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市场调查报告书
商品编码
1864624

半导体和IC封装材料市场：依销售管道、应用、材料类型和封装类型划分－2025-2032年全球预测

Semiconductor & IC Packaging Materials Market by Sales Channel, Application, Material Type, Packaging Type - Global Forecast 2025-2032
出版日期: | 出版商: 360iResearch | 英文 184 Pages | 商品交期: 最快1-2个工作天内

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预计到 2032 年，半导体和IC封装材料市场将成长至 955 亿美元，复合年增长率为 10.75%。

关键市场统计数据
基准年 2024 421.6亿美元
预计年份：2025年 468亿美元
预测年份 2032 955亿美元
复合年增长率 (%) 10.75%

本文简要概述了影响现代半导体和IC封装的材料性能演变、供应链趋势和整合挑战。

在计算密度不断提高、异质整合日益普及以及跨产业终端市场需求的推动下，半导体和积体电路（IC）封装材料生态系统正经历技术革新和商业性转型的时期。晶圆层次电子构装、扇出型封装和先进的覆晶组装等封装结构的创新，对材料的黏着性、温度控管和电气完整性等方面的性能提出了更高的要求。同时，供应链的韧性、原材料的可追溯性以及永续性等因素，在采购和设计规范的选择中也变得至关重要。

因此，价值链上的各个相关人员（材料配方商、基板和晶圆级封装製造商、原始设备製造商以及测试机构）都在调整其发展蓝图，以平衡可靠性、可製造性和拥有成本。汽车安全电子、高效能运算和小型消费性电子设备等领域新应用的兴起，推动了在日益严苛的外形尺寸下仍能维持稳定机械和热性能的材料的需求。因此，材料科学与封装程式工程之间的合作已成为决定产品差异化和上市时间的关键因素。

本报告重点在于先进包装结构及其支撑材料的交汇点。报告探讨了技术驱动因素、监管阻力以及客户需求如何相互作用，从而重塑供应商策略和研发重点。报告旨在为决策者提供需求模式结构性变化、下一代材料所需性能标准以及采购、认证和规模化生产等方面的实际影响的简明概述。

异质整合如何重塑包装材料策略

半导体封装材料领域正经历技术、监管和商业性变革的交汇融合，这些变革正在重新定义竞争优势。首先，异质整合（即将逻辑、储存和类比功能整合到紧凑的多晶粒组件中）的技术发展趋势，提高了对晶片黏接胶、底部填充胶和环氧树脂封装材料的性能要求。这些材料必须满足更严格的散热预算、更小的互连间距和更严苛的电迁移限制，同时还要能实现大规模生产。

其次，汽车、通讯和医疗等行业对特定应用性能要求的日益多样化，正在推动材料组合的碎片化。汽车电子产品需要为高级驾驶辅助系统和动力传动系统电子设备提供高温稳定性和长期可靠性，而通讯基础设施则强调基地台和网路设备的低损耗基板和高频相容性。在家用电子电器，智慧型手机、平板电脑和穿戴式装置仍然优先考虑小型化和成本效益，这迫使供应商提供差异化的化学成分和製程解决方案。

第三，永续性和监管压力正在加速传统合金和有害元素的替代，并重塑供应链和认证时间表。循环经济的考量以及对某些含铅和卤化材料的限制，迫使製造商在不影响可靠性的前提下检验替代成分。最后，诸如近岸外包、策略性库存缓衝以及合作研发伙伴关係等商业性趋势正在改变供应商关係和供应商选择标准。这些变化正在培育一个更协作的生态系统，在这个系统中，材料性能、可製造性、环境相容性和全球供应连续性都得到全面评估。

评估2025年关税调整和贸易限制引发的供应链重组和筹资策略

2025年前后实施的政策和贸易措施增加了全球半导体封装材料供应链的复杂性。关税调整和有针对性的出口限制影响了某些前驱物化学品、特殊金属和中间组件的流通，迫使采购部门重新评估采购区域和合约保障措施。因此，各公司更重视供应商多元化、库存优化以及二级供应商资格认证，以降低关键材料供应受限的风险。

为因应这些贸易趋势，製造商正加快与国内及伙伴国家供应商在策略性产品上的合作，并调整采购计画以适应特种材料更长的前置作业时间。这也影响了产品认证的速度。更长的前置作业时间要求更早进行材料选择并延长检验週期，以确保生产的连续性。同时，一些公司正利用垂直整合和长期供应协议，以确保优先获得先进封装、底部填充材料、焊料合金等产品的产能。

此外，关税和贸易限制正在影响区域製造业产能的投资决策。企业正在评估将包装业务迁至更靠近主要需求中心的成本效益，以减少跨境摩擦，并缩短研发与生产之间的反馈週期。这种策略转变也促使供应商提高原产地、认证和合规文件的透明度，从而加快海关清关速度并方便客户认证。最终，2025年关税调整的累积影响提高了供应链可视性、供应商冗余和早期材料风险评估的策略性溢价。

针对销售管道、应用、材料类别和先进包装结构，绘製出细緻的材料需求图，以实现策略协同。

了解细分市场的细微差别至关重要，这有助于使材料开发和商业性推广活动与最终用户的期望和实际工艺流程相契合。策略客户管理和分销策略会因销售管道的不同而有所差异。直销模式适用于与大型原始设备製造商 (OEM) 达成的复杂、高价值交易，而分销商销售和线上通路则更适合区域包装企业和契约製造销售标准化、高週转率的耗材。因此，供应商的通路策略应在技术支援需求和规模经济之间取得平衡。

