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封面
市场调查报告书
商品编码
1153886

半导体用粘胶、薄膜的全球市场:趋势，机会，竞争分析

Semiconductor Adhesive Paste and Film Market: Trends, Opportunities and Competitive Analysis
出版日期: | 出版商: Lucintel | 英文 211 Pages | 商品交期: 3个工作天内

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简介目录

全球半导体用粘胶、薄膜的市场规模，预计从2021年到2027年以5.1％的年复合成长率扩大，2027年成为787亿美元。牵引市场的主要原因，是家电产品的成长与汽车的电子内容的增加造成半导体需求增加等。

本报告提供半导体用粘胶、薄膜的世界市场调查，市场规模和预测，市场促进因素及课题，市场趋势，各市场区隔的市场分析，竞争情形，成长机会分析等系统性资讯。

目录

第1章 摘要整理

第2章 市场背景与分类法

  • 简介，背景，分类法
  • 供应链
  • 产业的推动因素与课题

第3章 市场趋势与预测分析(2016年～2027年)

  • 宏观经济趋势(2016年～2021年)与预测(2022年～2027年)
  • 全球市场趋势(2016年～2021年)与预测(2022年～2027年)
  • 各产品类型
    • 环氧树脂系黏剂
    • 硅胶系黏剂
    • 丙烯系黏剂
    • 聚氨酯系黏剂
    • 其他
  • 各用途
    • 汽车
    • 家电
    • 航太与防卫
    • 生物科学
    • 其他

第4章 市场趋势与预测分析:各地区(2016年～2027年)

  • 各地区
  • 北美
    • 各产品类型
    • 各用途
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 各产品类型
    • 各用途
    • 德国
    • 法国
    • 义大利
    • 英国
  • 亚太地区
    • 各产品类型
    • 各用途
    • 中国
    • 印度
    • 日本
  • 其他地区
    • 各产品类型
    • 各用途

第5章 竞争分析

  • 产品系列分析
  • 地理有效半径
  • 波特的五力分析

第6章 成长机会及策略分析

  • 成长机会分析
    • 各产品类型
    • 各用途
    • 各地区
  • 全球市场的新的趋势
  • 策略分析
    • 新产品的开发
    • 生产能力的扩大
    • 合併，收购，合资企业

第7章 主要企业的简介

  • H.B. Fuller
  • Henkel
  • Master Bond
  • Panacol-Elosol
  • 3M
简介目录

Semiconductor Adhesive Paste and Film Market Trends and Forecast

The future of the semiconductor adhesive paste and film market looks promising with opportunities in the automotive, consumer electronics, aerospace and defense, and bioscience industries. The semiconductor adhesive paste and film market is expected to reach an estimated $78.7 billion by 2027 with a CAGR of 5.1% from 2021 to 2027. The major drivers for this market are increasing demand for semiconductors due to growth in consumer electronics and increasing electronic content in vehicles.

A total of 93 figures / charts and 93 tables are provided in this 211-page report to help in your business decisions. Learn the scope of benefits, companies researched, and other details of the semiconductor adhesive paste and film market report.

Semiconductor Adhesive Paste and Film Market by Segment

The study includes a forecast for the global semiconductor adhesive paste and film market by product type, application, and region as follows:

Semiconductor Adhesive Paste and Film Market by Product Type [Value ($M) shipment analysis for 2016 - 2027]:

  • Epoxy Based Adhesives
  • Silicone Based Adhesives
  • Acrylic Based Adhesives
  • Polyurethane Based Adhesives
  • Others

Semiconductor Adhesive Paste and Film Market by Application [Value ($M) shipment analysis for 2016 - 2027]:

  • Automotive
  • Consumer Electronics
  • Aerospace and Defense
  • Biosciences
  • Others

Semiconductor Adhesive Paste and Film Market by Region [Value ($M) analysis for 2016 - 2027]:

  • North America

USA

Mexico

Canada

  • Europe

Germany

Spain

UK

Italy

France

  • Asia Pacific

China

India

Japan

  • The Rest of the World

List of Semiconductor Adhesive Paste and Film Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies semiconductor adhesive paste and film companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the semiconductor adhesive paste and film companies profiled in this report includes.

