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市场调查报告书
商品编码
1447007

到 2030 年印刷电路板市场预测 - 按类型、基板、层压材料、原材料、最终用户和地理位置进行的全球分析

Printed Circuit Board Market Forecasts to 2030 - Global Analysis By Type, Substrate, Laminate Material, Raw Material, End User and by Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3个工作天内

价格

根据 Stratistics MRC 的数据，2023 年全球印刷电路板 (PCB) 市场规模为 861.8 亿美元，预计到 2030 年将达到 1,439.1 亿美元，预测期内CAGR为 7.6%。作为电子设备的结构基础，印刷电路板或 PCB 是当代电子产品的重要组成部分。它是一块平板，上面蚀刻或印刷有导电路径，通常由玻璃纤维或其他非导电材料製成。这些通常由铜组成的路径连接电阻器、电容器和积体电路以及其他电子元件，形成一个网路。

国际电子工程师协会 (IAEE) 表示，技术的快速发展需要印刷电路板 (PCB) 的设计和製造不断创新，并强调这些组件在推动不同行业的电子系统方面发挥关键作用。

市场动态：

司机：

对紧凑、高效电子产品的需求

从智慧型手机到智慧手錶，消费者对功能更强大、更轻、更小的电子设备的持续需求推动了对复杂印刷电路板 (PCB) 的需求。此外，PCB製造商被迫设计具有更高性能和更高元件密度的PCB，以满足紧凑但功能丰富的电子设备不断变化的需求，这推动PCB市场在小型化和技术能力方面不断创新。

克制：

製造复杂性和成本不断增加

由于对具有更高性能和小型化的复杂 PCB 的持续需求，製造程序变得越来越复杂。此外，复杂设计和尖端材料的使用在成本和复杂性方面给生产带来了困难。为了满足这些需求，製造商必须投资最先进的机械和高技能劳动力，这可能会导致生产成本增加，然后转嫁给客户。

机会：

5G基础设施发展

5G技术的广泛部署为P​​CB产业提供了巨大的机会。 5G 网路的部署需要具有高频功能和低讯号损失的先进印刷电路板 (PCB)。此外，对基地台、天线和通讯设备等5G基础设施零件的需求不断增长，为PCB製造商带来了商机，并将刺激高频PCB技术的进步。

威胁：

缺乏必需的原料

製造所需的铜和稀土元素等关键原料可能会变得稀缺，对 PCB 产业构成威胁。此外，这些材料的可用性和成本可能会因供应链中断、地缘政治紧张局势和需求增加而波动，这可能会影响生产成本并延迟 PCB 的製造。

Covid-19 影响：

COVID-19 大流行对印刷电路板 (PCB) 市场产生了深远影响，颠覆了需求动态和供应链。全球范围内的封锁和限制导致製造业务中断，导致生产延误和关键零件短缺。 PCB市场受到供应链问题、消费者支出下降和经济不确定性的影响，从而减少了对电子设备的需求。此外，整个市场努力适应前所未有的破坏，这导致供应链策略的重新评估，更加重视数位化，以及产业内的弹性和灵活性。

多层细分市场预计将在预测期内成为最大的细分市场

预计多层PCB类别将占据最大的市场份额。夹在一起的多层绝缘材料和铜迹线定义了多层印刷电路板 (PCB)，从而实现了复杂的电路设计和改进的功能。这些 PCB 广泛用于需要有效讯号路由和空间最佳化的复杂电子设备，例如电脑、网路设备和智慧型手机。此外，多层 PCB 的市场主导地位是对小型、功能丰富的电子设备的需求不断增长的结果。

预计医疗保健领域在预测期内的CAGR最高

预计医疗保健领域的市场CAGR最高。医疗保健产业的强劲扩张归因于医疗器材、诊断工具和医疗保健设施领域尖端技术的日益整合。在医疗保健领域，对感测器、监视器和通讯系统等电子元件的需求不断增加。此外，远距医疗趋势、智慧医疗设备的创建以及对患者监测和诊断的关注是推动医疗保健领域在电子市场快速扩张的一些因素。

占比最大的地区：

亚太地区所占份额最大。该地区强大的製造生态系统，尤其是韩国、台湾、中国、日本和韩国这些全球电子产业的主要参与者，是推动其主导地位的原因。该地区在市场上的主导地位得益于其在依赖 PCB 的消费性电子产品、汽车零件和其他电子机器製造领域的强大地位。此外，该地区是 PCB 製造和创新的中心，因为它还拥有高技能的劳动力、先进的製造能力和广泛的供应网络。