目录

第一章：序言

第二章调查方法

第三章执行摘要

第四章 市场概览

第五章 市场洞察

  • 5G无线模组对先进高导热基板的需求日益增长
  • 采用扇出型晶圆层次电子构装促进行动装置小型化
  • 开发环保无铅焊料以提高汽车电子设备的可靠性
  • 面向人工智慧和机器学习加速器的异构多晶片封装集成
  • 为满足资料中心日益增长的频宽需求，铜柱电缆的出现应运而生
  • 为了降低高速积体电路中的寄生电容，人们开始转向使用低介电常数材料。
  • 引入穿透硅通孔技术以支援 3D 堆迭式储存模组
  • 穿戴式电子产品和物联网感测器中柔性聚合物封装的采用率不断提高
  • 底部填充材料的进步改善了高功率LED应用的温度控管
  • 晶圆级晶片封装技术拓展，缩小家用电子电器的外形规格。

第六章：美国关税的累积影响，2025年

第七章：人工智慧的累积影响，2025年

8. 半导体和IC封装材料市场（依销售管道划分）

  • 直销
  • 透过分销商销售
  • 线上管道

9. 按应用分類的半导体和IC封装材料市场

  • 车
    • ADAS
    • 资讯娱乐系统
    • 动力传动系统
  • 家用电子电器
    • 笔记型电脑
    • 智慧型手机
      • 安卓智慧型手机
      • iOS智慧型手机
    • 药片
      • 安卓平板电脑
      • iOS平板电脑
    • 穿戴式装置
  • 卫生保健
    • 诊断设备
    • 诊断影像设备
    • 穿戴式医疗设备
  • 工业的
    • 自动化设备
    • 电动工具
    • 机器人技术
  • 电讯
    • 基地台
    • 网路装置
    • 路由器

第十章 半导体和IC封装材料市场（依材料类型划分）

  • 模具黏合剂
    • 银环氧树脂
    • 烧结浆
  • 封装
    • 液态封装
    • 固态封装
  • 环氧模塑料
    • 填充类型
    • 无需填充
  • 焊球
    • 无铅
    • 铅
  • 底部填充
    • 毛细管底部填充
    • 模压底部填充物

11. 半导体和IC封装材料市场（依封装类型划分）

  • 球栅阵列
    • CBGA
    • MBGA
    • PBGA
  • 晶片级封装
    • PoP
    • WLCSP
  • 覆晶
    • 覆晶BGA
    • 覆晶CSP
  • 四方平面无引脚
    • DFN
    • LGA
  • 晶圆层次电子构装
    • 扇入式 WLP
    • 扇出WLP

12. 半导体和IC封装材料市场（按地区划分）

  • 美洲
    • 北美洲
    • 拉丁美洲
  • 欧洲、中东和非洲
    • 欧洲
    • 中东
    • 非洲
  • 亚太地区

第十三章 半导体和IC封装材料市场（依组别划分）

  • ASEAN
  • GCC
  • EU
  • BRICS
  • G7
  • NATO

第十四章 各国半导体和IC封装材料市场

  • 美国
  • 加拿大
  • 墨西哥
  • 巴西
  • 英国
  • 德国
  • 法国
  • 俄罗斯
  • 义大利
  • 西班牙
  • 中国
  • 印度
  • 日本
  • 澳洲
  • 韩国

第十五章 竞争格局

  • 2024年市占率分析
  • FPNV定位矩阵，2024
  • 竞争分析
    • Henkel AG & Co. KGaA
    • Sumitomo Bakelite Co., Ltd.
    • Showa Denko Materials Co., Ltd.
    • 3M Company
    • JSR Corporation
    • Dow Inc.
    • DuPont de Nemours, Inc.
    • Element Solutions Inc.
    • MKS Instruments, Inc.
    • KCC Corporation
Product Code: MRR-7A22CB0E5917

The Semiconductor & IC Packaging Materials Market is projected to grow by USD 95.50 billion at a CAGR of 10.75% by 2032.

KEY MARKET STATISTICS
Base Year [2024] USD 42.16 billion
Estimated Year [2025] USD 46.80 billion
Forecast Year [2032] USD 95.50 billion
CAGR (%) 10.75%

A concise orientation to the evolving material performance, supply chain dynamics, and integration challenges shaping modern semiconductor and IC packaging

The semiconductor and integrated circuit packaging materials ecosystem is undergoing a period of concentrated technical refinement and commercial reorientation driven by rising compute density, heterogeneous integration, and cross-industry end-market demands. Innovations in package architectures such as wafer-level packaging, fan-out approaches, and advanced flip chip assemblies are pushing material performance requirements for adhesion, thermal management, and electrical integrity. At the same time, supply chain resilience, raw material traceability, and sustainability considerations are becoming integral to procurement and design specification choices.

Consequently, stakeholders across the value chain-material formulators, substrate and wafer-level packagers, original equipment manufacturers, and testing houses-are aligning roadmaps to balance reliability, manufacturability, and cost of ownership. Emerging end uses in automotive safety electronics, high-performance computing, and compact consumer devices have intensified the need for materials that deliver consistent mechanical and thermal properties under increasingly aggressive form factor constraints. As a result, collaboration between materials science and packaging process engineering is now a core determinant of product differentiation and time-to-market success.

