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市场调查报告书
商品编码
1418051

高性能刚性 PCB 市场报告：2030 年趋势、预测与竞争分析

High Performance Rigid PCB Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日期: | 出版商: Lucintel | 英文 150 - page report | 商品交期: 3个工作天内

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简介目录

高性能刚性 PCB 趋势与预测

预计2024年至2030年全球高性能刚性PCB市场将以4.6%的复合年增长率成长。该市场的主要驱动因素是消费性电子、汽车、航太和通讯等各行业对高性能刚性 PCB 的需求不断增长，电子产品、云端运算、物联网、5G 等领域的技术不断发展和改进。以资料为中心的技术和应用（例如人工智慧）的快速成长。全球高性能刚性 PCB 市场的未来前景广阔，航太、消费性电子、汽车、通讯、医疗和工业市场充满机会。

Lucintel 预测，多层板将由多层导电材料与绝缘层粘合而成，从而实现单层或两层基板不可能实现的具有高元件密度的高度复杂电路。预计在此期间将出现最高增长。

在预测期内，亚太地区可能仍然是最大的地区，因为它是中国、台湾和韩国等主要电子製造地的所在地。

常问问题

Q1.市场成长预测如何？

A1. 2024年至2030年，全球高性能刚性PCB市场预计将以4.6%的复合年增长率成长。

Q2.影响市场成长的主要驱动因素有哪些？

A2. 该市场的主要驱动因素是消费性电子、汽车、航太和通讯等各行业对高性能刚性PCB的需求不断增长，电子产品和云端运算的不断技术发展和改进。以资料为中心的技术和应用（例如物联网、5G 和人工智慧）的成长。

Q3.市场的主要细分市场有哪些？

A3. 全球高性能刚性PCB市场前景广阔，航太、消费性电子、汽车、通讯、医疗和工业市场充满机会。

Q4.市场上主要企业有哪些？

A4. 主要高性能刚性PCB公司如下。

  • Ibiden
  • PCBmay
  • TTM
  • Unimicron Technology
  • Tripod Technology
  • At&S
  • SEMIKRON
  • Kinwong
  • AVARY Holding
  • Hannstar Board

Q5.未来最大的细分市场是什么？

A5.Lucintel认为，在预测期内，多层板由多层导电材料与绝缘层粘合而成，可以实现具有高密度元件的极其复杂的电路，这是单层或双层基板无法实现的.预计将出现最高成长。

Q6. 未来五年预计哪个地区将成为最大的市场？

A6. 由于中国、台湾和韩国等主要电子製造地，预计亚太地区在预测期内仍将是最大的地区。

Q7. 可以客製化报告吗？

A7. 是的，Lucintel 提供 10% 的客製化服务，无需额外付费。

目录

第一章执行摘要

第二章全球高性能刚性PCB市场：市场动态

  • 简介、背景、分类
  • 供应链
  • 产业驱动因素与挑战

第三章 2018-2030年市场趋势及预测分析

  • 宏观经济趋势（2018-2023）与预测（2024-2030）
  • 全球高性能刚性PCB市场趋势（2018-2023）与预测（2024-2030）
  • 按类型分類的全球高性能刚性 PCB 市场
    • 单层
    • 双层
    • 多层
  • 全球高性能刚性 PCB 市场（按应用）
    • 航太
    • 家用电器
    • 车
    • 沟通
    • 药品
    • 工业的
    • 其他的

第四章 2018-2030年区域市场趋势及预测分析

  • 全球高性能刚性PCB市场区域分布
  • 北美高性能刚性PCB市场
  • 欧洲高性能刚性PCB市场
  • 亚太高性能刚性 PCB 市场
  • 其他地区高性能刚性PCB市场

第五章 竞争分析

  • 产品系列分析
  • 营运整合
  • 波特五力分析

第六章 成长机会与策略分析

  • 成长机会分析
    • 按类型分類的全球高性能刚性 PCB 市场成长机会
    • 全球高性能刚性 PCB 市场成长机会（按应用）
    • 全球高性能刚性 PCB 市场成长机会（按地区）
  • 全球高性能刚性PCB市场新趋势
  • 战略分析
    • 新产品开发
    • 扩大全球高性能刚性PCB市场产能
    • 全球高性能刚性PCB市场的併购和合资企业
    • 认证和许可

第七章主要企业概况

  • Ibiden
  • PCBMay
  • TTM
  • Unimicron Technology
  • Tripod Technology
  • AT&S
  • SEMIKRON
  • Kinwong
  • AVARY HOLDING
  • HannStar Board
简介目录

High Performance Rigid PCB Trends and Forecast

The future of the global high performance rigid PCB market looks promising with opportunities in the aerospace, consumer electronics, automobile, communication, medical, and industrial markets. The global high performance rigid PCB market is expected to grow with a CAGR of 4.6% from 2024 to 2030. The major drivers for this market are growing need for high-performance rigid PCBs in a variety of industries, including consumer electronics, automotive, aerospace, and telecommunications, constant technical development and improvements in electronic gadgets, along with the exponential growth of data-centric technologies and applications, including cloud computing, IoT, 5G, and AI.

A more than 150-page report is developed to help in your business decisions.

High Performance Rigid PCB by Segment

The study includes a forecast for the global high performance rigid PCB by type, application, and region.