复合CAGR最高的地区：

由于欧洲地区先进的技术和充满活力的电子产业，印刷电路板（PCB）市场预计将以最高的CAGR成长。在欧洲 PCB 领域，法国、德国和英国等国家对于促进製造业的创新和卓越发挥重要作用。对尖端 PCB 的需求特别受到汽车产业的推动，它们用于自动驾驶系统、电动车和车内连接。此外，欧洲对工业自动化、航空航太和再生能源的重视也促进了先进 PCB 技术的广泛使用。

主要进展：

2023 年 11 月，总部位于圣塔安娜的印刷电路板生产商 TTM Technologies Inc. 和圣荷西的数位支付公司 Paypal Holdings Inc. 均公布了超出华尔街预期的第三季收益。 TTM Technologies 披露第三季亏损 3,710 万美元，即每股亏损 36 美分。然而，在根据资产减损和摊销成本进行调整后，每股收益升至 43 美分，超过 Zacks Investment Research 三位分析师每股 28 美分的平均预期。

2023 年 10 月，安费诺公司收购 PCTEL 公司。全球无线技术解决方案提供商 PCTEL Inc 表示，它已达成最终协议，将被 Ampheno Corp 收购。该交易为全现金交易，PCTEL Inc 的估值接近 1.397 亿美元。根据 PCTEL 董事会批准的交易条款，PCTEL 股东所拥有的每股普通股将获得 7 美元现金。

2023 年 3 月，住友电工株式会社和 US Conec Ltd. 宣布执行最终许可协议，使住友电工 Lightwave, Corp. 能够製造 MMC 连接器和 TMT 插芯组件，用于部署下一代高密度、多光纤布线解决方案。 US Conec 的 MMC 连接器将新颖的、占用空间减小的多光纤插芯与非常小的外形 (VSFF) 连接器占用空间（尺寸为 MPO 格式的 1/3）结合在一起。

我们的报告提供了什么：

  • 区域和国家层面的市场份额评估
  • 对新进入者的策略建议
  • 涵盖2021年、2022年、2023年、2026年及2030年的市场资料
  • 市场趋势（驱动因素、限制因素、机会、威胁、挑战、投资机会和建议）
  • 根据市场预测提出关键业务部门的策略建议
  • 竞争性景观美化绘製主要共同趋势
  • 公司概况，包括详细的策略、财务状况和最新发展
  • 反映最新技术进步的供应链趋势

免费客製化产品：

本报告的所有客户都将有权获得以下免费自订选项之一：

  • 公司简介
    • 其他市场参与者的综合分析（最多 3 个）
    • 关键参与者的 SWOT 分析（最多 3 个）
  • 区域细分
    • 根据客户的兴趣对任何主要国家的市场估计、预测和CAGR（註：取决于可行性检查）
  • 竞争基准化分析
    • 根据产品组合、地理分布和策略联盟对主要参与者基准化分析

目录

第 1 章：执行摘要

第 2 章：前言

  • 抽象的
  • 股东
  • 研究范围
  • 研究方法论
    • 资料探勘
    • 数据分析
    • 数据验证
    • 研究方法
  • 研究来源
    • 主要研究来源
    • 二手研究来源
    • 假设

第 3 章：市场趋势分析

  • 介绍
  • 司机
  • 限制
  • 机会
  • 威胁
  • 最终用户分析
  • 新兴市场
  • Covid-19 的影响

第 4 章：波特五力分析

  • 供应商的议价能力
  • 买家的议价能力
  • 替代品的威胁
  • 新进入者的威胁
  • 竞争竞争

第 5 章：全球印刷电路板 (PCB) 市场：按类型

  • 介绍
  • 单方面的
  • 两面性
  • 多层
  • 高密度互连 (HDI)
  • 其他类型

第 6 章：全球印刷电路板 (PCB) 市场：依基材分类

  • 介绍
  • 死板的
  • 灵活的
  • 刚柔结合

第 7 章：全球印刷电路板 (PCB) 市场：依层压材料分类

  • 介绍
  • 阻燃剂（FR-4）
    • 阻燃剂（FR-4）高Tg
    • 阻燃剂 (FR-4) 无卤
    • 标准及其他
  • 柔性（PI、PET）
  • 纸
  • 复合材料
  • 其他层压材料