This introduction frames the report's core focus on the intersection of advanced packaging architectures and the materials enabling them. It highlights the interplay of technical drivers, regulatory headwinds, and customer requirements that are reshaping supplier strategies and R&D priorities. The objective is to equip decision-makers with a concise synthesis of structural shifts in demand patterns, the performance thresholds required of next-generation materials, and the practical implications for procurement, qualification, and manufacturing scale-up.

How heterogenous integration, application-specific performance demands, regulatory pressures, and supply continuity are reshaping packaging materials strategies

The landscape for semiconductor packaging materials is being transformed by a convergence of technological, regulatory, and commercial shifts that are redefining competitive advantage. First, the technical imperative for heterogeneous integration-combining logic, memory, and analog functions within compact, multi-die assemblies-has elevated performance expectations for die attach adhesives, underfills, and epoxy molding compounds. These materials must now satisfy tighter thermal budgets, finer pitch interconnects, and more stringent electromigration constraints while also enabling high-volume manufacturability.

Second, the proliferation of application-specific performance requirements in automotive, telecommunications, and healthcare has driven segmentation of material portfolios. Automotive electronics demand high-temperature stability and long-term reliability for advanced driver assistance systems and powertrain electronics, while telecommunications infrastructure emphasizes low-loss substrates and high-frequency compatibility for base stations and network equipment. Consumer electronics continue to prioritize miniaturization and cost-effectiveness for smartphones, tablets, and wearables, prompting suppliers to offer differentiated chemistries and process-ready solutions.

Third, sustainability and regulatory pressures are accelerating the substitution of legacy alloys and hazardous constituents, which is reshaping supply chains and qualification timelines. Circularity considerations and restrictions on certain leaded or halogenated materials require manufacturers to validate alternative compositions without compromising reliability. Finally, commercial dynamics such as nearshoring, strategic inventory buffering, and collaborative R&D partnerships are altering supplier relationships and vendor selection criteria. Taken together, these shifts are fostering a more collaborative ecosystem where materials performance, manufacturability, environmental compliance, and global supply continuity are evaluated in an integrated fashion.

Evaluating the systemic supply chain realignments and procurement strategies triggered by tariff adjustments and trade constraints in 2025

Policy and trade measures enacted in and around 2025 have introduced a layer of complexity to global supply chains for semiconductor packaging inputs. Tariff adjustments and targeted export controls have affected the movement of certain precursor chemicals, specialty metals, and intermediate components, prompting procurement teams to reassess sourcing geographies and contractual safeguards. As a consequence, organizations are placing greater emphasis on supplier diversification, inventory optimization, and qualifying secondary suppliers to mitigate the risk of constrained access to critical materials.

In response to these trade dynamics, manufacturers are accelerating engagement with domestic and friendly-country suppliers for strategic items, and they are redesigning procurement timelines to accommodate extended lead times for specialized materials. This has implications for product qualification cadence: longer lead windows necessitate earlier material selection and extended validation cycles to ensure production continuity. At the same time, some firms are leveraging vertical integration or long-term supply agreements to secure priority access to capacity for advanced encapsulants, underfills, and solder alloys.

Further, tariffs and trade restrictions are influencing investment decisions in regional manufacturing capacity. Firms are evaluating the cost-benefit of relocating packaging operations closer to key demand centers to reduce exposure to cross-border frictions and to shorten feedback loops between R&D and production. These strategic shifts are also prompting suppliers to strengthen transparency around origin, certification, and compliance documentation, enabling faster customs processing and smoother qualification by customers. Ultimately, the cumulative impact of tariff changes in 2025 has been to increase the strategic premium on supply chain visibility, supplier redundancy, and early material risk assessments.

Mapping nuanced material requirements across sales channels, application domains, material classes, and advanced packaging architectures for strategic alignment

A nuanced understanding of segmentation is essential for aligning materials development and commercial go-to-market actions with end-user expectations and process realities. Based on sales channel, strategic account management and distribution strategies diverge; direct sales are optimal for complex, qualification-heavy engagements with large OEMs, whereas distributor sales and online channels are more suited to standardized, high-turn consumables that support regional packaging houses and contract manufacturers. Consequently, supplier channel strategy should reflect the balance between technical support requirements and scale economics.

Based on application, materials must meet distinct performance matrices across automotive, consumer electronics, healthcare, industrial, and telecommunication segments. Automotive applications impose stringent qualification and extended lifetime expectations for ADAS, infotainment systems, and powertrain modules. Consumer electronics prioritize thin profiles and thermal dissipation across laptops, smartphones, tablets, and wearables, with smartphone form factors further differentiating requirements between Android and iOS OEM specifications, and tablets invoking separate considerations for Android and iOS ecosystems. Healthcare use cases such as diagnostic equipment, imaging systems, and wearable medical devices demand biocompatibility, electrical safety, and rigorous traceability. Industrial automation equipment, power tools, and robotics require materials with mechanical robustness and long-term thermal stability, while telecommunication infrastructure including base stations, network equipment, and routers emphasizes signal integrity and environmental endurance.

Based on material type, suppliers must tailor formulations to the unique functional role of each class. Die attach adhesives require both silver epoxy and sintered paste options to accommodate thermal conductivity and mechanical stress profiles. Encapsulants are chosen from liquid and solid chemistries depending on processing constraints and stress mitigation needs. Epoxy molding compounds are engineered as filled or unfilled variants to balance mechanical reinforcement and warpage control. Solder balls continue to be offered in lead-free and leaded compositions to serve legacy and new-production assemblies, while underfill strategies span capillary underfill for established flip-chip processes and molded underfill for higher throughput or more complex geometries.