High Performance Rigid PCB Market by Type [Shipment Analysis by Value from 2018 to 2030]:

  • Single-Layer
  • Double-Layer
  • Multi-Layer

High Performance Rigid PCB Market by Application [Shipment Analysis by Value from 2018 to 2030]:

  • Aerospace
  • Consumer Electronics
  • Automobile
  • Communications
  • Medical
  • Industrial
  • Others

High Performance Rigid PCB Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of High Performance Rigid PCB Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies high performance rigid PCB companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the high performance rigid PCB companies profiled in this report include-

  • Ibiden
  • PCBmay
  • TTM
  • Unimicron Technology
  • Tripod Technology
  • At&S
  • SEMIKRON
  • Kinwong
  • AVARY Holding
  • Hannstar Board

High Performance Rigid PCB

Lucintel forecasts that multi-layer is expected to witness highest growth over the forecast period because it consists of several layers of conductive material bonded together with insulating layers and this allows for incredibly complex circuitry with high component density, which is impossible to achieve with single or double-layer boards.

APAC will remain the largest region over the forecast period because the region is home to major electronics manufacturing hubs like China, Taiwan, and South Korea.

Features of the Global High Performance Rigid PCB Market

Market Size Estimates: High performance rigid pcb market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: High performance rigid pcb market size by type, application, and region in terms of value ($B).

Regional Analysis: High performance rigid pcb market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different type, application, and regions for the high performance rigid PCB market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the high performance rigid PCB market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the growth forecast for high performance rigid PCB market?

Answer: The global high performance rigid PCB market is expected to grow with a CAGR of 4.6% from 2024 to 2030.

Q2. What are the major drivers influencing the growth of the high performance rigid PCB market?

Answer: The major drivers for this market are growing need for high-performance rigid PCBs in a variety of industries, including consumer electronics, automotive, aerospace, and telecommunications, constant technical development and improvements in electronic gadgets, along with the exponential growth of data-centric technologies and applications, including cloud computing, IoT, 5G, and AI.

Q3. What are the major segments for high performance rigid PCB market?

Answer: The future of the global high performance rigid PCB market looks promising with opportunities in the aerospace, consumer electronics, automobile, communication, medical, and industrial markets.

Q4. Who are the key high performance rigid PCB market companies?

Answer: Some of the key high performance rigid PCB companies are as follows.

  • Ibiden
  • PCBmay
  • TTM
  • Unimicron Technology
  • Tripod Technology
  • At&S
  • SEMIKRON
  • Kinwong
  • AVARY Holding
  • Hannstar Board

Q5. Which high performance rigid PCB market segment will be the largest in future?

Answer: Lucintel forecasts that multi-layer is expected to witness highest growth over the forecast period because it consists of several layers of conductive material bonded together with insulating layers and this allows for incredibly complex circuitry with high component density, which is impossible to achieve with single or double-layer boards.

Q6. In high performance rigid PCB market, which region is expected to be the largest in next 5 years?

Answer: APAC will remain the largest region over the forecast period because the region is home to major electronics manufacturing hubs like China, Taiwan, and South Korea.

Q7. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the high performance rigid PCB market by type (single-layer, double-layer, and multi-layer), application (aerospace, consumer electronics, automobile, communications, medical, industrial, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global High Performance Rigid PCB Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global High Performance Rigid PCB Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global High Performance Rigid PCB Market by Type
    • 3.3.1: Single-layer
    • 3.3.2: Double-layer
    • 3.3.3: Multi-layer
  • 3.4: Global High Performance Rigid PCB Market by Application
    • 3.4.1: Aerospace
    • 3.4.2: Consumer Electronics
    • 3.4.3: Automobile
    • 3.4.4: Communications
    • 3.4.5: Medical
    • 3.4.6: Industrial
    • 3.4.7: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global High Performance Rigid PCB Market by Region
  • 4.2: North American High Performance Rigid PCB Market
    • 4.2.2: North American High Performance Rigid PCB Market by Application: Aerospace, Consumer Electronics, Automobile, Communications, Medical, Industrial, and Others
  • 4.3: European High Performance Rigid PCB Market
    • 4.3.1: European High Performance Rigid PCB Market by Type: Single-layer, Double-layer, and Multi-layer
    • 4.3.2: European High Performance Rigid PCB Market by Application: Aerospace, Consumer Electronics, Automobile, Communications, Medical, Industrial, and Others
  • 4.4: APAC High Performance Rigid PCB Market
    • 4.4.1: APAC High Performance Rigid PCB Market by Type: Single-layer, Double-layer, and Multi-layer
    • 4.4.2: APAC High Performance Rigid PCB Market by Application: Aerospace, Consumer Electronics, Automobile, Communications, Medical, Industrial, and Others
  • 4.5: ROW High Performance Rigid PCB Market
    • 4.5.1: ROW High Performance Rigid PCB Market by Type: Single-layer, Double-layer, and Multi-layer
    • 4.5.2: ROW High Performance Rigid PCB Market by Application: Aerospace, Consumer Electronics, Automobile, Communications, Medical, Industrial, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global High Performance Rigid PCB Market by Type
    • 6.1.2: Growth Opportunities for the Global High Performance Rigid PCB Market by Application
    • 6.1.3: Growth Opportunities for the Global High Performance Rigid PCB Market by Region
  • 6.2: Emerging Trends in the Global High Performance Rigid PCB Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global High Performance Rigid PCB Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global High Performance Rigid PCB Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Ibiden
  • 7.2: PCBMay
  • 7.3: TTM
  • 7.4: Unimicron Technology
  • 7.5: Tripod Technology
  • 7.6: AT&S
  • 7.7: SEMIKRON
  • 7.8: Kinwong
  • 7.9: AVARY HOLDING
  • 7.10: HannStar Board