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全球 Chiplet 市场：按处理器、封装技术、最终用途、地区划分 - 到 2028 年的预测
市场调查报告书
商品编码
1366414

全球 Chiplet 市场：按处理器、封装技术、最终用途、地区划分 - 到 2028 年的预测

Chiplet Market by Processor (Field-Programmable Gate Array (FPGA), Central Processing Unit (CPU), Graphics Processing Unit (GPU), APU, AI ASIC Co-Processor), Packaging Technology (SiP, FCCSP, FCBGA, 2.5D/3D, WLCSP, Fan-Out) - Global Forecast to 2028
出版日期: | 出版商: MarketsandMarkets | 英文 242 Pages | 订单完成后即时交付

价格
简介目录

Chiplet市场规模预计将从2023年的65亿美元增至2028年的1,480亿美元，2023年至2028年的年复合成长率为86.7%。

人工智慧和边缘运算中小晶片的采用、全球资料中心的普及以及先进封装技术的采用预计将成为推动小晶片市场成长的要素。

报告范围
目标期间 2019–2028
基准年 2022年
预测期 2023-2028
分析单位 金额（十亿美元）
部分 按加工商、按包装技术、按最终用途、按地区
目标区域 北美、欧洲、亚太等地区

在预测期内，小晶片市场的人工智慧专用用途（AI ASIC）积体电路处理器部分将以高年复合成长率成长。这一增长是由对人工智慧 (AI) 应用的客製化、用户特定解决方案日益增长的需求所推动的。这一趋势是由全行业向人工智慧主导的决策流程转变所推动的。此外，对能源效率和效能最佳化的追求促使企业转向AI ASIC协处理器来增强AI能力。这些技术进步、策略联盟以及对人工智慧主导解决方案不断增长的需求的融合，凸显了 AI ASIC 协处理器领域在小晶片市场中的指数级增长潜力，而以人工智慧为中心的它巩固了其在不断发展的格局中的作用。计算。

在预测期内，企业电子领域将以高年复合成长率成长。资料中心正在迅速采用小晶片来提高处理能力，同时降低能耗，这使得它们对业务运营至关重要。 Chiplet 的吸引力在于其模组化设计，可提供扩充性以满足企业不断变化的需求。它透过减少延迟和最佳化功耗彻底改变了伺服器架构，为以资料为中心的企业提供了一个有前景的解决方案。关键用途包括人工智慧加速器、记忆体晶片和网路处理器，为资料中心基础设施提供高效、灵活的解决方案。

该报告研究了全球小晶片市场，包括处理器、封装技术、最终用途、地区和市场参与者概况的趋势。

目录

第1章简介

第2章调查方法

第3章执行摘要

第4章重要考察

第5章市场概况

  • 介绍
  • 市场动态
  • 技术分析
  • 价值链分析
  • 生态系绘图
  • 影响客户业务的趋势和颠覆
  • 波特五力分析
  • 价格分析
  • 案例研究分析
  • 贸易分析
  • 价格分析
  • 专利分析
  • 2023-2024年重大会议和活动
  • 标准和法规状况
  • 主要相关人员和采购标准

第6章Chiplet 市场（按处理器）

  • 介绍
  • 现场可程式闸阵列 (FPGA)
  • 图形处理单元（GPU）
  • 中央处理器（CPU）
  • 应用处理单元（APU）
  • 人工智慧用途积体电路(AI ASIC) 协处理器

第7章Chiplet 市场（依封装技术）

  • 介绍
  • 系统级封装 (SIP)
  • 倒装晶片尺寸封装 (FCCSP)
  • 倒装晶片球栅阵列 (FCBGA)
  • 2.5D/3D
  • 晶圆级晶片尺寸封装 (WLCSP)
  • 扇出 (FO)

第8章Chiplet 市场（依最终用途）

  • 介绍
  • 企业电子
  • 家用电器
  • 汽车
  • 工业自动化
  • 卫生保健
  • 军事/航太
  • 其他的

第9章Chiplet 市场（按地区）

  • 介绍
  • 北美洲
  • 欧洲
  • 亚太地区
  • 其他地区

第10章竞争形势

  • 概述
  • 领先企业采取的关键策略
  • 2020-2022年收益分析
  • 2022 年市场占有率分析
  • 2022年主要企业评估矩阵
  • 新创公司/中小企业 (SMES) 评估矩阵，2022 年
  • 新创公司/小型企业名单
  • 竞争基准化分析
  • 竞争格局及趋势

第11章公司简介

  • 主要参与企业
    • INTEL CORPORATION
    • ADVANCED MICRO DEVICES, INC.
    • APPLE INC.
    • IBM
    • MARVELL
    • MEDIATEK INC.
    • NVIDIA CORPORATION
    • ACHRONIX SEMICONDUCTOR CORPORATION
    • RANOVUS
    • ASE
  • 其他公司
    • CADENCE DESIGN SYSTEMS, INC.
    • SYNOPSYS, INC.
    • ALPHAWAVE SEMI
    • ELIYAN
    • NETRONOME
    • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    • NHANCED SEMICONDUCTORS
    • CHIPULLER
    • SIFIVE, INC.
    • RAMBUS
    • AYAR LABS, INC.
    • TACHYUM
    • X-CELEPRINT
    • KANDOU BUS SA
    • RAIN NEUROMORPHICS
    • TENSTORRENT

第12章附录

简介目录
Product Code: SE 8811

The chiplet market is projected to grow from USD 6.5 billion in 2023 and is projected to reach USD 148.0 billion by 2028; it is expected to grow at a CAGR of 86.7% from 2023 to 2028.

Adoption of chiplets in AI and edge computing applications, proliferation of data centers worldwide, and adoption of advanced packaging technologies are the factors expected to fuel the growth of the chiplet market.

