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市场调查报告书
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HDI PCB 市场：趋势、机会与竞争分析 [2024-2030]

HDI PCB Market: Trends, Opportunities and Competitive Analysis [2024-2030]
出版日期: | 出版商: Lucintel | 英文 195 Pages | 商品交期: 3个工作天内

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简介目录

HDI PCB市场趋势及预测

预计到 2030 年，全球 HDI PCB 市场将达到 208 亿美元，2024 年至 2030 年复合年增长率为 4.8%。该市场的主要驱动力是消费性电子市场的成长、电子设备的小型化以及对高性能设备的需求不断增加。全球 HDI PCB 市场的未来性充满希望，智慧型手机、电脑、通讯/资料通讯、消费性电子和汽车产业都有机会。

  • Lucintel 预测，由于智慧型手机和通讯设备的需求增加，4-6 层仍将是最大的细分市场。由于智慧型穿戴装置和连网型设备的需求不断增长，预计 10 层以上 HDI PCB 市场将在预测期内实现最高成长。
  • 由于对高性能 PCB 和大型智慧型手机电池空间的需求不断增加，智慧型手机将继续成为最大的最终用途产业。由于汽车电子产品的进步，预计汽车产业将在预测期内实现最高成长。
  • 亚太地区仍然是最大的市场，由于汽车电子含量的增加以及消费性电子和通讯产品的成长，预计在预测期内将经历最高的成长。

亚太地区仍是最大的 HDI PCB 市场。

1.美国：英特尔公司、苹果公司和高通等公司在HDI PCB技术方面处于主导地位。美国政府致力于推动半导体製造创新，正在推动HDI PCB的研发，应用于智慧型手机、笔记型电脑和汽车电子领域。

2.中国：华为技术有限公司、腾讯控股有限公司和小米公司等中国公司是该市场的主要参与者。中国政府对半导体产业的支持和「中国製造2025」计画等措施正在推动HDI PCB技术在通讯、消费性电子和汽车应用中的采用。

3.德国：博世、西门子、英飞凌等公司在市场上占有重要地位。德国政府推动工业 4.0 和数数位化的倡议正在推动智慧製造和汽车电子领域 HDI PCB 的创新。

4.台湾：台积电、富士康科技集团等台湾企业在HDI PCB製造中扮演重要角色。政府对台湾半导体产业的支持以及对技术研究的投资正在加速各种电子设备的HDI PCB技术的进步。

5.日本：Sony Corporation、Panasonic Corporation、Canon Inc.等公司活跃在HDI PCB市场。日本政府对技术研究的投资以及与公司的合作正在促进消费性电子产品、医疗设备和汽车系统的 HDI PCB 的开发。

HDI PCB市场新趋势

对产业动态有直接影响的新兴趋势包括电子产品的小型化以及对低损耗/高速 HDI PCB 不断增长的需求。

HDI PCB市场近期趋势

1.消费电子领域对HDI PCB的需求不断增长 在更小尺寸、更高功能和更高性能等趋势的推动下，消费性电子领域对HDI PCB的需求持续增长。用于智慧型手机、平板电脑、穿戴式装置和其他可携式电子设备的 HDI PCB 订单正在迅速增加。采用先进的 HDI 技术（例如雷射钻孔和连续式层压）可以生产超紧凑的 PCB 设计，并提高完整性和可靠性。

2.扩大HDI PCB产能：领先的PCB製造商正在扩大其HDI PCB产能，以满足各个最终用途行业不断增长的需求。公司正在投资新的製造设施、设备升级和流程最佳化，以提高产量和效率。此次产能扩张旨在满足市场对高密度、高性能PCB解决方案的需求，并支援下一代电子产品的开发。

3.专注于先进的HDI技术：PCB製造商专注于推进HDI技术，以满足现代电子设备不断发展的要求。最近的趋势包括雷射钻孔、微孔形成和互连技术的创新，以增加层数、缩小迹线/空间宽度并提高完整性。这些技术进步使得 HDI 印刷基板的开发具有改进的电气性能、温度控管和可靠性，支援尖端电子设备的设计和製造。

