和增强电气性能的封装材料产生了更高的需求。市场按类型细分，包括有机基板、键合线、引线框架、封装树脂、晶片黏接材料、热界面材料、陶瓷封装等。 %。

有机基材广泛应用于消费性电子产品，特别是智慧型手机、平板电脑和穿戴式装置等装置。由于技术的快速进步，对这些电子产品的需求不断增加，从而推动了对这些基板的需求。就最终用途产业而言，半导体和IC封装材料市场服务于航太和国防、汽车、消费性电子、医疗保健、IT和电信等产业。 IT 和电信产业预计将占据主导地位，到 2032 年将资料超过 30 亿美元的收入。性能包装材料。

市场范围
开始年份	2023年
预测年份	2024-2032
起始值	41 亿美元
预测值	100 亿美元
复合年增长率	10%

北美半导体和IC封装材料市场将经历显着成长，预计到2032年复合年增长率将超过10%。英特尔、AMD 和高通等主要半导体公司集中在北美，协助推动产业发展并制定全球创新标准

产业生态系统分析
供应商矩阵
利润率分析
技术与创新格局
专利分析
重要新闻和倡议
监管环境
衝击力
- 成长动力
  - 扩大半导体在工业自动化的应用
  - 半导体技术的进步
  - 消费性电子产品的扩展
  - 物联网设备的激增
  - 对 5G 和高效能运算的需求不断增长
- 产业陷阱与挑战
  - 製造复杂性和成本
  - 技术和检验问题
成长潜力分析
波特的分析
PESTEL分析

第 4 章：竞争格局

介绍
公司市占率分析
竞争定位矩阵
战略展望矩阵

第 5 章：市场估计与预测：按类型，2021-2032 年

主要趋势
有机基材
键合线
引线框架
封装树脂
陶瓷封装
晶片黏接材料
热界面材料
其他的

第 6 章：市场估计与预测：依封装技术，2021-2032 年

主要趋势
引线键合
倒装晶片封装
晶圆级封装 (WLP)
系统级封装 (SiP)
其他的

第 7 章：市场估计与预测：依最终用途产业，2021-2032 年

主要趋势
航太与国防
汽车
消费性电子产品
卫生保健
资讯科技与电信
其他的

第 8 章：市场估计与预测：按地区，2021-2032 年

主要趋势
北美洲
- 我们
- 加拿大
欧洲
- 英国
- 德国
- 法国
- 义大利
- 西班牙
- 欧洲其他地区
亚太地区
- 中国
- 印度
- 日本
- 韩国
- 澳新银行
- 亚太地区其他地区
拉丁美洲
- 巴西
- 墨西哥
- 拉丁美洲其他地区
MEA
- 阿联酋
- 南非
- 沙乌地阿拉伯
- MEA 的其余部分

第 9 章：公司简介

ASE
Chang Chun Group
DuPont
Henkel
Hitachi High-Tech
Indium
Kyocera
LG Chem
MacDermid Alpha Electronics Solutions
Nan Ya Plastics
Powertech Technology
Samsung Electro-Mechanics
Shin-Etsu Chemical
Sumitomo Bakelite
Sumitomo Chemical
Tanaka Holdings
Texas Instruments
Toppan Printing
Toray Industries
VeriSilicon

简介目录

Product Code: 11659

The Global Semiconductor And IC Packaging Materials Market was valued at USD 4.1 billion in 2023 and is projected to grow at a CAGR of 10% from 2024 to 2032. This growth is primarily driven by the rapid expansion of consumer electronics, such as smartphones and wearable devices, increasing the demand for advanced packaging solutions. The rise of the Internet of Things (IoT) has also contributed to the market's growth, as the number of connected devices across industries such as smart homes, healthcare, and healthcare manufacturing surged. According to the GSMA 2023 report, IoT connections are expected to more than double, from 2.5 billion in 2022 to over 5 billion by 2030.

This explosion in connected devices fuels the need for semiconductors and ICs, creating a higher demand for packaging materials that offer protection, efficient heat dissipation, and enhanced electrical performance. The market is segmented by type, including organic substrates, bonding wires, lead frames, encapsulation resins, die attach materials, thermal interface materials, ceramic packages, and others.Among these, the organic substrate segment is projected to grow at a CAGR of over 10% throughout 2024-2032.

Organic substrates find extensive usage in consumer electronics, particularly in devices like smartphones, tablets, and wearables. Increasing demand for these electronics, spurred by rapid technological advances, drives the need for these substrates. In terms of end-use industries, the semiconductor and IC packaging materials market serves sectors such as aerospace and defense, automotive, consumer electronics, healthcare, IT and telecommunications, and others. The IT and telecommunications sector is projected to dominate, generating over USD 3 billion in revenue by 2032. The ongoing rollout of 5G networks, the expansion of data centers, and the development of cutting-edge communication infrastructure are key factors driving demand in this sector for high-performance packaging materials.

Market Scope
Start Year	2023
Forecast Year	2024-2032
Start Value	$4.1 Billion
Forecast Value	$10 Billion
CAGR	10%

North America is set to experience significant growth in the semiconductor and IC packaging materials market, with a projected CAGR of over 10% by 2032. The region's established technological infrastructure, heavy investment in research and development, and strong manufacturing capabilities contribute to its leadership position. Major semiconductor companies like Intel, AMD, and Qualcomm, concentrated in North America, help advance the industry and set global standards for innovation

Chapter 1 Methodology & Scope

1.1 Market scope & definition
1.2 Base estimates & calculations
1.3 Forecast calculation
1.4 Data sources
- 1.4.1 Primary
- 1.4.2 Secondary
  - 1.4.2.1 Paid sources
  - 1.4.2.2 Public sources

Chapter 2 Executive Summary

2.1 Industry 360° synopsis, 2021-2032

Chapter 3 Industry Insights

3.1 Industry ecosystem analysis
3.2 Vendor matrix
3.3 Profit margin analysis
3.4 Technology & innovation landscape
3.5 Patent analysis
3.6 Key news and initiatives
3.7 Regulatory landscape
3.8 Impact forces
- 3.8.1 Growth drivers
  - 3.8.1.1 Expanding semiconductor applications in industrial automation
  - 3.8.1.2 Advancement in semiconductor technologies
  - 3.8.1.3 Expansion of consumer electronics
  - 3.8.1.4 Proliferation of IoT devices
  - 3.8.1.5 Rising demand for 5G and high-performance computing
- 3.8.2 Industry pitfalls & challenges
  - 3.8.2.1 Manufacturing complexity and costs
  - 3.8.2.2 Technical and inspection issues
3.9 Growth potential analysis
3.10 Porter's analysis
- 3.10.1 Supplier power
- 3.10.2 Buyer power
- 3.10.3 Threat of new entrants
- 3.10.4 Threat of substitutes
- 3.10.5 Industry rivalry
3.11 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

4.1 Introduction
4.2 Company market share analysis
4.3 Competitive positioning matrix
4.4 Strategic outlook matrix

Chapter 5 Market Estimates & Forecast, By Type, 2021-2032 (USD Million)

5.1 Key trends
5.2 Organic substrate
5.3 Bonding wires
5.4 Lead frames
5.5 Encapsulation resins
5.6 Ceramic packages
5.7 Die attach materials
5.8 Thermal interface materials
5.9 Others

Chapter 6 Market Estimates & Forecast, By Packaging Technology, 2021-2032 (USD Million)

6.1 Key trends
6.2 Wire bonding
6.3 Flip-chip packaging
6.4 Wafer-level packaging (WLP)
6.5 System-in-package (SiP)
6.6 Others

Chapter 7 Market Estimates & Forecast, By End Use Industry, 2021-2032 (USD Million)

7.1 Key trends
7.2 Aerospace & defense
7.3 Automotive
7.4 Consumer electronics
7.5 Healthcare
7.6 IT & telecommunication
7.7 Others

Chapter 8 Market Estimates & Forecast, By Region, 2021-2032 (USD Million)

8.1 Key trends
8.2 North America
- 8.2.1 U.S.
- 8.2.2 Canada
8.3 Europe
- 8.3.1 UK
- 8.3.2 Germany
- 8.3.3 France
- 8.3.4 Italy
- 8.3.5 Spain
- 8.3.6 Rest of Europe
8.4 Asia Pacific
- 8.4.1 China
- 8.4.2 India
- 8.4.3 Japan
- 8.4.4 South Korea
- 8.4.5 ANZ
- 8.4.6 Rest of Asia Pacific
8.5 Latin America
- 8.5.1 Brazil
- 8.5.2 Mexico
- 8.5.3 Rest of Latin America
8.6 MEA
- 8.6.1 UAE
- 8.6.2 South Africa
- 8.6.3 Saudi Arabia
- 8.6.4 Rest of MEA