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市场调查报告书
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1438021

到 2030 年线路重布材料的市场预测：按类型、材料类型、应用和区域进行全球分析

Redistribution Layer Material Market Forecasts to 2030 - Global Analysis By Type (Fan-out wafer-level packaging, 5D/3D Integrated Circuit Packaging and Other Types), Material Type, Application, and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3个工作天内

价格

根据Stratistics MRC预测，2023年全球线路重布材料市场规模将达2.1836亿美元，预计2030年将达到5.2985亿美元，预测期内复合年增长率为13.5%。

线路重布材料 (RLM) 是电子设备中的关键组件，有助于能量和讯号的有效分配。 RLM 充当晶片不同层之间的桥樑，实现高效互连和讯号分配。 RDL 材料通常需要与先进的封装製程相容，例如覆晶接合和 TSV（硅通孔）技术。 RDL材料具有良好的导热性能，能够散发运作过程中产生的热量，确保半导体装置的可靠性和寿命，特别是在半导体产业的新技术和小型化趋势下。

据尤索夫伊萨东南亚研究院称，东南亚是重要的汽车生产中心，也是全球第七大汽车生产中心，2021年生产汽车350万辆。

积体电路的复杂性不断增加

积体电路变得越来越复杂，在有限的空间中整合了更多的组件和功能。这些材料提供高效的互连解决方案，最大限度地减少讯号损失，并增强先进半导体装置有限空间内的温度控管。此外，RDL材料还有助于提高积体电路的可靠性和性能，推动市场成长。

高成本

开发具有高导电性和导热性等精确特性的 RDL 材料非常复杂，并且带来了许多成本挑战。这些先进製程导致更高的製造成本并影响半导体装置的整体承受能力。此外，竞争激烈的市场需要具有成本效益的解决方案，这给製造商优化生产成本带来了越来越大的压力。材料成本上涨导致最终产品价格上涨，限制了市场进入和采用。

先进封装技术

随着电子设备变得越来越复杂，对紧凑、高效能封装解决方案的需求不断增加。这些封装创新对于满足从行动装置到复杂运算系统的现代电子应用的需求至关重要。此外，促进在单一晶片上整合多种功能、提高性能以及创建更小、更高性能的设备正在推动这一市场的扩张。

有限的标准化

缺乏标准化的测试方法和基准使得相关人员很难准确评估和比较不同RDL材料的性能。这种通用的缺乏阻碍了互通性和相容性，使 RDL 材料与不同半导体装置的整合变得复杂。此外，对于製造商来说，供应链管理的复杂性增加，阻碍了市场扩张。

COVID-19 的影响

COVID-19的爆发对市场产生了重大影响，导致供应链中断并影响市场动态。许多製造商面临原物料采购困难，导致价格上涨和报酬率压力。此外，向远距工作的转变以及消费者在非必需电子产品上的支出减少进一步削弱了市场表现。

5D/3D 积体电路 (IC) 封装领域预计将在预测期内成为最大的领域

5D/3D 积体电路 (IC) 封装领域预计将占据最大份额，因为它将多层 IC 整合到3D以增强效能和功能。模式转移提高导热性、电气性能和可靠性的材料。此外，由于 5D/3D IC 封装实现了多个半导体层的堆迭，RDL 材料在促进这些复杂结构内的互连和讯号分布方面发挥关键作用，使得我们正在推动这一领域的成长。

Butene领域预计在预测期内复合年增长率最高

预计Butene产业在预测期内将出现最高的复合年增长率，特别是在先进微电子和半导体封装领域。 BCB是一种高性能聚合物，是积体电路RDL製造的必备材料。此外，良好的热稳定性、低介电常数和出色的平坦化能力等独特特性使其成为 RDL 应用的理想选择，推动了该领域的成长。

比最大的地区

由于家用电子电器、通讯和汽车电子的快速扩张，亚太地区在预测期内占据了最大的市场占有率。中国、日本、韩国和台湾等国家处于该市场的前沿，拥有主要的半导体製造商和组装设施。此外，随着电子设备变得越来越复杂、越来越小，高效的 RDL 材料对于确保高性能积体电路变得至关重要，从而推动了该地区的市场规模。

复合年增长率最高的地区：

由于半导体封装和微电子技术的进步，预计欧洲在预测期内将呈现最高的复合年增长率。该地区是英飞凌科技、日立化学、杜邦微系统有限责任公司和 Amkor Technology 等主要企业以及主要製造和研究设施的所在地。此外，政府促进创新的努力以及对品质和精密工程的重视正在支持该地区的扩张。