4. HDI印刷电路基板在汽车应用中的兴起：由于ADAS（高级驾驶辅助系统）、资讯娱乐系统和电动车（EV）技术的日益采用，HDI印刷电路基板在汽车应用中越来越受欢迎。汽车製造商依靠 HDI 印刷电路基板来製造小型、轻量的电子模组，从而在恶劣的汽车环境中提供卓越的性能和可靠性。 HDI 技术允许将复杂的功能整合到更小的外形规格中，支援更智慧、更连网型的车辆的开发。

5.5G基础设施对HDI印刷电路基板的需求：5G网路的部署正在增加基地台、天线和路由器等通讯基础设施设备对HDI PCB的需求。 HDI PCB 在支援 5G通讯系统的高速、高频要求、实现更快的资料传输、更低的延迟和更大的网路容量方面发挥关键作用。製造商正在加大针对 5G 应用优化的 HDI PCB 的生产，采用先进材料和设计技术，以满足下一代无线网路的严格性能标准。

常问问题

Q1.市场规模为：

A1. 到2030年，全球HDI PCB市场预计将达到208亿美元。

Q2.市场成长预测是多少：

A2. 2024年至2030年，HDI PCB市场预计将以4.8%的复合年增长率成长。

Q3.影响市场成长的主要驱动因素是：

A3. 该市场的主要驱动因素是消费性电子市场的成长、电子设备的小型化以及对高性能设备的需求不断增加。

Q4.HDI PCB的主要用途和最终用途产业有哪些？

A4. 智慧型手机、平板电脑和电脑是HDI PCB市场的主要最终用途产业。

Q5.HDI PCB市场有哪些新趋势？

A5. 将直接影响产业动态的新兴趋势包括电子设备的小型化以及对低损耗/高速 HDI 印刷电路基板不断增长的需求。

Q6.主要企业有哪些？

A6. 主要HDI PCB公司如下：

  • TTM Technologies, Inc.
  • Tripod Technology Corporation
  • AT&S
  • Kingboard Holdings Ltd.
  • CCTC
  • DG Shengyi Electronics
  • Dynamic Electronics Co. Ltd.
  • Gold Circuit Electronics
  • Olympic
  • DAP
  • Unimicron Technology Corp.
  • Compeq Manufacturing Co., Ltd.
  • Ibiden Co., Ltd.
  • Zhen Ding Technology Holding Limited
  • Unitech
  • Samsung Electro-Mechanics
  • Meiko Electronics Co. Ltd

Q7. 未来哪个HDI印刷基板技术领域将成为最大？

A7.Lucintel 预测，由于智慧型手机、电信和资料通讯的需求不断增长，4-6 级仍将是最大的细分市场。由于智慧型穿戴装置和连网型设备的需求不断增长，预计 10 层以上 HDI PCB 市场将在预测期内实现最高成长。

Q8.未来五年，哪个地区的 HDI PCB 市场预计成长最快？

A8.预计未来五年亚太地区仍将是最大的地区并呈现最高的成长。

Q9. 可以客製化报告吗？

A9. 是的，Lucintel 提供 10% 的客製化服务，无需额外付费。

目录

第一章执行摘要

第二章 市场背景及分类

  • 简介、背景、分类
  • 供应链
  • 产业驱动因素与挑战

第三章 2018-2030年市场趋势及预测分析

  • 宏观经济趋势（2018-2023）与预测（2024-2030）
  • 全球HDI PCB市场趋势（2018-2023）与预测（2024-2030）
  • 按最终用途行业分類的 HDI PCB 市场
    • 智慧型手机和平板电脑
    • 电脑
    • 通讯/资料通讯
    • 家用电器
    • 车
    • 其他的
  • 按技术分類的 HDI PCB 市场
    • 4-6层HDI PCB
    • 8-10层HDI PCB
    • 10层以上HDI PCB
  • 按建构结构分類的 HDI PCB 市场
    • 1+N+1 HDI PCB
    • 2+N+2 HDI PCB
    • 3+N+3 HDI PCB
    • 其他的

