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市场调查报告书
商品编码
1418459

晶片邦定机设备市场报告：2030 年趋势、预测与竞争分析

Die Bonder Equipment Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日期: | 出版商: Lucintel | 英文 150 - page report | 商品交期: 3个工作天内

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简介目录

晶片黏合机设备趋势和预测

预计到 2030 年，全球贴片机设备市场将达到 8.333 亿美元，2024 年至 2030 年复合年增长率为 3.0%。该市场的主要驱动力是，由于半导体 IC 设计的复杂性不断增加，堆迭晶粒技术在物联网(IoT) 设备中的使用越来越多，对微型电子元件的需求不断增加，以及用于无线应用的高品质半导体IC。需求的扩大。全球贴片机设备市场的未来前景广阔，家用电子电器、汽车、工业、通讯、医疗保健、航太和国防市场充满机会。

晶片接合机设备市场洞察

根据Lucintel的预测，由于全自动晶片焊接机具有大规模组装和封装、提高精度以及自动化组装和封装等优势特点，预计在预测期内将出现最高增长。

由于平板电脑和智慧型手机的需求不断增长以及製造商的丰富，预计亚太地区在预测期内将出现最高的增长。

常问问题

Q1.市场规模有多大？

A1. 到 2030 年，全球贴片机设备市场预计将达到 8.333 亿美元。

Q2.市场成长预测如何？

A2. 2024年至2030年，全球贴片机设备市场预计将以3.0%的复合年增长率成长。

Q3.影响市场成长的主要驱动因素有哪些？

A3. 该市场的主要驱动力是物联网 (IoT) 设备中越来越多地使用堆迭晶粒技术、对微型电子元件的需求不断增加，以及由于半导体IC 设计的复杂性不断增加而提高无线应用的质量。半导体积体电路正在不断扩大。

Q4.市场的主要细分市场是什么？

A4. 全球贴片机设备市场的未来充满希望，家用电子电器、汽车、工业、通讯、医疗保健、航太和国防市场都有机会。

Q5. 市场上主要企业有哪些？

A5. 生产贴片机设备的主要企业如下。

  • BE Semiconductor Industries
  • ASM Pacific Technology
  • Kulicke & Soffa
  • Mycronic
  • Palomar Technologies
  • West*Bond
  • MicroAssembly Technologies

Q6.未来最大的细分市场是什么？

A6.根据Lucintel的预测，由于大规模组装和封装、精度提高以及自动化组装和封装等有利特征，全自动晶片黏合机预计将在预测期内实现最高成长。

Q7. 未来五年预计哪个地区将成为最大的市场？

A7.由于平板电脑和智慧型手机的需求不断增长以及该地区製造商数量众多，预计亚太地区将在预测期内实现最高增长。

Q8. 可以客製化报告吗？

A8. 是的，Lucintel 提供 10% 的客製化服务，无需额外付费。

目录

第一章执行摘要

第二章全球晶片邦定机设备市场：市场动态

  • 简介、背景、分类
  • 供应链
  • 产业驱动因素与挑战

第三章 2018-2030年市场趋势及预测分析

  • 宏观经济趋势（2018-2023）与预测（2024-2030）
  • 全球贴片机设备市场趋势（2018-2023）与预测（2024-2030）
  • 按类型分類的全球晶片邦定机设备市场
    • 手动固晶机
    • 半自动固晶机
    • 全自动固晶机
  • 按键合技术分類的全球晶片键合机设备市场
    • 环氧树脂
    • 共晶
    • 软质焊料
    • 其他的
  • 按设备分類的全球晶片黏合机设备市场
    • 光电子学
    • 微机电系统及微机电系统
    • 功率元件
  • 全球贴片机设备市场（按应用）
    • 家用电器
    • 车
    • 工业的
    • 电讯
    • 卫生保健
    • 航太和国防
    • 其他的

