倒装芯片技术市场——增长、趋势、COVID-19 的影响、预测 (2023-2028)

在预测期内，倒装芯片技术市场预计将以 5.91% 的复合年增长率增长。

作为一个技术驱动的市场，製造商主要关注凸块工艺中的创新和新技术，导致对製造所需原材料的需求增加。

主要亮点

• 这就是该行业在原材料供应商中蓬勃发展的原因。 与其他封装方法相比，可靠性、尺寸、灵活性、性能和成本等关键优势正在推动倒装芯片市场的增长。 此外，倒装芯片原材料、设备和服务的供应也有望在预测期内推动市场发展。
• 此外，与竞争方法相比的许多优势，例如更小的尺寸、更高的性能和更大的 I/O 灵活性，也有助于市场增长。 预计在移动无线、消费应用、网络、服务器和数据中心等高性能应用中，对倒装芯片的需求将会增加。 倒装芯片是超越摩尔方法的 3D 集成和高级 SoC（片上系统）的关键推动因素之一。
• MMIC（单片微波 IC）的强劲增长正在扩大 MMIC 作为在微波频率（300 MHz 至 300 GHz）下运行的设备的市场。 这些设备通常执行诸如微波混合、功率放大、低噪声放大和高频开关等功能。
• 扇出型晶圆级封装和嵌入式芯片是倒装芯片市场中发展最快的新兴技术之一。 此外，一些知名供应商正在增加对这些技术的投资，从而扩大其影响范围。
• 例如，2021 年 3 月，Samsung Electronics与 Marvell 合作，共同开发了一种新的片上系统，可提供增强的 5G 网络性能。 新推出的芯片用于Samsung 的 Massive MIMO，预计到 2021 年第二季度将出现在一级运营商中。 同样，MediaTek于2020年11月签署了约8500万美元的收购协议，收购IntelEnpirion的电源管理芯片资产。
• COVID-19 严重影响了市场的增长。 这是因为消费者的购买行为已经从家电、汽车等奢侈品转向食品等必需品。 它还影响了供应链，减缓了市场增长。

主要市场趋势

军事需求和国防工业推动市场增长

• 现代军事和国防环境需要经过验证、可靠且可扩展的技术。 传感器是这些技术的关键部分，因为它们为涉及復杂控制、测量、监视和执行的国防生态系统提供解决方案。
• 根据军事要求，组件必须冷却至 50K，因此开发了基于铟微型泵的技术。 军事系统中的传感器数量持续增长，推动了军事计算平台对倒装芯片技术的需求。
• Radar 说包装和组装是成功实施的关键。 随着雷达应用的增加，成本变得非常重要。 成本和封装是汽车毫米波雷达和无人机的关键问题。 单芯片雷达和多通道 T/R 模块正在变得可行。
• 例如，已开发出用于 76-84 GHz 汽车雷达的 SiGe 发射/接收相控阵芯片。 该芯片使用受控塌陷芯片连接 (C4) 凸块工艺倒装到低成本印刷电路板上，在发送和接收链之间提供 50 dB 的隔离度。 这项工作代表了毫米波段高性能 FMCW 雷达同步发射和接收操作的最先进复杂性。
• 由于军事应用对复杂性、高性能、引脚数、功耗和成本的要求越来越高，由于 GPS 的部署，封装行业正转向军事和国防应用的倒装芯片和晶圆级封装和雷达应用。我们正在转向更高性能的封装，例如扇出封装。 在这种类型的应用中使用倒装芯片技术已被证明是许多应用中高密度电子产品的可靠封装技术。
• Qorvo 是创新 RF 解决方案的领先供应商，最近赢得了一份为期三年的额外合同，以推进其铜柱 GaN 倒装芯片技术的开发。 该国防部 (DoD) 计划建立了一家高产国内铸造厂，以成熟覆铜组装工艺。 该工艺可以为空间受限的相控阵雷达系统和其他国防电子设备实现垂直芯片堆迭。

