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电子设计自动化 (EDA) 市场 - 2025 年至 2030 年预测

Electronic Design Automation Market - Forecasts from 2025 to 2030

出版日期: 2025年10月22日 | 出版商:

Knowledge Sourcing Intelligence | 英文 144 Pages | 商品交期: 最快1-2个工作天内

价格

简介目录

电子设计自动化 (EDA) 市场预计将从 2025 年的 161.34 亿美元成长到 2030 年的 275.51 亿美元，复合年增长率为 11.30%。

电子设计自动化 (EDA) 市场提供支撑整个半导体产业的关键软体、硬体和智慧财产权 (IP)。当前市场动态的特征是底层技术变革与宏观经济因素波动相互交织。该行业正经历一场根本性的变革，从碎片化的晶片级设计转向整体的「从硅到系统」方法。这一转变由先进製程节点的推进和人工智慧的系统性整合所驱动，从而导致对先进 EDA 许可证和平台的持续高价值需求。

核心市场动态：驱动因素与必要条件

市场发展轨迹正受到多个强大且相互关联的驱动因素的影响。其中最主要的是向异构运算和晶片组架构的决定性转变。随着传统单片式晶片设计在5奈米及以下製程节点面临物理和经济的限制，晶片组正成为主要的演进路径。这种架构转变立即催生了对创新EDA解决方案的迫切需求，这些解决方案能够解决整个封装内的晶粒通讯、电源完整性和温度控管。尤其值得一提的是，它加速了对先进的2.5D/3D IC物理设计和检验工具以及用于多物理场模拟的CAE软体的需求，这些工具对于模拟定义晶片组性能的高频宽、低延迟通讯至关重要。

同时，人工智慧 (AI) 和机器学习 (ML) 整合到 EDA 工作流程中本身正成为一个重要的需求驱动因素。随着设计复杂性超越手动优化的极限，AI 驱动的生成式 IC 设计和多重运行检验解决方案对于维持设计品质和缩短週期时间至关重要。这并非普遍趋势，而是推动高阶软体授权的特异性因素，这些软体利用大规模运算资源进行自主设计空间探索，从而直接转化为 AI 赋能 EDA 平台的高价值订阅。

汽车产业是需求特别强劲的领域。向软体定义汽车 (SDV) 的转型以及高级驾驶辅助系统 (ADAS) 和自动驾驶平台的开发，对电子元件的整合提出了前所未有的要求。这需要具备混合讯号设计、强大的多物理场模拟和全面的功能安全检验等专业功能的电子设计自动化 (EDA) 工具，以满足 ISO 26262 等严格标准。

重大挑战及相关机会

儘管市场需求强劲，仍面临许多不利因素。主要挑战在于围绕云端基础EDA部署的持续安全性和资料主权问题。虽然云端平台能够为运算密集型任务提供可扩展性，但企业不愿将关键业务IP迁移到外部，这直接抑制了对云端基础模式的需求，并增加了对资本密集型本地基础设施的依赖。然而，这种限制也为供应商提供了一个绝佳的机会，让他们可以投资并提供具有检验加密和存取控制的高度安全的混合云端架构，从而释放潜在需求。

第二个挑战是高技能EDA工程人才日益短缺。新一代工具的日益复杂化造成了技能缺口，并增加了EDA解决方案的整体拥有成本。这项挑战也为EDA供应商带来了机会：客户对承包系统设计和分析工具以及专业服务的需求不断增长，以弥补其内部人才缺口。

地缘政治和监管影响

市场越来越容易受到政府政策和地缘政治紧张局势的影响。美国实施的出口限制是主要的波动因素，不仅会即时对EDA公司的收入造成衝击，还会促使受影响地区积极投资于国内EDA替代技术，从而导致长期全球需求发生战略性转变。

法规也在间接推动需求成长。例如，欧盟提案的人工智慧法案侧重于高风险人工智慧应用的透明度和安全性，从而催生了对能够提供审核检验流程的EDA工具的合规主导需求。同时，印度的「设计关联奖励」（DLI）计画则直接奖励策略了这一需求，为新兴的国内设计公司创造了EDA软体授权的补贴需求管道，使该地区成为一个充满活力的成长区域。

竞争格局：面向系统的集成

EDA市场实际上处于寡占状态，高度集中于三家全端供应商：摘要、Cadence Design Systems和Siemens EDA。竞争格局正从纯粹的晶片设计转向提供整合、认证流程的能力，以应对晶片之外的系统级挑战，例如封装、热设计和结构分析。如今，竞争的焦点在于如何将AI/ML功能整合到设计中，以及如何透过策略性收购将供应商的整体市场潜力扩展到系统级实体领域。

这一点在主要企业的策略方向上显而易见。 Cadence 的「智慧型系统设计」策略专注于端到端解决方案，并透过收购一家核心多实体场模拟软体公司，进一步拓展至结构分析领域，从而强化了这一策略。同样，摘要也完成了一项变革性收购，将世界一流的模拟和分析能力直接整合到其核心晶片设计平台中，巩固了其市场领导地位和「从晶片到系统」的理念。这些倡议反映了市场的核心需求，即实现对大规模电子系统（例如自动驾驶汽车和伺服器机架）中晶片性能的模拟。

结论

EDA市场正处于一个转折点，其角色正从支援晶片设计扩展到赋能整个电子系统。诸如晶片组等新型架构的需求、人工智慧的变革潜力以及汽车等产业的高要求，正推动EDA能力的根本性变革。儘管安全和人才方面的挑战仍然存在，但它们也为创新和服务拓展提供了明确的机会。在此背景下，领先的供应商正透过策略性收购巩固自身地位，弥合晶片与系统之间的鸿沟，确保EDA仍是全球技术进步不可或缺的重要基础。

本报告的主要优势：

深入分析：获取主要和新兴地区的深入市场洞察，重点关注客户群、政府政策和社会经济因素、消费者偏好、垂直行业和其他细分市场。
竞争格局：了解全球主要企业的策略倡议，并了解透过正确的策略实现市场渗透的潜力。
市场驱动因素与未来趋势：探索推动市场的动态因素和关键趋势，以及它们将如何塑造未来的市场发展。
可操作的建议：利用这些见解，在动态环境中做出策略决策，并开拓新的商机和收入来源。
受众广泛：适用于Start-Ups、研究机构、顾问公司、中小企业和大型企业，且经济实惠。

企业使用我们的报告的目的是什么？

产业与市场分析、机会评估、产品需求预测、打入市场策略、地理扩张、资本投资决策、法规结构及影响、新产品开发、竞争情报

报告范围：

2022年至2024年的历史数据和2025年至2030年的预测数据
成长机会、挑战、供应链前景、法规结构与趋势分析
竞争定位、策略和市场占有率分析
按业务板块和地区分類的收入成长和预测评估，包括国家/地区
公司概况（策略、产品、财务资讯、关键发展等）

电子设计自动化（EDA）市场的市场区隔

按类型
电脑辅助工程（CAE）
积体电路物理设计与检验
印刷基板（PCB）和多晶片模组（MCM）
半导体智慧财产权（SIP）
其他的
按实现类型
本地部署
云端基础的
透过使用
航太/国防
车
家用电子电器
产业
医疗保健
电讯
按地区
北美洲（美国、加拿大、墨西哥）
南美洲（巴西、阿根廷等）
欧洲（德国、法国、英国、西班牙等）
中东和非洲（沙乌地阿拉伯、阿拉伯联合大公国等）
亚太地区（中国、印度、日本、韩国、印尼、泰国、世界其他地区）

介绍
北美洲
- 美国
- 加拿大
- 墨西哥
南美洲
- 巴西
- 阿根廷
- 其他的
欧洲
- 德国
- 法国
- 英国
- 西班牙
- 其他的
中东和非洲
- 沙乌地阿拉伯
- 阿拉伯聯合大公国
- 其他的
亚太地区
- 中国
- 印度
- 日本
- 韩国
- 印尼
- 泰国
- 其他的

第九章：竞争格局与分析

主要企业和策略分析
市占率分析
合併、收购、协议和合作
竞争对手仪錶板

第十章：公司简介

Cadence Design Systems
Synopsys
Mentor Graphics
Vennsa Technologies
Ansys
Altium
Zuken
Agnisys
Aldec

第十一章附录

货币
先决条件
基准年和预测年时间表
相关人员的主要收益
调查方法
简称

简介目录

Product Code: KSI061612951

Electronic Design Automation Market, at a 11.30% CAGR, is anticipated to achieve USD 27.551 billion by 2030 from USD 16.134 billion in 2025.

The Electronic Design Automation (EDA) market provides the indispensable software, hardware, and intellectual property (IP) that underpin the entire semiconductor industry. The current market dynamic is defined by a convergence of foundational technology shifts and volatile macroeconomic forces. The industry is undergoing a fundamental evolution, moving from siloed chip-level design to a holistic "silicon-to-systems" approach. This transition, driven by the move to advanced nodes and the systemic integration of AI, is translating into sustained, high-value demand for advanced EDA licenses and platforms.

Core Market Dynamics: Drivers and Imperatives

The market's trajectory is being shaped by several powerful, interconnected drivers. Foremost among these is the decisive shift toward heterogeneous computing and chiplet-based architectures. As traditional monolithic chip design faces physical and economic constraints at sub-5nm nodes, chiplets have emerged as the dominant path forward. This architectural shift creates an urgent and direct demand for novel EDA solutions capable of addressing inter-die communication, power integrity, and thermal management across the entire package. This environment specifically propels demand for sophisticated 2.5D/3D IC physical design & verification tools and CAE software for multi-physics simulation, which are essential for modeling the high-bandwidth, low-latency communication that defines chiplet performance.

Concurrently, the integration of Artificial Intelligence (AI) and Machine Learning (ML) into EDA workflows is becoming a critical demand driver in its own right. As design complexity outstrips the capacity for manual optimization, AI-driven solutions for generative IC design and multi-run verification are becoming indispensable for maintaining design quality and reducing cycle times. This is not a generic trend but a specific driver for advanced software licenses that leverage massive compute resources for autonomous design space exploration, directly translating into higher-value subscriptions for AI-enabled EDA platforms.

The automotive sector represents a particularly potent source of demand. The transformation into Software-Defined Vehicles (SDVs), coupled with the development of ADAS and autonomous platforms, mandates an unprecedented integration of electronics. This creates a non-negotiable requirement for EDA tools that offer specialized capabilities for mixed-signal design, robust multiphysics simulation, and comprehensive functional safety verification to meet stringent standards like ISO 26262.

Critical Challenges and Consequent Opportunities

Despite strong demand, the market faces significant headwinds. The primary challenge is the persistent security and data sovereignty concern surrounding cloud-based EDA deployment. While the cloud offers scalability for compute-intensive tasks, the hesitation to migrate mission-critical IP off-premise directly suppresses demand for cloud-based models, reinforcing reliance on high-capital on-premise infrastructure. This constraint, however, presents a clear opportunity for vendors to invest in and offer highly secure, hybrid cloud architectures with verifiable encryption and access control, thereby unlocking pent-up demand.

A secondary challenge is the escalating scarcity of highly specialized EDA engineering talent. The sophistication of next-generation tools creates a skills gap that increases the total cost of ownership for EDA solutions. This challenge generates a parallel opportunity for EDA vendors to see higher demand for turnkey system design and analysis tools and professional services, which can compensate for the internal talent deficit of their customers.

Geopolitical and Regulatory Influences

The market is increasingly subject to the influence of government policy and geopolitical tensions. Export controls, such as those implemented by the US, introduce significant volatility, creating immediate revenue disruptions for EDA firms while simultaneously acting as a catalyst for affected jurisdictions to aggressively fund domestic EDA alternatives, strategically shifting long-term global demand.

Regulations are also creating indirect demand vectors. For instance, the European Union's proposed AI Act, with its focus on transparency and safety for high-risk AI applications, creates a compliance-driven imperative for EDA tools that provide verifiable and auditable design flows. In contrast, India's Design Linked Incentive (DLI) scheme represents a direct stimulus, creating a subsidized demand channel for EDA software licenses among emerging domestic design houses and making the region a highly dynamic growth area.

Competitive Landscape: The Consolidation toward Systems

The EDA market is an effective oligopoly, highly concentrated around three dominant, full-stack vendors: Synopsys, Cadence Design Systems, and Siemens EDA. Competition has shifted from pure chip design to the capability of delivering a unified, certified flow that addresses system-level challenges beyond the chip itself, such as packaging, thermal, and structural analysis. The primary competitive axes are now the integration of AI/ML capabilities for design autonomy and strategic acquisitions that extend the vendors' total addressable market into system-level physics.

This is evidenced by the strategic direction of the key players. Cadence's "Intelligent System Design" strategy focuses on end-to-end solutions, a direction reinforced by its move to acquire businesses with core multiphysics simulation software to expand into structural analysis. Similarly, Synopsys has fortified its leadership and "Silicon to Systems" approach by completing a transformative acquisition that integrates world-class simulation and analysis capabilities directly into its core silicon design platform. These moves are explicitly designed to enable customers to simulate chip performance within larger electronic systems, such as autonomous vehicles or server racks, reflecting the market's central imperative.