Scope of the Report
Years Considered for the Study2019–2028
Base Year2022
Forecast Period2023-2028
Units ConsideredValue (USD Billion)
SegmentsBy Processor, Packaging Technology, Region
North America, Europe, APAC, RoW

"AI ASIC coprocessor segment of the chiplet market to witness high growth during the forecast period."

The artificial intelligence application-specific integrated circuit (AI ASIC) coprocessor segment of the chiplet market to grow at high CAGR during the forecast period. The growth is attributed to the growing demand for user-specific customized solutions tailored for artificial intelligence (AI) applications. The shift toward AI-driven decision-making processes across industries is a driving force behind this trend. In addition, the pursuit of energy efficiency and optimized performance is steering companies toward AI ASIC coprocessors to bolster their AI capabilities. This convergence of technological advancements, strategic alliances, and a burgeoning demand for AI-driven solutions underscores the tremendous growth potential of the AI ASIC coprocessor segment within the chiplet market, cementing its role in the evolving landscape of AI-focused computing.

"Enterprise electronics segment to witness significant growth for chiplet market during the forecast period."

Enterprise electronics segment to grow at high CAGR during the forecast period. Data centers are crucial for enterprise operations as it rapidly adopts chiplets to enhance processing power while reducing energy consumption. The appeal of chiplets lies in their modular design, providing scalability aligned with evolving enterprise needs. They are revolutionizing server architectures by reducing latency and optimizing power consumption, offering a promising solution for data-centric enterprises. Its key applications include AI accelerators, memory chiplets, and network processors, providing efficient and flexible solutions for data center infrastructures.

"Asia Pacific to hold a major market share of the chiplet market during the forecast period" Asia Pacific is expected to hold a major market share for chiplet market during the forecast period. The emergence of advanced technologies, such as AI, IoT, and Big Data has paved the way for the implementation of large-scale data centers in the region. Global giants such as Alibaba (China), Facebook (US), Amazon (US), Microsoft (US), Google (US), and Baidu (China) have already established their data centers in the Asian territory and are planning to expand their dominance in other regions. In Asia Pacific, the market is currently driven by Chinese and Indian consumers because of their increasing adoption rate of high-speed broadband services and mobile devices. The increasing telecommunication and data center networking infrastructure expansion is expected to drive the Asia Pacific chiplet market over the forecast period.

Extensive primary interviews were conducted with key industry experts in the chiplet market space to determine and verify the market size for various segments and subsegments gathered through secondary research. The break-up of primary participants for the report has been shown below:

The break-up of the profile of primary participants in the chiplet market:

  • By Company Type: Tier 1 - 50%, Tier 2 - 30%, and Tier 3 - 20%
  • By Designation: C Level - 20%, Director Level - 50%, Others-30%
  • By Region: North America - 30%, Europe - 20%, Asia Pacific - 40%, ROW- 10%

The report profiles key players in the chiplet market with their respective market ranking analysis. Prominent players profiled in this report are Intel Corporation (US), Advanced Micro Devices, Inc. (US), Apple Inc. (US), IBM (US), Marvell (US), MediaTek Inc. (Taiwan), NVIDIA Corporation (us), Achronix Semiconductor Corporation (US), Ranovus (Canada), and ASE Technology Holding Co., Ltd. (Taiwan).

Apart from this, Netronome (US), Cadence Design Systems, Inc. (US), and Synopsys, Inc. (US), SiFive, Inc. (US), ALPHAWAVE SEMI (UK), Eliyan (US), Ayar Labs, Inc. (US), Tachyum (US), X-Celeprint (Ireland), Kandou Bus SA (Switzerland), NHanced Semiconductors (US), Tenstorrent (Canada), Chipuller (China) and Rain Neuromorphics (US) are among a few emerging companies in the chiplet market.

Research Coverage: This research report categorizes the chiplet market on the basis of processor, packaging technology, end-use application, and region. The report describes the major drivers, restraints, challenges, and opportunities pertaining to the chiplet market and forecasts the same till 2028. Apart from these, the report also consists of leadership mapping and analysis of all the companies included in the chiplet ecosystem.

Key Benefits of Buying the Report The report will help the market leaders/new entrants in this market with information on the closest approximations of the revenue numbers for the overall chiplet market and the subsegments. This report will help stakeholders understand the competitive landscape and gain more insights to position their businesses better and to plan suitable go-to-market strategies. The report also helps stakeholders understand the pulse of the market and provides them with information on key market drivers, restraints, challenges, and opportunities.

The report provides insights on the following pointers:

  • Analysis of key drivers (adoption of high-performance computing (HPC) servers in various sectors, proliferation of data centers worldwide, adoption of advanced packaging technologies), restraints (heat management issues, lack of industry-wide interoperability standards), opportunities (development of quantum chiplets, rapid expansion of 5G infrastructure, rising incorporation of high-performance and power-efficient chiplets in medical devices, adoption of chiplets in AI and edge computing applications, increasing investments in autonomous vehicles) and challenges (challenges related to intellectual property (IP) protection and licensing, cybersecurity and vulnerability issues associated with chiplet-based systems) influencing the growth of the chiplet market.
  • Product Development/Innovation: Detailed insights on upcoming technologies, research & development activities, and new product & service launches in the chiplet market.
  • Market Development: Comprehensive information about lucrative markets - the report analysis the chiplet market across varied regions
  • Market Diversification: Exhaustive information about new products & services, untapped geographies, recent developments, and investments in the chiplet market
  • Competitive Assessment: In-depth assessment of market shares, growth strategies and service offerings of leading players like Intel Corporation (US), Advanced Micro Devices, Inc. (US), Apple Inc. (US), IBM (US), Marvell (US), among others in the chiplet market.