中国占有重要的市场份额

• 中国包装行业有望在预测期内实现潜在增长。 对 IC 组件的强劲需求正在推动提供更高密度和 I/O 连接的先进封装解决方案的部署。
• 中国政府的“中国製造 2025”计划旨在到 2030 年使半导体行业产值达到 3050 亿美元，满足 80% 的国内需求。 随着技术战争的爆发，中国大力发展其芯片产业。 中美之间的贸易战，以及中国公司被美国技术切断的威胁（像HUAWEI这样的大公司）正在推动中国半导体行业向前发展。
• 倒装芯片市场包括植球和组装，但中国公司在提高植球能力方面非常先进，尤其是 12 英寸铜柱。 超过 90% 的先进封装厂商具有 300mm 晶圆的凸块能力。 2019 年，中国电子公司江苏长电科技 (JCET) 开始在晶圆上量产凸块。 公司新添置12吋晶圆凸块线并转入量产。 量产已经运往长电科技在中国的客户，并且还有几家设备製造商已经批准了这条生产线的出货。
• 由于长期停工，COVID-19 大流行影响了中国的所有製造业和地点，从而影响了倒装芯片技术市场。 此外，中国测试和封装公司不断获得高端封装技术（倒装芯片、凸块等）和更先进的（扇入、扇出、2.5D 中介层、SiP 等）加工能力。
• 由于技术发展和併购，预计今年长电科技、天海通和通通微电子等中国服务提供商的收入表现将实现两位数增长，高于行业平均水平。

竞争格局

由于汽车、工业和消费电子行业的终端用户数量不断增加，倒装芯片技术市场呈现碎片化。 预计该市场在预测期内将稳步增长。 市场现有企业正试图通过采用 5G 通信、高性能数据中心和小型电子产品等新技术来保持竞争力。 市场的最新发展包括：

• 2021 年 11 月 - 领先的半导体封装和测试服务提供商 Amkor Technology Inc.（纳斯达克股票代码：AMKR）计划在越南北宁建立一座最先进的智能工厂。 新工厂的一期工程将专注于为全球领先的半导体和电子製造商提供先进的系统级封装 (SiP) 组装和测试解决方案。

其他好处

• Excel 格式的市场预测 (ME) 表
• 三个月的分析师支持

内容

第一章介绍

• 研究假设和市场定义
• 调查范围

第二章研究方法论

第 3 章执行摘要

第 4 章市场洞察

• 市场概览
• 产业吸引力 - 波特五力分析
  • 供应商的议价能力
  • 买家的议价能力
  • 新进入者的威胁
  • 替代品的威胁
  • 竞争公司之间的敌对关係
• 工业价值链分析

第 5 章市场动态

• 市场驱动力
  • 对可穿戴设备的需求不断扩大
  • MMIC（单片微波 IC）应用的强劲增长
• 市场挑战
  • 与技术相关的成本上升

第 6 章技术快照

第 7 章市场细分

• 通过晶圆凸块工艺
  • 铜柱
  • 锡铅共晶焊料
  • 无铅焊料
  • 金钉碰撞
• 按包装技术
  • BGA (2.1D/2.5D/3D)
  • 客户服务提供商
• 按产品（仅限定性分析）
  • 内存
  • 发光二极管
  • CMOS 图像传感器
  • SoC
  • GPU
  • 中央处理器
• 最终用户
  • 军事/国防
  • 医疗/保健
  • 工业领域
  • 汽车
  • 消费类电子产品
  • 通讯领域
• 区域信息
  • 中国
  • 台湾
  • 美国
  • 韩国
  • 马来西亚
  • 新加坡
  • 日本

第八章竞争格局

• 公司简介
  • Amkor Technology Inc.
  • UTAC Holdings Ltd
  • Taiwan Semiconductor Manufacturing Company Limited
  • Chipbond Technology Corporation
  • TF AMD Microlectronics Sdn Bhd
  • Jiangsu Changjiang Electronics Technology Co. Ltd
  • Powertech Technology Inc.
  • ASE Industrial Holding Ltd（Siliconware Precision Industries Co. Ltd）

第九章投资分析

第十章市场前景

The flip chip technology market is expected to register a CAGR of 5.91% over the forecast period. Being a technologically driven market, manufacturers are mainly focusing on innovations and on new technologies for the bumping process, which, in turn, is increasing the demand for raw materials required for manufacturing.