  • H.B. Fuller
  • Henkel
  • Master Bond
  • Panacol-Elosol
  • 3M

Semiconductor Adhesive Paste and Film Market Insight

  • Epoxy based adhesives will remain the largest segment and it is expected to witness the highest growth over the forecast period due to its superior properties, such as excellent adhesion, versatility, good electrical properties, compatibility, resistance to weathering, and ease of application that can readily be tailored according to the demand of manufacturer
  • Asia Pacific is expected to remain the largest region over the forecast period due to the large manufacturing base for semiconductors.

Features of Semiconductor Adhesive Paste and Film Market

  • Market Size Estimates: Semiconductor adhesive paste and film market size estimation in terms of value ($M)
  • Trend and Forecast Analysis: Market trends (2016-2021) and forecast (2022-2027) by various segments and regions.
  • Segmentation Analysis: Market size by product type and application
  • Regional Analysis: Semiconductor adhesive paste and film market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
  • Growth Opportunities: Analysis of growth opportunities in different product type, application, and regions for the semiconductor adhesive paste and film market.
  • Strategic Analysis: This includes M&A, new product development, and competitive landscape for the semiconductor adhesive paste and film market.
  • Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the semiconductor adhesive paste and film market size?

Answer: The global semiconductor adhesive paste and film market is expected to reach an estimated $78.7 billion by 2027

Q2. What is the growth forecast for semiconductor adhesive paste and film market?

Answer: The semiconductor adhesive paste and film market is expected to grow at a CAGR of 5.1% from 2021 to 2027.

Q3. What are the major drivers influencing the growth of the semiconductor adhesive paste and film market?

Answer: The major drivers for this market are increasing demand for electronic devices including smartphones, laptops, and others

Q4. Who are the key semiconductor adhesive paste and film companies?

Answer: Some of the key semiconductor adhesive paste and film companies are as follows:

  • H.B. Fuller
  • Henkel
  • Master Bond
  • Panacol-Elosol
  • 3M

Q5. In semiconductor adhesive paste and film market, which region is expected to be the largest in next 5 years?

Answer: Asia Pacific is expected to remain the largest region and witness the highest growth over next 5 years

Q6. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% Customization Without any Additional Cost.

This report answers following 11 key questions

  • Q.1 What are some of the most promising potential, high growth opportunities for the global semiconductor adhesive paste and film market by product type (epoxy based adhesives, silicone based adhesives, acrylic based adhesives, polyurethane based adhesives, and others), application (automotive, consumer electronics, aerospace and defense, biosciences, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2 Which segments will grow at a faster pace and why?
  • Q.3 Which regions will grow at a faster pace and why?
  • Q.4 What are the key factors affecting market dynamics? What are the drivers and challenges of the market?
  • Q.5 What are the business risks and threats to the market?
  • Q.6 What are the emerging trends in this market and the reasons behind them?
  • Q.7 What are the changing demands of customers in the market?
  • Q.8 What are the new developments in the market? Which companies are leading these developments?
  • Q.9 Who are the major players in this market? What strategic initiatives are being implemented by key players for business growth?
  • Q.1 0 What are some of the competitive products and processes in this area and how big of a threat do they pose for loss of market share via material or product substitution?
  • Q.1 1 What M & A activities have taken place in the last 5 years in this market?