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 STUDY OBJECTIVES
  • 1.2 MARKET DEFINITION
  • 1.3 STUDY SCOPE
    • 1.3.1 MARKETS COVERED
    • FIGURE 1 CHIPLET MARKET SEGMENTATION
    • 1.3.2 REGIONAL SCOPE
    • 1.3.3 INCLUSIONS AND EXCLUSIONS
    • 1.3.4 YEARS CONSIDERED
    • 1.3.5 CURRENCY CONSIDERED
  • 1.4 LIMITATIONS
  • 1.5 STAKEHOLDERS
  • 1.6 RECESSION IMPACT
    • FIGURE 2 GDP GROWTH PROJECTION UNTIL 2023 FOR MAJOR ECONOMIES

2 RESEARCH METHODOLOGY

  • 2.1 RESEARCH DATA
    • FIGURE 3 CHIPLET MARKET: RESEARCH DESIGN
    • 2.1.1 SECONDARY DATA
      • 2.1.1.1 Major secondary sources
      • 2.1.1.2 Key data from secondary sources
    • 2.1.2 PRIMARY DATA
      • 2.1.2.1 Participants and key opinion leaders for primary interviews
      • 2.1.2.2 Breakdown of primaries
      • 2.1.2.3 Key data from primary sources
    • 2.1.3 SECONDARY AND PRIMARY RESEARCH
      • 2.1.3.1 Key industry insights
  • 2.2 MARKET SIZE ESTIMATION
    • FIGURE 4 RESEARCH FLOW FOR MARKET SIZE ESTIMATION
    • 2.2.1 BOTTOM-UP APPROACH
      • 2.2.1.1 Approach to derive market size using bottom-up analysis (demand side)
    • FIGURE 5 MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH
    • 2.2.2 TOP-DOWN APPROACH
      • 2.2.2.1 Approach to derive market size using top-down analysis (supply side)
    • FIGURE 6 MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH
      • 2.2.2.2 Supply-side analysis
    • FIGURE 7 MARKET SIZE ESTIMATION METHODOLOGY: SUPPLY-SIDE ANALYSIS
  • 2.3 MARKET BREAKDOWN AND DATA TRIANGULATION
    • FIGURE 8 DATA TRIANGULATION
  • 2.4 RESEARCH ASSUMPTIONS
    • FIGURE 9 ASSUMPTIONS
  • 2.5 APPROACH TO ANALYZE IMPACT OF RECESSION ON CHIPLET MARKET
  • 2.6 RISK ASSESSMENT
    • TABLE 1 RISK ASSESSMENT
  • 2.7 RESEARCH LIMITATIONS

3 EXECUTIVE SUMMARY

  • 3.1 GROWTH RATE ASSUMPTIONS/FORECAST
    • FIGURE 10 CPU SEGMENT TO HOLD LARGEST MARKET SHARE IN 2028
    • FIGURE 11 2.5D/3D SEGMENT TO HOLD LARGEST MARKET SHARE IN 2028
    • FIGURE 12 ENTERPRISE ELECTRONICS SEGMENT TO HOLD LARGEST MARKET SHARE IN 2028
    • FIGURE 13 ASIA PACIFIC HELD LARGEST SHARE OF CHIPLET MARKET IN 2022

4 PREMIUM INSIGHTS

  • 4.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN CHIPLET MARKET
    • FIGURE 14 RISING NUMBER OF DATA CENTERS WORLDWIDE
  • 4.2 CHIPLET MARKET, BY PROCESSOR
    • FIGURE 15 CPU SEGMENT TO DOMINATE CHIPLET MARKET DURING FORECAST PERIOD
  • 4.3 CHIPLET MARKET, BY PACKAGING TECHNOLOGY AND END-USE APPLICATION
    • FIGURE 16 2.5D/3D AND ENTERPRISE ELECTRONICS SEGMENTS TO HOLD LARGEST MARKET SHARES IN 2023
  • 4.4 CHIPLET MARKET, BY REGION
    • FIGURE 17 ASIA PACIFIC TO HOLD LARGEST MARKET SHARE IN 2023
  • 4.5 CHIPLET MARKET, BY COUNTRY
    • FIGURE 18 CHINA TO REGISTER HIGHEST CAGR IN CHIPLET MARKET FROM 2023 TO 2028