Key Highlights

• This leads to rapid growth in this industry among raw material suppliers. Its primary advantages over other packaging methods, namely, reliability, size, flexibility, performance, and cost, are the factors driving the growth of the flip-chip market. The availability of flip-chip raw materials, equipment, and services is further expected to drive the market lucratively during the forecast period.
• Moreover, the growth of the market is attributed to its numerous advantages, such as smaller size, higher- performance, and enhanced I/O flexibility over its competitive methodologies. The demand for flip-chip is expected to rise in mobile and wireless, consumer applications, and other high-performance applications such as networks, servers, and data centers. In terms of 3D integration and more than the Moore approach, the flip-chip is one of the key driving factors and helps enable sophisticated SoC (system on chip).
• Due to the strong growth in MMIC (monolithic microwave IC), the market is growing, as MMICs are devices that operate at microwave frequencies (300 MHz to 300 GHz). These devices typically perform functions such as microwave mixing, power amplification, low-noise amplification, and high-frequency switching.
• Fan-out wafer-level packaging and embedded die are some of the fastest emerging technologies for the flip-chip market. Also, some of the prominent vendors are increasing their investment in these technologies, thereby expanding their scope.
• For instance, in March 2021, Samsung Electronics partnered with Marvell to jointly develop a novel system-on-a-chip to offer enhanced 5G network performance. The newly launched chip finds usage in Samsung's massive MIMO and is anticipated to see its presence among Tier One operators by Q2 2021. Similarly, Mediatek, Inc., in November 2020, inked an acquisition deal of approximately USD 85 million to purchase the power management chip assets of Intel Enpirion.
• COVID-19 has severely affected the market growth. This is due to the shifting of consumer purchasing behavior towards essential goods such as groceries from luxury goods such as consumer electronics and vehicles. The supply chain was also affected, thus slowing down the market growth.

Key Market Trends

The Military and Defense Industry to Drive the Market Growth

• Modern military and defense environments require proven, reliable, and scalable technologies. Sensors are a critical part of the technologies, as these provide solutions to the whole defense ecosystem, including complex controls, measurements, monitoring, and execution.
• For military requirements, the need to cool components down to 50 K has led to the development of a technology based on indium micropumps. The sensor content of military systems continues to grow, thereby driving requirements for flip chip technology in military computing platforms.
• For any radar, packaging and assembly are the keys to a successful implementation. As radar applications proliferate, cost becomes critical. For millimeter-wave automotive and UAV, cost and packaging are being addressed. Single-chip radars and multi-channel T/R modules are becoming feasible.
• For example, a SiGe transmit-receive phased-array chip for automotive radar applications at 76 to 84 GHz has been developed. The chip uses a controlled collapse chip connection (C4) bumping process and is flip-chipped onto a low-cost printed circuit board, achieving 50 dB isolation between the transmit and receive chains. This work represents state-of-the-art complexity for a high-performance FMCW radar at millimeter-wave frequencies, with simultaneous transmit and receive operation.
• Due to the increasing complexities and higher performance, pin count, power, and cost requirements of military applications, the packaging industry is moving toward high-performance packages, such as flip-chip or wafer-level fan-out packaging, for military and defense by deploying GPS and radar applications. The use of flip-chip technology for this type of application has proven itself, in many applications, to be a reliable packaging technology to achieve high-density electronics.
• Recently, Qorvo, a leading provider of innovative RF solutions, was awarded a three-year contract further to advance the development of copper-pillar-on-GaN flip-chip technology. This Department of Defense (DoD) program will create a high-yield domestic foundry to mature the copper flip assembly process, which enables vertical die stacking in space-constrained phased array radar systems and other defense electronics.

China Occupies the Significant Market Share

• The packaging industry in China is expected to register potential growth during the forecast period. There is a strong demand for IC components, which has expanded the deployment of advanced packaging solutions that offer higher levels of integration and higher numbers of I/O connections.
• The Chinese government's initiative of "Made in China 2025" aims to make its semiconductor industry reach USD 305 billion in output by 2030 and meet 80% of domestic demand. China is ramping up its chip industry amid a brewing tech war. United States-China trade war and the threat that Chinese firms could be cut off from American technology(as major firms like Huawei) are boosting China's push for its semiconductor industry.
• The flip-chip market includes bumping and assembly, and there is enormous ramping of bumping capacity by Chinese players, particularly in the 12" Cu pillar. More than 90% of advanced packaging players have 300 mm wafer bumping capability. In 2019, Chinese electronics company Jiangsu Changjiang Electronics Technology (JCET) started high-volume wafer bumping. The company has moved into volume production with its new 12-inch wafer bumping line. Production volumes are already being shipped to China-based JCET customers, with several additional device manufacturers qualifying the line for shipments.
• Due to the COVID-19 pandemic, all the manufacturing industries and bases are affected in China due to the long-lasting shutdown in the country, thereby affecting the flip-chip technology market. Moreover, the Chinese testing and packaging companies continue to gain processing capacity for high-end packaging technologies (e.g., flip-chip and bumping) and more advanced (e.g., fan-in, fan-out, 2.5D interposer, and SiP).
• Owing to the progress in both technology development and merger and acquisitions, Chinese service providers, such as JCET, TSHT, and TFME, are projected to rise above the industry's average in their revenue performances this year with double-digit growth rates.

Competitive Landscape

The flip chip technology market is fragmented due to the growing number of end users in automotive, industrial, and consumer electronics. The market is expected to grow at a fair steady rate over the forecast period. The existing players in the market are striving to maintain a competitive edge by catering to newer technologies, such as 5G telecommunication, high-performance data centers, compact electronic devices, etc. Some of the recent developments in the market are -

• November 2021 - Amkor Technology Inc. (NASDAQ: AMKR), a leading provider of semiconductor packaging and test services, planned to build a state-of-the-art smart factory in Bac Ninh, Vietnam. The first phase of the new factory would focus on providing advanced system in package (SiP) assembly and test solutions to the leading global semiconductor and electronic manufacturing companies.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

• 4.1 Market Overview
• 4.2 Industry Attractiveness - Porter's Five Forces Analysis
  • 4.2.1 Bargaining Power of Suppliers
  • 4.2.2 Bargaining Power of Buyers
  • 4.2.3 Threat of New Entrants
  • 4.2.4 Threat of Substitute Products
  • 4.2.5 Intensity of Competitive Rivalry
• 4.3 Industry Value Chain Analysis

5 MARKET DYNAMICS

• 5.1 Market Drivers
  • 5.1.1 Increasing Demand for Wearable Devices
  • 5.1.2 Strong Growth in MMIC (Monolithic Microwave IC) Applications
• 5.2 Market Challenge
  • 5.2.1 Higher Costs Associated with the Technology

6 TECHNOLOGY SNAPSHOT​

7 MARKET SEGMENTATION

• 7.1 By Wafer Bumping Process
  • 7.1.1 Copper Pillar
  • 7.1.2 Tin-Lead Eutectic Solder
  • 7.1.3 Lead Free Solder
  • 7.1.4 Gold Stud Bumping
• 7.2 By Packaging Technology
  • 7.2.1 BGA (2.1D/2.5D/3D)
  • 7.2.2 CSP
• 7.3 By Product (Only Qualitative Analysis)
  • 7.3.1 Memory
  • 7.3.2 Light Emitting Diode
  • 7.3.3 CMOS Image Sensor
  • 7.3.4 SoC
  • 7.3.5 GPU
  • 7.3.6 CPU
• 7.4 By End User
  • 7.4.1 Military and Defense
  • 7.4.2 Medical and Healthcare
  • 7.4.3 Industrial Sector
  • 7.4.4 Automotive
  • 7.4.5 Consumer Electronics
  • 7.4.6 Telecommunications
• 7.5 By Geography
  • 7.5.1 China
  • 7.5.2 Taiwan
  • 7.5.3 United States
  • 7.5.4 South Korea
  • 7.5.5 Malaysia
  • 7.5.6 Singapore
  • 7.5.7 Japan

8 COMPETITIVE LANDSCAPE

• 8.1 Company Profiles*
  • 8.1.1 Amkor Technology Inc.
  • 8.1.2 UTAC Holdings Ltd
  • 8.1.3 Taiwan Semiconductor Manufacturing Company Limited
  • 8.1.4 Chipbond Technology Corporation
  • 8.1.5 TF AMD Microlectronics Sdn Bhd
  • 8.1.6 Jiangsu Changjiang Electronics Technology Co. Ltd
  • 8.1.7 Powertech Technology Inc.
  • 8.1.8 ASE Industrial Holding Ltd (Siliconware Precision Industries Co. Ltd)

9 INVESTMENT ANALYSIS

10 FUTURE OF THE MARKET