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市场调查报告书
商品编码
1775487

液体封装市场：2025-2030 年预测

Liquid Encapsulation Market - Forecasts from 2025 to 2030
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 143 Pages | 商品交期: 最快1-2个工作天内

价格
简介目录

液体封装市场预计将从 2025 年的 19.4 亿美元成长到 2030 年的 24.4 亿美元，复合年增长率为 4.73%。

半导体应用的成长

由于液体封装能够提升复杂组件的耐用性和功能性，因此微型半导体装置需求的激增是主要驱动因素。 2024年，全球半导体产业对积体电路 (IC) 和电子机械系统 (MEMS) 的需求成长了15%，尤其是在消费性电子和汽车领域。液体封装技术（例如底部填充和球顶封装）可保护精密组件免受衝击和潮湿的影响，从而确保智慧型手机、穿戴式装置和汽车感测器的可靠性。这一趋势将透过实现高性能、紧凑型设备来推动市场成长。

技术进步

封装技术的创新正在推动市场扩张。 2023年6月，滑铁卢大学推出了一种液-液封装系统，其能耗比传统方法低5,000倍，并消除了微塑料，从而提高了永续性。这项突破性技术支援快速原型製作和生产环保封装设备，可为製造商降低高达12%的成本，并扩大其在医疗和穿戴式科技领域的应用。

汽车产业的成长

在汽车行业，向电动车 (EV) 和高级驾驶辅助系统 (ADAS) 的转变正在推动对液体封装的需求。到 2024 年，用于惯性、压力和光学应用的 MEMS 感测器在汽车製造业中的应用将增加 10%，这需要坚固的封装来抵御环境因素的影响。台湾作为汽车製造业的重要市场，其汽车生产正支持这一趋势，液体封装技术可以提高电动车中引线接合法元件的机械强度。

政府倡议

政府的扶持政策正在推动市场成长，尤其是在半导体中心地区。 2023年，台湾国家科学技术委员会启动了倡议加强积体电路製造的计划，推动了板载晶片和电晶体应用对液体封装的需求。这些政策旨在使台湾成为全球半导体生产的领导者，间接促进了封装市场的发展。

市场挑战

生产成本高

液体封装采用的复杂製程和材料（例如环氧树脂和导电聚合物）导致製造成本高昂：到 2024 年，封装单一 MEMS 设备的平均成本将达到 50 美元，这限制了发展中地区小型製造商采用该技术。

技术复杂性

将液体封装整合到先进的半导体设计中需要专业知识。高密度积体电路的兼容性问题已经减缓了亚太地区的生产速度，导致2023年某些细分市场的市场成长放缓。

供应链约束

特种聚合物等高品质封装供应有限，扰乱了供应链，供不应求导致材料成本在 2024 年上涨 8%，影响中东和非洲的扩充性。

市场区隔分析

按材质

环氧树脂凭藉其在半导体和汽车应用的多功能性和耐用性，在2024年占据了60%的市场占有率，占据了主导地位。受穿戴式装置和医疗设备灵活性的推动，聚合物基封装正在经历快速成长。

按用途

积体电路占据主导地位，在消费性电子和汽车产业需求的推动下，到2024年将占市场收益的45%。受电动车和物联网设备中感测器应用的推动，MEMS应用正在快速成长。光电子技术也是重要的贡献者，为显示和照明技术提供动力。

按最终用户

电子产业占据主导地位，智慧型手机和穿戴式装置推动了需求成长。汽车产业是一个快速成长的领域，受电动车和高级驾驶辅助系统 (ADAS) 的推动。包括医疗植入在内的医疗保健应用正在稳步扩张。

地理洞察力

亚太地区占最大份额，2024 年市场收益占 50%。在日东电工 (Nitto Denko) 和台湾 PU 等公司的支持下，台湾的积体电路生产正在推动该地区的成长。其次是北美，美国专注于汽车和医疗应用。在消费性电子产品的推动下，欧洲正经历稳定成长。

竞争格局

汉高、日东电工、信越化学和松下等主要企业正透过研发和策略扩张推动技术创新。 2024年，汉高推出了一种用于MEMS封装的新型低能耗环氧树脂，将製造成本降低了10%。日东电工则扩大了台湾业务，瞄准汽车感测器应用。

本报告的主要优点

  • 深刻分析：获得深入的市场洞察，重点关注客户细分、政府政策和社会经济因素、消费者偏好、垂直行业和其他细分市场，涵盖主要地区和新兴地区。
  • 竞争格局：了解主要企业采用的策略策略，并了解正确策略的市场渗透潜力。
  • 市场趋势和驱动因素：探索动态因素和关键市场趋势以及它们将如何影响未来的市场发展。
  • 可行的建议：利用洞察力来提供策略决策，在动态环境中开闢新的业务流和收益。
  • 受众范围广：对于新兴企业、研究机构、顾问、中小企业和大型企业来说都是有益且具成本效益的。