免费客製化服务：

订阅此报告的客户可以存取以下免费自订选项之一：

  • 公司简介
    • 其他市场参与者的综合分析（最多 3 家公司）
    • 主要企业SWOT分析（最多3家企业）
  • 区域分割
    • 根据客户兴趣对主要国家的市场估计、预测和复合年增长率（註：基于可行性检查）
  • 竞争基准化分析
    • 根据产品系列、地理分布和策略联盟对主要企业基准化分析

目录

第一章执行摘要

第二章 前言

  • 概述
  • 相关利益者
  • 调查范围
  • 调查方法
    • 资料探勘
    • 资料分析
    • 资料检验
    • 研究途径
  • 调查来源
    • 主要调查来源
    • 二次调查来源
    • 先决条件

第三章市场趋势分析

  • 促进因素
  • 抑制因素
  • 机会
  • 威胁
  • 应用分析
  • 新兴市场
  • 新型冠状病毒感染疾病（COVID-19）的影响

第4章波特五力分析

  • 供应商的议价能力
  • 买方议价能力
  • 替代品的威胁
  • 新进入者的威胁
  • 竞争对手之间存在敌对关係

第五章全球线路重布材料市场：依类型

  • 扇出晶圆级封装 (FOWLP)
  • 5D/3D 积体电路 (IC) 封装
  • 其他类型

第六章全球线路重布材料市场：依材料类型

  • Butene
  • 聚酰亚胺
  • Polybenzoxazole
  • 其他材质类型

第七章全球线路重布材料市场：依应用

  • 化学工业
  • 电子产品
  • 其他用途

第八章全球线路重布材料市场：按地区

  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 义大利
    • 法国
    • 西班牙
    • 其他欧洲国家
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 澳洲
    • 纽西兰
    • 韩国
    • 其他亚太地区
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 南美洲其他地区
  • 中东和非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 卡达
    • 南非
    • 其他中东和非洲

第九章 主要进展

  • 合约、伙伴关係、协作和合资企业
  • 收购和合併
  • 新产品发布
  • 业务扩展
  • 其他关键策略

第十章 公司简介

  • Fujifilm Corporation
  • HD MicroSystems LLC
  • NXP Semiconductors.
  • A/SE Group
  • Infineon Technologies
  • Samsung Electronics Co., Ltd.
  • Amkor Technology
  • SK Hynix Inc.
  • Shin-Etsu Chemical Co., Ltd
  • Jiangsu Changjiang Electronics Technology Co., Ltd.
Product Code: SMRC25009

According to Stratistics MRC, the Global Redistribution Layer Material Market is accounted for $218.36 million in 2023 and is expected to reach $529.85 million by 2030 growing at a CAGR of 13.5% during the forecast period. A redistribution layer material (RLM) is a crucial component in electronic devices, facilitating efficient energy or signal distribution. It serves as a bridge between different layers of a chip, enabling efficient interconnection and signal distribution. RDL materials often need to be compatible with advanced packaging processes, such as flip-chip bonding or through-silicon via (TSV) technology. RDL materials possess favorable thermal conductivity characteristics to dissipate heat generated during operation, ensuring the reliability and longevity of the semiconductor device, particularly in the context of emerging technologies and miniaturization trends in the semiconductor industry.

According to the ISEAS-Yusof Ishak Institute, Southeast Asia is an important automobile production base and seventh largest automotive manufacturing hub worldwide and produced 3.5 million vehicles in 2021.

Market Dynamics:

Driver:

Rising complexity in integrated circuits

Integrated circuits are becoming more intricate, incorporating a greater number of components and functionalities within a limited space. These materials provide efficient interconnection solutions, minimize signal losses, and enhance thermal management within the confined spaces of advanced semiconductor devices. In addition, RDL materials contribute to the reliability and performance of integrated circuits, thereby boosting market growth.

Restraint:

High costs

The complexity of developing RDL materials with precise properties, such as high electrical and thermal conductivity, adds to the cost challenge. These sophisticated processes contribute to elevated production costs, impacting the overall affordability of semiconductor devices. Furthermore, the demand for cost-effective solutions in a competitive market intensifies the pressure on manufacturers to optimize production expenses. High material costs can lead to increased end-product prices, limiting market accessibility and adoption.