Table of Contents

1. Executive Summary

2. Market Background and Classifications

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2016 to 2027

  • 3.1: Macroeconomic Trends (2016-2021) and Forecast (2022-2027)
  • 3.2: Global Semiconductor Adhesive Paste and Film Market Trends (2016-2021) and Forecast (2022-2027)
  • 3.3: Global Semiconductor Adhesive Paste and Film Market by Product Type
    • 3.3.1: Epoxy Based Adhesives
    • 3.3.2: Silicone Based Adhesives
    • 3.3.3: Acrylic Based Adhesives
    • 3.3.4: Polyurethane Based Adhesives
    • 3.3.5: Others
  • 3.4: Global Semiconductor Adhesive Paste and Film Market by Application
    • 3.4.1: Automotive
    • 3.4.2: Consumer Electronics
    • 3.4.3: Aerospace and Defense
    • 3.4.4: Biosciences
    • 3.4.5: Others

4. Market Trends and Forecast Analysis by Region from 2016 to 2027

  • 4.1: Global Semiconductor Adhesive Paste and Film Market by Region
  • 4.2: North American Semiconductor Adhesive Paste and Film Market
    • 4.2.1: Market by Product Type: Epoxy Based Adhesives, Silicone Based Adhesives, Acrylic Based Adhesives, Polyurethane Based Adhesives, and Others
    • 4.2.2: Market by Application: Automotive, Consumer Electronics, Aerospace and Defense, Biosciences, and Others
    • 4.2.3: United States Semiconductor Adhesive Paste and Film Market
    • 4.2.4: Canadian Semiconductor Adhesive Paste and Film Market
    • 4.2.5: Mexican Semiconductor Adhesive Paste and Film Market
  • 4.3: European Semiconductor Adhesive Paste and Film Market
    • 4.3.1: Market by Product Type: Epoxy Based Adhesives, Silicone Based Adhesives, Acrylic Based Adhesives, Polyurethane Based Adhesives, and Others
    • 4.3.2: Market by Application: Automotive, Consumer Electronics, Aerospace and Defense, Biosciences, and Others
    • 4.3.3: German Semiconductor Adhesive Paste and Film Market
    • 4.3.4: French Semiconductor Adhesive Paste and Film Market
    • 4.3.5: Italian Semiconductor Adhesive Paste and Film Market
    • 4.3.6: United Kingdom Semiconductor Adhesive Paste and Film Market
  • 4.4: APAC Semiconductor Adhesive Paste and Film Market
    • 4.4.1: Market by Product Type: Epoxy Based Adhesives, Silicone Based Adhesives, Acrylic Based Adhesives, Polyurethane Based Adhesives, and Others
    • 4.4.2: Market by Application: Automotive, Consumer Electronics, Aerospace and Defense, Biosciences, and Others
    • 4.4.3: Chinese Semiconductor Adhesive Paste and Film Market
    • 4.4.4: Indian Semiconductor Adhesive Paste and Film Market
    • 4.4.5: Japanese Semiconductor Adhesive Paste and Film Market
  • 4.5: ROW Semiconductor Adhesive Paste and Film Market
    • 4.5.1: Market by Product Type: Epoxy Based Adhesives, Silicone Based Adhesives, Acrylic Based Adhesives, Polyurethane Based Adhesives, and Others
    • 4.5.2: Market by Application: Automotive, Consumer Electronics, Aerospace and Defense, Biosciences, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Geographical Reach
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Semiconductor Adhesive Paste and Film Market by Product Type
    • 6.1.2: Growth Opportunities for the Global Semiconductor Adhesive Paste and Film Market by Application
    • 6.1.3: Growth Opportunities for the Global Semiconductor Adhesive Paste and Film Market by Region
  • 6.2: Emerging Trends in the Global Semiconductor Adhesive Paste and Film Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Semiconductor Adhesive Paste and Film Market
    • 6.3.3: Mergers and Acquisitions, and Joint Ventures in the Global Semiconductor Adhesive Paste and Film Industry

7. Company Profiles of Leading Players

  • 7.1: H.B. Fuller
  • 7.2: Henkel
  • 7.3: Master Bond
  • 7.4: Panacol-Elosol
  • 7.5: 3M