第 8 章：全球印刷电路板 (PCB) 市场：依原料分类

  • 介绍
  • 玻璃布
  • 环氧树脂
  • 牛皮纸
  • 酚醛树脂
  • 聚酰亚胺薄膜
  • 其他原料

第 9 章：全球印刷电路板 (PCB) 市场：依最终用户分类

  • 介绍
  • 工业电子
  • 卫生保健
  • 航太和国防
  • 汽车
  • 资讯科技与电信
  • 消费性电子产品
  • 其他最终用户

第 10 章：全球印刷电路板 (PCB) 市场：依地理位置

  • 介绍
  • 北美洲
    • 我们
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 义大利
    • 法国
    • 西班牙
    • 欧洲其他地区
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 澳洲
    • 纽西兰
    • 韩国
    • 亚太地区其他地区
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 南美洲其他地区
  • 中东和非洲
    • 沙乌地阿拉伯
    • 阿联酋
    • 卡达
    • 南非
    • 中东和非洲其他地区

第 11 章：主要进展

  • 协议、伙伴关係、合作和合资企业
  • 收购与合併
  • 新产品发布
  • 扩充
  • 其他关键策略

第 12 章：公司概况

  • Nippon Mektron, Ltd.
  • Sumitomo Electric Industries Ltd
  • Amphenol Corporation
  • Zhen Ding Technology Holding Limited
  • Fujikura Ltd.
  • Nitto Denko Corporation
  • Tripod Technology Corporation
  • Advanced Circuits Inc.
  • TTM Technologies Inc.
  • Wurth elektronik group (Wurth group)
  • Auter Elektronics Ltd.
  • Unimicron Technology Corporation
Product Code: SMRC25268

According to Stratistics MRC, the Global Printed Circuit Board (PCB) Market is accounted for $86.18 billion in 2023 and is expected to reach $143.91 billion by 2030 growing at a CAGR of 7.6% during the forecast period. As the structural foundation of electronic devices, printed circuit boards, or PCBs, are essential parts of contemporary electronics. It's a flat board with conductive pathways etched or printed onto it that is typically made of fiberglass or another non-conductive material. Connecting resistors, capacitors, and integrated circuits, among other electronic components, these pathways, which are typically composed of copper, create a network.

According to the International Association of Electronics Engineers (IAEE), the rapid evolution of technology necessitates constant innovation in the design and fabrication of Printed Circuit Boards (PCBs), emphasizing the critical role these components play in advancing electronic systems across diverse industries.

Market Dynamics:

Driver:

Demand for compact and high-efficiency electronics

The need for sophisticated printed circuit boards (PCBs) is driven by the ongoing consumer demand for more powerful, lighter, and smaller electronic devices, from smartphones to smart watches. Furthermore, PCB manufacturers are forced to design PCBs with improved performance and higher component density to meet the ever-changing demands of compact yet feature-rich electronic devices, which drives the PCB market to continuously innovate in terms of miniaturization and technological capabilities.

Restraint:

Growing manufacturing complexity and cost

Manufacturing procedures are becoming more complicated as a result of the ongoing demand for sophisticated PCBs with greater performance and miniaturization. Additionally, the use of sophisticated designs and cutting-edge materials presents difficulties for production in terms of cost and complexity. To meet these demands, manufacturers must make investments in state-of-the-art machinery and highly skilled labor, which may lead to increased production costs that are then passed on to customers.

Opportunity:

Development of 5G infrastructure

The broad deployment of 5G technology offers the PCB industry a substantial window of opportunity. Advanced printed circuit boards (PCBs) with high-frequency capabilities and low signal loss are necessary for the deployment of 5G networks. Moreover, the increasing need for 5G infrastructure parts, such as base stations, antennas, and communication devices, presents a business opportunity for PCB manufacturers and will spur advancements in high-frequency PCB technology.

Threat:

Lack of essential raw materials

Critical raw materials like copper and rare earth elements, which are necessary for manufacturing, could become scarce, posing a threat to the PCB industry. Furthermore, the availability and cost of these materials can fluctuate due to supply chain disruptions, geopolitical tensions, and increased demand, which could have an effect on production costs and delay the manufacture of PCBs.