第四章 2018-2030年区域市场趋势及预测分析

  • 全球晶片黏合机设备市场（按地区）
  • 北美贴片机设备市场
  • 欧洲贴片机设备市场
  • 亚太晶片黏合机设备市场
  • 其他地区固晶机设备市场

第五章 竞争分析

  • 产品系列分析
  • 营运整合
  • 波特五力分析

第六章 成长机会与策略分析

  • 成长机会分析
    • 全球晶片邦定机设备市场成长机会（按类型）
    • 键合技术的全球晶片键合机设备市场成长机会
    • 全球晶片键合机设备市场成长机会（按设备）
    • 全球晶片邦定机设备市场成长机会（按应用）
    • 全球晶片定机设备市场成长机会（按地区）
  • 全球贴片机设备市场新趋势
  • 战略分析
    • 新产品开发
    • 扩大全球贴片机设备市场的产能
    • 全球贴片机设备市场的合併、收购与合资企业
    • 认证和许可

第七章主要企业概况

  • BE Semiconductor Industries
  • ASM Pacific Technology
  • Kulicke & Soffa
  • Mycronic
  • Palomar Technologies
  • West*Bond
  • MicroAssembly Technologies
简介目录

Die Bonder Equipment Trends and Forecast

The future of the global die bonder equipment market looks promising with opportunities in the consumer electronic, automotive, industrial, telecommunication, healthcare, and aerospace & defense markets. The global die bonder equipment market is expected to reach an estimated $833.3 million by 2030 with a CAGR of 3.0% from 2024 to 2030. The major drivers for this market are increasing use of stacked die technology in Internet of Things (IoT) devices, growing demand for tiny electronic components, need for high-quality semiconductor ICs for wireless applications is expanding along with the complexity of semiconductor IC designs.

A more than 150-page report is developed to help in your business decisions.

Die Bonder Equipment by Segment

The study includes a forecast for the global die bonder equipment by type, bonding technique, device, application, and region.

Die Bonder Equipment Market by Type [Shipment Analysis by Value from 2018 to 2030]:

  • Manual Die Bonders
  • Semiautomatic Die Bonders
  • Fully Automatic Die Bonders

Die Bonder Equipment Market by Bonding Technique [Shipment Analysis by Value from 2018 to 2030]:

  • Epoxy
  • Eutectic
  • Soft Solder
  • Others

Die Bonder Equipment Market by Device [Shipment Analysis by Value from 2018 to 2030]:

  • Optoelectronics
  • MEMS and MOEMS
  • Power Devices

Die Bonder Equipment Market by Application [Shipment Analysis by Value from 2018 to 2030]:

  • Consumer Electronics
  • Automotive
  • Industrial
  • Telecommunications
  • Healthcare
  • Aerospace & Defense
  • Others

Die Bonder Equipment Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Die Bonder Equipment Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies die bonder equipment companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the die bonder equipment companies profiled in this report include-

  • BE Semiconductor Industries
  • ASM Pacific Technology
  • Kulicke & Soffa
  • Mycronic
  • Palomar Technologies
  • West*Bond
  • MicroAssembly Technologies

Die Bonder Equipment Market Insights

Lucintel forecasts that fully automatic die bonders is expected to witness the highest growth over the forecast period due to its advantageous characteristics such as, large-scale assembly and packaging, precision enhancement, and automated assembly and packaging.

APAC is expected to witness highest growth over the forecast period due to growing need for tablets and smartphones as well as the region's abundance of manufacturers.

Features of the Global Die Bonder Equipment Market

Market Size Estimates: Die bonder equipment market size estimation in terms of value ($M).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Die bonder equipment market size by bonding technique, device, application, and region in terms of value ($M).

Regional Analysis: Die bonder equipment market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different type, bonding technique, device, application, and regions for the die bonder equipment market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the die bonder equipment market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the die bonder equipment market size?

Answer: The global die bonder equipment market is expected to reach an estimated $833.3 million by 2030.

Q2. What is the growth forecast for die bonder equipment market?

Answer: The global die bonder equipment market is expected to grow with a CAGR of 3.0% from 2024 to 2030.

Q3. What are the major drivers influencing the growth of the die bonder equipment market?

Answer: The major drivers for this market are increasing use of stacked die technology in Internet of Things (IoT) devices, growing demand for tiny electronic components, need for high-quality semiconductor ICs for wireless applications is expanding along with the complexity of semiconductor IC designs.

Q4. What are the major segments for die bonder equipment market?

Answer: The future of the global die bonder equipment market looks promising with opportunities in the consumer electronic, automotive, industrial, telecommunication, healthcare, and aerospace & defense markets.

Q5. Who are the key die bonder equipment market companies?

Answer: Some of the key die bonder equipment companies are as follows.