第四章 2018-2030年区域市场趋势及预测分析

  • 按地区分類的 HDI PCB 市场
  • 北美HDI PCB市场
  • 欧洲HDI PCB市场
  • 亚太地区HDI PCB市场
  • 其他地区HDI PCB市场

第五章 竞争分析

  • 产品系列分析
  • 地理范围
  • 波特五力分析

第六章 成长机会与策略分析

  • 成长机会分析
    • 最终用途产业的 HDI PCB 市场成长机会
    • HDI PCB 市场成长机会（按技术）
    • 按建构结构分類的 HDI PCB 市场成长机会
    • 按地区分類的 HDI PCB 市场成长机会
  • 全球HDI PCB市场新趋势
  • 战略分析
    • HDI PCB市场新产品开发
    • 扩大全球HDI PCB市场产能
    • 全球HDI PCB市场併购
    • 全球HDI PCB市场技术发展

第七章主要企业概况

  • TTM Technologies, Inc.
  • Tripod Technology Corporation
  • AT&S
  • Kingboard Holdings Ltd.
  • CCTC
  • DG Shengyi Electronics
  • Dynamic Electronics Co. Ltd.
  • Gold Circuit Electronics
  • Olympic
  • DAP
  • Unimicron Technology Corp.
  • Compeq Manufacturing Co., Ltd.
  • Ibiden Co., Ltd.
  • Zhen Ding Technology Holding Limited
  • Unitech
  • Samsung Electro-Mechanics
  • Meiko Electronics Co. Ltd
简介目录

HDI PCB Market Trends and Forecast

The future of the global high-density interconnect (HDI) PCB market looks promising with opportunities in the smartphone, computer, telecom and datacom, consumer electronics, and automotive industries. The global HDI PCB market is expected to reach an estimated $20.8 billion by 2030 with a CAGR of 4.8% from 2024 to 2030. The major drivers for this market are growth in consumer electronics market, miniaturization of electronic devices, and increasing demand for high performance devices.

  • Lucintel forecasts that 4-6 layers will remain the largest segment due to increasing demand in smartphones and telecommunication equipment. The 10+ layer HDI PCB market is expected to witness the highest growth during the forecast period due to the growing demand for smart wearables and connected devices.
  • Smartphones will remain the largest end use industry due to the increasing demand for high performance PCB and growing demand for more space in smartphones for larger batteries. Automotive is expected to witness the highest growth over the forecast period due to advancement in automotive electronics.
  • Asia Pacific will remain the largest market, and it is also expected to witness the highest growth over the forecast period due to the increasing electronic content in automotive and growth in consumer electronic devices & telecommunication products.

Asia Pacific will remain the largest market in the HDI PCB Market

1. United States: Companies like Intel Corporation, Apple Inc., and Qualcomm Incorporated are leading initiatives in HDI PCB technology. The US government's focus on promoting innovation in semiconductor manufacturing drives research and development in HDI PCBs for applications in smartphones, laptops, and automotive electronics.

2. China: Chinese companies such as Huawei Technologies Co., Ltd., Tencent Holdings Limited, and Xiaomi Corporation are prominent players in the market. China's government support for the semiconductor industry and initiatives like the "Made in China 2025" plan drive the adoption of HDI PCB technology for telecommunications, consumer electronics, and automotive applications.

3. Germany: Companies like Bosch GmbH, Siemens AG, and Infineon Technologies AG are significant in the market. Germany's government initiatives to promote Industry 4.0 and digitalization drive innovation in HDI PCBs for smart manufacturing and automotive electronics.

4. Taiwan: Taiwanese companies such as Taiwan Semiconductor Manufacturing Company Limited (TSMC) and Foxconn Technology Group play a key role in HDI PCB manufacturing. Taiwan's government support for the semiconductor industry and investment in technology research accelerates advancements in HDI PCB technology for various electronic devices.

5. Japan: Companies like Sony Corporation, Panasonic Corporation, and Canon Inc. are active in the HDI PCB market. Japan's government investment in technology research and collaboration with companies promote the development of HDI PCBs for consumer electronics, medical devices, and automotive systems.