Covid-19 Impact:

The COVID-19 pandemic had a profound effect on the printed circuit board (PCB) market, upending demand dynamics and the supply chain. Production delays and shortages of critical components resulted from the disruption of manufacturing operations caused by the worldwide lockdowns and restrictions. The PCB market was impacted by supply chain issues, declining consumer spending, and economic uncertainty, which reduced demand for electronic devices. Additionally, the market as a whole struggled to adjust to the unprecedented disruptions, which led to a re-evaluation of supply chain strategies, a greater emphasis on digitalization, and an increased focus on resilience and flexibility within the industry.

The Multi-Layer segment is expected to be the largest during the forecast period

It is projected that the multi-layer PCB category will command the largest market share. Multiple layers of insulating material and copper traces sandwiched together define multi-layer printed circuit boards (PCBs), which enable complex circuit designs and improved functionality. These PCBs are widely used in sophisticated electronic devices that require effective signal routing and space optimization, like computers, networking equipment, and smartphones. Moreover, the market dominance of multi-layer PCBs is a result of the growing demand for small, feature-rich electronic devices.

The Healthcare segment is expected to have the highest CAGR during the forecast period

The market's highest CAGR is predicted for the healthcare segment. The strong expansion of the healthcare industry is ascribed to the growing amalgamation of cutting-edge technologies in medical apparatus, diagnostic tools, and healthcare facilities. In the healthcare sector, there is an increasing need for electronic components such as sensors, monitors, and communication systems. Additionally, the telemedicine trend, the creation of smart medical devices, and the focus on patient monitoring and diagnostics are some of the factors driving the healthcare segment's rapid expansion in the electronics market.

Region with largest share:

The Asia-Pacific region has the largest share. The robust manufacturing ecosystem in this region, especially in South Korea, Taiwan, China, Japan, and South Korea, which are major players in the global electronics industry, is what propels its dominance. The region's dominance in the market is supported by its robust standing in the manufacturing of PCB-dependent consumer electronics, auto parts, and other electronic machines. Furthermore, the area is a hub for PCB manufacturing and innovation because it also has a highly skilled labor force, sophisticated manufacturing capabilities, and an extensive supply network.

Region with highest CAGR:

The printed circuit board (PCB) market is expected to grow at the highest CAGR in the Europe region due to the region's advanced technology and dynamic electronics industry. In the European PCB landscape, nations like France, Germany, and the United Kingdom are important for fostering innovation and excellence in manufacturing. Demand for cutting-edge PCBs is driven by the automotive industry in particular, where they are used in autonomous driving systems, electric vehicles, and in-car connectivity. Additionally, the growing use of advanced PCB technologies is facilitated by Europe's emphasis on industrial automation, aerospace, and renewable energy.

Key players in the market

Some of the key players in Printed Circuit Board (PCB) market include Nippon Mektron, Ltd., Sumitomo Electric Industries Ltd, Amphenol Corporation, Zhen Ding Technology Holding Limited, Fujikura Ltd., Nitto Denko Corporation, Tripod Technology Corporation, Advanced Circuits Inc., TTM Technologies Inc., Wurth elektronik group (Wurth group), Auter Elektronics Ltd. and Unimicron Technology Corporation.

Key Developments:

In November 2023, Santa Ana-based TTM Technologies Inc., a printed circuit board producer, and San Jose's digital payments company, Paypal Holdings Inc., both reported third-quarter earnings that beat Wall Street expectations. TTM Technologies disclosed a Q3 loss of $37.1 million or 36 cents per share. However, when adjusted for asset impairment and amortization costs, earnings rose to 43 cents per share, exceeding the average estimate of 28 cents per share by Zacks Investment Research's three analysts.

In October 2023, Amphenol Corp to acquire the company PCTEL. PCTEL Inc, a global provider of wireless technology solutions, said that it had reached a definitive agreement to be purchased by Amphenol Corp. The deal, which is structured as an all cash transaction, values PCTEL Inc at nearly $139.7 million. Under the terms of the deal, approved by PCTEL's board of directors, PCTEL shareholders will receive $7.00 in cash for every share of common stock they own.

In March 2023, Sumitomo Electric Industries, Ltd. and US Conec Ltd. announce the execution of a definitive license agreement enabling Sumitomo Electric Lightwave, Corp. to manufacture MMC connector and TMT ferrule components for the deployment of next-generation, high-density, multi-fiber cabling solutions. US Conec's MMC connector combines a novel, reduced footprint multi-fiber ferrule with a very small Form factor (VSFF) connector footprint which is 1/3 the size of the MPO format.