Based on packaging type, material selection must accommodate architecture-specific demands across ball grid array, chip scale package, flip chip, quad flat no-lead, and wafer-level packaging options. Ball grid array families, including CBGA, MBGA, and PBGA, impose distinct thermal cycling and coplanarity constraints. Chip scale packages such as PoP and WLCSP demand minimal standoff heights and precise adhesion control. Flip chip variants-flip chip BGA and flip chip CSP-require adhesive and underfill chemistries capable of maintaining micro-bump integrity. Quad flat no-lead formats, including DFN and LGA, necessitate low-extrusion molding and precise bond line control, while wafer-level packaging solutions like fan-in WLP and fan-out WLP drive material innovation aimed at scalability, warpage management, and fine-pitch interconnect reliability.

Together, these segmentation vectors form a matrix of technical and commercial requirements. Suppliers that can map differentiated material roadmaps to the intersection of channel, application, material type, and packaging architecture are best positioned to reduce qualification friction, accelerate adoption, and capture value across multiple end markets.

How regional regulatory regimes, manufacturing scale, and customer priorities in the Americas, EMEA, and Asia-Pacific influence materials selection and deployment

Regional dynamics continue to play a central role in shaping the operational choices of materials suppliers and packagers. In the Americas, demand is driven by advanced computing, defense, and a resurgent manufacturing base that prioritizes secure supply chains, high-reliability components, and shorter lead times. This region also emphasizes collaboration between materials suppliers and local OEMs to shorten development cycles and to meet stringent quality assurance protocols.

In Europe, Middle East & Africa, regulatory compliance and environmental stewardship are significant determinants of material selection and process design. Manufacturers in this region stress environmental documentation, lifecycle impact reduction, and adherence to tight reliability standards for automotive and industrial applications. The region's mix of established automotive clusters and evolving telecom infrastructure creates a diversified demand profile that favors adaptable material solutions.

In Asia-Pacific, the scale and concentration of semiconductor packaging capacity, together with a dense supplier ecosystem, drive rapid iteration and adoption of novel materials. Proximity to large OEMs and contract manufacturers accelerates qualification and scaling; however, it also intensifies competition and compresses time-to-adoption windows. Regional policy incentives and localized investments in packaging capacity further influence where suppliers prioritize technical support and inventory allocation. Across all regions, regional nuances in regulatory regimes, logistics infrastructure, and customer expectation influence supplier strategy and the pace at which new material chemistries are validated and commercialized.

Competitive moves driving value capture include technical differentiation, integrated service models, and strategic partnerships to accelerate qualification and adoption

Competitive dynamics among material suppliers and packaging service providers are characterized by three parallel strategies: deepening technical differentiation, expanding integrated service offerings, and pursuing selective capacity investment. Leading suppliers are investing in formulation science to improve thermal conductivity, lower coefficient of thermal expansion mismatch, and minimize ionic contamination, while also developing process-support capabilities such as dispensing optimization, curing profiles, and warpage mitigation protocols.

Strategic partnerships between materials firms and advanced packaging houses are increasingly common, enabling co-development programs that shorten qualification cycles. Such collaborations often take the form of joint pilot lines, shared reliability testing, and in-field failure analysis partnerships that accelerate problem resolution. In addition, some suppliers are augmenting their commercial propositions with value-added services such as application engineering, turnkey qualification packages, and documentation support to reduce the barrier for adoption by contract manufacturers and OEMs.

Mergers, acquisitions, and minority investments remain tools for rapidly acquiring niche chemistries or process expertise, particularly in areas like underfill innovations and high-reliability encapsulants. At the same time, intellectual property-formulation libraries, curing kinetics models, and testing protocols-constitutes a critical asset that differentiates market leaders. For incumbent suppliers and new entrants alike, building demonstrable process compatibility, a robust qualification dossier, and responsive technical support is essential to securing long-term contracts with tier-one packagers and OEMs.

Actionable strategies for balancing supply continuity, accelerated co-development, sustainability commitments, and channel optimization to secure competitive advantage

Industry leaders should adopt a dual-track strategy that balances near-term supply continuity with sustained investment in differentiated material capabilities. In the near term, companies must prioritize supplier redundancy, certification of alternate chemistries, and hardened inventory management protocols to insulate production from geopolitical and logistical disruptions. Concurrently, prioritizing transparent origin documentation and compliance records will reduce customs friction and support faster qualification acceptance by major OEMs.

On the product and innovation side, companies should accelerate co-development programs with packaging houses and OEMs that align material performance targets with assembly process constraints. Investing in modular qualification packages-predefined test matrices, environmental stress screening protocols, and application notes-can substantially lower adoption friction for customers and shorten time-to-production for new material introductions. Further, pursuing greener chemistries and materials with lower lifecycle impacts will not only align with regulatory trajectories but also open opportunities with customers that have aggressive sustainability mandates.

Commercially, organizations should refine channel strategies to match engagement intensity with customer needs, deploying direct sales for strategic accounts while leveraging distributor and online channels for high-volume consumables. Finally, strengthening field application engineering capabilities and creating rapid-response failure analysis teams will enhance customer confidence and protect long-term relationships, thereby converting technical competence into durable commercial advantage.