它有什么用途？

产业与市场考量、商业机会评估、产品需求预测、打入市场策略、地理扩张、资本支出决策、法律规范与影响、新产品开发、竞争影响

调查范围

  • 实际数据为2022年至2024年，预测数据为2025年至2030年
  • 成长机会、挑战、供应链前景、法律规范与趋势分析
  • 竞争定位、策略和市场占有率分析
  • 收益成长和预测细分市场和区域分析（包括国家）
  • 公司概况（策略、产品、财务、主要发展等）

目录

第一章执行摘要

第二章市场概述

  • 市场概览
  • 市场定义
  • 调查范围
  • 市场区隔

第三章 经营状况

  • 市场驱动因素
  • 市场限制
  • 市场机会
  • 波特五力分析
  • 产业价值链分析
  • 政策法规
  • 策略建议

第四章 技术展望

5. 液体封装市场（依树脂类型）

  • 介绍
  • 环氧树脂
  • 硅树脂
  • 聚氨酯树脂
  • 其他的

6. 液体封装市场（依应用）

  • 介绍
  • 积体电路（IC）
  • 光电子
  • 感应器
  • 其他的

7. 液体封装市场（依最终用户）

  • 介绍
  • 车
  • 资讯科技/通讯
  • 电子产品
  • 製造业
  • 其他的

8. 液体封装市场（按地区）

  • 介绍
  • 美洲
    • 美国
    • 其他的
  • 欧洲、中东和非洲
    • 德国
    • 法国
    • 英国
    • 其他的
  • 亚太地区
    • 中国
    • 日本
    • 韩国
    • 台湾
    • 其他的

第九章：竞争格局及分析

  • 主要企业和策略分析
  • 市场占有率分析
  • 合併、收购、协议和合作
  • 竞争对手仪表板

第十章：公司简介

  • BASF SE
  • Panasonic Corporation
  • Sumitomo Bakelite
  • KYOCERA Corporation
  • Shin-Etsu Chemical
  • Nagase & Co.
  • Nitto Denko Corporation
  • CAPLINQ Corporation
  • Henkel AG & Co. KGaA

第十一章 附录

  • 货币
  • 先决条件
  • 基准年和预测年时间表
  • 相关人员的主要利益
  • 调查方法
  • 简称
简介目录
Product Code: KSI061610206

The liquid encapsulation market is expected to grow from USD 1.940 billion in 2025 to USD 2.444 billion in 2030, at a CAGR of 4.73%.

Growing Semiconductor Applications

The surge in demand for miniaturized semiconductor devices is a primary driver, as liquid encapsulation enhances the durability and functionality of intricate components. In 2024, the global semiconductor industry saw a 15% increase in demand for integrated circuits (ICs) and microelectromechanical systems (MEMS), particularly in consumer electronics and automotive sectors. Liquid encapsulation techniques, such as under-filling and glob-top encapsulation, protect delicate components from shocks and moisture, ensuring reliability in smartphones, wearables, and automotive sensors. This trend drives market growth by enabling high-performance, compact devices.

Technological Advancements

Innovations in encapsulation technologies are propelling market expansion. In June 2023, the University of Waterloo introduced a liquid-liquid encapsulation system, which consumes 5,000 times less energy than traditional methods and eliminates microplastics, enhancing sustainability. This breakthrough supports rapid prototyping and production of eco-friendly encapsulated devices, reducing costs by up to 12% for manufacturers and broadening applications in medical and wearable technologies.

Automotive Sector Growth

The automotive industry's shift toward electric vehicles (EVs) and advanced driver-assistance systems (ADAS) is boosting demand for liquid encapsulation. In 2024, MEMS-based sensors for inertia, pressure, and optical applications saw a 10% adoption increase in automotive manufacturing, requiring robust encapsulation to protect against environmental factors. Taiwan's automotive production, a key market, supported this trend, with liquid encapsulation enhancing the mechanical strength of wire-bonded devices in EVs.

Government Initiatives

Supportive government policies are fostering market growth, particularly in semiconductor hubs. In 2023, Taiwan's National Science and Technology Council launched initiatives to strengthen IC manufacturing, driving demand for liquid encapsulation in chip-on-board and transistor applications. These policies aim to position Taiwan as a global leader in semiconductor production, indirectly boosting the encapsulation market.

Market Challenges

High Production Costs

The complex processes and materials, such as epoxy resins and conductive polymers, used in liquid encapsulation result in high production costs. In 2024, the average cost of encapsulating a single MEMS device was USD 50, limiting adoption among smaller manufacturers in developing regions.

Technical Complexity

The integration of liquid encapsulation with advanced semiconductor designs requires specialized expertise. In 2023, compatibility issues with high-density ICs delayed production in Asia-Pacific, slowing market growth in some segments.

Supply Chain Constraints

Limited availability of high-quality encapsulation materials, such as specialized polymers, disrupts supply chains. In 2024, supply shortages increased material costs by 8%, impacting scalability in the Middle East and Africa.

Market Segmentation Analysis

By Material

Epoxy resins dominate, holding a 60% market share in 2024, due to their versatility and durability in semiconductor and automotive applications. Polymer-based encapsulants are growing rapidly, driven by their flexibility in wearable and medical devices.