Types Covered:

  • Single Sided
  • Double Sided
  • Multi-Layer
  • High Density Interconnect (HDI)
  • Other Types

Substrates Covered:

  • Rigid
  • Flexible
  • Rigid-Flex

Laminate Materials Covered:

  • Flame Retardant (FR-4)
  • Flexible (PI,PET)
  • Paper
  • Composites
  • Other Laminate Materials

Raw Materials Covered:

  • Glass Fabric
  • Epoxy Resin
  • Kraft Paper
  • Phenolic Resin
  • Polyimide Film
  • Other Raw Materials

End Users Covered:

  • Industrial Electronics
  • Healthcare
  • Aerospace and Defense
  • Automotive
  • IT & Telecom
  • Consumer Electronics
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2021, 2022, 2023, 2026, and 2030
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 End User Analysis
  • 3.7 Emerging Markets
  • 3.8 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Printed Circuit Board (PCB) Market, By Type

  • 5.1 Introduction
  • 5.2 Single Sided
  • 5.3 Double Sided
  • 5.4 Multi-Layer
  • 5.5 High Density Interconnect (HDI)
  • 5.6 Other Types

6 Global Printed Circuit Board (PCB) Market, By Substrate

  • 6.1 Introduction
  • 6.2 Rigid
  • 6.3 Flexible
  • 6.4 Rigid-Flex

7 Global Printed Circuit Board (PCB) Market, By Laminate Material

  • 7.1 Introduction
  • 7.2 Flame Retardant (FR-4)
    • 7.2.1 Flame Retardant (FR-4) high Tg
    • 7.2.2 Flame Retardant (FR-4) halogen Free
    • 7.2.3 Standard & Others
  • 7.3 Flexible (PI,PET)
  • 7.4 Paper
  • 7.5 Composites
  • 7.6 Other Laminate Materials

8 Global Printed Circuit Board (PCB) Market, By Raw Material

  • 8.1 Introduction
  • 8.2 Glass Fabric
  • 8.3 Epoxy Resin
  • 8.4 Kraft Paper
  • 8.5 Phenolic Resin
  • 8.6 Polyimide Film
  • 8.7 Other Raw Materials

9 Global Printed Circuit Board (PCB) Market, By End User

  • 9.1 Introduction
  • 9.2 Industrial Electronics
  • 9.3 Healthcare
  • 9.4 Aerospace and Defense
  • 9.5 Automotive
  • 9.6 IT & Telecom
  • 9.7 Consumer Electronics
  • 9.8 Other End Users

10 Global Printed Circuit Board (PCB) Market, By Geography

  • 10.1 Introduction
  • 10.2 North America
    • 10.2.1 US
    • 10.2.2 Canada
    • 10.2.3 Mexico
  • 10.3 Europe
    • 10.3.1 Germany
    • 10.3.2 UK
    • 10.3.3 Italy
    • 10.3.4 France
    • 10.3.5 Spain
    • 10.3.6 Rest of Europe
  • 10.4 Asia Pacific
    • 10.4.1 Japan
    • 10.4.2 China
    • 10.4.3 India
    • 10.4.4 Australia
    • 10.4.5 New Zealand
    • 10.4.6 South Korea
    • 10.4.7 Rest of Asia Pacific
  • 10.5 South America
    • 10.5.1 Argentina
    • 10.5.2 Brazil
    • 10.5.3 Chile
    • 10.5.4 Rest of South America
  • 10.6 Middle East & Africa
    • 10.6.1 Saudi Arabia
    • 10.6.2 UAE
    • 10.6.3 Qatar
    • 10.6.4 South Africa
    • 10.6.5 Rest of Middle East & Africa

11 Key Developments

  • 11.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 11.2 Acquisitions & Mergers
  • 11.3 New Product Launch
  • 11.4 Expansions
  • 11.5 Other Key Strategies

12 Company Profiling

  • 12.1 Nippon Mektron, Ltd.
  • 12.2 Sumitomo Electric Industries Ltd
  • 12.3 Amphenol Corporation
  • 12.4 Zhen Ding Technology Holding Limited
  • 12.5 Fujikura Ltd.
  • 12.6 Nitto Denko Corporation
  • 12.7 Tripod Technology Corporation
  • 12.8 Advanced Circuits Inc.
  • 12.9 TTM Technologies Inc.
  • 12.10 Wurth elektronik group (Wurth group)
  • 12.11 Auter Elektronics Ltd.
  • 12.12 Unimicron Technology Corporation