A rigorous synthesis of primary interviews, secondary technical literature, and analytical triangulation to validate insights and identify resilience measures

The research approach combines structured primary engagement, comprehensive secondary intelligence, and rigorous analytical triangulation to ensure robust, actionable findings. Primary research included in-depth interviews with packaging engineers, materials scientists, procurement leaders, and reliability test specialists, providing firsthand insight into qualification pain points, performance requirements, and supplier selection criteria. These engagements informed scenario analysis and helped surface nuanced differences across application segments and packaging architectures.

Secondary intelligence was gathered from technical literature, standards bodies, patent filings, and publicly available regulatory documentation to corroborate trends identified during primary interviews. Where possible, lifecycle and material safety data sheets were reviewed to validate claims regarding thermal stability, curing behavior, and contaminant profiles. The synthesis of these inputs enabled an evidence-based mapping of material classes to application demands and process constraints.

Analytically, findings were validated through triangulation-comparing supplier disclosures, customer feedback, and independent technical references-to reduce bias and to identify persistent performance gaps. The methodology also incorporated sensitivity analysis around supply chain disruptions and regulatory changes to frame resilience recommendations. Limitations include the proprietary nature of some supplier formulations and the continuous evolution of packaging process capabilities, which means ongoing monitoring is recommended to capture emergent innovations in chemistries and process integration.

Synthesis of technical, commercial, and regulatory imperatives that will determine supplier success in the evolving semiconductor packaging materials ecosystem

In conclusion, the semiconductor and IC packaging materials landscape is at an inflection point where technical performance, supply chain resilience, and regulatory compliance converge to define competitive differentiation. Materials that can deliver on thermal management, mechanical reliability, and process compatibility while meeting environmental and traceability expectations will increasingly command preference across automotive, telecommunications, healthcare, industrial, and consumer applications. Suppliers that align R&D priorities with packaging architecture trends, and that offer robust application support, will accelerate adoption and reinforce customer loyalty.

Moreover, the strategic effects of 2025 tariff adjustments have underscored the value of supplier diversification, early material qualification, and regional capacity planning. Companies that proactively address these risk vectors by securing alternate supply sources and by designing qualification pathways that anticipate longer lead times will be better positioned to maintain production continuity. Equally important is the move toward greener chemistries and transparent origin documentation, which are becoming baseline requirements for many tier-one customers.

Taken together, the insights in this report provide a pragmatic framework for manufacturers, material suppliers, and packaging service providers to prioritize investments, adapt commercial models, and accelerate collaborative innovation. Executing on these priorities will determine who captures value as packaging technologies and application demands continue to evolve.

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Stakeholders

2. Research Methodology

3. Executive Summary

4. Market Overview

5. Market Insights

  • 5.1. Growing demand for advanced high thermal conductivity substrates in 5G radio modules
  • 5.2. Adoption of fan-out wafer-level packaging to enhance miniaturization in mobile devices
  • 5.3. Development of eco-friendly lead-free solder materials for automotive electronics reliability
  • 5.4. Integration of heterogeneous multi-die packaging for AI and machine learning accelerators
  • 5.5. Emergence of copper pillar interconnects to meet rising bandwidth requirements in datacenters
  • 5.6. Shift towards low-k dielectric materials to reduce parasitic capacitance in high-speed ICs
  • 5.7. Implementation of through silicon via technology to support 3D stacked memory modules
  • 5.8. Increased use of flexible polymer encapsulants in wearable electronics and IoT sensors
  • 5.9. Advances in underfill materials improving thermal management for high-power LED applications
  • 5.10. Expansion of wafer-level chip scale packages to reduce form factor in consumer electronics

6. Cumulative Impact of United States Tariffs 2025

7. Cumulative Impact of Artificial Intelligence 2025

8. Semiconductor & IC Packaging Materials Market, by Sales Channel

  • 8.1. Direct Sales
  • 8.2. Distributor Sales
  • 8.3. Online Channels

9. Semiconductor & IC Packaging Materials Market, by Application

  • 9.1. Automotive
    • 9.1.1. ADAS
    • 9.1.2. Infotainment Systems
    • 9.1.3. Powertrain
  • 9.2. Consumer Electronics
    • 9.2.1. Laptops
    • 9.2.2. Smartphones
      • 9.2.2.1. Android Smartphones
      • 9.2.2.2. iOS Smartphones
    • 9.2.3. Tablets
      • 9.2.3.1. Android Tablets
      • 9.2.3.2. iOS Tablets
    • 9.2.4. Wearables
  • 9.3. Healthcare
    • 9.3.1. Diagnostic Equipment
    • 9.3.2. Imaging Equipment
    • 9.3.3. Wearable Medical Devices
  • 9.4. Industrial
    • 9.4.1. Automation Equipment
    • 9.4.2. Power Tools
    • 9.4.3. Robotics
  • 9.5. Telecommunication
    • 9.5.1. Base Stations
    • 9.5.2. Network Equipment
    • 9.5.3. Routers

10. Semiconductor & IC Packaging Materials Market, by Material Type

  • 10.1. Die Attach Adhesive
    • 10.1.1. Silver Epoxy
    • 10.1.2. Sintered Paste
  • 10.2. Encapsulant
    • 10.2.1. Liquid Encapsulant
    • 10.2.2. Solid Encapsulant
  • 10.3. Epoxy Molding Compound
    • 10.3.1. Filled
    • 10.3.2. Unfilled
  • 10.4. Solder Ball
    • 10.4.1. Lead-Free
    • 10.4.2. Leaded
  • 10.5. Underfill
    • 10.5.1. Capillary Underfill
    • 10.5.2. Molded Underfill

