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倒装芯片技术市场：趋势、机遇、竞争分析 [2023-2028]
市场调查报告书
商品编码
1277661

倒装芯片技术市场：趋势、机遇、竞争分析 [2023-2028]

Flip Chip Technology Market: Trends, Opportunities and Competitive Analysis [2023-2028]
出版日期: | 出版商: Lucintel | 英文 150 Pages | 商品交期: 3个工作天内

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简介目录

倒装芯片技术市场趋势和预测

到 2028 年，全球倒装芯片技术市场预计将达到 441 亿美元，2023 年至 2028 年復合年增长率为 5.8%。 该市场的主要驱动力是电动汽车需求的增长、小型化趋势的增强以及这些技术在消费电子、汽车和电信行业的渗透率不断提高。 倒装芯片技术市场的未来前景广阔，在电子、工业、汽车和运输、医疗保健、IT 和电信、航空航天和国防工业等领域都蕴藏着商机。

倒装芯片技术公司名单

市场上的公司根据其提供的产品质量进行竞争。 该市场的主要参与者专注于扩大製造设施、研发投资、基础设施开发以及利用整个价值链的整合机会。 这些策略使倒装芯片技术公司能够满足不断增长的需求、保持竞争力、开发创新产品和技术、降低製造成本并扩大客户群。

倒装芯片技术市场洞察

  • 由于在收发器、嵌入式处理器、电源管理、基带、ASIC 和 SOC 等应用中越来越多地使用铜柱作为互连，Lucintel 将在预测期内看到铜柱的增长最快。我们预计会出现增长率。
  • 由于预计芯片封装、芯片电气连接、封装与电路板的互连以及封装设计设备对倒装芯片的需求增加，电子行业将在预测期内呈现最高增长。
  • 由于大公司的持续研发以及印度和中国製造基地的存在，预计亚太地区在预测期内将实现最高增长。

本报告回答了 11 个关键问题：

  • Q.1.您的细分市场中最有前途和高增长的机会是什么？
  • Q.2.您认为哪些领域会以更快的速度增长？为什么？
  • Q.3.您认为哪些地区的增长速度会更快？为什么？
  • Q.4.影响市场动态的关键因素有哪些？ 这个市场的主要挑战和商业风险是什么？
  • Q.5.这个市场的业务风险和竞争威胁是什么？
  • Q.6.这个市场有哪些新趋势？为什么？
  • Q.7.这个市场中的客户需求有哪些变化？
  • Q.8.市场有哪些新发展？ 哪些公司正在引领这些发展？
  • Q.9.这个市场的主要参与者是谁？ 主要参与者采取哪些战略举措来发展业务？
  • Q.10.这个市场上的竞争产品有哪些？因材料或产品替代而失去市场份额的威胁是什么？
  • Q.11.过去五年发生了哪些类型的併购，对行业产生了哪些影响？

内容

第 1 章执行摘要

第 2 章全球倒装芯片技术市场：市场动态

  • 简介、背景、分类
  • 供应链
  • 推动行业发展的因素和挑战

第三章2017-2028年市场趋势及预测分析

  • 宏观经济趋势（2017-2022 年）和预测（2023-2028 年）
  • 倒装芯片技术全球市场趋势（2017-2022）和预测（2023-2028）
  • 按封装技术划分的全球倒装芯片技术市场
    • 3D IC
    • 5D IC
    • 二维集成电路
  • 全球倒装芯片技术市场：按凸块技术划分
    • 铜柱
    • 焊料凸点
    • 锡铅共晶焊料
    • 无铅焊料
    • 金凸块
    • 其他
  • 按最终用途行业划分的全球倒装芯片技术市场
    • 电子产品
    • 行业
    • 汽车和运输设备
    • 医疗保健
    • IT/通信
    • 航空航天与国防
    • 其他

第四章2017-2028年区域市场趋势及预测分析

  • 全球倒装芯片技术市场：按地区划分
  • 北美倒装芯片技术市场
  • 欧洲倒装芯片技术市场
  • 亚太倒装芯片技术市场
  • 其他地区倒装芯片技术市场

第五章竞争分析

  • 产品组合分析
  • 运营整合
  • 波特五力分析

第 6 章增长机会和战略分析

  • 增长机会分析
    • 倒装芯片技术封装技术的全球市场增长机会
    • 倒装芯片技术全球市场增长机会：通过凸块技术
    • 倒装芯片技术最终用途行业的全球市场增长机会
    • 倒装芯片技术全球市场增长机会：按地区
  • 全球倒装芯片技术市场的新兴趋势
  • 战略分析
    • 新产品开发
    • 扩大倒装芯片技术全球市场的产能
    • 全球倒装芯片技术市场的併购和合资企业
    • 身份验证和许可

第 7 章主要公司简介

  • IBM
  • Intel
  • Fujitsu
  • 3M
  • Samsung Electronics
简介目录

Flip Chip Technology Market Trends and Forecast

The future of the flip chip technology market looks promising with opportunities in the electronic, industrial, automotive & transport, healthcare, IT & telecommunication, and aerospace & defense industries. The global flip chip technology market is expected to reach an estimated $44.1 billion by 2028 with a CAGR of 5.8% from 2023 to 2028. The major drivers for this market are growing demand for electric vehicles, increasing trend of miniaturization, and rising penetration of these technology in consumer electronics, automotive, and telecommunication industries.

A more than 150-page report is developed to help in your business decisions.

Flip Chip Technology Market by Segment

The study includes a forecast for the global flip chip technology market by packaging technology, bumping technology, end use industry, and region, as follows.

Flip Chip Technology Market by Packaging Technology [Value ($B) Shipment Analysis from 2017 to 2028]:

  • 3D IC
  • 5D IC
  • 2D IC

Flip Chip Technology Market by Bumping Technology [Value ($B) Shipment Analysis from 2017 to 2028]:

  • Copper Pillar
  • Solder Bumping
  • Tin-Lead Eutectic Solder
  • Lead-Free Solder
  • Gold Bumping
  • Others

Flip Chip Technology Market by End Use Industry [Value ($B) Shipment Analysis from 2017 to 2028]:

  • Electronics
  • Industrial
  • Automotive & Transport
  • Healthcare
  • IT & Telecommunication
  • Aerospace & Defense
  • Others

Flip Chip Technology Market by Region [Value ($B) Shipment Analysis from 2017 to 2028]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Flip Chip Technology Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies flip chip technology companies cater to increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the flip chip technology companies profiled in this report include.

  • IBM
  • Intel
  • Fujitsu
  • 3M
  • Samsung Electronics

Flip Chip Technology Market Insights

  • Lucintel forecasts that copper pillar is expected to witness highest growth over the forecast period due to increasing usage of copper pillar as an interconnector in transceiver, embedded processor, power management, baseband, ASIC, and SOC application.
  • Electronics is expected to witness highest growth over the forecast period due to the increasing demand for flip chips in devices for chip encapsulating, chips electrical link, package interconnection to circuit boards, and package design.
  • APAC is expected to witness highest growth over the forecast period due to the continuous research and development by major players and existence of manufacturing hubs in India and China.

Features of the Flip Chip Technology Market

  • Market Size Estimates: Flip chip technology market size estimation in terms of value ($B)
  • Trend And Forecast Analysis: Market trends (2017-2022) and forecast (2023-2028) by various segments and regions.
  • Segmentation Analysis: Flip chip technology market size by various segments, such as by packaging technology, bumping technology, end use industry, and region
  • Regional Analysis: Flip chip technology market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
  • Growth Opportunities: Analysis on growth opportunities in different by packaging technology, bumping technology, end use industry, and regions for the flip chip technology market.
  • Strategic Analysis: This includes M&A, new product development, and competitive landscape for the flip chip technology market.
  • Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the flip chip technology market size?

Answer: The global flip chip technology market is expected to reach an estimated $44.1 billion by 2028.

Q2. What is the growth forecast for flip chip technology market?

Answer: The global flip chip technology market is expected to grow with a CAGR of 5.8% from 2023 to 2028.

Q3. What are the major drivers influencing the growth of the flip chip technology market?

Answer: The major drivers for this market are growing demand for electric vehicles, increasing trend of miniaturization, and rising penetration of these technology in consumer electronics, automotive, and telecommunication industries.

Q4. What are the major segments for flip chip technology market?

Answer: The future of the flip chip technology market looks promising with opportunities in the electronics, industrial, automotive & transport, healthcare, IT & telecommunication, and aerospace & defense industries.

Q5. Who are the key flip chip technology companies?

Answer: Some of the key flip chip technology companies are as follows.

  • IBM
  • Intel
  • Fujitsu
  • 3M
  • Samsung Electronics

Q6. Which flip chip technology segment will be the largest in future?

Answer: Lucintel forecasts that copper pillar is expected to witness highest growth over the forecast period due to increasing usage of copper pillar as an interconnector in transceiver, embedded processor, power management, baseband, ASIC, and SOC application.

Q7. In flip chip technology market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period due to the continuous research and development by major players and existence of manufacturing hubs in India and China.

Q8. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% Customization Without any Additional Cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the flip chip technology market by packaging technology (3D IC, 5D IC, and 2D IC), bumping technology (copper pillar, solder bumping, tin-lead eutectic solder, lead-free solder, gold bumping, and others), end use industry (electronics, industrial, automotive & transport, healthcare, IT & telecommunication, aerospace & defense, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Flip Chip Technology Market: Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2017 to 2028

  • 3.1: Macroeconomic Trends (2017-2022) and Forecast (2023-2028)
  • 3.2: Global Flip Chip Technology Market Trends (2017-2022) and Forecast (2023-2028)
  • 3.3: Global Flip Chip Technology Market by Packaging Technology
    • 3.3.1: 3D IC
    • 3.3.2: 5D IC
    • 3.3.3: 2D IC
  • 3.4: Global Flip Chip Technology Market by Bumping Technology
    • 3.4.1: Copper Pillar
    • 3.4.2: Solder Bumping
    • 3.4.3: Tin-Lead Eutectic Solder
    • 3.4.4: Lead-Free Solder
    • 3.4.5: Gold Bumping
    • 3.4.6: Others
  • 3.5: Global Flip Chip Technology Market by End Use Industry
    • 3.5.1: Electronics
    • 3.5.2: Industrial
    • 3.5.3: Automotive & Transport
    • 3.5.4: Healthcare
    • 3.5.5: IT & Telecommunication
    • 3.5.6: Aerospace & Defense
    • 3.5.7: Others

4. Market Trends and Forecast Analysis by Region from 2017 to 2028

  • 4.1: Global Flip Chip Technology Market by Region
  • 4.2: North American Flip Chip Technology Market
    • 4.2.1: North American Flip Chip Technology Market by Packaging Technology: 3D IC, 5D IC, and 2D IC
    • 4.2.2: North American Flip Chip Technology Market by End Use Industry: Electronics, Industrial, Automotive & Transport, Healthcare, IT & Telecommunication, Aerospace & Defense, and Others
  • 4.3: European Flip Chip Technology Market
    • 4.3.1: European Flip Chip Technology Market by Packaging Technology: 3D IC, 5D IC, and 2D IC
    • 4.3.2: European Flip Chip Technology Market by End Use Industry: Electronics, Industrial, Automotive & Transport, Healthcare, IT & Telecommunication, Aerospace & Defense, and Others
  • 4.4: APAC Flip Chip Technology Market
    • 4.4.1: APAC Flip Chip Technology Market by Packaging Technology: 3D IC, 5D IC, and 2D IC
    • 4.4.2: APAC Flip Chip Technology Market by End Use Industry: Electronics, Industrial, Automotive & Transport, Healthcare, IT & Telecommunication, Aerospace & Defense, and Others
  • 4.5: ROW Flip Chip Technology Market
    • 4.5.1: ROW Flip Chip Technology Market by Packaging Technology: 3D IC, 5D IC, and 2D IC
    • 4.5.2: ROW Flip Chip Technology Market by End Use Industry: Electronics, Industrial, Automotive & Transport, Healthcare, IT & Telecommunication, Aerospace & Defense, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Flip Chip Technology Market by Packaging Technology
    • 6.1.2: Growth Opportunities for the Global Flip Chip Technology Market by Bumping Technology
    • 6.1.3: Growth Opportunities for the Global Flip Chip Technology Market by End Use Industry
    • 6.1.4: Growth Opportunities for the Global Flip Chip Technology Market by Region
  • 6.2: Emerging Trends in the Global Flip Chip Technology Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Flip Chip Technology Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Flip Chip Technology Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: IBM
  • 7.2: Intel
  • 7.3: Fujitsu
  • 7.4: 3M

7:5: Samsung Electronics