By Application

Integrated circuits lead, accounting for 45% of market revenue in 2024, driven by demand in consumer electronics and automotive sectors. MEMS applications are the fastest-growing, fueled by their use in sensors for EVs and IoT devices. Optoelectronics also contribute significantly, supporting display and lighting technologies.

By End-User

The electronics sector dominates, with smartphones and wearables driving demand. The automotive industry is the fastest-growing segment, supported by EV and ADAS adoption. Healthcare applications, including medical implants, are expanding steadily.

Geographical Insights

Asia-Pacific holds the largest share, contributing 50% of market revenue in 2024, with Taiwan and China leading due to their robust semiconductor industries. Taiwan's IC production, supported by companies like Nitto Denko and Taiwan PU Corporation, drives regional growth. North America follows, with the U.S. focusing on automotive and medical applications. Europe is growing steadily, supported by advancements in consumer electronics.

Competitive Landscape

Key players, including Henkel, Nitto Denko, Shin-Etsu Chemical, and Panasonic, drive innovation through R&D and strategic expansions. In 2024, Henkel introduced a new low-energy epoxy resin for MEMS encapsulation, reducing production costs by 10%. Nitto Denko expanded its Taiwan operations, targeting automotive sensor applications.

Key Benefits of this Report:

  • Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
  • Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
  • Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
  • Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
  • Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

What do businesses use our reports for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

  • Historical data from 2022 to 2024 & forecast data from 2025 to 2030
  • Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
  • Competitive Positioning, Strategies, and Market Share Analysis
  • Revenue Growth and Forecast Assessment of segments and regions including countries
  • Company Profiling (Strategies, Products, Financial Information, and Key Developments among others.

Liquid Encapsulation Market Segmentation

By Resin Type

  • Epoxy Resin
  • Silicone Resin
  • Polyurethane Resin
  • Others

By Application

  • Integrated Circuits (IC)
  • Optoelectronics
  • Sensors
  • Others

By End-User

  • Automotive
  • IT & Telecommunication
  • Electronics
  • Manufacturing
  • Others

By Geography

  • Americas
  • USA
  • Others
  • Europe, Middle East and Africa
  • Germany
  • UK
  • France
  • Others
  • Asia Pacific
  • China
  • Japan
  • Taiwan
  • South Korea
  • Others

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

2. MARKET SNAPSHOT

  • 2.1. Market Overview
  • 2.2. Market Definition
  • 2.3. Scope of the Study
  • 2.4. Market Segmentation

3. BUSINESS LANDSCAPE

  • 3.1. Market Drivers
  • 3.2. Market Restraints
  • 3.3. Market Opportunities
  • 3.4. Porter's Five Forces Analysis
  • 3.5. Industry Value Chain Analysis
  • 3.6. Policies and Regulations
  • 3.7. Strategic Recommendations

4. TECHNOLOGICAL OUTLOOK

5. LIQUID ENCAPSULATION MARKET BY RESIN TYPE

  • 5.1. Introduction
  • 5.2. Epoxy Resin
  • 5.3. Silicon Resin
  • 5.4. Polyurethane Resin
  • 5.5. Others

6. LIQUID ENCAPSULATION MARKET BY APPLICATION

  • 6.1. Introduction
  • 6.2. Integrated Circuits (ICs)
  • 6.3. Optoelectronics
  • 6.4. Sensors
  • 6.5. Others

7. LIQUID ENCAPSULATION MARKET BY END-USER

  • 7.1. Introduction
  • 7.2. Automotive
  • 7.3. IT & Telecommunication
  • 7.4. Electronics
  • 7.5. Manufacturing
  • 7.6. Others

8. LIQUID ENCAPSULATION MARKET BY GEOGRAPHY

  • 8.1. Introduction
  • 8.2. Americas
    • 8.2.1. USA
    • 8.2.2. Others
  • 8.3. Europe Middle East and Africa
    • 8.3.1. Germany
    • 8.3.2. France
    • 8.3.3. United Kingdom
    • 8.3.4. Others
  • 8.4. Asia Pacific
    • 8.4.1. China
    • 8.4.2. Japan
    • 8.4.3. South Korea
    • 8.4.4. Taiwan
    • 8.4.5. Others

9. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 9.1. Major Players and Strategy Analysis
  • 9.2. Market Share Analysis
  • 9.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 9.4. Competitive Dashboard

10. COMPANY PROFILES

  • 10.1. BASF SE
  • 10.2. Panasonic Corporation
  • 10.3. Sumitomo Bakelite
  • 10.4. KYOCERA Corporation
  • 10.5. Shin-Etsu Chemical
  • 10.6. Nagase & Co.
  • 10.7. Nitto Denko Corporation
  • 10.8. CAPLINQ Corporation
  • 10.9. Henkel AG & Co. KGaA

11. APPENDIX

  • 11.1. Currency
  • 11.2. Assumptions
  • 11.3. Base and Forecast Years Timeline
  • 11.4. Key benefits for the stakeholders
  • 11.5. Research Methodology
  • 11.6. Abbreviations