Opportunity:

Advanced packaging technologies

The demand for compact and high-performance packaging solutions has intensified as electronic devices become increasingly sophisticated. These packaging innovations are crucial for meeting the demands of modern electronic applications, ranging from mobile devices to complex computing systems. Moreover, it facilitates the integration of multiple functions on a single chip, enhances performance, and enables the creation of smaller, more powerful devices, which is driving this market expansion.

Threat:

Limited standardization

The absence of standardized testing methods and benchmarks makes it challenging for stakeholders to assess and compare the performance of different RDL materials accurately. This lack of common ground hinders interoperability and interchangeability, leading to complications in the integration of RDL materials into diverse semiconductor devices. It also increases the complexity of supply chain management for manufacturers, which is impeding this market size.

Covid-19 Impact

The COVID-19 pandemic has significantly impacted the market, causing disruptions in the supply chain and influencing market dynamics. Many manufacturers faced difficulties in sourcing raw materials, leading to increased prices and a strain on profit margins. Moreover, the shift towards remote working and reduced consumer spending on non-essential electronics further dampened the market's performance.

The 5D/3D integrated circuit (IC) Packaging segment is expected to be the largest during the forecast period

The 5D/3D integrated circuit (IC) Packaging segment is estimated to hold the largest share, due to the integration of multiple layers of ICs in three dimensions, enhancing performance and functionality. A paradigm shift towards materials offer improved thermal conductivity, electrical performance, and reliability. Moreover, as 5D/3D IC packaging enables the stacking of multiple semiconductor layers, RDL materials play a critical role in facilitating interconnects and signal distribution within these complex structures which is driving this segment growth.

The benzocylobutene segment is expected to have the highest CAGR during the forecast period

The benzocylobutene segment is anticipated to have highest CAGR during the forecast period, particularly in the realm of advanced microelectronics and semiconductor packaging. BCB, a high-performance polymer, serves as a crucial material for the fabrication of RDLs in integrated circuits. Furthermore, unique properties, including excellent thermal stability, a low dielectric constant, and superior planarization capabilities, make it an ideal choice for RDL applications, which are boosting this segment's growth.

Region with largest share:

Asia Pacific commanded the largest market share during the extrapolated period, owing to a rapidly expanding consumer electronics, telecommunications, and automotive electronics. Countries such as China, Japan, South Korea, and Taiwan are at the forefront of this market, hosting major semiconductor manufacturers and assembly facilities. In addition, as electronic devices become more sophisticated and compact, the need for efficient RDL materials becomes critical for ensuring high-performance integrated circuits, driving the size of this region.

Region with highest CAGR:

Europe is expected to witness highest CAGR over the projection period, owing to advancements in semiconductor packaging and microelectronics. The region is home to several key players, including Infineon Technologies, Hitachi Chemical, DuPont MicroSystems L.L.C., and Amkor Technology, which host major manufacturing and research facilities. Moreover, government initiatives promoting innovation, coupled with a strong emphasis on quality and precision engineering, are propelling this region's expansion.

Key players in the market

Some of the key players in the Redistribution Layer Material Market include Fujifilm Corporation, HD MicroSystems LLC, NXP Semiconductors, ASE Group, Infineon Technologies, Samsung Electronics Co., Ltd., Amkor Technology, SK Hynix Inc., Shin-Etsu Chemical Co., Ltd and Jiangsu Changjiang Electronics Technology Co., Ltd.

Key Developments:

In November 2023, Amkor Technology, Inc. announced that it has committed to setting targets to reduce greenhouse gas emissions in alignment with the Science Based Targets initiative (SBTi).

In June 2023, FUJIFILM Cellular Dynamics, announces the global commercial launch of its human iPSC-derived iCell® Blood-Brain Barrier Isogenic Kit for scientists engaged in neuroscience research and drug discovery for neuroactive drugs.