5 MARKET OVERVIEW

  • 5.1 INTRODUCTION
  • 5.2 MARKET DYNAMICS
    • FIGURE 19 CHIPLET MARKET: DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES
    • 5.2.1 DRIVERS
      • 5.2.1.1 Adoption of high-performance computing (HPC) servers in various sectors
      • 5.2.1.2 Proliferation of data centers worldwide
    • FIGURE 20 NUMBER OF DATA CENTERS WORLDWIDE
      • 5.2.1.3 Adoption of advanced packaging technologies
    • FIGURE 21 ANALYSIS OF IMPACT OF DRIVERS ON CHIPLET MARKET
    • 5.2.2 RESTRAINTS
      • 5.2.2.1 Heat management issues
      • 5.2.2.2 Lack of industry-wide interoperability standards
    • FIGURE 22 ANALYSIS OF IMPACT OF RESTRAINTS ON CHIPLET MARKET
    • 5.2.3 OPPORTUNITIES
      • 5.2.3.1 Development of quantum chiplets
      • 5.2.3.2 Rapid expansion of 5G infrastructure
      • 5.2.3.3 Rising incorporation of high-performance and power-efficient chiplets into medical devices
      • 5.2.3.4 Adoption of chiplets in AI and edge computing applications
      • 5.2.3.5 Increasing investments in autonomous vehicles
    • FIGURE 23 ANALYSIS OF IMPACT OF OPPORTUNITIES ON CHIPLET MARKET
    • 5.2.4 CHALLENGES
      • 5.2.4.1 Challenges related to intellectual property (IP) protection and licensing
      • 5.2.4.2 Cybersecurity and vulnerability issues associated with chiplet-based systems
    • FIGURE 24 ANALYSIS OF IMPACT OF OPPORTUNITIES ON CHIPLET MARKET
  • 5.3 TECHNOLOGY ANALYSIS
  • 5.4 VALUE CHAIN ANALYSIS
    • FIGURE 25 CHIPLET MARKET: VALUE CHAIN ANALYSIS
  • 5.5 ECOSYSTEM MAPPING
    • TABLE 2 CHIPLET MARKET: ROLE OF KEY PLAYERS IN ECOSYSTEM
    • FIGURE 26 KEY PLAYERS IN CHIPLET ECOSYSTEM
  • 5.6 TRENDS AND DISRUPTIONS IMPACTING CUSTOMERS' BUSINESSES
    • FIGURE 27 REVENUE SHIFTS AND NEW REVENUE POCKETS FOR PLAYERS IN CHIPLET MARKET
  • 5.7 PORTER'S FIVE FORCES ANALYSIS
    • TABLE 3 CHIPLET MARKET: PORTER'S FIVE FORCES ANALYSIS
    • FIGURE 28 PORTER'S FIVE FORCES ANALYSIS
    • 5.7.1 THREAT OF NEW ENTRANTS
    • 5.7.2 THREAT OF SUBSTITUTES
    • 5.7.3 BARGAINING POWER OF SUPPLIERS
    • 5.7.4 BARGAINING POWER OF BUYERS
    • 5.7.5 INTENSITY OF COMPETITIVE RIVALRY
  • 5.8 PRICING ANALYSIS
    • 5.8.1 INDICATIVE PRICING ANALYSIS FOR CHIPLET SOLUTIONS
    • TABLE 4 INDICATIVE PRICING ANALYSIS, BY KEY PLAYER (USD)
    • TABLE 5 INDICATIVE PRICING ANALYSIS, BY PROCESSOR (USD)
    • TABLE 6 INDICATIVE PRICING ANALYSIS, BY APPLICATION (USD)
  • 5.9 CASE STUDY ANALYSIS
    • 5.9.1 INTEL AND SIEMENS HEALTHINEERS DEVELOPED STATE-OF-THE-ART AI-POWERED IMAGING SOLUTIONS USING CHIPLETS
    • 5.9.2 ACHRONIX'S EMBEDDED FPGAS (EFPGAS) EMPOWERED HETEROGENEOUS CHIPLET INTEGRATION
    • 5.9.3 ELIYAN PARTNERED WITH TMSC TO ADVANCE CHIPLET INTEGRATION
  • 5.10 TRADE ANALYSIS
    • FIGURE 29 IMPORT DATA FOR PRODUCTS COVERED UNDER HS CODE 854231, BY COUNTRY, 2018-2022 (USD MILLION)
    • FIGURE 30 EXPORT DATA FOR PRODUCTS COVERED UNDER HS CODE 854231, BY COUNTRY, 2018-2022 (USD MILLION)
  • 5.11 TARIFF ANALYSIS
    • TABLE 7 MFN TARIFF FOR HS CODE 854231-COMPLIANT PRODUCTS EXPORTED BY CHINA
    • TABLE 8 MFN TARIFF FOR HS CODE 854231-COMPLIANT PRODUCTS EXPORTED BY US
    • TABLE 9 MFN TARIFF FOR HS CODE 854231-COMPLIANT PRODUCTS EXPORTED BY GERMANY
  • 5.12 PATENT ANALYSIS
    • FIGURE 31 NUMBER OF PATENTS GRANTED RELATED TO CHIPLETS PUBLISHED FROM 2012 TO 2023
    • FIGURE 32 TOP 10 PATENT APPLICANTS, 2012-2023
    • TABLE 10 TOP 20 PATENT OWNERS, 2012-2023
    • TABLE 11 PATENT REGISTRATIONS, 2019-2023
  • 5.13 KEY CONFERENCES AND EVENTS, 2023-2024
    • TABLE 12 CHIPLET MARKET: KEY CONFERENCES AND EVENTS, 2023-2024
  • 5.14 STANDARDS AND REGULATORY LANDSCAPE
    • 5.14.1 REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
    • TABLE 13 NORTH AMERICA: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
    • TABLE 14 EUROPE: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
    • TABLE 15 ASIA PACIFIC: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
    • TABLE 16 ROW: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
    • 5.14.2 STANDARDS
    • 5.14.3 GOVERNMENT REGULATIONS
  • 5.15 KEY STAKEHOLDERS AND BUYING CRITERIA
    • 5.15.1 KEY STAKEHOLDERS IN BUYING PROCESS
    • FIGURE 33 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP 3 END-USE APPLICATIONS
    • TABLE 17 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP 3 END-USE APPLICATIONS (%)
    • 5.15.2 BUYING CRITERIA
    • FIGURE 34 KEY BUYING CRITERIA FOR TOP 3 END-USE APPLICATIONS
    • TABLE 18 KEY BUYING CRITERIA FOR TOP 3 END-USE APPLICATIONS