List of Tables

  • Table 1 Global Printed Circuit Board (PCB) Market Outlook, By Region (2021-2030) ($MN)
  • Table 2 Global Printed Circuit Board (PCB) Market Outlook, By Type (2021-2030) ($MN)
  • Table 3 Global Printed Circuit Board (PCB) Market Outlook, By Single Sided (2021-2030) ($MN)
  • Table 4 Global Printed Circuit Board (PCB) Market Outlook, By Double Sided (2021-2030) ($MN)
  • Table 5 Global Printed Circuit Board (PCB) Market Outlook, By Multi-Layer (2021-2030) ($MN)
  • Table 6 Global Printed Circuit Board (PCB) Market Outlook, By High Density Interconnect (HDI) (2021-2030) ($MN)
  • Table 7 Global Printed Circuit Board (PCB) Market Outlook, By Other Types (2021-2030) ($MN)
  • Table 8 Global Printed Circuit Board (PCB) Market Outlook, By Substrate (2021-2030) ($MN)
  • Table 9 Global Printed Circuit Board (PCB) Market Outlook, By Rigid (2021-2030) ($MN)
  • Table 10 Global Printed Circuit Board (PCB) Market Outlook, By Flexible (2021-2030) ($MN)
  • Table 11 Global Printed Circuit Board (PCB) Market Outlook, By Rigid-Flex (2021-2030) ($MN)
  • Table 12 Global Printed Circuit Board (PCB) Market Outlook, By Laminate Material (2021-2030) ($MN)
  • Table 13 Global Printed Circuit Board (PCB) Market Outlook, By Flame Retardant (FR-4) (2021-2030) ($MN)
  • Table 14 Global Printed Circuit Board (PCB) Market Outlook, By Flame Retardant (FR-4) high Tg (2021-2030) ($MN)
  • Table 15 Global Printed Circuit Board (PCB) Market Outlook, By Flame Retardant (FR-4) halogen Free (2021-2030) ($MN)
  • Table 16 Global Printed Circuit Board (PCB) Market Outlook, By Standard & Others (2021-2030) ($MN)
  • Table 17 Global Printed Circuit Board (PCB) Market Outlook, By Flexible (PI, PET) (2021-2030) ($MN)
  • Table 18 Global Printed Circuit Board (PCB) Market Outlook, By Paper (2021-2030) ($MN)
  • Table 19 Global Printed Circuit Board (PCB) Market Outlook, By Composites (2021-2030) ($MN)
  • Table 20 Global Printed Circuit Board (PCB) Market Outlook, By Other Laminate Materials (2021-2030) ($MN)
  • Table 21 Global Printed Circuit Board (PCB) Market Outlook, By Raw Material (2021-2030) ($MN)
  • Table 22 Global Printed Circuit Board (PCB) Market Outlook, By Glass Fabric (2021-2030) ($MN)
  • Table 23 Global Printed Circuit Board (PCB) Market Outlook, By Epoxy Resin (2021-2030) ($MN)
  • Table 24 Global Printed Circuit Board (PCB) Market Outlook, By Kraft Paper (2021-2030) ($MN)
  • Table 25 Global Printed Circuit Board (PCB) Market Outlook, By Phenolic Resin (2021-2030) ($MN)
  • Table 26 Global Printed Circuit Board (PCB) Market Outlook, By Polyimide Film (2021-2030) ($MN)
  • Table 27 Global Printed Circuit Board (PCB) Market Outlook, By Other Raw Materials (2021-2030) ($MN)
  • Table 28 Global Printed Circuit Board (PCB) Market Outlook, By End User (2021-2030) ($MN)
  • Table 29 Global Printed Circuit Board (PCB) Market Outlook, By Industrial Electronics (2021-2030) ($MN)
  • Table 30 Global Printed Circuit Board (PCB) Market Outlook, By Healthcare (2021-2030) ($MN)
  • Table 31 Global Printed Circuit Board (PCB) Market Outlook, By Aerospace and Defense (2021-2030) ($MN)
  • Table 32 Global Printed Circuit Board (PCB) Market Outlook, By Automotive (2021-2030) ($MN)
  • Table 33 Global Printed Circuit Board (PCB) Market Outlook, By IT & Telecom (2021-2030) ($MN)
  • Table 34 Global Printed Circuit Board (PCB) Market Outlook, By Consumer Electronics (2021-2030) ($MN)
  • Table 35 Global Printed Circuit Board (PCB) Market Outlook, By Other End Users (2021-2030) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.