In January 2023, FUJIFILM Cellular Dynamics, Inc., announced that it has entered an agreement to grant global healthcare company Novo Nordisk A/S a non-exclusive right to use FUJIFILM Cellular Dynamics' iPSC platform for the development and commercialization of iPSC-derived cell therapies with a focus on addressing serious chronic diseases

Types Covered:

  • Fan-out wafer-level packaging (FOWLP)
  • 5D/3D Integrated Circuit (IC) Packaging
  • Other Types

Material Types Covered:

  • Benzocylobutene
  • Polyimide
  • Polybenzoxazole
  • Other Material Types

Applications Covered:

  • Chemical Industry
  • Electronic Appliances
  • Other Applications

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2021, 2022, 2023, 2026, and 2030
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Application Analysis
  • 3.7 Emerging Markets
  • 3.8 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Redistribution Layer Material Market, By Type

  • 5.1 Introduction
  • 5.2 Fan-out wafer-level packaging (FOWLP)
  • 5.3 5D/3D Integrated Circuit (IC) Packaging
  • 5.4 Other Types

6 Global Redistribution Layer Material Market, By Material Type

  • 6.1 Introduction
  • 6.2 Benzocylobutene
  • 6.3 Polyimide
  • 6.4 Polybenzoxazole
  • 6.5 Other Material Types

7 Global Redistribution Layer Material Market, By Application

  • 7.1 Introduction
  • 7.2 Chemical Industry
  • 7.3 Electronic Appliances
  • 7.4 Other Applications

8 Global Redistribution Layer Material Market, By Geography

  • 8.1 Introduction
  • 8.2 North America
    • 8.2.1 US
    • 8.2.2 Canada
    • 8.2.3 Mexico
  • 8.3 Europe
    • 8.3.1 Germany
    • 8.3.2 UK
    • 8.3.3 Italy
    • 8.3.4 France
    • 8.3.5 Spain
    • 8.3.6 Rest of Europe
  • 8.4 Asia Pacific
    • 8.4.1 Japan
    • 8.4.2 China
    • 8.4.3 India
    • 8.4.4 Australia
    • 8.4.5 New Zealand
    • 8.4.6 South Korea
    • 8.4.7 Rest of Asia Pacific
  • 8.5 South America
    • 8.5.1 Argentina
    • 8.5.2 Brazil
    • 8.5.3 Chile
    • 8.5.4 Rest of South America
  • 8.6 Middle East & Africa
    • 8.6.1 Saudi Arabia
    • 8.6.2 UAE
    • 8.6.3 Qatar
    • 8.6.4 South Africa
    • 8.6.5 Rest of Middle East & Africa

9 Key Developments

  • 9.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 9.2 Acquisitions & Mergers
  • 9.3 New Product Launch
  • 9.4 Expansions
  • 9.5 Other Key Strategies

10 Company Profiling

  • 10.1 Fujifilm Corporation
  • 10.2 HD MicroSystems LLC
  • 10.3 NXP Semiconductors.
  • 10.4 A/SE Group
  • 10.5 Infineon Technologies
  • 10.6 Samsung Electronics Co., Ltd.
  • 10.7 Amkor Technology
  • 10.8 SK Hynix Inc.
  • 10.9 Shin-Etsu Chemical Co., Ltd
  • 10.10 Jiangsu Changjiang Electronics Technology Co., Ltd.