11. Semiconductor & IC Packaging Materials Market, by Packaging Type

  • 11.1. Ball Grid Array
    • 11.1.1. CBGA
    • 11.1.2. MBGA
    • 11.1.3. PBGA
  • 11.2. Chip Scale Package
    • 11.2.1. PoP
    • 11.2.2. WLCSP
  • 11.3. Flip Chip
    • 11.3.1. Flip Chip BGA
    • 11.3.2. Flip Chip CSP
  • 11.4. Quad Flat No-Lead
    • 11.4.1. DFN
    • 11.4.2. LGA
  • 11.5. Wafer-Level Packaging
    • 11.5.1. Fan-In WLP
    • 11.5.2. Fan-Out WLP

12. Semiconductor & IC Packaging Materials Market, by Region

  • 12.1. Americas
    • 12.1.1. North America
    • 12.1.2. Latin America
  • 12.2. Europe, Middle East & Africa
    • 12.2.1. Europe
    • 12.2.2. Middle East
    • 12.2.3. Africa
  • 12.3. Asia-Pacific

13. Semiconductor & IC Packaging Materials Market, by Group

  • 13.1. ASEAN
  • 13.2. GCC
  • 13.3. European Union
  • 13.4. BRICS
  • 13.5. G7
  • 13.6. NATO

14. Semiconductor & IC Packaging Materials Market, by Country

  • 14.1. United States
  • 14.2. Canada
  • 14.3. Mexico
  • 14.4. Brazil
  • 14.5. United Kingdom
  • 14.6. Germany
  • 14.7. France
  • 14.8. Russia
  • 14.9. Italy
  • 14.10. Spain
  • 14.11. China
  • 14.12. India
  • 14.13. Japan
  • 14.14. Australia
  • 14.15. South Korea

15. Competitive Landscape

  • 15.1. Market Share Analysis, 2024
  • 15.2. FPNV Positioning Matrix, 2024
  • 15.3. Competitive Analysis
    • 15.3.1. Henkel AG & Co. KGaA
    • 15.3.2. Sumitomo Bakelite Co., Ltd.
    • 15.3.3. Showa Denko Materials Co., Ltd.
    • 15.3.4. 3M Company
    • 15.3.5. JSR Corporation
    • 15.3.6. Dow Inc.
    • 15.3.7. DuPont de Nemours, Inc.
    • 15.3.8. Element Solutions Inc.
    • 15.3.9. MKS Instruments, Inc.
    • 15.3.10. KCC Corporation

LIST OF FIGURES

  • FIGURE 1. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, 2018-2032 (USD MILLION)
  • FIGURE 2. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SALES CHANNEL, 2024 VS 2032 (%)
  • FIGURE 3. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SALES CHANNEL, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 4. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2024 VS 2032 (%)
  • FIGURE 5. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 6. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY MATERIAL TYPE, 2024 VS 2032 (%)
  • FIGURE 7. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY MATERIAL TYPE, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 8. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TYPE, 2024 VS 2032 (%)
  • FIGURE 9. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TYPE, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 10. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY REGION, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 11. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SUBREGION, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 12. NORTH AMERICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 13. LATIN AMERICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 14. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SUBREGION, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 15. EUROPE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 16. MIDDLE EAST SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 17. AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 18. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 19. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY GROUP, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 20. ASEAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 21. GCC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 22. EUROPEAN UNION SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 23. BRICS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 24. G7 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 25. NATO SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 26. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 27. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SHARE, BY KEY PLAYER, 2024
  • FIGURE 28. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, FPNV POSITIONING MATRIX, 2024

