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5G PCB 市场报告：2030 年趋势、预测与竞争分析
市场调查报告书
商品编码
1356393

5G PCB 市场报告：2030 年趋势、预测与竞争分析

5G PCB Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日期: | 出版商: Lucintel | 英文 150 Pages | 商品交期: 3个工作天内

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简介目录

5G PCB市场趋势及预测

至2030年，全球5G PCB市场预计将达到436亿美元，2024年至2030年的年复合成长率为15.4%。该市场的主要驱动力是对高速和低延迟技术的需求持续增长、对基于 5G PCB 的天线的日益偏好，以及汽车、通讯、消费性电子等各种最终用途领域对这些 PCB 的需求不断增长、工业等，需求量巨大。全球5G PCB市场前景广阔，汽车、通讯、家用电子电器和工业市场蕴藏商机。

5G PCB市场洞察

  • Lucintel 认为，高密度互连 (HDI) 在预测期内将是最好的，因为这些 PCB 因其高效能和可靠性以及处理高频率和高速资料传输的能力而得到重要用途。我们预测预计将出现增长。
  • 由于人们对先进通讯系统以及智慧型手机和平板电脑等连接设备的偏好增加，消费性电子产品预计将在预测期内实现最高成长。
  • 由于消费性电子和汽车产业的持续扩张，以及该地区资料中心和云端基础公司数量的不断增加，亚太地区仍然是最大的地区。

本报告回答了 11 个关键问题：

  • Q.1. 细分市场中最有前途和高成长的机会是什么？
  • Q.2.哪个细分市场将以更快的速度成长？为什么？
  • Q.3.您认为哪些地区未来会出现更快的成长？为什么？
  • Q.4. 影响市场动态的主要因素有哪些？市场的主要挑战和商业风险是什么？
  • Q.5. 这个市场的商业风险和竞争威胁是什么？
  • Q.6.这个市场有哪些新趋势？为什么？
  • Q.7.市场客户需求有何改变？
  • Q.8. 该市场有哪些新发展以及哪些公司处于领先地位？
  • Q.9.这个市场的主要企业有哪些？主要企业采取哪些策略配合措施来发展业务？
  • Q.10. 该市场上的竞争产品有哪些，由于材料或产品替代导致市场占有率下降的威胁有多大？
  • Q.11.过去年度发生了哪些併购事件，对产业产生了哪些影响？

目录

第1章执行摘要

第2章全球5G PCB市场：市场动态

  • 简介、背景、分类
  • 供应链
  • 产业驱动因素与挑战

第3章2018-2030年市场趋势及预测分析

  • 宏观经济趋势（2018-2023）与预测（2024-2030）
  • 全球5G PCB市场趋势（2018-2023）与预测（2024-2030）
  • 按 PCB 类型分類的全球 5G PCB 市场
    • 一边
    • 双方
    • 多层
    • 高密度互连 (HDI)
    • 其他的
  • 全球5G PCB市场（按基板）
    • 难的
    • 灵活的
    • 刚性-柔性
  • 全球 5G PCB 市场（按最终用途行业）
    • 汽车
    • 通讯
    • 家用电器
    • 工业的
    • 其他的

第4章2018-2030年分地区市场趋势及预测分析

  • 全球5G PCB市场区域分布
  • 北美5G PCB市场
  • 欧洲5G PCB市场
  • 亚太5G PCB市场
  • 其他地区5G PCB市场

第5章竞争分析

  • 产品系列分析
  • 营运整合
  • 波特五力分析

第6章成长机会与策略分析

  • 成长机会分析
    • 按 PCB 类型分類的全球 5G PCB 市场成长机会
    • 全球 5G PCB 市场成长机会（按基板）
    • 全球 5G PCB 市场成长机会（按最终用途产业）
    • 全球5G PCB市场区域成长机会
  • 全球5G PCB市场新趋势
  • 战略分析
    • 新产品开发
    • 全球5G PCB市场产能扩张
    • 全球5G PCB市场合併与收购
    • 认证和许可

第7章主要企业概况

  • Panasonic Industry
  • Xinfeng Huihe Circuits
  • Chin Poon Industrial
  • Tripod Technology
  • Shennan Circuits
  • WUS Printed Circuit
  • Kinsus
  • Zhen Ding Technology
  • Hannstar Board
  • Compeq Manufacturing
简介目录

5G PCB Market Trends and Forecast

The future of the global 5G PCB market looks promising with opportunities in the automotive, telecommunication, consumer electronics, and industrial markets. The global 5G PCB market is expected to reach an estimated $43.6 billion by 2030 with a CAGR of 15.4% from 2024 to 2030. The major drivers for this market are continual growth in demand for high-speed and low-latency technologies, growing preference for 5G PCB based antennas ,and significant demand for these PCBs in various end use sectors, such as automotive, telecommunication, consumer electronics, and industrial.

A more than 150-page report is developed to help in your business decisions.

5G PCB Market by Segment

The study includes a forecast for the global 5G PCB market by PCB type, substrate, end use industry, and region.

5G PCB Market by PCB Type [Shipment Analysis by Value from 2018 to 2030]:

  • Single-Sided
  • Double-Sided
  • Multi-Layered
  • High-Density Interconnect (HDI)
  • Others

5G PCB Market by Substrate [Shipment Analysis by Value from 2018 to 2030]:

  • Rigid
  • Flexible
  • Rigid-flexible

5G PCB Market by End Use Industry [Shipment Analysis by Value from 2018 to 2030]:

  • Automotive
  • Telecommunication
  • Consumer Electronics
  • Industrial
  • Others

5G PCB Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of 5G PCB Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies 5G PCB companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the 5G PCB companies profiled in this report include-

  • Panasonic Industry
  • Xinfeng Huihe Circuits
  • Chin Poon Industrial
  • Tripod Technology
  • Shennan Circuits
  • WUS Printed Circuit
  • Kinsus
  • Zhen Ding Technology
  • Hannstar Board
  • Compeq Manufacturing

5G PCB Market Insights

  • Lucintel forecast that high-density interconnect (HDI)is expected to witness highest growth over the forecast period due to its significant use of these PCBs owing to its high performance and reliability as well as the ability to handle high frequencies and high-speed data transmission.
  • Consumer electronics is expected to witness highest growth over the forecast perioddue to escalating preference for advanced communication systems and connected devices like smartphones and tablets.
  • APAC will remain the largest region due to continous expansion in consumer electronics and automotive industries and growing number of data centers and cloud based enterprises in the region.

Features of the Global 5G PCB Market

  • market Size Estimates: 5G PCB market size estimation in terms of value ($B).
  • Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.
  • Segmentation Analysis: 5G PCB market size by PCB type, substrate,end use industry, and region in terms of value ($B).
  • Regional Analysis: 5G PCB market breakdown by North America, Europe, Asia Pacific, and Rest of the World.
  • Growth Opportunities: Analysis of growth opportunities in different PCB type, substrate,end use industry, and region for the 5G PCB market.
  • Strategic Analysis: This includes M&A, new product development, and competitive landscape of the 5G PCB market.
  • Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q.1. What is the 5G PCB market size?

Answer: The global 5G PCB market is expected to reach an estimated $43.6 billion by 2030.

Q.2. What is the growth forecast for 5G PCB market?

Answer: The global 5G PCB market is expected to grow with a cagr of 15.4% from 2024 to 2030

Q.3. What are the major drivers influencing the growth of the 5G PCB market?

Answer: The major drivers for this market are continual growth in demand for high-speed and low-latency technologies growing preference for 5G PCB based antennas significant demand for these pcbs in various end use sectors, such as automotive, telecommunication, consumer electronics, and industrial

Q.4. What are the major segments for 5G PCB market?

Answer: The future of the 5G PCB market looks promising with opportunities in the automotive, telecommunication, consumer electronics, and industrialmarkets.

Q.5. Who are the key 5G PCB market companies?

Answer: Some of the key 5G PCB companies are as follows:

  • Panasonic Industry
  • Xinfeng Huihe Circuits
  • Chin Poon Industrial
  • Tripod Technology
  • Shennan Circuits
  • WUS Printed Circuit
  • Kinsus
  • Zhen Ding Technology
  • Hannstar Board
  • Compeq Manufacturing

Q.6. Which 5G PCB market segment will be the largest in future?

Answer: Lucintel forecast that high-density interconnect (HDI)is expected to witness highest growth over the forecast period due to its significant use of these pcbs owing to its high performance and reliability as well as the ability to handle high frequencies and high-speed data transmission.

Q.7. In 5G PCB market, which region is expected to be the largest in next 5 years?

Answer: APAC will remain the largest region due to continous expansion in consumer electronics and automotive industries and growing number of data centers and cloud based enterprises in the region.

Q.8. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the 5G PCB market by PCB type (single-sided, double-sided, multi-layered, high-density interconnect (HDI), and others), substrate (rigid, flexible, and rigid-flexible), end use industry (automotive, telecommunication, consumer electronics, industrial, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global 5G PCB Market: Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global 5G PCB Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global 5G PCB Market by PCB Type
    • 3.3.1: Single-Sided
    • 3.3.2: Double-Sided
    • 3.3.3: Multi-Layered
    • 3.3.4: High-Density Interconnect (HDI)
    • 3.3.5: Others
  • 3.4: Global 5G PCB Market by Substrate
    • 3.4.1: Rigid
    • 3.4.2: Flexible
    • 3.4.3: Rigid-flexible
  • 3.5: Global 5G PCB Market by End Use Industry
    • 3.5.1: Automotive
    • 3.5.2: Telecommunication
    • 3.5.3: Consumer Electronics
    • 3.5.4: Industrial
    • 3.5.5: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global 5G PCB Market by Region
  • 4.2: North American 5G PCB Market
    • 4.2.1: North American 5G PCB Market by PCB Type: Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect (HDI), and Others
    • 4.2.2: North American 5G PCB Market by End Use Industry: Automotive, Telecommunication, Consumer Electronics, Industrial, and Others
  • 4.3: European 5G PCB Market
    • 4.3.1: European 5G PCB Market by PCB Type: Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect (HDI), and Others
    • 4.3.2: European 5G PCB Market by End Use Industry: Automotive, Telecommunication, Consumer Electronics, Industrial, and Others
  • 4.4: APAC 5G PCB Market
    • 4.4.1: APAC 5G PCB Market by PCB Type: Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect (HDI), and Others
    • 4.4.2: APAC 5G PCB Market by End Use Industry: Automotive, Telecommunication, Consumer Electronics, Industrial, and Others
  • 4.5: ROW 5G PCB Market
    • 4.5.1: ROW 5G PCB Market by PCB Type: Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect (HDI), and Others
    • 4.5.2: ROW 5G PCB Market by End Use Industry: Automotive, Telecommunication, Consumer Electronics, Industrial, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global 5G PCB Market by PCB Type
    • 6.1.2: Growth Opportunities for the Global 5G PCB Market by Substrate
    • 6.1.3: Growth Opportunities for the Global 5G PCB Market by End Use Industry
    • 6.1.4: Growth Opportunities for the Global 5G PCB Market Region
  • 6.2: Emerging Trends in the Global 5G PCB Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global 5G PCB Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global 5G PCB Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Panasonic Industry
  • 7.2: Xinfeng Huihe Circuits
  • 7.3: Chin Poon Industrial
  • 7.4: Tripod Technology
  • 7.5: Shennan Circuits
  • 7.6: WUS Printed Circuit
  • 7.7: Kinsus
  • 7.8: Zhen Ding Technology
  • 7.9: Hannstar Board
  • 7.10: Compeq Manufacturing