List of Tables

  • Table 1 Global Redistribution Layer Material Market Outlook, By Region (2021-2030) ($MN)
  • Table 2 Global Redistribution Layer Material Market Outlook, By Type (2021-2030) ($MN)
  • Table 3 Global Redistribution Layer Material Market Outlook, By Fan-out wafer-level packaging (FOWLP) (2021-2030) ($MN)
  • Table 4 Global Redistribution Layer Material Market Outlook, By 5D/3D Integrated Circuit (IC) Packaging (2021-2030) ($MN)
  • Table 5 Global Redistribution Layer Material Market Outlook, By Other Types (2021-2030) ($MN)
  • Table 6 Global Redistribution Layer Material Market Outlook, By Material Type (2021-2030) ($MN)
  • Table 7 Global Redistribution Layer Material Market Outlook, By Benzocylobutene (2021-2030) ($MN)
  • Table 8 Global Redistribution Layer Material Market Outlook, By Polyimide (2021-2030) ($MN)
  • Table 9 Global Redistribution Layer Material Market Outlook, By Polybenzoxazole (2021-2030) ($MN)
  • Table 10 Global Redistribution Layer Material Market Outlook, By Other Material Types (2021-2030) ($MN)
  • Table 11 Global Redistribution Layer Material Market Outlook, By Application (2021-2030) ($MN)
  • Table 12 Global Redistribution Layer Material Market Outlook, By Chemical Industry (2021-2030) ($MN)
  • Table 13 Global Redistribution Layer Material Market Outlook, By Electronic Appliances (2021-2030) ($MN)
  • Table 14 Global Redistribution Layer Material Market Outlook, By Other Applications (2021-2030) ($MN)
  • Table 15 North America Redistribution Layer Material Market Outlook, By Country (2021-2030) ($MN)
  • Table 16 North America Redistribution Layer Material Market Outlook, By Type (2021-2030) ($MN)
  • Table 17 North America Redistribution Layer Material Market Outlook, By Fan-out wafer-level packaging (FOWLP) (2021-2030) ($MN)
  • Table 18 North America Redistribution Layer Material Market Outlook, By 5D/3D Integrated Circuit (IC) Packaging (2021-2030) ($MN)
  • Table 19 North America Redistribution Layer Material Market Outlook, By Other Types (2021-2030) ($MN)
  • Table 20 North America Redistribution Layer Material Market Outlook, By Material Type (2021-2030) ($MN)
  • Table 21 North America Redistribution Layer Material Market Outlook, By Benzocylobutene (2021-2030) ($MN)
  • Table 22 North America Redistribution Layer Material Market Outlook, By Polyimide (2021-2030) ($MN)
  • Table 23 North America Redistribution Layer Material Market Outlook, By Polybenzoxazole (2021-2030) ($MN)
  • Table 24 North America Redistribution Layer Material Market Outlook, By Other Material Types (2021-2030) ($MN)
  • Table 25 North America Redistribution Layer Material Market Outlook, By Application (2021-2030) ($MN)
  • Table 26 North America Redistribution Layer Material Market Outlook, By Chemical Industry (2021-2030) ($MN)
  • Table 27 North America Redistribution Layer Material Market Outlook, By Electronic Appliances (2021-2030) ($MN)
  • Table 28 North America Redistribution Layer Material Market Outlook, By Other Applications (2021-2030) ($MN)
  • Table 29 Europe Redistribution Layer Material Market Outlook, By Country (2021-2030) ($MN)
  • Table 30 Europe Redistribution Layer Material Market Outlook, By Type (2021-2030) ($MN)
  • Table 31 Europe Redistribution Layer Material Market Outlook, By Fan-out wafer-level packaging (FOWLP) (2021-2030) ($MN)
  • Table 32 Europe Redistribution Layer Material Market Outlook, By 5D/3D Integrated Circuit (IC) Packaging (2021-2030) ($MN)
  • Table 33 Europe Redistribution Layer Material Market Outlook, By Other Types (2021-2030) ($MN)
  • Table 34 Europe Redistribution Layer Material Market Outlook, By Material Type (2021-2030) ($MN)
  • Table 35 Europe Redistribution Layer Material Market Outlook, By Benzocylobutene (2021-2030) ($MN)
  • Table 36 Europe Redistribution Layer Material Market Outlook, By Polyimide (2021-2030) ($MN)
  • Table 37 Europe Redistribution Layer Material Market Outlook, By Polybenzoxazole (2021-2030) ($MN)
  • Table 38 Europe Redistribution Layer Material Market Outlook, By Other Material Types (2021-2030) ($MN)
  • Table 39 Europe Redistribution Layer Material Market Outlook, By Application (2021-2030) ($MN)
  • Table 40 Europe Redistribution Layer Material Market Outlook, By Chemical Industry (2021-2030) ($MN)
  • Table 41 Europe Redistribution Layer Material Market Outlook, By Electronic Appliances (2021-2030) ($MN)
  • Table 42 Europe Redistribution Layer Material Market Outlook, By Other Applications (2021-2030) ($MN)
  • Table 43 Asia Pacific Redistribution Layer Material Market Outlook, By Country (2021-2030) ($MN)
  • Table 44 Asia Pacific Redistribution Layer Material Market Outlook, By Type (2021-2030) ($MN)
  • Table 45 Asia Pacific Redistribution Layer Material Market Outlook, By Fan-out wafer-level packaging (FOWLP) (2021-2030) ($MN)
  • Table 46 Asia Pacific Redistribution Layer Material Market Outlook, By 5D/3D Integrated Circuit (IC) Packaging (2021-2030) ($MN)
  • Table 47 Asia Pacific Redistribution Layer Material Market Outlook, By Other Types (2021-2030) ($MN)
  • Table 48 Asia Pacific Redistribution Layer Material Market Outlook, By Material Type (2021-2030) ($MN)
  • Table 49 Asia Pacific Redistribution Layer Material Market Outlook, By Benzocylobutene (2021-2030) ($MN)
  • Table 50 Asia Pacific Redistribution Layer Material Market Outlook, By Polyimide (2021-2030) ($MN)
  • Table 51 Asia Pacific Redistribution Layer Material Market Outlook, By Polybenzoxazole (2021-2030) ($MN)
  • Table 52 Asia Pacific Redistribution Layer Material Market Outlook, By Other Material Types (2021-2030) ($MN)
  • Table 53 Asia Pacific Redistribution Layer Material Market Outlook, By Application (2021-2030) ($MN)
  • Table 54 Asia Pacific Redistribution Layer Material Market Outlook, By Chemical Industry (2021-2030) ($MN)
  • Table 55 Asia Pacific Redistribution Layer Material Market Outlook, By Electronic Appliances (2021-2030) ($MN)
  • Table 56 Asia Pacific Redistribution Layer Material Market Outlook, By Other Applications (2021-2030) ($MN)
  • Table 57 South America Redistribution Layer Material Market Outlook, By Country (2021-2030) ($MN)
  • Table 58 South America Redistribution Layer Material Market Outlook, By Type (2021-2030) ($MN)
  • Table 59 South America Redistribution Layer Material Market Outlook, By Fan-out wafer-level packaging (FOWLP) (2021-2030) ($MN)
  • Table 60 South America Redistribution Layer Material Market Outlook, By 5D/3D Integrated Circuit (IC) Packaging (2021-2030) ($MN)
  • Table 61 South America Redistribution Layer Material Market Outlook, By Other Types (2021-2030) ($MN)
  • Table 62 South America Redistribution Layer Material Market Outlook, By Material Type (2021-2030) ($MN)
  • Table 63 South America Redistribution Layer Material Market Outlook, By Benzocylobutene (2021-2030) ($MN)
  • Table 64 South America Redistribution Layer Material Market Outlook, By Polyimide (2021-2030) ($MN)
  • Table 65 South America Redistribution Layer Material Market Outlook, By Polybenzoxazole (2021-2030) ($MN)
  • Table 66 South America Redistribution Layer Material Market Outlook, By Other Material Types (2021-2030) ($MN)
  • Table 67 South America Redistribution Layer Material Market Outlook, By Application (2021-2030) ($MN)
  • Table 68 South America Redistribution Layer Material Market Outlook, By Chemical Industry (2021-2030) ($MN)
  • Table 69 South America Redistribution Layer Material Market Outlook, By Electronic Appliances (2021-2030) ($MN)
  • Table 70 South America Redistribution Layer Material Market Outlook, By Other Applications (2021-2030) ($MN)
  • Table 71 Middle East & Africa Redistribution Layer Material Market Outlook, By Country (2021-2030) ($MN)
  • Table 72 Middle East & Africa Redistribution Layer Material Market Outlook, By Type (2021-2030) ($MN)
  • Table 73 Middle East & Africa Redistribution Layer Material Market Outlook, By Fan-out wafer-level packaging (FOWLP) (2021-2030) ($MN)
  • Table 74 Middle East & Africa Redistribution Layer Material Market Outlook, By 5D/3D Integrated Circuit (IC) Packaging (2021-2030) ($MN)
  • Table 75 Middle East & Africa Redistribution Layer Material Market Outlook, By Other Types (2021-2030) ($MN)
  • Table 76 Middle East & Africa Redistribution Layer Material Market Outlook, By Material Type (2021-2030) ($MN)
  • Table 77 Middle East & Africa Redistribution Layer Material Market Outlook, By Benzocylobutene (2021-2030) ($MN)
  • Table 78 Middle East & Africa Redistribution Layer Material Market Outlook, By Polyimide (2021-2030) ($MN)
  • Table 79 Middle East & Africa Redistribution Layer Material Market Outlook, By Polybenzoxazole (2021-2030) ($MN)
  • Table 80 Middle East & Africa Redistribution Layer Material Market Outlook, By Other Material Types (2021-2030) ($MN)
  • Table 81 Middle East & Africa Redistribution Layer Material Market Outlook, By Application (2021-2030) ($MN)
  • Table 82 Middle East & Africa Redistribution Layer Material Market Outlook, By Chemical Industry (2021-2030) ($MN)
  • Table 83 Middle East & Africa Redistribution Layer Material Market Outlook, By Electronic Appliances (2021-2030) ($MN)
  • Table 84 Middle East & Africa Redistribution Layer Material Market Outlook, By Other Applications (2021-2030) ($MN)