LIST OF TABLES

  • TABLE 1. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SEGMENTATION & COVERAGE
  • TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2024
  • TABLE 3. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, 2018-2024 (USD MILLION)
  • TABLE 4. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, 2025-2032 (USD MILLION)
  • TABLE 5. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SALES CHANNEL, 2018-2024 (USD MILLION)
  • TABLE 6. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SALES CHANNEL, 2025-2032 (USD MILLION)
  • TABLE 7. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIRECT SALES, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 8. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIRECT SALES, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 9. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIRECT SALES, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 10. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIRECT SALES, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 11. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIRECT SALES, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 12. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIRECT SALES, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 13. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DISTRIBUTOR SALES, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 14. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DISTRIBUTOR SALES, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 15. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DISTRIBUTOR SALES, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 16. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DISTRIBUTOR SALES, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 17. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DISTRIBUTOR SALES, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 18. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DISTRIBUTOR SALES, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 19. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ONLINE CHANNELS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 20. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ONLINE CHANNELS, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 21. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ONLINE CHANNELS, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 22. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ONLINE CHANNELS, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 23. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ONLINE CHANNELS, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 24. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ONLINE CHANNELS, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 25. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2024 (USD MILLION)
  • TABLE 26. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2025-2032 (USD MILLION)
  • TABLE 27. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY AUTOMOTIVE, 2018-2024 (USD MILLION)
  • TABLE 28. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY AUTOMOTIVE, 2025-2032 (USD MILLION)
  • TABLE 29. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY AUTOMOTIVE, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 30. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY AUTOMOTIVE, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 31. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY AUTOMOTIVE, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 32. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY AUTOMOTIVE, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 33. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY AUTOMOTIVE, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 34. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY AUTOMOTIVE, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 35. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ADAS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 36. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ADAS, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 37. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ADAS, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 38. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ADAS, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 39. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ADAS, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 40. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ADAS, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 41. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY INFOTAINMENT SYSTEMS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 42. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY INFOTAINMENT SYSTEMS, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 43. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY INFOTAINMENT SYSTEMS, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 44. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY INFOTAINMENT SYSTEMS, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 45. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY INFOTAINMENT SYSTEMS, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 46. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY INFOTAINMENT SYSTEMS, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 47. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY POWERTRAIN, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 48. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY POWERTRAIN, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 49. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY POWERTRAIN, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 50. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY POWERTRAIN, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 51. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY POWERTRAIN, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 52. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY POWERTRAIN, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 53. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2024 (USD MILLION)
  • TABLE 54. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY CONSUMER ELECTRONICS, 2025-2032 (USD MILLION)
  • TABLE 55. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 56. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 57. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY CONSUMER ELECTRONICS, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 58. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY CONSUMER ELECTRONICS, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 59. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY CONSUMER ELECTRONICS, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 60. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY CONSUMER ELECTRONICS, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 61. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LAPTOPS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 62. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LAPTOPS, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 63. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LAPTOPS, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 64. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LAPTOPS, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 65. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LAPTOPS, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 66. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LAPTOPS, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 67. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SMARTPHONES, 2018-2024 (USD MILLION)
  • TABLE 68. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SMARTPHONES, 2025-2032 (USD MILLION)
  • TABLE 69. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SMARTPHONES, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 70. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SMARTPHONES, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 71. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SMARTPHONES, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 72. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SMARTPHONES, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 73. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SMARTPHONES, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 74. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SMARTPHONES, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 75. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ANDROID SMARTPHONES, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 76. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ANDROID SMARTPHONES, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 77. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ANDROID SMARTPHONES, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 78. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ANDROID SMARTPHONES, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 79. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ANDROID SMARTPHONES, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 80. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ANDROID SMARTPHONES, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 81. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY IOS SMARTPHONES, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 82. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY IOS SMARTPHONES, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 83. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY IOS SMARTPHONES, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 84. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY IOS SMARTPHONES, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 85. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY IOS SMARTPHONES, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 86. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY IOS SMARTPHONES, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 87. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TABLETS, 2018-2024 (USD MILLION)
  • TABLE 88. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TABLETS, 2025-2032 (USD MILLION)
  • TABLE 89. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TABLETS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 90. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TABLETS, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 91. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TABLETS, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 92. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TABLETS, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 93. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TABLETS, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 94. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TABLETS, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 95. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ANDROID TABLETS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 96. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ANDROID TABLETS, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 97. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ANDROID TABLETS, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 98. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ANDROID TABLETS, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 99. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ANDROID TABLETS, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 100. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ANDROID TABLETS, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 101. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY IOS TABLETS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 102. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY IOS TABLETS, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 103. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY IOS TABLETS, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 104. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY IOS TABLETS, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 105. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY IOS TABLETS, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 106. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY IOS TABLETS, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 107. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY WEARABLES, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 108. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY WEARABLES, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 109. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY WEARABLES, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 110. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY WEARABLES, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 111. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY WEARABLES, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 112. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY WEARABLES, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 113. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY HEALTHCARE, 2018-2024 (USD MILLION)
  • TABLE 114. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY HEALTHCARE, 2025-2032 (USD MILLION)
  • TABLE 115. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY HEALTHCARE, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 116. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY HEALTHCARE, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 117. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY HEALTHCARE, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 118. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY HEALTHCARE, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 119. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY HEALTHCARE, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 120. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY HEALTHCARE, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 121. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIAGNOSTIC EQUIPMENT, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 122. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIAGNOSTIC EQUIPMENT, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 123. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIAGNOSTIC EQUIPMENT, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 124. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIAGNOSTIC EQUIPMENT, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 125. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIAGNOSTIC EQUIPMENT, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 126. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIAGNOSTIC EQUIPMENT, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 127. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY IMAGING EQUIPMENT, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 128. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY IMAGING EQUIPMENT, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 129. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY IMAGING EQUIPMENT, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 130. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY IMAGING EQUIPMENT, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 131. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY IMAGING EQUIPMENT, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 132. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY IMAGING EQUIPMENT, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 133. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY WEARABLE MEDICAL DEVICES, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 134. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY WEARABLE MEDICAL DEVICES, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 135. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY WEARABLE MEDICAL DEVICES, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 136. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY WEARABLE MEDICAL DEVICES, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 137. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY WEARABLE MEDICAL DEVICES, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 138. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY WEARABLE MEDICAL DEVICES, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 139. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY INDUSTRIAL, 2018-2024 (USD MILLION)