6 CHIPLET MARKET, BY PROCESSOR

  • 6.1 INTRODUCTION
    • FIGURE 35 CPU SEGMENT TO HOLD LARGEST SHARE OF CHIPLET MARKET IN 2028
    • TABLE 19 CHIPLET MARKET, BY PROCESSOR, 2019-2022 (USD MILLION)
    • TABLE 20 CHIPLET MARKET, BY PROCESSOR, 2023-2028 (USD MILLION)
  • 6.2 FIELD PROGRAMMABLE GATE ARRAY (FPGA)
    • 6.2.1 RE-PROGRAMMABILITY, FLEXIBILITY, SCALABILITY, IMPROVED PERFORMANCE, AND POWER EFFICIENCY FEATURES TO FUEL DEMAND
    • TABLE 21 FPGA: CHIPLET MARKET, BY END-USE APPLICATION, 2019-2022 (USD MILLION)
    • TABLE 22 FPGA: CHIPLET MARKET, BY END-USE APPLICATION, 2023-2028 (USD MILLION)
    • TABLE 23 FPGA: CHIPLET MARKET, BY REGION, 2019-2022 (USD MILLION)
    • TABLE 24 FPGA: CHIPLET MARKET, BY REGION, 2023-2028 (USD MILLION)
  • 6.3 GRAPHICS PROCESSING UNIT (GPU)
    • 6.3.1 HIGHER BANDWIDTH THAN CPUS AND EXPANDING AI, MACHINE LEARNING, AND DATA CENTER MARKETS TO DRIVE DEMAND
    • TABLE 25 GPU: CHIPLET MARKET, BY END-USE APPLICATION, 2019-2022 (USD MILLION)
    • TABLE 26 GPU: CHIPLET MARKET, BY END-USE APPLICATION, 2023-2028 (USD MILLION)
    • TABLE 27 GPU: CHIPLET MARKET, BY REGION, 2019-2022 (USD MILLION)
    • TABLE 28 GPU: CHIPLET MARKET, BY REGION, 2023-2028 (USD MILLION)
  • 6.4 CENTRAL PROCESSING UNIT (CPU)
    • 6.4.1 COST-EFFECTIVENESS AND ABILITY TO HANDLE CERTAIN AI ALGORITHMS TO FUEL DEMAND
    • TABLE 29 CPU: CHIPLET MARKET, BY END-USE APPLICATION, 2019-2022 (USD MILLION)
    • TABLE 30 CPU: CHIPLET MARKET, BY END-USE APPLICATION, 2023-2028 (USD MILLION)
    • TABLE 31 CPU: CHIPLET MARKET, BY REGION, 2019-2022 (USD MILLION)
    • TABLE 32 CPU: CHIPLET MARKET, BY REGION, 2023-2028 (USD MILLION)
  • 6.5 APPLICATION PROCESSING UNIT (APU)
    • 6.5.1 EXCELLENT PERFORMANCE AND EFFICIENT THERMAL MANAGEMENT FEATURES TO DRIVE DEMAND
    • TABLE 33 APU: CHIPLET MARKET, BY END-USE APPLICATION, 2019-2022 (USD MILLION)
    • TABLE 34 APU: CHIPLET MARKET, BY END-USE APPLICATION, 2023-2028 (USD MILLION)
    • TABLE 35 APU: CHIPLET MARKET, BY REGION, 2019-2022 (USD MILLION)
    • TABLE 36 APU: CHIPLET MARKET, BY REGION, 2023-2028 (USD MILLION)
  • 6.6 ARTIFICIAL INTELLIGENCE APPLICATION-SPECIFIC INTEGRATED CIRCUIT (AI ASIC) COPROCESSOR
    • 6.6.1 GROWING NEED FOR USER-SPECIFIC CUSTOMIZED SOLUTIONS TO DRIVE MARKET
    • TABLE 37 AI ASIC COPROCESSOR: CHIPLET MARKET, BY END-USE APPLICATION, 2019-2022 (USD MILLION)
    • TABLE 38 AI ASIC COPROCESSOR: CHIPLET MARKET, BY END-USE APPLICATION, 2023-2028 (USD MILLION)
    • TABLE 39 AI ASIC COPROCESSOR: CHIPLET MARKET, BY REGION, 2019-2022 (USD MILLION)
    • TABLE 40 AI ASIC COPROCESSOR: CHIPLET MARKET, BY REGION, 2023-2028 (USD MILLION)

7 CHIPLET MARKET, BY PACKAGING TECHNOLOGY

  • 7.1 INTRODUCTION
    • FIGURE 36 2.5D/3D PACKAGING SEGMENT TO DOMINATE CHIPLET MARKET DURING FORECAST PERIOD
    • TABLE 41 CHIPLET MARKET, BY PACKAGING TECHNOLOGY, 2019-2022 (USD MILLION)
    • TABLE 42 CHIPLET MARKET, BY PACKAGING TECHNOLOGY, 2023-2028 (USD MILLION)
  • 7.2 SYSTEM-IN-PACKAGE (SIP)
    • 7.2.1 ABILITY OF SYSTEM-IN-PACKAGE (SIP) TECHNOLOGY TO SEAMLESSLY INTEGRATE MULTIPLE HETEROGENEOUS CHIPLETS INTO SINGLE, COMPACT MODULE TO FUEL DEMAND
  • 7.3 FLIP CHIP CHIP SCALE PACKAGE (FCCSP)
    • 7.3.1 EXCEPTIONAL ELECTRICAL PERFORMANCE OF FLIP CHIP CHIP SCALE PACKAGE (FCCSP) TECHNOLOGY TO FUEL DEMAND
  • 7.4 FLIP CHIP BALL GRID ARRAY (FCBGA)
    • 7.4.1 STRONG ELECTRICAL CONNECTION AND EFFICIENT HEAT DISSIPATION FEATURES OF FLIP CHIP BALL GRID ARRAY (FCBGA) TECHNOLOGY TO DRIVE MARKET
  • 7.5 2.5D/3D
    • 7.5.1 ABILITY OF 2.5D/3D PACKAGING TECHNOLOGY TO DELIVER SUPERIOR PERFORMANCE AND HIGH BANDWIDTH THROUGH VERTICAL STACKING TO PROPEL DEMAND
  • 7.6 WAFER-LEVEL CHIP SCALE PACKAGE (WLCSP)
    • 7.6.1 CAPABILITY OF WAFER-LEVEL CHIP SCALE PACKAGING (WLCSP) TECHNOLOGY TO ELIMINATE NEED FOR TRADITIONAL PACKAGING SUBSTRATES AND COMPATIBILITY WITH HIGH-VOLUME MANUFACTURING PROCESSES TO SUPPORT MARKET GROWTH
  • 7.7 FAN-OUT (FO)
    • 7.7.1 POTENTIALITY OF FAN-OUT (FO) PACKAGING TECHNOLOGY TO SUPPORT DIFFERENT CHIPLET CONFIGURATIONS TO FUEL ADOPTION