  • BE Semiconductor Industries
  • ASM Pacific Technology
  • Kulicke & Soffa
  • Mycronic
  • Palomar Technologies
  • West*Bond
  • MicroAssembly Technologies

Q6. Which die bonder equipment market segment will be the largest in future?

Answer: Lucintel forecasts that fully automatic die bonders is expected to witness the highest growth over the forecast period due to its advantageous characteristics such as, large-scale assembly and packaging, precision enhancement, and automated assembly and packaging.

Q7. In die bonder equipment market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period due to growing need for tablets and smartphones as well as the region's abundance of manufacturers.

Q.8 Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the die bonder equipment market by type (manual die bonders, semiautomatic die bonders, and fully automatic die bonders), bonding technique (epoxy, eutectic, soft solder, and others), device (optoelectronics, MEMS and MOEMS, and power devices), application (consumer electronics, automotive, industrial, telecommunications, healthcare, aerospace & defense, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Die Bonder Equipment Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global Die Bonder Equipment Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global Die Bonder Equipment Market by Type
    • 3.3.1: Manual Die Bonders
    • 3.3.2: Semiautomatic Die Bonders
    • 3.3.3: Fully Automatic Die Bonders
  • 3.4: Global Die Bonder Equipment Market by Bonding Technique
    • 3.4.1: Epoxy
    • 3.4.2: Eutectic
    • 3.4.3: Soft Solder
    • 3.4.4: Others
  • 3.5: Global Die Bonder Equipment Market by Device
    • 3.5.1: Optoelectronics
    • 3.5.2: MEMS and MOEMS
    • 3.5.3: Power Devices
  • 3.6: Global Die Bonder Equipment Market by Application
    • 3.6.1: Consumer Electronics
    • 3.6.2: Automotive
    • 3.6.3: Industrial
    • 3.6.4: Telecommunications
    • 3.6.5: Healthcare
    • 3.6.6: Aerospace & Defense
    • 3.6.7: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global Die Bonder Equipment Market by Region
  • 4.2: North American Die Bonder Equipment Market
    • 4.2.2: North American Die Bonder Equipment Market by Application: Consumer Electronics, Automotive, Industrial, Telecommunications, Healthcare, Aerospace & Defense, and Others
  • 4.3: European Die Bonder Equipment Market
    • 4.3.1: European Die Bonder Equipment Market by Type: Manual Die Bonders, Semiautomatic Die Bonders, and Fully Automatic Die Bonders
    • 4.3.2: European Die Bonder Equipment Market by Application: Consumer Electronics, Automotive, Industrial, Telecommunications, Healthcare, Aerospace & Defense, and Others
  • 4.4: APAC Die Bonder Equipment Market
    • 4.4.1: APAC Die Bonder Equipment Market by Type: Manual Die Bonders, Semiautomatic Die Bonders, and Fully Automatic Die Bonders
    • 4.4.2: APAC Die Bonder Equipment Market by Application: Consumer Electronics, Automotive, Industrial, Telecommunications, Healthcare, Aerospace & Defense, and Others
  • 4.5: ROW Die Bonder Equipment Market
    • 4.5.1: ROW Die Bonder Equipment Market by Type: Manual Die Bonders, Semiautomatic Die Bonders, and Fully Automatic Die Bonders
    • 4.5.2: ROW Die Bonder Equipment Market by Application: Consumer Electronics, Automotive, Industrial, Telecommunications, Healthcare, Aerospace & Defense, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Die Bonder Equipment Market by Type
    • 6.1.2: Growth Opportunities for the Global Die Bonder Equipment Market by Bonding Technique
    • 6.1.3: Growth Opportunities for the Global Die Bonder Equipment Market by Device
    • 6.1.4: Growth Opportunities for the Global Die Bonder Equipment Market by Application
    • 6.1.5: Growth Opportunities for the Global Die Bonder Equipment Market by Region
  • 6.2: Emerging Trends in the Global Die Bonder Equipment Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Die Bonder Equipment Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Die Bonder Equipment Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: BE Semiconductor Industries
  • 7.2: ASM Pacific Technology
  • 7.3: Kulicke & Soffa
  • 7.4: Mycronic
  • 7.5: Palomar Technologies
  • 7.6: West*Bond
  • 7.7: MicroAssembly Technologies