  • TABLE 140. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY INDUSTRIAL, 2025-2032 (USD MILLION)
  • TABLE 141. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY INDUSTRIAL, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 142. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY INDUSTRIAL, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 143. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY INDUSTRIAL, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 144. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY INDUSTRIAL, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 145. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY INDUSTRIAL, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 146. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY INDUSTRIAL, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 147. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY AUTOMATION EQUIPMENT, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 148. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY AUTOMATION EQUIPMENT, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 149. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY AUTOMATION EQUIPMENT, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 150. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY AUTOMATION EQUIPMENT, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 151. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY AUTOMATION EQUIPMENT, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 152. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY AUTOMATION EQUIPMENT, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 153. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY POWER TOOLS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 154. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY POWER TOOLS, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 155. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY POWER TOOLS, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 156. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY POWER TOOLS, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 157. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY POWER TOOLS, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 158. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY POWER TOOLS, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 159. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ROBOTICS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 160. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ROBOTICS, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 161. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ROBOTICS, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 162. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ROBOTICS, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 163. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ROBOTICS, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 164. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ROBOTICS, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 165. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TELECOMMUNICATION, 2018-2024 (USD MILLION)
  • TABLE 166. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TELECOMMUNICATION, 2025-2032 (USD MILLION)
  • TABLE 167. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TELECOMMUNICATION, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 168. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TELECOMMUNICATION, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 169. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TELECOMMUNICATION, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 170. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TELECOMMUNICATION, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 171. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TELECOMMUNICATION, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 172. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TELECOMMUNICATION, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 173. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY BASE STATIONS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 174. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY BASE STATIONS, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 175. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY BASE STATIONS, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 176. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY BASE STATIONS, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 177. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY BASE STATIONS, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 178. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY BASE STATIONS, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 179. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY NETWORK EQUIPMENT, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 180. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY NETWORK EQUIPMENT, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 181. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY NETWORK EQUIPMENT, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 182. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY NETWORK EQUIPMENT, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 183. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY NETWORK EQUIPMENT, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 184. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY NETWORK EQUIPMENT, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 185. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ROUTERS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 186. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ROUTERS, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 187. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ROUTERS, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 188. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ROUTERS, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 189. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ROUTERS, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 190. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ROUTERS, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 191. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY MATERIAL TYPE, 2018-2024 (USD MILLION)
  • TABLE 192. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY MATERIAL TYPE, 2025-2032 (USD MILLION)
  • TABLE 193. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIE ATTACH ADHESIVE, 2018-2024 (USD MILLION)
  • TABLE 194. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIE ATTACH ADHESIVE, 2025-2032 (USD MILLION)
  • TABLE 195. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIE ATTACH ADHESIVE, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 196. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIE ATTACH ADHESIVE, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 197. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIE ATTACH ADHESIVE, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 198. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIE ATTACH ADHESIVE, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 199. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIE ATTACH ADHESIVE, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 200. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIE ATTACH ADHESIVE, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 201. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SILVER EPOXY, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 202. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SILVER EPOXY, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 203. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SILVER EPOXY, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 204. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SILVER EPOXY, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 205. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SILVER EPOXY, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 206. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SILVER EPOXY, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 207. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SINTERED PASTE, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 208. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SINTERED PASTE, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 209. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SINTERED PASTE, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 210. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SINTERED PASTE, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 211. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SINTERED PASTE, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 212. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SINTERED PASTE, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 213. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ENCAPSULANT, 2018-2024 (USD MILLION)
  • TABLE 214. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ENCAPSULANT, 2025-2032 (USD MILLION)
  • TABLE 215. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ENCAPSULANT, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 216. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ENCAPSULANT, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 217. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ENCAPSULANT, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 218. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ENCAPSULANT, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 219. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ENCAPSULANT, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 220. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ENCAPSULANT, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 221. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LIQUID ENCAPSULANT, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 222. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LIQUID ENCAPSULANT, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 223. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LIQUID ENCAPSULANT, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 224. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LIQUID ENCAPSULANT, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 225. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LIQUID ENCAPSULANT, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 226. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LIQUID ENCAPSULANT, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 227. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SOLID ENCAPSULANT, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 228. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SOLID ENCAPSULANT, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 229. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SOLID ENCAPSULANT, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 230. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SOLID ENCAPSULANT, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 231. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SOLID ENCAPSULANT, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 232. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SOLID ENCAPSULANT, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 233. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY EPOXY MOLDING COMPOUND, 2018-2024 (USD MILLION)
  • TABLE 234. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY EPOXY MOLDING COMPOUND, 2025-2032 (USD MILLION)
  • TABLE 235. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY EPOXY MOLDING COMPOUND, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 236. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY EPOXY MOLDING COMPOUND, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 237. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY EPOXY MOLDING COMPOUND, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 238. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY EPOXY MOLDING COMPOUND, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 239. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY EPOXY MOLDING COMPOUND, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 240. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY EPOXY MOLDING COMPOUND, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 241. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY FILLED, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 242. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY FILLED, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 243. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY FILLED, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 244. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY FILLED, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 245. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY FILLED, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 246. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY FILLED, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 247. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY UNFILLED, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 248. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY UNFILLED, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 249. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY UNFILLED, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 250. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY UNFILLED, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 251. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY UNFILLED, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 252. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY UNFILLED, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 253. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SOLDER BALL, 2018-2024 (USD MILLION)
  • TABLE 254. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SOLDER BALL, 2025-2032 (USD MILLION)
  • TABLE 255. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SOLDER BALL, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 256. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SOLDER BALL, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 257. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SOLDER BALL, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 258. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SOLDER BALL, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 259. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SOLDER BALL, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 260. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SOLDER BALL, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 261. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LEAD-FREE, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 262. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LEAD-FREE, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 263. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LEAD-FREE, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 264. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LEAD-FREE, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 265. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LEAD-FREE, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 266. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LEAD-FREE, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 267. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LEADED, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 268. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LEADED, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 269. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LEADED, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 270. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LEADED, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 271. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET S