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3D 积体电路和硅穿孔电极(TSV) 互连市场报告：2030 年趋势、预测与竞争分析

Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日期: | 出版商: Lucintel | 英文 150 - page report | 商品交期: 3个工作天内

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简介目录

3D 积体电路和硅穿孔电极(TSV) 互连的趋势和预测

至2030年，全球3D积体电路和硅穿孔电极(TSV)互连市场预计将达到373亿美元，2024年至2030年的复合年增长率为10.7%。该市场的主要驱动力是日益增长的节能需求。消耗和密度不断增加，3D 积体电路和 TSV 互连解决方案的采用增加，以及对高效能和小型化电子设备的需求不断增长。全球 3D 积体电路和硅穿孔电极(TSV) 互连市场的未来前景广阔，在军事、航太和国防、消费性电器产品、资讯和通讯技术以及汽车市场中蕴藏着机会。

深入了解 3D 积体电路和硅穿孔电极(TSV) 互连市场

Lucintel 预计，在整个预测期内，绝缘体上硅将继续成为更大的细分市场。

在该市场中，航太和国防预计将在预测期内实现最高成长。

由于智慧型手机製造对硅晶圆的需求不断增加以及该地区 5G 技术的采用不断增加，预计亚太地区在整个预测期内仍将是最大的地区。

常问问题

Q.1 3D 积体电路和硅穿孔电极(TSV) 互连的市场规模有多大？

A1. 到 2030 年，全球 3D 积体电路和硅穿孔电极(TSV) 互连市场预计将达到 373 亿美元。

Q.2 3D积体电路和硅穿孔电极（TSV）互连市场的成长预测是什么？

A2. 全球 3D 积体电路和硅穿孔电极(TSV) 互连市场预计 2024 年至 2030 年复合年增长率为 10.7%。

Q.3 影响 3D 积体电路和硅穿孔电极(TSV) 互连市场成长的关键因素有哪些：

A3. 该市场的主要驱动力是对降低消费量和增加密度的需求不断增长、3D 集成电路和 TSV 互连解决方案的采用不断增加，以及对高性能和小型化电子设备的需求不断增长。

Q4.市场的主要细分市场是：

A4. 3D 积体电路和硅穿孔电极(TSV) 互连市场的未来前景广阔，在军事、航太和国防、消费性电器产品、资讯与通讯技术以及汽车市场中都有机会。

Q5.市场的主要企业是：

A5. 一些主要的 3D 积体电路和硅穿孔电极(TSV) 互连公司包括：

  • Amkor Technology
  • Elpida Memory
  • Intel Corporation
  • Micron Technology
  • Monolithic 3d
  • Renesas Electronics Corporation

Q6.未来最大的细分市场是什么？

A6.Lucintel 预计，由于以下因素的影响，绝缘体上硅在整个预测期内仍将占据更大的市场份额：

Q7.未来五年预计哪些地区的市场成长最大？

A7.由于智慧型手机製造对硅晶圆的需求不断增加以及该地区5G技术的采用不断增加，预计亚太地区在整个预测期内仍将是最大的地区。

Q8. 可以客製化报告吗？

A8. 是的，Lucintel 提供 10% 的客製化服务，无需额外付费。

目录

第一章执行摘要

第二章全球3D积体电路与硅穿孔电极（TSV）互连市场：市场动态

  • 简介、背景、分类
  • 供应链
  • 产业驱动因素与挑战

第三章 2018-2030年市场趋势及预测分析

  • 宏观经济趋势（2018-2023）与预测（2024-2030）
  • 全球3D积体电路与硅穿孔电极（TSV）互连市场趋势（2018-2023）与预测（2024-2030）
  • 按技术分類的全球 3D 积体电路和硅穿孔电极(TSV) 互连市场
    • 硅晶绝缘体
    • 体硅
  • 全球 3D 积体电路和硅穿孔电极(TSV) 互连市场（依产品）
    • 记忆
    • 发光二极体
    • 感应器
    • 电源和类比元件
    • 电子机械系统
    • 其他的
  • 全球 3D 积体电路和使用键合技术的硅穿孔电极孔 (TSV) 互连市场
    • 晶粒
    • 晶粒到晶圆
    • 晶圆到晶圆
    • 直接绑定
    • 用黏剂
    • 金属结合剂
  • 全球 3D 积体电路和硅穿孔电极(TSV) 互连市场（依应用）
    • 军队
    • 航太和国防
    • 家用电器
    • 资讯和通讯技术
    • 车
    • 其他的

第四章 2018-2030年区域市场趋势及预测分析

  • 全球3D积体电路与硅穿孔电极（TSV）互连市场（按地区）
  • 北美3D积体电路与硅穿孔电极（TSV）互连市场
  • 欧洲3D积体电路与硅穿孔电极(TSV)互连市场
  • 亚太地区 3D 积体电路和硅穿孔电极(TSV) 互连市场
  • 其他地区3D积体电路与硅穿孔电极（TSV）互连市场

第五章 竞争分析

  • 产品系列分析
  • 营运整合
  • 波特五力分析

第六章 成长机会与策略分析

  • 成长机会分析
    • 全球 3D 积体电路和硅穿孔电极(TSV) 互连市场成长机会（按技术）
    • 全球 3D 积体电路和硅穿孔电极(TSV) 互连市场成长机会（依产品）
    • 全球 3D 积体电路和透过键合技术硅穿孔电极(TSV) 互连市场的成长机会
    • 全球 3D 积体电路与硅穿孔电极(TSV) 互连市场成长机会（依应用）
    • 全球 3D 积体电路和硅穿孔电极(TSV) 互连市场成长机会（按地区）
  • 全球 3D 积体电路和硅穿孔电极(TSV) 互连市场的新兴趋势
  • 战略分析
    • 新产品开发
    • 全球3D积体电路与硅穿孔电极(TSV)互连市场产能扩张
    • 全球 3D 积体电路和硅穿孔电极(TSV) 互连市场的併购和合资企业
    • 认证和许可

第七章主要企业概况

  • Amkor Technology
  • Elpida Memory
  • Intel Corporation
  • Micron Technology
  • Monolithic 3d
  • Renesas Electronics Corporation
简介目录

Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Trends and Forecast

The future of the global three-dimensional integrated circuit & through-silicon via (TSV) interconnect market looks promising with opportunities in the military, aerospace and defense, consumer electronics, information and communication technology, and automotive markets. The global three-dimensional integrated circuit & through-silicon via (TSV) interconnect market is expected to reach an estimated $37.3 billion by 2030 with a CAGR of 10.7% from 2024 to 2030. The major drivers for this market are increasing need for decreased energy consumption and enhanced density, growing adoption of 3D IC and TSV interconnect solutions, and rising demand of high-performance and miniaturized electronic devices.

A more than 150-page report is developed to help in your business decisions.

Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect by Segment

The study includes a forecast for the global three-dimensional integrated circuit & through-silicon via (TSV) interconnect by technology, product, bonding technique, application, and region.

Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Technology [Shipment Analysis by Value from 2018 to 2030]:

  • Silicon on Insulator
  • Bulk Silicon

Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Product [Shipment Analysis by Value from 2018 to 2030]:

  • Memories
  • Light Emitting Diodes
  • Sensors
  • Power and Analog Components
  • Micro Electro Mechanical Systems
  • Others

Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Bonding Technique [Shipment Analysis by Value from 2018 to 2030]:

  • Die to Die
  • Die to Wafer
  • Wafer to Wafer
  • Direct Bonding
  • Adhesive Bonding
  • Metallic Bonding

Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Application [Shipment Analysis by Value from 2018 to 2030]:

  • Military
  • Aerospace and Defense
  • Consumer Electronics
  • Information and Communication Technology
  • Automotive
  • Others

Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies three-dimensional integrated circuit & through-silicon via (TSV) interconnect companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the three-dimensional integrated circuit & through-silicon via (TSV) interconnect companies profiled in this report include-

  • Amkor Technology
  • Elpida Memory
  • Intel Corporation
  • Micron Technology
  • Monolithic 3D
  • Renesas Electronics Corporation

Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market Insights

Lucintel forecasts that silicon on insulator will remain the larger segment over the forecast period.

Within this market, aerospace & defense is expected to witness the highest growth over the forecast period.

APAC will remain the largest region over the forecast period due to increasing need for silicon wafers in smartphone manufacturing and rising adoption of 5G technology in the region.

Features of the Global Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market

Market Size Estimates: Three-dimensional integrated circuit & through-silicon via (TSV) interconnect market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Three-dimensional integrated circuit & through-silicon via (TSV) interconnect market size by technology, product, bonding technique, application, and region in terms of value ($B).

Regional Analysis: Three-dimensional integrated circuit & through-silicon via (TSV) interconnect market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different technologies, products, bonding techniques, applications, and regions for the three-dimensional integrated circuit & through-silicon via (TSV) interconnect market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the three-dimensional integrated circuit & through-silicon via (TSV) interconnect market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q.1 What is the three-dimensional integrated circuit & through-silicon via (TSV) interconnect market size?

Answer: The global three-dimensional integrated circuit & through-silicon via (TSV) interconnect market is expected to reach an estimated $37.3 billion by 2030.

Q.2 What is the growth forecast for three-dimensional integrated circuit & through-silicon via (TSV) interconnect market?

Answer: The global three-dimensional integrated circuit & through-silicon via (TSV) interconnect market is expected to grow with a CAGR of 10.7% from 2024 to 2030.

Q.3 What are the major drivers influencing the growth of the three-dimensional integrated circuit & through-silicon via (TSV) interconnect market?

Answer: The major drivers for this market are increasing need for decreased energy consumption and enhanced density, growing adoption of 3D IC and TSV interconnect solutions, and rising demand of high-performance and miniaturized electronic devices.

Q4. What are the major segments for three-dimensional integrated circuit & through-silicon via (TSV) interconnect market?

Answer: The future of the three-dimensional integrated circuit & through-silicon via (TSV) interconnect market looks promising with opportunities in the military, aerospace and defense, consumer electronics, information and communication technology, and automotive markets.

Q5. Who are the key three-dimensional integrated circuit & through-silicon Via (TSV) Interconnect market companies?

Answer: Some of the key three-dimensional integrated circuit & through-silicon via (TSV) interconnect companies are as follows:

  • Amkor Technology
  • Elpida Memory
  • Intel Corporation
  • Micron Technology
  • Monolithic 3d
  • Renesas Electronics Corporation

Q6. Which three-dimensional integrated circuit & through-silicon via (TSV) interconnect market segment will be the largest in future?

Answer: Lucintel forecasts that silicon on insulator will remain the larger segment over the forecast period due to .

Q7. In three-dimensional integrated circuit & through-silicon via (TSV) interconnect market, which region is expected to be the largest in next 5 years?

Answer: APAC will remain the largest region over the forecast period due to increasing need for silicon wafers in smartphone manufacturing and rising adoption of 5G technology in the region.

Q.8 Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the three-dimensional integrated circuit & through-silicon via (TSV) interconnect market by technology (silicon on insulator and bulk silicon), product (memories, light emitting diodes, sensors, power and analog components, micro electro mechanical systems, and others), bonding technique (die to die, die to wafer, wafer to wafer, direct bonding, adhesive bonding, and metallic bonding), application (military, aerospace and defense, consumer electronics, information and communication technology, automotive, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Technology
    • 3.3.1: Silicon on Insulator
    • 3.3.2: Bulk Silicon
  • 3.4: Global Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Product
    • 3.4.1: Memories
    • 3.4.2: Light Emitting Diodes
    • 3.4.3: Sensors
    • 3.4.4: Power and Analog Components
    • 3.4.5: Micro Electro Mechanical Systems
    • 3.4.6: Others
  • 3.5: Global Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Bonding Technique
    • 3.5.1: Die to Die
    • 3.5.2: Die to Wafer
    • 3.5.3: Wafer to Wafer
    • 3.5.4: Direct Bonding
    • 3.5.5: Adhesive Bonding
    • 3.5.6: Metallic Bonding
  • 3.6: Global Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Application
    • 3.6.1: Military
    • 3.6.2: Aerospace and Defense
    • 3.6.3: Consumer Electronics
    • 3.6.4: Information and Communication Technology
    • 3.6.5: Automotive
    • 3.6.6: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Region
  • 4.2: North American Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market
    • 4.2.2: North American Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Application: Military, Aerospace and Defense, Consumer Electronics, Information and Communication Technology, Automotive, and Others
  • 4.3: European Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market
    • 4.3.1: European Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Technology: Silicon on Insulator and Bulk Silicon
    • 4.3.2: European Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Application: Military, Aerospace and Defense, Consumer Electronics, Information and Communication Technology, Automotive, and Others
  • 4.4: APAC Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market
    • 4.4.1: APAC Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Technology: Silicon on Insulator and Bulk Silicon
    • 4.4.2: APAC Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Application: Military, Aerospace and Defense, Consumer Electronics, Information and Communication Technology, Automotive, and Others
  • 4.5: ROW Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market
    • 4.5.1: ROW Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Technology: Silicon on Insulator and Bulk Silicon
    • 4.5.2: ROW Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Application: Military, Aerospace and Defense, Consumer Electronics, Information and Communication Technology, Automotive, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Technology
    • 6.1.2: Growth Opportunities for the Global Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Product
    • 6.1.3: Growth Opportunities for the Global Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Bonding Technique
    • 6.1.4: Growth Opportunities for the Global Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Application
    • 6.1.5: Growth Opportunities for the Global Three-Dimensional Integrated Circuit & Through-Silicon Via (TSV) Interconnect Market by Region
  • 6.2: Emerging Trends in the Global Three-Dimensional Integrated Circuit & Through-Silicon Via (Tsv) Interconnect Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Three-Dimensional Integrated Circuit & Through-Silicon Via (Tsv) Interconnect Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Three-Dimensional Integrated Circuit & Through-Silicon Via (Tsv) Interconnect Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Amkor Technology
  • 7.2: Elpida Memory
  • 7.3: Intel Corporation
  • 7.4: Micron Technology
  • 7.5: Monolithic 3d
  • 7.6: Renesas Electronics Corporation