查看购物车
  • Traditional Chinese
  • English
  • Japanese
封面
市场调查报告书
商品编码
1878278

面板级封装市场－2025-2030 年预测

Panel Level Packaging Market - Forecasts from 2025 to 2030
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 150 Pages | 商品交期: 最快1-2个工作天内

价格
简介目录

面板级封装市场预计将从 2025 年的 405,083,000 美元增长到 2030 年的 1,968,233,000 美元，复合年增长率为 37.18%。

面板级包装市场分析

面板级封装是一种先进的组装技术，它将电子元件整合到大型基板或面板上，然后将该面板分割成更小的单元或独立封装。这些面板采用多种材料製造，包括玻璃、陶瓷和有机基板，从而在设计和性能特性方面具有灵活性。多种组装技术，例如覆晶合、焊线和表面黏着技术(SMT)，用于将电子元件固定到面板基板。电阻器和电容器等被动元件也可以嵌入基板结构中，从而实现更高的整合密度和更优异的电气性能。

面板级封装技术是全球半导体封装产业最具发展前景的领域之一。推动面板级封装市场发展的关键因素包括灵活的电路设计能力和满足现代半导体应用经济和技术要求的成本效益高的封装解决方案。这项技术使製造商能够在保持先进电子应用所需的高精度和高可靠性标准的同时，实现规模经济。

主要市场驱动因素

电子设备和5G技术

面板级封装市场预计将在5G网路、人工智慧、进阶驾驶辅助系统（ADAS）、智慧城市和物联网相关产品等未来应用中发挥关键作用。面板级封装具有高效能、节能、轻薄小巧外形规格，并有望在消费性电子产业中广泛应用，用于製造智慧型手机、笔记型电脑和智慧型穿戴装置等超薄便携设备。

美国消费科技协会 (CTA) 预测，消费性电子产品零售额将成长 4.3%，达到 4,610 亿美元，显示市场正强劲扩张。消费性电子产品销售额的年增长显着提升了对面板级封装解决方案的需求，以支持小型化趋势。据 CTA 称，记忆体、逻辑电路、类比电路和微处理器相关的半导体产品占半导体行业总销售额的 80% 以上，这促使市场领导更加专注于这些特定产品类型类别的面板级封装製程。

主流5G智慧型手机天线模组采用面板级封装技术，这使得5G部署与封装需求之间形成了直接的需求连结。全球行动通讯系统协会（GSMA）预测，到2025年，全球三分之一的人口将覆盖5G网络，这将显着提升对5G智慧型手机的需求。美国消费科技协会（CTA）估计，2022年5G智慧型手机的营收将达到613.7亿美元，比2021年的533.8亿美元成长15%。这一成长趋势表明，市场对面板级封装解决方案的需求庞大，以支援下一代无线技术的部署。

汽车产业的成长

在汽车行业，采用能够将电子元件小型化并整合到单一面板上的尖端半导体封装技术，预计将显着推动面板级封装市场的成长。电气及电子工程师学会（IEEE）指出，诸如车联网（V2X）和高级驾驶辅助系统（ADAS）等技术通讯，持续维持汽车产业对半导体的需求。

根据国际汽车製造商协会（OICA）的数据，2021年印度乘用车销量约占全球总销量的68.21%，而中国和美国是该领域最大的两个市场。印度汽车製造商协会（SIAM）的报告显示，印度汽车产业持续稳定成长，2021-2022财年（2021年4月至2022年2月）汽车销售量成长了35.97%。这表明，全球市场对面板级封装解决方案的需求巨大，以支持汽车电子产品的普及。

随着汽车产业向电气化、自动驾驶和联网汽车汽车等方向发展，每辆车所需的半导体数量显着增加。面板级封装（PLP）技术能够以经济高效的方式整合复杂的电子系统，同时满足汽车应用特有的严格可靠性和环境要求，从而满足这些需求。

区域市场动态

预计亚太地区在整个预测期内将继续保持显着的市场份额。该地区是重要的半导体製造中心，并在面板级封装技术发展方面处于领先地位。根据半导体产业协会（SIA）估计，亚太地区占全球半导体销售额的50%以上，巩固了该地区在全球半导体生产领域的主导地位。

许多主要的面板级封装市场参与企业都位于台湾，包括台积电、日月光科技和力拓科技。这些公司正大力投资面板级封装技术，以提升其半导体产品的功能和提案。 2020年，台湾政府工业局推出了“半导体登月计划”，旨在开发包括面板级封装在内的先进封装技术。该计划在五年内共投入500亿新台币（约18亿美元），反映了政府维持技术领先地位的决心。

这些因素共同推动亚太半导体市场的成长，产生协同效应，将在整个预测期内促进面板级封装市场的发展，从而巩固该地区作为全球先进半导体封装技术开发和生产中心的地位。

本报告的主要优势：

  • 深入分析：提供对主要和新兴地区的深入市场洞察，重点关注客户群、政府政策和社会经济因素、消费者偏好、行业垂直领域和其他细分市场。
  • 竞争格局：了解全球主要参与者采取的策略倡议，并了解透过正确的策略进入市场的潜力。
  • 市场驱动因素与未来趋势：分析市场驱动因素和关键趋势及其对未来市场发展的影响。
  • 可操作的建议：利用这些见解，在动态环境中做出策略决策，并开拓新的商机和收入来源。
  • 受众广泛：适用于Start-Ups、研究机构、顾问公司、中小企业和大型企业，且经济实惠。

公司如何使用我们的报告范例

产业与市场分析、机会评估、产品需求预测、打入市场策略、地理扩张、资本投资决策、法规结构及影响、新产品开发、竞争情报

报告范围：

  • 2022年至2024年的历史数据和2025年至2030年的预测数据
  • 成长机会、挑战、供应链前景、法规结构与趋势分析
  • 竞争定位、策略和市场占有率分析
  • 按业务板块和地区分類的收入成长和预测评估，包括国家/地区
  • 公司概况（策略、产品、财务资讯、关键发展等）

目录

第一章执行摘要

第二章 市场概览

  • 市场概览
  • 市场定义
  • 调查范围
  • 市场区隔

第三章 商业情境

  • 市场驱动因素
  • 市场限制
  • 市场机会
  • 波特五力分析
  • 产业价值链分析
  • 政策与法规
  • 策略建议

第四章 技术展望

5. 依晶圆尺寸分類的面板级封装市场

  • 介绍
  • 400毫米或更小
  • 超过400毫米

6. 按最终用户分類的面板级包装市场

  • 介绍
  • 车
  • 电子设备
  • 通讯
  • 其他的

7. 按区域分類的面板级包装市场

  • 介绍
  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 南美洲
    • 巴西
    • 阿根廷
    • 其他的
  • 欧洲
    • 德国
    • 法国
    • 英国
    • 西班牙
    • 其他的
  • 中东和非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 其他的
  • 亚太地区
    • 中国
    • 印度
    • 日本
    • 韩国
    • 印尼
    • 泰国
    • 其他的

第八章 竞争格局与分析

  • 主要企业和策略分析
  • 市占率分析
  • 合併、收购、协议和合作
  • 竞争对手仪錶板

第九章：公司简介

  • Amkor Technologies
  • ASE Group
  • Deca Technologies
  • Innocentrix LLC
  • JCET Global
  • PowerTech Technology Inc
  • Siliconware Precision Industries
  • SPTS Technologies
  • TSMC

第十章附录

  • 货币
  • 先决条件
  • 基准年和预测年时间表
  • 相关人员的主要收益
  • 调查方法
  • 简称
简介目录
Product Code: KSI061614853

The Panel Level Packaging Market, with a 37.18% CAGR, is anticipated to reach USD 1,968.233 million in 2030 from USD 405.083 million in 2025.

Panel Level Packaging Market Analysis

Panel level packaging represents an advanced assembly methodology involving the integration of electrical components onto large substrates or panels, which are subsequently divided into smaller units or individual packages. These panels are fabricated from diverse materials including glass, ceramic, or organic substrates, providing flexibility in design and performance characteristics. Multiple assembly techniques including flip-chip bonding, wire bonding, and surface mount technology are employed to secure electrical components to the panel substrate. Passive components such as resistors and capacitors may also be embedded within the substrate structure, enabling higher integration density and improved electrical performance.

Panel-level package technology represents the most promising advancement area within the global semiconductor packaging industry. Key influencing elements driving panel-level packaging market development include flexible circuit design capabilities and cost-effective packaging solutions that address the economic and technical requirements of modern semiconductor applications. This technology enables manufacturers to achieve economies of scale while maintaining high precision and reliability standards essential for advanced electronic applications.

Primary Market Drivers

Electronic Devices and 5G Technology

The panel level packaging market is anticipated to play crucial roles in future applications involving 5G networks, artificial intelligence, advanced driver-assistance systems (ADAS), smart cities, and Internet of Things-related products. Panel-level packaging delivers high-performing, energy-efficient, thin, and small form factor packages finding extensive applications in the consumer electronics industry for creating ultra-thin portable devices including smart mobile phones, laptops, and smart wearables.

The Consumer Technology Association (CTA) predicted retail purchases of consumer electronics would increase by 4.3% to $461 billion, demonstrating robust market expansion. Annual growth in consumer electronics sales has substantially increased demand for panel-level packaging solutions supporting miniaturization trends. According to CTA, memory, logic, analog, and microprocessor-related semiconductor products account for more than 80% of total semiconductor industry sales, providing market leaders with stronger motivation to concentrate on panel-level packaging processes for these specific product categories.

Mainstream chips in antenna modules of 5G smartphones utilize panel-level packaging technology, creating direct demand linkage between 5G deployment and packaging requirements. The Groupe Speciale Mobile Association (GSMA) predicted that by 2025, one-third of the world's population would be serviced by 5G networks, substantially increasing demand for 5G-enabled smartphones. The Consumer Technology Association (CTA) estimated 5G smartphone sales would generate $61.37 billion in revenue in 2022, representing a 15% increase from $53.38 billion in 2021. This growth trajectory demonstrates substantial demand for panel-level packaging market solutions supporting next-generation wireless technology deployment.

Automotive Sector Growth

The automotive sector is expected to boost panel level packaging market growth significantly through adoption of cutting-edge semiconductor packaging technologies enabling miniaturization and integration of electronic components onto single panels. The Institute of Electrical and Electronics Engineers (IEEE) noted that automotive industry demand for semiconductors has remained consistent due to advancements in technologies including vehicle-to-everything communication and advanced driver-assistance systems (ADAS).

According to the International Organization of Motor Vehicle Manufacturers (OICA), approximately 68.21% of passenger cars were sold globally in 2021, with China and the United States representing the two largest markets in this sector. The Society of Indian Automobile Manufacturers (SIAM) reported that the Indian automobile industry has been expanding steadily, with automobile sales increasing by 35.97% in fiscal year 2021-22 (April 2021 through February 2022). This demonstrates substantial demand for panel level packaging solutions supporting automotive electronics proliferation across global markets.

The automotive industry's transition toward electrification, autonomous driving capabilities, and connected vehicle features requires significantly increased semiconductor content per vehicle. Panel-level packaging technology addresses these requirements by enabling cost-effective integration of complex electronic systems while meeting the stringent reliability and environmental requirements characteristic of automotive applications.

Regional Market Dynamics

During the forecast period, the Asia Pacific region is expected to maintain significant market share dominance. The Asia Pacific region functions as a major hub for semiconductor manufacturing and has positioned itself at the forefront of panel-level packaging technology development. The Semiconductor Industry Association (SIA) estimated that Asia-Pacific accounts for more than 50% of worldwide semiconductor revenue, underscoring the region's dominant position in global semiconductor production.

Numerous significant panel-level packaging market participants including TSMC, ASE Technology Holding, and Powertech Technology are based in Taiwan. These companies are making substantial investments in panel-level packaging technology to enhance functionality and value propositions of their semiconductor products. The Taiwanese government's Industrial Development Bureau (IDB) launched the "Semiconductor Moonshot Project" in 2020, aimed at developing advanced packaging technologies including panel-level packaging. The project was allocated total funding of TWD 50 billion (approximately $1.8 billion) over five years, demonstrating governmental commitment to maintaining technological leadership.

These factors collectively contribute to semiconductor market growth in Asia Pacific regions, creating reinforcing momentum that boosts the panel level packaging market throughout the forecast period and solidifies the region's position as the global epicenter for advanced semiconductor packaging innovation and production.

Key Benefits of this Report:

  • Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
  • Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
  • Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
  • Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
  • Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

What do businesses use our reports for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

  • Historical data from 2022 to 2024 & forecast data from 2025 to 2030
  • Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
  • Competitive Positioning, Strategies, and Market Share Analysis
  • Revenue Growth and Forecast Assessment of segments and regions including countries
  • Company Profiling (Strategies, Products, Financial Information, and Key Developments among others.

Segmentation:

  • PANEL LEVEL PACKAGING MARKET BY WAFER SIZE
  • Up to 400mm
  • More than 400mm
  • PANEL LEVEL PACKAGING MARKET BY END-USER
  • Automotive
  • Electronics
  • Communications
  • Others
  • PANEL LEVEL PACKAGING MARKET BY GEOGRAPHY
  • North America
  • USA
  • Canada
  • Mexico
  • South America
  • Brazil
  • Argentina
  • Others
  • Europe
  • Germany
  • France
  • United Kingdom
  • Spain
  • Others
  • Middle East and Africa
  • Saudi Arabia
  • UAE
  • Others
  • Asia Pacific
  • China
  • India
  • Japan
  • South Korea
  • Indonesia
  • Thailand
  • Others

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

2. MARKET SNAPSHOT

  • 2.1. Market Overview
  • 2.2. Market Definition
  • 2.3. Scope of the Study

2.4. Market Segmentation

3. BUSINESS LANDSCAPE

  • 3.1. Market Drivers
  • 3.2. Market Restraints
  • 3.3. Market Opportunities
  • 3.4. Porter's Five Forces Analysis
  • 3.5. Industry Value Chain Analysis
  • 3.6. Policies and Regulations
  • 3.7. Strategic Recommendations

4. TECHNOLOGICAL OUTLOOK

5. PANEL LEVEL PACKAGING MARKET BY WAFER SIZE

  • 5.1. Introduction
  • 5.2. Up to 400mm
  • 5.3. More than 400mm

6. PANEL LEVEL PACKAGINGMARKET BY END-USER

  • 6.1. Introduction
  • 6.2. Automotive
  • 6.3. Electronics
  • 6.4. Communications
  • 6.5. Others

7. PANEL LEVEL PACKAGING MARKET BY GEOGRAPHY

  • 7.1. Introduction
  • 7.2. North America
    • 7.2.1. USA
    • 7.2.2. Canada
    • 7.2.3. Mexico
  • 7.3. South America
    • 7.3.1. Brazil
    • 7.3.2. Argentina
    • 7.3.3. Others
  • 7.4. Europe
    • 7.4.1. Germany
    • 7.4.2. France
    • 7.4.3. United Kingdom
    • 7.4.4. Spain
    • 7.4.5. Others
  • 7.5. Middle East and Africa
    • 7.5.1. Saudi Arabia
    • 7.5.2. UAE
    • 7.5.3. Others
  • 7.6. Asia Pacific
    • 7.6.1. China
    • 7.6.2. India
    • 7.6.3. Japan
    • 7.6.4. South Korea
    • 7.6.5. Indonesia
    • 7.6.6. Thailand
    • 7.6.7. Others

8. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 8.1. Major Players and Strategy Analysis
  • 8.2. Market Share Analysis
  • 8.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 8.4. Competitive Dashboard

9. COMPANY PROFILES

  • 9.1. Amkor Technologies
  • 9.2. ASE Group
  • 9.3. Deca Technologies
  • 9.4. Innocentrix LLC
  • 9.5. JCET Global
  • 9.6. PowerTech Technology Inc
  • 9.7. Siliconware Precision Industries
  • 9.8. SPTS Technologies
  • 9.9. TSMC

10. APPENDIX

  • 10.1. Currency
  • 10.2. Assumptions
  • 10.3. Base and Forecast Years Timeline
  • 10.4. Key Benefits for the Stakeholders
  • 10.5. Research Methodology
  • 10.6. Abbreviations