Emerging Trends in the HDI PCB Market

Emerging trends, which have a direct impact on the dynamics of the industry, include miniaturization of electronic devices and growing demand for low loss/high-speed HDI PCBs.

A total of 99 figures / charts and 76 tables are provided in this 195-page report to help in your business decisions. Sample figures with insights are shown below.

HDI PCB Market by Segment

The study includes trends and forecast for the global high density interconnect (HDI) PCB market by end use industry, technology, build-up layer count, and region as follows:

By End Use Industry [$M and Thousand Sqm shipment analysis for 2018 - 2030]:

  • Smartphones and Tablets
  • Computers
  • Telecom/Datacom
  • Consumer Electronics
  • Automotive
  • Others

By Technology [$M and Thousand Sqm shipment analysis for 2018 - 2030]:

  • 4-6 Layer
  • 8-10 Layer
  • 10+ Layer

By Build-Up Structure [$M and Thousand Sqm shipment analysis for 2018 - 2030]:

  • 1+n+1
  • 2+n+2
  • 3+n+3
  • Others

By Region [$M and Thousand Sqm shipment analysis for 2018 - 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of HDI PCB Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies HDI PCB companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the HDI PCB companies profiled in this report includes.

  • TTM Technologies, Inc.
  • Tripod Technology Corporation
  • AT&S
  • Kingboard Holdings Ltd.
  • CCTC
  • DG Shengyi Electronics
  • Dynamic Electronics Co. Ltd.
  • Gold Circuit Electronics
  • Olympic
  • DAP
  • Unimicron Technology Corp.
  • Compeq Manufacturing Co., Ltd.
  • Ibiden Co., Ltd.
  • Zhen Ding Technology Holding Limited
  • Unitech
  • Samsung Electro-Mechanics
  • Meiko Electronics Co. Ltd

Recent Developments in the HDI PCB Market

1. Rising Demand for HDI PCBs in Consumer Electronics: The demand for HDI PCBs continues to grow in the consumer electronics sector, driven by trends such as miniaturization, increased functionality, and higher performance requirements. Manufacturers are witnessing a surge in orders for HDI PCBs used in smartphones, tablets, wearable devices, and other portable electronics. The adoption of advanced HDI technologies, including laser drilling and sequential lamination, enables the production of ultra-compact PCB designs with improved signal integrity and reliability.

2. Expansion of HDI PCB Production Capacity: Leading PCB manufacturers are expanding their production capacity for HDI PCBs to meet growing demand from various end-use industries. Companies are investing in new manufacturing facilities, equipment upgrades, and process optimizations to increase output and improve efficiency. The expansion of production capacity is aimed at addressing market demand for high-density, high-performance PCB solutions and supporting the development of next-generation electronic devices.

3. Focus on Advanced HDI Technologies: PCB manufacturers are focusing on advancing HDI technologies to meet the evolving requirements of modern electronic devices. Recent developments include innovations in laser drilling, microvia formation, and interconnection techniques to achieve higher layer counts, finer trace/space widths, and improved signal integrity. These technological advancements enable the development of HDI PCBs with enhanced electrical performance, thermal management, and reliability, supporting the design and production of cutting-edge electronics.

4. Rise of HDI PCBs in Automotive Applications: HDI PCBs are gaining traction in automotive applications, driven by the increasing adoption of advanced driver-assistance systems (ADAS), infotainment systems, and electric vehicle (EV) technology. Automakers are leveraging HDI PCBs to enable compact and lightweight electronic modules that deliver superior performance and reliability in harsh automotive environments. The use of HDI technology allows for the integration of complex functionalities into smaller form factors, supporting the development of smarter and more connected vehicles.

5. Demand for HDI PCBs in 5G Infrastructure: The rollout of 5G networks is fueling demand for HDI PCBs in telecommunications infrastructure equipment, including base stations, antennas, and routers. HDI PCBs play a crucial role in supporting the high-speed, high-frequency requirements of 5G communication systems, enabling faster data transmission, lower latency, and greater network capacity. Manufacturers are ramping up production of HDI PCBs optimized for 5G applications, incorporating advanced materials and design techniques to meet the stringent performance criteria of next-generation wireless networks.