8 CHIPLET MARKET, BY END-USE APPLICATION

  • 8.1 INTRODUCTION
    • FIGURE 37 ENTERPRISE ELECTRONICS SEGMENT TO DOMINATE CHIPLET MARKET DURING FORECAST PERIOD
    • TABLE 43 CHIPLET MARKET, BY END-USE APPLICATION, 2019-2022 (USD MILLION)
    • TABLE 44 CHIPLET MARKET, BY END-USE APPLICATION, 2023-2028 (USD MILLION)
  • 8.2 ENTERPRISE ELECTRONICS
    • 8.2.1 INCREASING DEMAND FOR ENERGY EFFICIENCY IN ORGANIZATIONAL OPERATIONS TO DRIVE SEGMENTAL GROWTH
    • TABLE 45 ENTERPRISE ELECTRONICS: CHIPLET MARKET, BY PROCESSOR, 2019-2022 (USD MILLION)
    • TABLE 46 ENTERPRISE ELECTRONICS: CHIPLET MARKET, BY PROCESSOR, 2023-2028 (USD MILLION)
  • 8.3 CONSUMER ELECTRONICS
    • 8.3.1 TECHNOLOGICAL ADVANCEMENTS IN CONSUMER ELECTRONICS TO FUEL ADOPTION OF MICROPROCESSORS FOR FAST DATA PROCESSING
    • TABLE 47 CONSUMER ELECTRONICS: CHIPLET MARKET, BY PROCESSOR, 2019-2022 (USD MILLION)
    • TABLE 48 CONSUMER ELECTRONICS: CHIPLET MARKET, BY PROCESSOR, 2023-2028 (USD MILLION)
  • 8.4 AUTOMOTIVE
    • 8.4.1 ADVANCEMENTS IN ADAS AND AUTONOMOUS DRIVING TECHNOLOGIES TO SUPPORT SEGMENTAL GROWTH
    • TABLE 49 AUTOMOTIVE: CHIPLET MARKET, BY PROCESSOR, 2019-2022 (USD MILLION)
    • TABLE 50 AUTOMOTIVE: CHIPLET MARKET, BY PROCESSOR, 2023-2028 (USD MILLION)
  • 8.5 INDUSTRIAL AUTOMATION
    • 8.5.1 INCREASING DEPLOYMENT OF ROBOTICS AND AUTOMATION ACROSS INDUSTRIAL PLANTS AND FACILITIES TO DRIVE DEMAND
    • TABLE 51 INDUSTRIAL AUTOMATION: CHIPLET MARKET, BY PROCESSOR, 2019-2022 (USD MILLION)
    • TABLE 52 INDUSTRIAL AUTOMATION: CHIPLET MARKET, BY PROCESSOR, 2023-2028 (USD MILLION)
  • 8.6 HEALTHCARE
    • 8.6.1 RISING NEED FOR WEARABLES AND IMPLANTABLE DEVICES TO FUEL MARKET GROWTH
    • TABLE 53 HEALTHCARE: CHIPLET MARKET, BY PROCESSOR, 2019-2022 (USD MILLION)
    • TABLE 54 HEALTHCARE: CHIPLET MARKET, BY PROCESSOR, 2023-2028 (USD MILLION)
  • 8.7 MILITARY & AEROSPACE
    • 8.7.1 GROWING NEED FOR RELIABILITY AND EXCEPTIONAL PERFORMANCE IN MILITARY & AEROSPACE SECTOR TO BOOST ADOPTION
    • TABLE 55 MILITARY & AEROSPACE: CHIPLET MARKET, BY PROCESSOR, 2019-2022 (USD MILLION)
    • TABLE 56 MILITARY & AEROSPACE: CHIPLET MARKET, BY PROCESSOR, 2023-2028 (USD MILLION)
  • 8.8 OTHERS
    • TABLE 57 OTHERS: CHIPLET MARKET, BY PROCESSOR, 2019-2022 (USD MILLION)
    • TABLE 58 OTHERS: CHIPLET MARKET, BY PROCESSOR, 2023-2028 (USD MILLION)