Conclusion

The EDA market is at an inflection point, where its role is expanding from enabling chip design to enabling entire electronic systems. The demands of new architectures like chiplets, the transformative potential of AI, and the stringent requirements of sectors like automotive are forcing a fundamental evolution in EDA capabilities. While challenges around security and talent persist, they present clear opportunities for innovation and service expansion. In this environment, the leading vendors are consolidating their positions through strategic acquisitions that bridge the gap between silicon and systems, ensuring that EDA remains the critical, non-negotiable foundation for global technological progress.

Key Benefits of this Report:

Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

What do businesses use our reports for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

Historical data from 2022 to 2024 & forecast data from 2025 to 2030
Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
Competitive Positioning, Strategies, and Market Share Analysis
Revenue Growth and Forecast Assessment of segments and regions including countries
Company Profiling (Strategies, Products, Financial Information, and Key Developments among others.

Electronic Design Automation Market Segmentation

By Type
Computer-Aided Engineering (CAE)
IC Physical Design & Verification
Printed Circuit Board (PCB) and Multi-Chip Module (MCM)
Semiconductor Intellectual Property (SIP)
Others
By Deployment
On-Premise
Cloud-Based
By Application
Aerospace & Defence
Automotive
Consumer Electronics
Industrial
Medical
Telecommunications
By Geography
North America (USA, Canada, Mexico)
South America (Brazil, Argentina, Others)
Europe (Germany, France, United Kingdom, Spain, Others)
Middle East and Africa (Saudi Arabia, UAE, Others)
Asia Pacific (China, India, Japan, South Korea, Indonesia, Thailand, Others)

1. EXECUTIVE SUMMARY

2. MARKET SNAPSHOT

2.1. Market Overview
2.2. Market Definition
2.3. Scope of the Study

2.4. Market Segmentation

3. BUSINESS LANDSCAPE

3.1. Market Drivers
3.2. Market Restraints
3.3. Market Opportunities
3.4. Porter's Five Forces Analysis
3.5. Industry Value Chain Analysis
3.6. Policies and Regulations
3.7. Strategic Recommendations

4. TECHNOLOGICAL OUTLOOK

5. ELECTRONIC DESIGN AUTOMATION MARKET BY TYPE

5.1. Introduction
5.2. Computer-Aided Engineering (CAE)
5.3. IC Physical Design & Verification
5.4. Printed Circuit Board (PCB) and Multi-Chip Module (MCM
5.5. Semiconductor Intellectual Property (SIP),
5.6. Others

6. ELECTRONIC DESIGN MARKET BY DEPLOYMENT

6.1. Introduction
6.2. On-Premise
6.3. Cloud-Based

7. ELECTRONIC DESIGN MARKET BY APPLICATION

7.1. Introduction
7.2. Aerospace & Defence
7.3. Automotive
7.4. Consumer Electronics
7.5. Industrial
7.6. Medical
7.7. Telecommunications

8. ELECTRONIC DESIGN MARKET BY GEOGRAPHY

8.1. Introduction
8.2. North America
- 8.2.1. USA
- 8.2.2. Canada
- 8.2.3. Mexico
8.3. South America
- 8.3.1. Brazil
- 8.3.2. Argentina
- 8.3.3. Others
8.4. Europe
- 8.4.1. Germany
- 8.4.2. France
- 8.4.3. United Kingdom
- 8.4.4. Spain
- 8.4.5. Others
8.5. Middle East and Africa
- 8.5.1. Saudi Arabia
- 8.5.2. UAE
- 8.5.3. Others
8.6. Asia Pacific
- 8.6.1. China
- 8.6.2. India
- 8.6.3. Japan
- 8.6.4. South Korea
- 8.6.5. Indonesia
- 8.6.6. Thailand
- 8.6.7. Others

9. COMPETITIVE ENVIRONMENT AND ANALYSIS

9.1. Major Players and Strategy Analysis
9.2. Market Share Analysis
9.3. Mergers, Acquisitions, Agreements, and Collaborations
9.4. Competitive Dashboard

10. COMPANY PROFILES

10.1. Cadence Design Systems
10.2. Synopsys
10.3. Mentor Graphics
10.4. Vennsa Technologies
10.5. Ansys
10.6. Altium
10.7. Zuken
10.8. Agnisys
10.9. Aldec

11. APPENDIX

11.1. Currency
11.2. Assumptions
11.3. Base and Forecast Years Timeline
11.4. Key Benefits for the Stakeholders
11.5. Research Methodology
11.6. Abbreviations

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电子设计自动化 (EDA) 市场 - 2025 年至 2030 年预测