Features of HDI PCB Market

  • Market Size Estimates: High Density Interconnect (HDI) PCB market size estimation in terms of value ($M) and Volume (Thousand Sqm)
  • Trend and Forecast Analysis: Market trends (2018-2023) and forecast (2024-2030) by various segments and regions.
  • Segmentation Analysis: High Density Interconnect (HDI) PCB market size by various segments, such as end use industry, technology, and built-up structure, in terms of value and volume.
  • Regional Analysis: High Density Interconnect (HDI) PCB market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
  • Growth Opportunities: Analysis on growth opportunities in various end use industries, technologies, built-up structures, and regions for the high density interconnect (HDI) PCB market.
  • Strategic Analysis: This includes M&A, new product development, and competitive landscape for the high density interconnects (HDI) PCB market.
  • Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the HDI PCB market size?

Answer: The global HDI PCB market is expected to reach an estimated $20.8 billion by 2030.

Q2. What is the growth forecast for HDI PCB market?

Answer: The HDI PCB market is expected to grow at a CAGR of 4.8% from 2024 to 2030.

Q3. What are the major drivers influencing the growth of the HDI PCB market?

Answer: The major drivers for this market are growth in the consumer electronics market, miniaturization of electronic devices, and increasing demand for high performance devices.

Q4. What are the major applications or end use industries for HDI PCB?

Answer: Smart phones and tablets, and computers are the major end use industries for HDI PCB market.

Q5. What are the emerging trends in HDI PCB market?

Answer: Emerging trends, which have a direct impact on the dynamics of the industry, include miniaturization of electronic devices and growing demand for low loss/high-speed HDI PCBs.

Q6. Who are the key HDI PCB companies?

Answer: Some of the key HDI PCB companies are as follows:

  • TTM Technologies, Inc.
  • Tripod Technology Corporation
  • AT&S
  • Kingboard Holdings Ltd.
  • CCTC
  • DG Shengyi Electronics
  • Dynamic Electronics Co. Ltd.
  • Gold Circuit Electronics
  • Olympic
  • DAP
  • Unimicron Technology Corp.
  • Compeq Manufacturing Co., Ltd.
  • Ibiden Co., Ltd.
  • Zhen Ding Technology Holding Limited
  • Unitech
  • Samsung Electro-Mechanics
  • Meiko Electronics Co. Ltd

Q7.Which HDI PCB technology segment will be the largest in future?

Answer: Lucintel forecasts that 4-6 layers will remain the largest segment due to increasing demand in smartphone and telecom and datacom. The 10+ layer HDI PCB market is expected to witness the highest growth during the forecast period due to the growing demand for smart wearables and connected devices.

Q8: In HDI PCB market, which region is expected to be the largest in next 5 years?

Answer: Asia Pacific is expected to remain the largest region and witness the highest growth over next 5 years.

Q9. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% Customization Without any Additional Cost.

This report answers following 11 key questions

  • Q.1 What are some of the most promising potential, high-growth opportunities for the global high density interconnect (HDI) PCB market by end use industry (smartphones and tablets, computers, telecom/datacom, consumer electronics, automotive and others), technology (4-6 layer, 8-10 layer, 10+ layer), build-up layer count (1+n+1, 2+n+2, 3+n+3, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2 Which segments will grow at a faster pace and why?
  • Q.3 Which regions will grow at a faster pace and why?
  • Q.4 What are the key factors affecting market dynamics? What are the drivers and challenges of the High Density Interconnect (HDI) PCB market?
  • Q.5 What are the business risks and threats to the high density interconnect (HDI) PCB market?
  • Q.6 What are the emerging trends in the high density interconnect (HDI) PCB market and the reasons behind them?
  • Q.7 What are some changing demands of customers in the high density interconnect (HDI) PCB market?
  • Q.8 What are the new developments in the high density interconnect (HDI) PCB market? Which companies are leading these developments?
  • Q.9 Who are the major players in the high density interconnect (HDI) PCB market? What strategic initiatives are being implemented by key players for business growth?
  • Q.10 What are some of the competitive products and processes in the high density interconnect (HDI) PCB market, and how big of a threat do they pose for loss of market share via material or product substitution?
  • Q.11 What M&A activities did take place in the last five years in the high density interconnect (HDI) PCB market?