9 CHIPLET MARKET, BY REGION

  • 9.1 INTRODUCTION
    • FIGURE 38 ASIA PACIFIC TO DOMINATE CHIPLET MARKET DURING FORECAST PERIOD
    • TABLE 59 CHIPLET MARKET, BY REGION, 2019-2022 (USD MILLION)
    • TABLE 60 CHIPLET MARKET, BY REGION, 2023-2028 (USD MILLION)
  • 9.2 NORTH AMERICA
    • 9.2.1 NORTH AMERICA: RECESSION IMPACT
    • FIGURE 39 NORTH AMERICA: CHIPLET MARKET SNAPSHOT
    • FIGURE 40 US TO DOMINATE NORTH AMERICAN CHIPLET MARKET DURING FORECAST PERIOD
    • TABLE 61 NORTH AMERICA: CHIPLET MARKET, BY COUNTRY, 2019-2022 (USD MILLION)
    • TABLE 62 NORTH AMERICA: CHIPLET MARKET, BY COUNTRY, 2023-2028 (USD MILLION)
    • TABLE 63 NORTH AMERICA: CHIPLET MARKET, BY PROCESSOR, 2019-2022 (USD MILLION)
    • TABLE 64 NORTH AMERICA: CHIPLET MARKET, BY PROCESSOR, 2023-2028 (USD MILLION)
    • 9.2.2 US
      • 9.2.2.1 Rising demand for chiplets in data centers and presence of stringent environmental policies to fuel market growth
    • 9.2.3 CANADA
      • 9.2.3.1 Government-led initiatives for boosting domestic semiconductor industry to drive demand
    • 9.2.4 MEXICO
      • 9.2.4.1 Growing automotive industry to fuel market growth
  • 9.3 EUROPE
    • 9.3.1 EUROPE: RECESSION IMPACT
    • FIGURE 41 EUROPE: CHIPLET MARKET SNAPSHOT
    • FIGURE 42 GERMANY TO DOMINATE EUROPEAN CHIPLET MARKET DURING FORECAST PERIOD
    • TABLE 65 EUROPE: CHIPLET MARKET, BY COUNTRY, 2019-2022 (USD MILLION)
    • TABLE 66 EUROPE: CHIPLET MARKET, BY COUNTRY, 2023-2028 (USD MILLION)
    • TABLE 67 EUROPE: CHIPLET MARKET, BY PROCESSOR, 2019-2022 (USD MILLION)
    • TABLE 68 EUROPE: CHIPLET MARKET, BY PROCESSOR, 2023-2028 (USD MILLION)
    • 9.3.2 GERMANY
      • 9.3.2.1 Government-led investments in semiconductor industry to fuel market growth
    • 9.3.3 UK
      • 9.3.3.1 Government-led focus on developing telecommunications industry to drive demand
    • 9.3.4 FRANCE
      • 9.3.4.1 Strategic investments in semiconductor manufacturing to support market growth
    • 9.3.5 REST OF EUROPE
  • 9.4 ASIA PACIFIC
    • 9.4.1 ASIA PACIFIC: RECESSION IMPACT
    • FIGURE 43 ASIA PACIFIC: CHIPLET MARKET SNAPSHOT
    • FIGURE 44 CHINA TO DOMINATE ASIA PACIFIC CHIPLET MARKET DURING FORECAST PERIOD
    • TABLE 69 ASIA PACIFIC: CHIPLET MARKET, BY COUNTRY, 2019-2022 (USD MILLION)
    • TABLE 70 ASIA PACIFIC: CHIPLET MARKET, BY COUNTRY, 2023-2028 (USD MILLION)
    • TABLE 71 ASIA PACIFIC: CHIPLET MARKET, BY PROCESSOR, 2019-2022 (USD MILLION)
    • TABLE 72 ASIA PACIFIC: CHIPLET MARKET, BY PROCESSOR, 2023-2028 (USD MILLION)
    • 9.4.2 CHINA
      • 9.4.2.1 Government-led efforts for enhancing semiconductor capabilities to drive demand
    • 9.4.3 JAPAN
      • 9.4.3.1 Technological advancements in automotive sector to accelerate market growth
    • 9.4.4 SOUTH KOREA
      • 9.4.4.1 Booming consumer electronics industry to drive demand
    • 9.4.5 REST OF ASIA PACIFIC
  • 9.5 ROW
    • 9.5.1 ROW: RECESSION IMPACT
    • TABLE 73 ROW: CHIPLET MARKET, BY REGION, 2019-2022 (USD MILLION)
    • TABLE 74 ROW: CHIPLET MARKET, BY REGION, 2023-2028 (USD MILLION)
    • TABLE 75 ROW: CHIPLET MARKET, BY PROCESSOR, 2019-2022 (USD MILLION)
    • TABLE 76 ROW: CHIPLET MARKET, BY PROCESSOR, 2023-2028 (USD MILLION)
    • 9.5.2 SOUTH AMERICA
      • 9.5.2.1 Increased need for data centers to drive market growth
    • 9.5.3 MIDDLE EAST & AFRICA
      • 9.5.3.1 Government funding for development of healthcare infrastructure to boost market growth

10 COMPETITIVE LANDSCAPE

  • 10.1 OVERVIEW
  • 10.2 KEY STRATEGIES ADOPTED BY MAJOR PLAYERS
    • TABLE 77 CHIPLET MARKET: OVERVIEW OF STRATEGIES ADOPTED BY KEY PLAYERS
  • 10.3 REVENUE ANALYSIS, 2020-2022
    • FIGURE 45 REVENUE ANALYSIS OF TOP FIVE MARKET PLAYERS, 2020-2022
  • 10.4 MARKET SHARE ANALYSIS, 2022
    • FIGURE 46 CHIPLET MARKET SHARE ANALYSIS, 2022
    • TABLE 78 CHIPLET MARKET SHARE ANALYSIS, 2022
  • 10.5 EVALUATION MATRIX OF KEY COMPANIES, 2022
    • 10.5.1 STARS
    • 10.5.2 EMERGING LEADERS
    • 10.5.3 PERVASIVE PLAYERS
    • 10.5.4 PARTICIPANTS
    • FIGURE 47 CHIPLET MARKET: EVALUATION MATRIX OF KEY COMPANIES, 2022
  • 10.6 EVALUATION MATRIX OF STARTUPS/SMALL AND MEDIUM-SIZED ENTERPRISES (SMES), 2022
    • 10.6.1 PROGRESSIVE COMPANIES
    • 10.6.2 RESPONSIVE COMPANIES
    • 10.6.3 DYNAMIC COMPANIES
    • 10.6.4 STARTING BLOCKS
    • FIGURE 48 CHIPLET MARKET: EVALUATION MATRIX OF STARTUPS/SMES, 2022
  • 10.7 LIST OF STARTUPS/SMES
    • TABLE 79 CHIPLET MARKET: LIST OF KEY STARTUPS/SMES
  • 10.8 COMPETITIVE BENCHMARKING
    • TABLE 80 STARTUP/SME: COMPANY FOOTPRINT
    • TABLE 81 OVERALL COMPANY FOOTPRINT
    • TABLE 82 PROCESSOR: COMPANY FOOTPRINT
    • TABLE 83 END-USE APPLICATION: COMPANY FOOTPRINT
    • TABLE 84 REGION: COMPANY FOOTPRINT
  • 10.9 COMPETITIVE SCENARIOS AND TRENDS
    • 10.9.1 PRODUCT LAUNCHES
    • TABLE 85 CHIPLET MARKET: PRODUCT LAUNCHES, 2019-2023
    • 10.9.2 DEALS
    • TABLE 86 CHIPLET MARKET: DEALS, 2019-2023

11 COMPANY PROFILES

  • (Business overview, Products/Solutions/Services offered, Recent Developments, MNM view)**
  • 11.1 KEY PLAYERS
    • 11.1.1 INTEL CORPORATION
    • TABLE 87 INTEL CORPORATION: COMPANY OVERVIEW
    • FIGURE 49 INTEL CORPORATION: COMPANY SNAPSHOT
    • TABLE 88 INTEL CORPORATION: PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • TABLE 89 INTEL CORPORATION: PRODUCT LAUNCHES
    • TABLE 90 INTEL CORPORATION: DEALS
    • 11.1.2 ADVANCED MICRO DEVICES, INC.
    • TABLE 91 ADVANCED MICRO DEVICES, INC.: COMPANY OVERVIEW
    • FIGURE 50 ADVANCED MICRO DEVICES, INC.: COMPANY SNAPSHOT
    • TABLE 92 ADVANCED MICRO DEVICES, INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • TABLE 93 ADVANCED MICRO DEVICES, INC.: PRODUCT LAUNCHES
    • TABLE 94 ADVANCED MICRO DEVICES, INC.: DEALS
    • 11.1.3 APPLE INC.
    • TABLE 95 APPLE INC.: COMPANY OVERVIEW
    • FIGURE 51 APPLE INC.: COMPANY SNAPSHOT
    • TABLE 96 APPLE INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • TABLE 97 APPLE INC.: PRODUCT LAUNCHES
    • TABLE 98 APPLE INC.: DEALS
    • 11.1.4 IBM
    • TABLE 99 IBM: COMPANY OVERVIEW
    • FIGURE 52 IBM: COMPANY SNAPSHOT
    • TABLE 100 IBM: PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • TABLE 101 IBM: PRODUCT LAUNCHES
    • TABLE 102 IBM: DEALS
    • 11.1.5 MARVELL
    • TABLE 103 MARVELL: COMPANY OVERVIEW
    • FIGURE 53 MARVELL: COMPANY SNAPSHOT
    • TABLE 104 MARVELL: PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • TABLE 105 MARVELL: PRODUCT LAUNCHES
    • TABLE 106 MARVELL: DEALS
    • 11.1.6 MEDIATEK INC.
    • TABLE 107 MEDIATEK INC.: COMPANY OVERVIEW
    • FIGURE 54 MEDIATEK INC.: COMPANY SNAPSHOT
    • TABLE 108 MEDIATEK, INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • TABLE 109 MEDIATEK, INC.: PRODUCT LAUNCHES
    • TABLE 110 MEDIATEK, INC.: DEALS
    • 11.1.7 NVIDIA CORPORATION
    • TABLE 111 NVIDIA CORPORATION: COMPANY OVERVIEW
    • FIGURE 55 NVIDIA CORPORATION: COMPANY SNAPSHOT
    • TABLE 112 NVIDIA CORPORATION: PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • TABLE 113 NVIDIA CORPORATION: PRODUCT LAUNCHES
    • TABLE 114 NVIDIA CORPORATION: DEALS
    • 11.1.8 ACHRONIX SEMICONDUCTOR CORPORATION
    • TABLE 115 ACHRONIX SEMICONDUCTOR CORPORATION: COMPANY OVERVIEW
    • TABLE 116 ACHRONIX SEMICONDUCTOR CORPORATION: PRODUCTS/SOLUTIONS/ SERVICES OFFERED
    • TABLE 117 ACHRONIX SEMICONDUCTOR CORPORATION: PRODUCT LAUNCHES
    • TABLE 118 ACHRONIX SEMICONDUCTOR CORPORATION: DEALS
    • 11.1.9 RANOVUS
    • TABLE 119 RANOVUS: COMPANY OVERVIEW
    • TABLE 120 RANOVUS: PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • TABLE 121 RANOVUS: PRODUCT LAUNCHES
    • TABLE 122 RANOVUS: DEALS
    • 11.1.10 ASE
    • TABLE 123 ASE: COMPANY OVERVIEW
    • FIGURE 56 ASE: COMPANY SNAPSHOT
    • TABLE 124 ASE: PRODUCTS/SOLUTIONS/SERVICES OFFERED
    • TABLE 125 ASE: PRODUCT LAUNCHES
    • TABLE 126 ASE: DEALS
  • 11.2 OTHER PLAYERS
    • 11.2.1 CADENCE DESIGN SYSTEMS, INC.
    • 11.2.2 SYNOPSYS, INC.
    • 11.2.3 ALPHAWAVE SEMI
    • 11.2.4 ELIYAN
    • 11.2.5 NETRONOME
    • 11.2.6 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    • 11.2.7 NHANCED SEMICONDUCTORS
    • 11.2.8 CHIPULLER
    • 11.2.9 SIFIVE, INC.
    • 11.2.10 RAMBUS
    • 11.2.11 AYAR LABS, INC.
    • 11.2.12 TACHYUM
    • 11.2.13 X-CELEPRINT
    • 11.2.14 KANDOU BUS SA
    • 11.2.15 RAIN NEUROMORPHICS
    • 11.2.16 TENSTORRENT
  • *Details on Business overview, Products/Solutions/Services offered, Recent Developments, MNM view might not be captured in case of unlisted companies.

12 APPENDIX

  • 12.1 DISCUSSION GUIDE
  • 12.2 KNOWLEDGESTORE: MARKETSANDMARKETS' SUBSCRIPTION PORTAL
  • 12.3 CUSTOMIZATION OPTIONS
  • 12.4 RELATED REPORTS
  • 12.5 AUTHOR DETAILS