Table of Contents

1. Executive Summary

2. Market Background and Classifications

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1: Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2: Global High Density Interconnect (HDI) PCB Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global High Density Interconnect (HDI) PCB Market by End Use Industry
    • 3.3.1: Smartphones and Tablets
    • 3.3.2: Computers
    • 3.3.3: Telecom/Datacom
    • 3.3.4: Consumer Electronics
    • 3.3.5: Automotive
    • 3.3.6: Others
  • 3.4: Global High Density Interconnect (HDI) PCB Market by Technology
    • 3.4.1: 4-6 Layer HDI PCBs
    • 3.4.2: 8-10 Layer HDI PCBs
    • 3.4.3: 10+ Layer HDI PCBs
  • 3.5: Global High Density Interconnect (HDI) PCB Market by Built-Up Structure
    • 3.5.1: 1+N+1 HDI PCBs
    • 3.5.2: 2+N+2 HDI PCBs
    • 3.5.3: 3+N+3 HDI PCBs
    • 3.5.4: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global High Density Interconnect (HDI) PCB Market by Region
  • 4.2: North American High Density Interconnect (HDI) PCB Market
    • 4.2.1: Market by End Use Industry
    • 4.2.2: Market by Technology
    • 4.2.3: Market by Built-Up Structure
  • 4.3: European High Density Interconnect (HDI) PCB Market
    • 4.3.1: Market by End Use Industry
    • 4.3.2: Market by Technology
    • 4.3.3: Market by Built-Up Structure
  • 4.4: APAC High Density Interconnect (HDI) PCB Market
    • 4.4.1: Market by End Use Industry
    • 4.4.2: Market by Technology
    • 4.4.3: Market by Built-Up Structure
  • 4.5: ROW High Density Interconnect (HDI) PCB Market
    • 4.5.1: Market by End Use Industry
    • 4.5.2: Market by Technology
    • 4.5.3: Market by Built-Up Structure

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Geographical Reach
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global High Density Interconnect (HDI) PCB Market by End Use Industry
    • 6.1.2: Growth Opportunities for the Global High Density Interconnect (HDI) PCB Market by Technology
    • 6.1.3: Growth Opportunities for the Global High Density Interconnect (HDI) PCB Market by Built-Up Structure
    • 6.1.4: Growth Opportunities for the Global High Density Interconnect (HDI) PCB Market by Region
  • 6.2: Emerging Trends in the Global High Density Interconnect (HDI) PCB Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development in the Global High Density Interconnect (HDI) PCB Market
    • 6.3.2: Capacity Expansions in the Global High Density Interconnect (HDI) PCB Market
    • 6.3.3: Mergers and Acquisitions in the Global High Density Interconnect (HDI) PCB Market
    • 6.3.4: Technology Development of the Global High Density Interconnect (HDI) PCB Market

7. Company Profiles of Leading Players

  • 7.1: TTM Technologies, Inc.
  • 7.2: Tripod Technology Corporation
  • 7.3: AT&S
  • 7.4: Kingboard Holdings Ltd.
  • 7.5: CCTC
  • 7.6: DG Shengyi Electronics
  • 7.7: Dynamic Electronics Co. Ltd.
  • 7.8: Gold Circuit Electronics
  • 7.9: Olympic
  • 7.10: DAP
  • 7.11: Unimicron Technology Corp.
  • 7.12: Compeq Manufacturing Co., Ltd.
  • 7.13: Ibiden Co., Ltd.
  • 7.14: Zhen Ding Technology Holding Limited
  • 7.15: Unitech
  • 7.16: Samsung Electro-Mechanics
  • 7.17: Meiko Electronics Co. Ltd